CN211047721U - Heat dissipation circuit board for fan - Google Patents
Heat dissipation circuit board for fan Download PDFInfo
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- CN211047721U CN211047721U CN201922347684.3U CN201922347684U CN211047721U CN 211047721 U CN211047721 U CN 211047721U CN 201922347684 U CN201922347684 U CN 201922347684U CN 211047721 U CN211047721 U CN 211047721U
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- fan
- cooling
- row
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Abstract
The utility model provides a heat dissipation circuit board for fan belongs to heat dissipation technical field, and this heat dissipation circuit board for fan includes the circuit board, circuit board top outer wall has air-cooled heat dissipation mechanism through bolted connection, circuit board one side top outer wall has cold row mechanism through bolted connection, the welding of circuit board top has circuit board principal element, there is cold head mechanism circuit board principal element top through bolted connection, air-cooled heat dissipation mechanism includes first fan and air-cooled row, cold row mechanism includes inlet tube, outlet pipe, fan housing, water-cooled row shell, second fan, water-cooled row, apopore and inlet opening, cold head mechanism includes water-cooled head, water-cooled head chassis, water pump support and water pump. The utility model discloses a be provided with cold row mechanism can the efficient pass through fan and water-cooling arrange with heat diffusion to the air, can be with coolant liquid cyclic utilization, through being provided with cold head mechanism, can be timely absorb the heat through the coolant liquid.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to radiating circuit board for fan.
Background
The efficient heat radiating device comprises a metal substrate, and particularly, paired stamping fins, one side of which is connected with the substrate, are regularly arranged on the metal substrate. The utility model provides a high-efficient fin device, on a slice thin slice of constituteing the radiator, adopt the mode of punching to turn out the punching press piece of symmetry, and every pair of punching press piece is arranged in opposite directions. The metal sheet heat dissipation device has the advantages that the stamping sheet is turned away from the base surface of the metal sheet, so that the heat exchange area is increased under the condition that the area of the original substrate is not reduced, the time of cool air acting on the metal sheet is prolonged, more heat is taken away from the metal sheet, and a more ideal heat dissipation effect is achieved.
Through search, chinese patent No. CN203057683U discloses a heat dissipation circuit board structure for a fan, which aims to solve the technical problem of poor heat dissipation effect caused by small size of the circuit board in the prior art. The utility model provides a circuit board heat radiation structure, with paster power device fixed connection, circuit board heat radiation structure includes: a circuit board for bearing components and parts, inlay in copper foil face in the circuit board locates copper foil face surface and is used for fixing paster power device's copper foil pad to and locate a plurality of heat conductors on copper foil face surface. The utility model provides a circuit board heat radiation structure through implementing hot design optimization measure to the copper foil face, sets up heat-conducting material and has strengthened the heat conductivility, has increased heat radiating area, sets up the radiating groove and has increased the circulation of air, improves the radiating effect of copper foil face effectively to power paster device operating temperature on this circuit board has been reduced.
However, the above technical solution is not improved from the aspect of the whole heat dissipation mechanism because the structure of the copper foil surface is improved, so that the problems of low heat dissipation efficiency and long heat dissipation time exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a radiating circuit board for fan aims at solving the radiating efficiency among the prior art not high, the long problem of radiating time.
In order to achieve the above object, the utility model provides a following technical scheme: the air-cooled radiating mechanism is connected to the outer wall of the top of the circuit board through a bolt, the cold discharging mechanism is connected to the outer wall of the top of one side of the circuit board through a bolt, a main element of the circuit board is welded to the top of the circuit board, and the cold head mechanism is connected to the top of the main element of the circuit board through a bolt.
In order to ensure timely heat dissipation around the main component, as the utility model relates to a preferred, air-cooled heat dissipation mechanism includes first fan and air-cooled row, circuit board top outer wall is connected with air-cooled row through the bolt, air-cooled row top outer wall has first fan through bolted connection.
In order to ensure that the heat can in time transmit the water-cooling and arrange, as the utility model relates to an it is preferred, cold row mechanism includes inlet tube, outlet pipe, and fan shell, water-cooling row shell, second fan, water-cooling row, apopore and inlet opening, circuit board one side outer wall has the water-cooling row shell through bolted connection, water-cooling row shell inner wall has the water-cooling to arrange through bolted connection, and water-cooling row one side outer wall is provided with inlet opening and apopore.
In order to ensure the flow of the cooling liquid, as a preferred embodiment of the present invention, the outer wall of the water-cooling discharge casing is connected to a fan casing through a bolt, and a second fan is welded to the inner wall of the fan casing; the outer wall of the water cooling drainage shell is connected with a water inlet pipe and a water outlet pipe through bolts.
