CN112867231B - Do benefit to radiating multilayer printed circuit board - Google Patents
Do benefit to radiating multilayer printed circuit board Download PDFInfo
- Publication number
- CN112867231B CN112867231B CN202011576876.2A CN202011576876A CN112867231B CN 112867231 B CN112867231 B CN 112867231B CN 202011576876 A CN202011576876 A CN 202011576876A CN 112867231 B CN112867231 B CN 112867231B
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- Prior art keywords
- heat dissipation
- fixedly connected
- water
- circuit board
- cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The invention relates to the technical field of circuit boards, and discloses a multilayer printed circuit board beneficial to heat dissipation, which comprises a circuit board body, wherein a heat dissipation mechanism is installed at the upper end of the circuit board body, the heat dissipation mechanism comprises an air-cooled heat dissipation assembly, one end of the air-cooled heat dissipation assembly is fixedly connected with a first fin heat dissipation plate through a screw, and one side, far away from the air-cooled heat dissipation assembly, of the bottom end of the first fin heat dissipation plate is fixedly connected with a first water-cooled heat dissipation assembly through a screw. The heat dissipation mechanism of the multilayer printed circuit board comprises the air-cooled heat dissipation assembly, the first fin heat dissipation plate, the first water-cooled heat dissipation assembly, the second water-cooled heat dissipation assembly and the second fin heat dissipation plate, wherein the heat dissipation motor of the air-cooled heat dissipation assembly drives the axial fan blades to rotate at a high speed, and the water-cooled flat tubes in the first water-cooled heat dissipation assembly and the second water-cooled heat dissipation assembly can take away a part of heat through circulating water, so that the heat dissipation effect of the circuit board body can be greatly improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a multilayer printed circuit board beneficial to heat dissipation.
Background
For electronic equipment, certain heat can be generated during working, so that the internal temperature of the equipment rises rapidly, if the equipment is not distributed in time, the temperature of the equipment can be continuously raised, devices can lose efficacy due to overheating, and the reliability of the electronic equipment can be reduced.
Chinese patent discloses a printed circuit board fast dispels heat (No. CN211019837U), and this patent technique can reach the purpose that conveniently changes the coolant liquid through the water-cooling mode, and then has improved the availability factor of heat dissipation printed circuit board, and then has improved the practicality of heat dissipation printed circuit board, but its heat dissipation to the multilayer printed circuit board of high heat is not ideal, and is inconvenient to change radiator unit.
Disclosure of Invention
The present invention is directed to a multi-layer printed circuit board with heat dissipation, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a do benefit to radiating multilayer printed circuit board, includes the circuit board body, the mounting hole has all been seted up in the four corners of circuit board body, heat dissipation mechanism is installed to the upper end of circuit board body, the lower extreme fixedly connected with stay tube of mounting hole, heat dissipation mechanism includes air-cooled radiator unit, the first fin heating panel of screw fixedly connected with is passed through to air-cooled radiator unit's one end, and air-cooled radiator unit's the other end passes through screw fixedly connected with second fin heating panel, the first water-cooling radiator unit of screw fixedly connected with is passed through to one side that air-cooled radiator unit was kept away from to the bottom of first fin heating panel, and one side that air-cooled radiator unit was kept away from to the bottom of second fin heating panel passes through screw fixedly connected with second water-cooling radiator unit, first water-cooling radiator unit and second water-cooling radiator unit's structure is the same.
As a further scheme of the invention: the air-cooled heat dissipation assembly comprises a fan shell, the lower end of the inner side of the fan shell is fixedly connected with a heat dissipation motor through screws, the upper end of the inner side of the fan shell is meshed with a filter screen cover, the output end of the heat dissipation motor is fixedly connected with an axial flow fan blade, and the middle of the filter screen cover is provided with a dust removal structure in a penetrating mode.
As a still further scheme of the invention: the dust removal structure comprises a cleaning motor, the output end of the cleaning motor is fixedly connected with a rotating pipe through a pin key, the upper end of the outer side of the cleaning motor is fixedly connected with three fixing lugs, and the top end of the rotating pipe is fixedly connected with a cleaning brush.
