CN218601765U - Built-in liquid cooling structure of Internet of things server - Google Patents

Abstract

The utility model provides a built-in liquid cooling structure of thing networking server relates to server technical field, comprising a main body, the surface of main part is equipped with cooling frame, and cooling frame and main part swing joint, and cooling frame runs through the main part surface, cooling frame's inboard is equipped with the circulating pipe, cooling frame's inboard array is equipped with hollow fin, and hollow fin and circulating pipe connection, be equipped with the backup pad between hollow fin and the circulating pipe, be equipped with the heat dissipation fan between the backup pad, after the circulating pipe has absorbed the heat in the main part, in the coolant liquid got into hollow fin, make coolant liquid and external area of contact increase in the hollow fin, then under the work of heat dissipation fan, the coolant liquid has obtained quick cooling, and the cooling efficiency of coolant liquid has been strengthened to this kind of design, and the specific heat capacity of coolant liquid is great, can absorb a large amount of heats, has improved thing networking server's radiating efficiency.

Description

A built-in liquid cooling structure for IoT servers

technical field

The utility model relates to the technical field of servers, in particular to a built-in liquid cooling structure of an Internet of Things server.

Background technique

With the continuous development of the Internet era, servers, as the core of Internet development, have attracted more and more attention from the public. Excessive heat generated by the server during work will affect the performance of the server. Therefore, it is necessary to dissipate heat inside the server. Usually, a cooling fan is installed inside the server to dissipate heat from high-power devices and the entire machine.

According to the patent No. CN209590757U, a self-cooling and heat dissipation structure of a server is disclosed, which includes a chassis and a base. The bottom of the chassis is arranged on the base through a grid plate, and vents are provided on the peripheral side walls of the base. The casing is respectively provided with a heat insulation board and a heat conduction plate from bottom to top. And the upper side wall is provided with cooling holes, and the aperture size of the guide holes is smaller than the aperture size of the cooling holes. Change the layout of modules such as the power supply and main board in the existing server to the upper and lower structure layout. According to the principle of hot air rising, the hot air around the heating modules such as the upper main board transfers heat through the heat conducting plate and dissipates heat through the cooling holes on the chassis. The formed self-suction force allows cold air to enter from the vents of the base; in addition, when the temperature inside the chassis is too high, the fan can be used to supplement the cooling of the chassis to improve the cooling efficiency.

Most of the heat dissipation of existing IoT servers is to open a heat dissipation port on the main body surface, and then set a cooling fan inside the server to dissipate heat from high-power devices and the whole machine. This cooling method has poor heat dissipation efficiency, making the IoT server The heat dissipation effect is poor.

Utility model content

The purpose of the utility model is to solve the shortcomings in the prior art, and propose a built-in liquid cooling structure of an Internet of Things server.

In order to achieve the above purpose, the utility model adopts the following technical solution: a built-in liquid cooling structure of an Internet of Things server, including a main body, a cooling frame is provided on the surface of the main body, and the cooling frame is movably connected with the main body, and the cooling frame runs through On the surface of the main body, circulation pipes are provided on the inner side of the cooling frame, hollow fins are arranged on the inner side of the cooling frame, and the hollow fins are connected to the circulation pipes, and a support plate is provided between the hollow fins and the circulation pipes , a cooling fan is arranged between the support plates.

Preferably, a guide plate is provided on the back of the main body, and a dust-proof plate is provided between the guide plates, and the dust-proof plate is movably connected with the guide plate, and the dust-proof plate runs through the back of the main body, and the bottom end of the guide plate is provided with a limit plate, and the limiting plate is connected with the main body.

Preferably, connecting pipes are provided between the hollow fins, and the connecting pipes run through the hollow fins, and the connecting pipes are alternately arranged between the hollow fins.

Preferably, the surface of the circulation pipe is provided with a heat absorbing plate, and the heat absorbing plate is made of copper sheet stamping and grinding.

Preferably, a circulation pump is provided in the cooling frame, and the output end and the input end of the circulation pump are respectively connected with the hollow fins and the circulation pipe.

Preferably, the surface array of the cooling frame is provided with cooling holes, and the cooling holes run through the surface of the cooling frame.

Beneficial effect

In the utility model, circulation pipes and hollow fins are arranged in the cooling frame. After the circulation pipe absorbs the heat in the main body, the cooling liquid enters the hollow fins, which increases the contact area between the cooling liquid in the hollow fins and the outside world. Large, and then under the work of the cooling fan, the coolant is cooled quickly. This design enhances the cooling efficiency of the coolant, and the specific heat capacity of the coolant is large, which can absorb a large amount of heat and improve the heat dissipation efficiency of the IoT server. .

Description of drawings

Fig. 1 is a side view of the utility model;

Fig. 2 is the internal structure figure of the utility model;

Fig. 3 is the rear view of the utility model;

Fig. 4 is a sectional view of the utility model.

illustration:

1. Dustproof plate; 2. Main body; 3. Cooling frame; 4. Radiation outlet; 5. Circulation pipe; 6. Heat absorption plate; 7. Hollow fin; 8. Connecting pipe; 9. Circulation pump; 10. Guide plate ; 11, limit plate; 12, support plate; 13, cooling fan.