In order to ensure that the cold heat can transmit the cold head, conduct the utility model relates to an it is preferred, cold head mechanism includes water-cooling head, water-cooling head chassis, water pump support and water pump, water-cooling head bottom joint has the water-cooling head chassis.
In order to ensure the circulation of coolant liquid, as the utility model relates to an it is preferred, there is the water pump support water-cooling head bottom inner wall through bolted connection, the welding of water pump support top has the water pump.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through being provided with forced air cooling heat dissipation mechanism, arrange the heat in the forced air cooling fast diffusion to reach the heat dissipation.
2. By arranging the cold discharge mechanism, heat can be efficiently diffused into air through the fan and the water-cooling discharge mechanism, and the cooling liquid can be recycled.
3. Through being provided with cold head mechanism, can be timely through the coolant liquid absorption heat to go out heat transfer.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of the structure of the present invention;
fig. 2 is a schematic side view of the present invention;
fig. 3 is a schematic view of a water cooling bar structure in the present invention;
FIG. 4 is a schematic view of the water pump of the present invention;
in the figure: 1-a circuit board; 2-water inlet pipe; 3-water outlet pipe; 4-a fan housing; 5-water cooling of the discharge shell; 6-a first fan; 7-circuit board main element; 8-a water cooling head; 9-a second fan; 10-fixing the plate; 11-water cooling head chassis; 12-water cooling drainage; 13-water outlet; 14-water inlet hole; 15-water pump bracket; 16-water pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: including circuit board 1, there is forced air cooling heat dissipation mechanism 1 top outer wall of circuit board through bolted connection, there is cold row mechanism 1 one side top outer wall of circuit board through bolted connection, 1 top welding of circuit board has circuit board principal component 7, there is the cold head mechanism 7 top of circuit board principal component through bolted connection.
The utility model discloses an in the embodiment, the fan is at the in-process of work, and circuit board major component 7 of circuit board can produce a large amount of heats, and at this moment, through fixing water-cooling head chassis 11 with cold head mechanism on circuit board major component 7, start cold second fan 9 of arranging the mechanism, the coolant liquid in the cold row mechanism enters into cold head mechanism through the pipeline after that, dispels the heat to circuit board major component 7, and air-cooled heat dissipation mechanism starts after that, rotates through first fan 6 and dispels the heat.
Specifically, air-cooled heat dissipation mechanism includes first fan 6 and forced air cooling row 10, the outer wall of circuit board 1 top is connected with forced air cooling row 10 through the bolt, the outer wall of forced air cooling row 10 top is connected with first fan 6 through bolted connection.
In this embodiment: when the fan works, besides the main element 7 of the circuit board, the peripheral position of the main element also generates a large amount of heat, at this time, the heat is transferred to the air cooling row 10 by arranging the air cooling heat dissipation mechanism, and then the first fan 7 rotates to quickly diffuse the heat in the air cooling row 10 so as to achieve heat dissipation.
Specifically, the cold drainage mechanism comprises a water inlet pipe 2, a water outlet pipe 3, a fan shell 4, a water-cooling drainage shell 5, a second fan 9, a water-cooling drainage 12, a water outlet hole 13 and a water inlet hole 14, wherein the outer wall of one side of the circuit board 1 is connected with the water-cooling drainage shell 5 through a bolt, the inner wall of the water-cooling drainage shell 5 is connected with the water-cooling drainage 12 through a bolt, the outer wall of one side of the water-cooling drainage 12 is provided with the water inlet hole 14 and the water outlet hole 13, the outer wall of the water-cooling drainage shell 5 is connected with the fan shell 4 through a bolt, and the second; the outer wall of the water cooling discharge shell 5 is connected with a water inlet pipe 2 and a water outlet pipe 3 through bolts.
In this embodiment: through being provided with water-cooling row 12, can store the coolant liquid in it to carry out the circulation effect with the coolant liquid through inlet tube 3 and outlet pipe 2, second fan 9 rotates, arranges the heat of the coolant liquid in water-cooling row 12 and dispels, through setting up cold row mechanism can the efficient through fan and water-cooling row with heat diffusion to the air in, and can utilize coolant liquid circulation.
Specifically, cold head mechanism includes water-cooling head 8, water-cooling head chassis 11, water pump support 15 and water pump 16, water-cooling head 8 bottom joint has water-cooling head chassis 11, there is water pump support 15 water-cooling head 8 bottom inner wall through bolted connection, the welding of water pump support 15 top has water pump 16.