As a still further scheme of the invention: the rotary pipe penetrates through the inner side of the filter screen cover, the cleaning motor is located at the lower end of the filter screen cover, the fixing lugs are fixedly connected with the filter screen cover through bolts, and the cleaning brush is located at the upper end of the filter screen cover.
As a still further scheme of the invention: the fan shell comprises a shell bottom plate, a round shell cylinder is fixedly connected to the middle of the upper end of the shell bottom plate, a plurality of first fins are fixedly connected to the outer side of the round shell cylinder and located at the upper end of the shell bottom plate, three connecting pieces are fixedly connected to the lower end of the inner side wall of the round shell cylinder, and an inner thread groove is formed in the upper end of the inner side wall of the round shell cylinder.
As a still further scheme of the invention: the heat dissipation motor is fixedly connected with the connecting sheet through a screw, and the lower end of the filter screen cover is meshed with the round shell through an internal thread groove.
As a still further scheme of the invention: the second water-cooling radiating component comprises a water-cooling bottom plate, one side of the water-cooling bottom plate is provided with a fixing strip through a screw fixedly connected with, the other end of the water-cooling bottom plate is provided with a plurality of second fins, a water-cooling flat tube is embedded between the water-cooling bottom plate and the fixing strip and is provided with a snap-gauge on the upper end fixedly connected with of the water-cooling bottom plate, and the snap-gauge is arranged under the lower end fixedly connected with of the water-cooling bottom plate, the front end fixedly connected with of the water-cooling flat tube is provided with a water return port, and the rear end fixedly connected with of the water-cooling flat tube is provided with a water inlet.
As a still further scheme of the invention: the upper end of the upper clamping plate is fixedly connected with the second fin heat dissipation plate through bolts, and the lower end of the upper clamping plate is fixedly connected with the circuit board body through bolts.
Compared with the prior art, the invention has the beneficial effects that:
the heat dissipation mechanism of the multilayer printed circuit board is composed of an air-cooled heat dissipation component, a first fin heat dissipation plate, a first water-cooled heat dissipation component, a second water-cooled heat dissipation component and a second fin heat dissipation plate, wherein, the heat dissipation motor of the air cooling heat dissipation component drives the axial fan blades to rotate at high speed, which can take away a large amount of heat from the upper part, the dust removal structure can remove dust from the filter screen cover to improve the air permeability, and the first fins of the fan shell can also dissipate heat from the upper part, meanwhile, the water-cooling flat pipes in the first water-cooling radiating component and the second water-cooling radiating component can take away a part of heat through circulating water, and the second fins can also radiate heat from the side surface, therefore, the radiating effect of the circuit board body can be greatly improved, the service life of the multilayer printed circuit board is prolonged, and the radiating mechanisms are formed by assembling, so that the circuit board is convenient to replace and install.
Drawings
FIG. 1 is a schematic diagram of a multi-layer printed circuit board for heat dissipation;
FIG. 2 is an exploded view of a heat dissipation mechanism of a multi-layered PCB for facilitating heat dissipation;
FIG. 3 is an exploded view of an air-cooled heat sink assembly of a multi-layer PCB to facilitate heat dissipation;
FIG. 4 is an exploded view of a dust removal structure of a multi-layered PCB for heat dissipation;
FIG. 5 is a schematic structural diagram of a fan housing in a multi-layer printed circuit board for heat dissipation;
fig. 6 is a schematic structural diagram of a second water-cooling heat dissipation assembly in a multi-layer printed circuit board for facilitating heat dissipation.
In the figure: 1. a circuit board body; 2. a heat dissipation mechanism; 21. an air-cooled heat dissipation assembly; 211. a fan housing; 2111. a housing floor; 2112. a cylindrical shell; 2113. an internal thread groove; 2114. connecting sheets; 2115. a first fin; 212. a heat dissipation motor; 213. axial flow fan blades; 214. a filter screen cover; 215. a dust removal structure; 2151. a cleaning brush; 2152. rotating the tube; 2153. cleaning the motor; 2154. fixing the ear; 22. a first fin heat dissipation plate; 23. a first water-cooling heat dissipation assembly; 24. a second water-cooling heat dissipation assembly; 241. water-cooling the bottom plate; 242. water-cooling flat pipes; 243. a fixing strip; 244. a water inlet; 245. an upper clamping plate; 246. a water return port; 247. a second fin; 248. a lower clamping plate; 25. a second finned heat dissipation plate; 3. mounting holes; 4. and (5) supporting the tube.