Detailed ways

In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific embodiments and accompanying drawings, but the following embodiments are only preferred embodiments of the utility model , not all. Based on the examples in the implementation manners, other examples obtained by those skilled in the art without making creative efforts all belong to the protection scope of the present utility model.

Describe the specific embodiment of the utility model below in conjunction with accompanying drawing.

Specific examples:

Referring to Figures 1-4, a built-in liquid cooling structure of an Internet of Things server includes a main body 2, that is, the main body of an Internet of Things server. The surface of the main body 2 is provided with a cooling frame 3, and the cooling frame 3 is movably connected with the main body 2, and the cooling The frame 3 runs through the surface of the main body 2, the inside of the cooling frame 3 is provided with a circulation pipe 5, and the inside array of the cooling frame 3 is provided with hollow fins 7, and the hollow fins 7 are connected with the circulation pipe 5, and the hollow fins 7 are connected with the circulation pipe 5 Support plates 12 are arranged between them, and cooling fans 13 are arranged between the support plates 12 .

The back of the main body 2 is provided with a guide plate 10, and a dust-proof plate 1 is arranged between the guide plates 10, and the dust-proof plate 1 is movably connected with the guide plate 10, and the dust-proof plate 1 runs through the back of the main body 2, and the bottom end of the guide plate 10 is provided with a limit plate 11, and the limiting plate 11 is connected with the main body 2. Connecting pipes 8 are arranged between the hollow fins 7 , and the connecting pipes 8 pass through the hollow fins 7 , and the connecting pipes 8 are alternately arranged between the hollow fins 7 . The surface of the circulation pipe 5 is provided with a heat absorbing plate 6, and the heat absorbing plate 6 is formed by punching and grinding copper sheets. A circulation pump 9 is arranged inside the cooling frame 3 , and the output end and the input end of the circulation pump 9 are respectively connected with the hollow fin 7 and the circulation pipe 5 . The surface array of the cooling frame 3 is provided with cooling holes 4 , and the cooling holes 4 run through the surface of the cooling frame 3 .

The working principle of the utility model: after the cooling frame 3 slides into the main body 2, the heat-absorbing plate 6 is close to the device inside the main body 2, and then driven by the circulation pump 9, the cooling liquid circulates in the circulation pipe 5 and the hollow fin 7 The cooling fan 13 blows and cools the hollow fins 7. When the cooling fan radiates heat, the external air enters the main body 2 through the dustproof plate 1, and the dust in the air is intercepted, preventing the dust from entering the main body 2 and causing damage. The cooling frame 3 is provided with a circulation pipe 5 and a hollow fin 7. When the circulation pipe 5 absorbs the heat in the main body 2, the cooling liquid enters the hollow fin 7, so that the cooling liquid in the hollow fin 7 contacts with the outside world The area increases, and then under the work of the cooling fan 13, the coolant is cooled rapidly. This design enhances the cooling efficiency of the coolant, and the specific heat capacity of the coolant is large, which can absorb a large amount of heat and improve the performance of the IoT server. cooling efficiency.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "below" a second feature may include direct contact between the first and second features, and may also include the first and second features being in direct contact with each other. The features are not in direct contact but through another feature between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the industry should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions are only preferred examples of the utility model, and are not used to limit the utility model. Without departing from the utility model Under the premise of the spirit and scope, the utility model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.

Claims (6)

1. The utility model provides a built-in liquid cooling structure of thing networking server, includes main part (2), its characterized in that: the surface of main part (2) is equipped with cooling frame (3), and cooling frame (3) and main part (2) swing joint, and cooling frame (3) run through main part (2) surface, the inboard of cooling frame (3) is equipped with circulating pipe (5), the inboard array of cooling frame (3) is equipped with hollow fin (7), and hollow fin (7) and circulating pipe (5) are connected, be equipped with backup pad (12) between hollow fin (7) and circulating pipe (5), be equipped with heat dissipation fan (13) between backup pad (12), the back of main part (2) is equipped with baffle (10), be equipped with dust guard (1) between baffle (10), and dust guard (1) and baffle (10) swing joint.

2. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: the dust guard (1) runs through the back of main part (2), the bottom of baffle (10) is equipped with limiting plate (11), and limiting plate (11) are connected with main part (2).

3. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: connecting pipes (8) are arranged between the hollow fins (7), the connecting pipes (8) penetrate through the hollow fins (7), and the connecting pipes (8) are alternately arranged among the hollow fins (7).

4. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: the surface of the circulating pipe (5) is provided with a heat absorbing plate (6), and the heat absorbing plate (6) is formed by punching and polishing a copper sheet.

5. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: a circulating pump (9) is arranged in the cooling frame (3), and the output end and the input end of the circulating pump (9) are respectively connected with the hollow fins (7) and the circulating pipe (5).

6. The built-in liquid cooling structure of the server of the internet of things of claim 1, characterized in that: the surface of the cooling frame (3) is provided with heat dissipation ports (4) in an array mode, and the heat dissipation ports (4) penetrate through the surface of the cooling frame (3).

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