In this embodiment: through being provided with water-cooling head chassis 11, with heat transfer to it in, then on water pump 16 transmits the coolant liquid through inlet tube 2 to water-cooling head chassis 11, the coolant liquid absorbs the heat and flows to water-cooling row 12 in through outlet pipe 3, and water-cooling row 12 discharges the heat to the external world through second fan 9, through being provided with cold head mechanism, can be timely absorb the heat through the coolant liquid to go out heat transfer.
The utility model discloses a theory of operation and use flow: when the fan is in operation, the circuit board main element 7 generates a large amount of heat, at this time, the second fan 9 of the cold discharge mechanism and the water pump 16 of the cold head mechanism are started, the water head chassis 11 absorbs the heat of the circuit board main element 7, the water pump 16 drives the cooling liquid to flow, the cooling liquid flows out from the water outlet hole 13 of the water cooling discharge 12, flows into the water cooling head 8 through the water outlet pipe 3, the cooling liquid absorbs heat and flows into the water cooling discharge 12 through the water inlet hole 13 along the water inlet pipe 3, the second fan 9 dissipates the heat in the water cooling discharge 12, for the heat around the main element 7 of the circuit board, the heat enters the air-cooled row 10 by arranging the air-cooled heat dissipation mechanism, is dissipated by the first fan 6, and is dissipated by air-cooled heat dissipation and water-cooled heat dissipation at the same time, the circuit board can be radiated to the maximum extent, and the stability and the safety of the fan during working are guaranteed.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A heat dissipation circuit board for a fan is characterized in that: the cooling device comprises a circuit board (1), wherein an air-cooled heat dissipation mechanism is connected to the outer wall of the top of the circuit board (1) through a bolt, a cold discharging mechanism is connected to the outer wall of the top of one side of the circuit board (1) through a bolt, a circuit board main element (7) is welded to the top of the circuit board (1), and a cold head mechanism is connected to the top of the circuit board main element (7) through a bolt.
2. The heat dissipating circuit board for a fan as set forth in claim 1, wherein: the air-cooled heat dissipation mechanism comprises a first fan (6) and an air-cooled row (10), wherein the outer wall of the top of the circuit board (1) is connected with the air-cooled row (10) through a bolt, and the outer wall of the top of the air-cooled row (10) is connected with the first fan (6) through a bolt.
3. The heat dissipating circuit board for a fan as set forth in claim 1, wherein: cold row's mechanism includes inlet tube (2), outlet pipe (3), and fan housing (4), water-cooling row shell (5), second fan (9), water-cooling row (12), apopore (13) and inlet opening (14), there are water-cooling row shell (5) circuit board (1) one side outer wall through bolted connection, water-cooling row shell (5) inner wall has water-cooling row (12) through bolted connection, and water-cooling row (12) one side outer wall is provided with inlet opening (14) and apopore (13).
4. The heat dissipating circuit board for a fan as set forth in claim 3, wherein: the outer wall of the water cooling discharge shell (5) is connected with a fan shell (4) through bolts, and a second fan (9) is welded on the inner wall of the fan shell (4); the outer wall of the water cooling drainage shell (5) is connected with a water inlet pipe (2) and a water outlet pipe (3) through bolts.
5. The heat dissipating circuit board for a fan as set forth in claim 1, wherein: the cold head mechanism comprises a water-cooling head (8), a water-cooling head chassis (11), a water pump bracket (15) and a water pump (16), wherein the water-cooling head chassis (11) is clamped at the bottom of the water-cooling head (8).
6. The heat dissipating circuit board for a fan as set forth in claim 5, wherein: the water cooling head (8) is characterized in that the inner wall of the bottom of the water cooling head (8) is connected with a water pump support (15) through a bolt, and a water pump (16) is welded at the top of the water pump support (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922347684.3U CN211047721U (en) | 2019-12-24 | 2019-12-24 | Heat dissipation circuit board for fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922347684.3U CN211047721U (en) | 2019-12-24 | 2019-12-24 | Heat dissipation circuit board for fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211047721U true CN211047721U (en) | 2020-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922347684.3U Active CN211047721U (en) | 2019-12-24 | 2019-12-24 | Heat dissipation circuit board for fan |
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| CN (1) | CN211047721U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867231A (en) * | 2020-12-28 | 2021-05-28 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
-
2019
- 2019-12-24 CN CN201922347684.3U patent/CN211047721U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867231A (en) * | 2020-12-28 | 2021-05-28 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
| CN112867231B (en) * | 2020-12-28 | 2022-03-15 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
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