Detailed Description
Referring to fig. 1 to 6, in an embodiment of the present invention, a multilayer printed circuit board beneficial to heat dissipation includes a circuit board body 1, four corners of the circuit board body 1 are all provided with mounting holes 3, an upper end of the circuit board body 1 is provided with a heat dissipation mechanism 2, a lower end of the mounting hole 3 is fixedly connected with a support tube 4, the heat dissipation mechanism 2 includes an air-cooled heat dissipation assembly 21, one end of the air-cooled heat dissipation assembly 21 is fixedly connected with a first fin heat dissipation plate 22 through a screw, the other end of the air-cooled heat dissipation assembly 21 is fixedly connected with a second finned heat dissipation plate 25 through a screw, one side of the bottom end of the first finned heat dissipation plate 22 far away from the air-cooled heat dissipation assembly 21 is fixedly connected with a first water-cooled heat dissipation assembly 23 through a screw, and one side of the bottom end of the second fin radiating plate 25 far away from the air-cooled radiating assembly 21 is fixedly connected with a second water-cooled radiating assembly 24 through screws, and the first water-cooled radiating assembly 23 and the second water-cooled radiating assembly 24 have the same structure.
In fig. 3: the air-cooled heat dissipation assembly 21 includes a fan housing 211, a heat dissipation motor 212 is fixedly connected to the lower end of the inner side of the fan housing 211 through screws, a filter screen cover 214 is connected to the upper end of the inner side of the fan housing 211 in a meshed manner, axial flow fan blades 213 are fixedly connected to the output end of the heat dissipation motor 212, a dust removal structure 215 is arranged in the middle of the filter screen cover 214 in a penetrating manner, the axial flow fan blades 213 are driven to rotate through the heat dissipation motor 212, and therefore heat generated by the circuit board body 1 can be discharged from the filter screen cover 214.
In fig. 4: dust removal structure 215 includes clean motor 2153, the output of clean motor 2153 passes through cotter fixedly connected with swinging pipe 2152, and the three fixed ear 2154 of upper end fixedly connected with in the outside of clean motor 2153, the top fixedly connected with cleaning brush 2151 of swinging pipe 2152, it rotates to drive swinging pipe 2152 through clean motor 2153, swinging pipe 2152 drives cleaning brush 2151 and rotates, make cleaning brush 2151 use the center of filter screen lid 214 to rotate as the centre of a circle, and then detach the dust on the filter screen lid 214, improve the gas permeability of filter screen lid 214, and then can improve its radiating effect.
In fig. 3 and 4: the rotating pipe 2152 penetrates through the inner side of the filter screen cover 214, so that the rotating pipe 2152 can rotate on the inner side of the filter screen cover 214, the cleaning motor 2153 is located at the lower end of the filter screen cover 214, the fixing lugs 2154 are fixedly connected with the filter screen cover 214 through bolts, the cleaning motor 2153 can be firmly fixed at the lower end of the filter screen cover 214, the cleaning brush 2151 is located at the upper end of the filter screen cover 214, the cleaning brush 2151 can rotate around the center of the filter screen cover 214, the upper end of the filter screen cover 214 can be dedusted by the cleaning brush 2151, air permeability of the filter screen cover 214 is improved, and heat dissipation of the filter screen cover 214 is facilitated.
In fig. 5: the fan housing 211 comprises a housing bottom plate 2111, a round housing tube 2112 is fixedly connected to the middle of the upper end of the housing bottom plate 2111, a plurality of first fins 2115 are fixedly connected to the outer side of the round housing tube 2112 at the upper end of the housing bottom plate 2111, three connecting pieces 2114 are fixedly connected to the lower end of the inner side wall of the round housing tube 2112, and an internal thread groove 2113 is formed in the upper end of the inner side wall of the round housing tube 2112, so that a part of heat can be dissipated by the first fins 2115, and the fan housing 211 and the filter screen cover 214 are conveniently mounted and dismounted through the connecting pieces 2114 and the internal thread groove 2113.
In fig. 3 and 5: the heat dissipation motor 212 is fixedly coupled to the coupling piece 2114 by means of screws so that the heat dissipation motor 212 and the fan housing 211 can be securely mounted together, and the lower end of the filter cover 214 and the cylindrical case 2112 are engaged and coupled through the female screw slot 2113 so that the filter cover 214 and the fan housing 211 can be securely mounted together.
In fig. 6: the second water-cooling heat dissipation assembly 24 includes a water-cooling bottom plate 241, one side of the water-cooling bottom plate 241 is fixedly connected with a fixing strip 243 through screws, the other end of the water-cooling bottom plate 241 is provided with a plurality of second fins 247, a water-cooling flat tube 242 is embedded between the water-cooling bottom plate 241 and the fixing strip 243, an upper clamping plate 245 is fixedly connected to the upper end of the water-cooling bottom plate 241, a lower clamping plate 248 is fixedly connected to the lower end of the water-cooling bottom plate 241, the front end of the water-cooling flat tube 242 is fixedly connected with a water return port 246, and the rear end of the water-cooling flat tube 242 is fixedly connected with a water inlet 244, the water inlet 244 and the water return port 246 form a circulation closed loop with an external water pump and a water tank, cooling water continuously flows into and flows out of the water-cooling flat tube 242 to take away heat absorbed by the water-cooling bottom plate 241, meanwhile, the second fins 247 can also dissipate a part of heat, and further greatly improve the heat dissipation effect.
In fig. 2 and 6: go up cardboard 245's upper end and pass through bolt and second fin heating panel 25 fixed connection to can be in the same place second water-cooling radiating component 24 and second fin heating panel 25 are installed, go up cardboard 245's lower extreme and pass through bolt and circuit board body 1 fixed connection, thereby can be in the same place second water-cooling radiating component 24 and circuit board body 1 are installed, be convenient for dismantle and install it.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.
Claims (6)
1. The utility model provides a do benefit to radiating multilayer printed circuit board, includes circuit board body (1), mounting hole (3) have all been seted up in the four corners of circuit board body (1), a serial communication port, heat dissipation mechanism (2) are installed to the upper end of circuit board body (1), lower extreme fixedly connected with stay tube (4) of mounting hole (3), heat dissipation mechanism (2) are including forced air cooling radiator unit (21), first fin heating panel (22) of screw fixedly connected with is passed through to the one end of forced air cooling radiator unit (21), and the other end of forced air cooling radiator unit (21) passes through screw fixedly connected with second fin heating panel (25), one side that forced air cooling radiator unit (21) was kept away from to the bottom of first fin heating panel (22) is through first water-cooling radiator unit (23) of screw fixedly connected with, and one side that forced air cooling radiator unit (21) was kept away from to the bottom of second fin heating panel (25) is passed through screw fixedly connected with second water-cooling radiator unit (25) (24) The first water-cooling heat dissipation component (23) and the second water-cooling heat dissipation component (24) have the same structure, the air-cooled heat dissipation assembly (21) comprises a fan shell (211), the lower end of the inner side of the fan shell (211) is fixedly connected with a heat dissipation motor (212) through a screw, the upper end of the inner side of the fan shell (211) is engaged with a filter screen cover (214), the output end of the heat dissipation motor (212) is fixedly connected with an axial flow fan blade (213), a dust removing structure (215) penetrates through the middle part of the filter screen cover (214), the dust removing structure (215) comprises a cleaning motor (2153), the output end of the cleaning motor (2153) is fixedly connected with a rotating pipe (2152) through a pin key, and the upper end of the outer side of the cleaning motor (2153) is fixedly connected with three fixing lugs (2154), and the top end of the rotating pipe (2152) is fixedly connected with a cleaning brush (2151).
2. The multi-layered printed circuit board facilitating heat dissipation according to claim 1, wherein the rotating pipe (2152) penetrates through an inner side of the screen cover (214), the cleaning motor (2153) is located at a lower end of the screen cover (214), the fixing lug (2154) is fixedly connected to the screen cover (214) by a bolt, and the cleaning brush (2151) is located at an upper end of the screen cover (214).
3. The multilayer printed circuit board facilitating heat dissipation according to claim 1, wherein the fan housing (211) comprises a housing bottom plate (2111), a round housing tube (2112) is fixedly connected to the middle of the upper end of the housing bottom plate (2111), a plurality of first fins (2115) are fixedly connected to the outer side of the round housing tube (2112) at the upper end of the housing bottom plate (2111), three connecting pieces (2114) are fixedly connected to the lower end of the inner side wall of the round housing tube (2112), and an inner thread groove (2113) is formed in the upper end of the inner side wall of the round housing tube (2112).
4. The multilayer printed circuit board facilitating heat dissipation according to claim 1, wherein the heat dissipation motor (212) is fixedly connected with the connection piece (2114) through a screw, and the lower end of the filter screen cover (214) is engaged with the cylindrical shell (2112) through an internal thread groove (2113).
5. The multilayer printed circuit board facilitating heat dissipation according to claim 1, wherein the second water-cooling heat dissipation assembly (24) comprises a water-cooling bottom plate (241), one side of the water-cooling bottom plate (241) is fixedly connected with a fixing strip (243) through screws, the other end of the water-cooling bottom plate (241) is provided with a plurality of second fins (247), a water-cooling flat pipe (242) is embedded between the water-cooling bottom plate (241) and the fixing strip (243), the upper end of the water-cooling bottom plate (241) is fixedly connected with an upper clamping plate (245), the lower end of the water-cooling bottom plate (241) is fixedly connected with a lower clamping plate (248), the front end of the water-cooling flat pipe (242) is fixedly connected with a water return port (246), and the rear end of the flat pipe water-cooling (242) is fixedly connected with a water inlet (244).
6. The multilayer printed circuit board facilitating heat dissipation according to claim 5, wherein the upper end of the upper clamping plate (245) is fixedly connected with the second finned heat dissipation plate (25) through a bolt, and the lower end of the upper clamping plate (245) is fixedly connected with the circuit board body (1) through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011576876.2A CN112867231B (en) | 2020-12-28 | 2020-12-28 | Do benefit to radiating multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011576876.2A CN112867231B (en) | 2020-12-28 | 2020-12-28 | Do benefit to radiating multilayer printed circuit board |
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| Publication Number | Publication Date |
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| CN112867231A CN112867231A (en) | 2021-05-28 |
| CN112867231B true CN112867231B (en) | 2022-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011576876.2A Active CN112867231B (en) | 2020-12-28 | 2020-12-28 | Do benefit to radiating multilayer printed circuit board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113677087A (en) * | 2021-08-20 | 2021-11-19 | 万安裕高电子科技有限公司 | High-heat-dissipation SMT and processing method thereof |
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| CN211047721U (en) * | 2019-12-24 | 2020-07-17 | 佛山市顺德区恒迅电子有限公司 | Heat dissipation circuit board for fan |
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| TW556469B (en) * | 2002-08-20 | 2003-10-01 | Via Tech Inc | IC package with an implanted heat-dissipation fin |
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| CN204610006U (en) * | 2015-04-24 | 2015-09-02 | 江苏朗信电气有限公司 | A kind of automobile engine cooling fan controller |
| CN205491635U (en) * | 2016-04-06 | 2016-08-17 | 西安因变光电科技有限公司 | Power circuit board geomantic omen mixed cooling machine case |
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Effective date of registration: 20220802 Address after: 242299 No. 11, Guohua Road, Guangde Economic Development Zone, Xuancheng City, Anhui Province Patentee after: Guangde Zhanxin Electronic Technology Co.,Ltd. Address before: No.7, Wenhui Road, economic development zone, Wangjiang County, Anqing City, Anhui Province 246200 Patentee before: Anhui Zhanxin Electronic Co.,Ltd. |