CN218601765U

CN218601765U - Built-in liquid cooling structure of Internet of things server

Info

Publication number: CN218601765U
Application number: CN202221934949.5U
Authority: CN
Inventors: 魏成勇
Original assignee: Wuhan Minghang Xinshiji Technology Co ltd
Current assignee: Wuhan Minghang Xinshiji Technology Co ltd
Priority date: 2022-07-21
Filing date: 2022-07-21
Publication date: 2023-03-10
Anticipated expiration: 2032-07-21

Abstract

The utility model provides a built-in liquid cooling structure of thing networking server relates to server technical field, comprising a main body, the surface of main part is equipped with cooling frame, and cooling frame and main part swing joint, and cooling frame runs through the main part surface, cooling frame's inboard is equipped with the circulating pipe, cooling frame's inboard array is equipped with hollow fin, and hollow fin and circulating pipe connection, be equipped with the backup pad between hollow fin and the circulating pipe, be equipped with the heat dissipation fan between the backup pad, after the circulating pipe has absorbed the heat in the main part, in the coolant liquid got into hollow fin, make coolant liquid and external area of contact increase in the hollow fin, then under the work of heat dissipation fan, the coolant liquid has obtained quick cooling, and the cooling efficiency of coolant liquid has been strengthened to this kind of design, and the specific heat capacity of coolant liquid is great, can absorb a large amount of heats, has improved thing networking server's radiating efficiency.

Description

Built-in liquid cooling structure of Internet of things server

Technical Field

The utility model relates to a server technical field especially relates to a built-in liquid cooling structure of thing networking server.

Background

With the continuous development of the internet era, the server is more and more concerned as the core of the internet development. The performance of the server is affected by excessive heat generated by the server during the working process, so that the inside of the server needs to be subjected to heat dissipation treatment, and a heat dissipation fan is usually arranged inside the server to perform heat dissipation treatment on a high-power device and a whole machine.

A self-cooling heat radiation structure of server is disclosed according to patent No. CN209590757U, including quick-witted case, base chassis bottom is in through grid tray setting on the base, be equipped with the vent on the peripheral lateral wall of base, quick-witted incasement is provided with from bottom to top respectively through heat insulating board, heat-conducting plate, the heat insulating board sets up on the inner wall of chassis bottom both sides, be provided with the water conservancy diversion hole on the heat-conducting plate, be equipped with the louvre on machine roof portion and the upper portion lateral wall, the aperture size in water conservancy diversion hole is less than the aperture size of louvre. The layout mode of modules such as a power supply, a mainboard and the like in the existing server is changed into an up-down structural layout, according to the principle that hot air rises, the hot air around heating modules such as an upper mainboard and the like is subjected to heat transfer through a heat conducting plate and is radiated through radiating holes in a case, and cold air enters from a vent hole of a base under the action of self-suction force; in addition, when the temperature in the case is too high, the fan can be used for supplementing and radiating heat to the case, and the heat radiating efficiency is improved.

Most of existing internet-of-things servers are provided with radiating ports on the surfaces of main bodies, and then radiating fans are arranged inside the servers to carry out radiating treatment on high-power devices and the whole servers.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcomings existing in the prior art, and providing a built-in liquid cooling structure of a server of the Internet of things.

In order to realize the purpose, the utility model adopts the following technical scheme: the utility model provides a built-in liquid cooling structure of thing networking server, includes the main part, the surface of main part is equipped with cooling frame, and cooling frame and main part swing joint, and cooling frame runs through the main part surface, cooling frame's inboard is equipped with the circulating pipe, cooling frame's inboard array is equipped with hollow fin, and hollow fin and circulating pipe connection, be equipped with the backup pad between hollow fin and the circulating pipe, be equipped with the heat dissipation fan between the backup pad.

Preferably, the back of main part is equipped with the baffle, be equipped with the dust guard between the baffle, and dust guard and baffle swing joint, and the dust guard runs through the back of main part, the bottom of baffle is equipped with the limiting plate, and the limiting plate is connected with the main part.

Preferably, connecting pipes are arranged between the hollow fins and penetrate through the hollow fins, and the connecting pipes are arranged between the hollow fins in an alternating mode.

Preferably, the surface of the circulating pipe is provided with a heat absorbing plate, and the heat absorbing plate is formed by stamping and polishing a copper sheet.

Preferably, a circulating pump is arranged in the cooling frame, and the output end and the input end of the circulating pump are respectively connected with the hollow fins and the circulating pipe.

Preferably, the surface array of the cooling frame is provided with heat dissipation ports, and the heat dissipation ports penetrate through the surface of the cooling frame.

Advantageous effects

The utility model discloses in, be equipped with circulating pipe and hollow fin in cooling frame, after the heat in the main part has been absorbed to the circulating pipe, in the coolant liquid got into hollow fin, made coolant liquid and external area of contact increase in the hollow fin, then under the work of heat dissipation fan, the coolant liquid has obtained quick cooling, and the cooling efficiency of coolant liquid has been strengthened to this kind of design, and the specific heat capacity of coolant liquid is great, can absorb a large amount of heats, has improved the radiating efficiency of thing networking server.

Drawings

FIG. 1 is an isometric view of the present invention;

FIG. 2 is an internal structural view of the present invention;

fig. 3 is a rear view of the present invention;

fig. 4 is a sectional view of the present invention.

Illustration of the drawings:

1. a dust-proof plate; 2. a main body; 3. a cooling frame; 4. a heat dissipation port; 5. a circulation pipe; 6. a heat absorbing plate; 7. hollow fins; 8. a connecting pipe; 9. a circulation pump; 10. a guide plate; 11. a limiting plate; 12. a support plate; 13. a heat dissipation fan.

Detailed Description

In order to make the technical means, creation features, achievement objects and functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-4, a built-in liquid cooling structure of an internet of things server comprises a main body 2, namely, the main body of the internet of things server, a cooling frame 3 is arranged on the surface of the main body 2, the cooling frame 3 is movably connected with the main body 2, the cooling frame 3 penetrates through the surface of the main body 2, a circulating pipe 5 is arranged on the inner side of the cooling frame 3, hollow fins 7 are arranged on the inner side of the cooling frame 3 in an array mode, the hollow fins 7 are connected with the circulating pipe 5, a supporting plate 12 is arranged between the hollow fins 7 and the circulating pipe 5, and a heat dissipation fan 13 is arranged between the supporting plates 12.

The back of main part 2 is equipped with baffle 10, is equipped with dust guard 1 between the baffle 10, and dust guard 1 and baffle 10 swing joint, and dust guard 1 runs through the back of main part 2, and the bottom of baffle 10 is equipped with limiting plate 11, and limiting plate 11 is connected with main part 2. Connecting pipes 8 are arranged between the hollow fins 7, the connecting pipes 8 penetrate through the hollow fins 7, and the connecting pipes 8 are alternately arranged between the hollow fins 7. The surface of the circulating pipe 5 is provided with a heat absorbing plate 6, and the heat absorbing plate 6 is formed by punching and polishing a copper sheet. A circulating pump 9 is arranged in the cooling frame 3, and the output end and the input end of the circulating pump 9 are respectively connected with the hollow fins 7 and the circulating pipe 5. The surface of the cooling frame 3 is provided with heat dissipation ports 4 in an array manner, and the heat dissipation ports 4 penetrate through the surface of the cooling frame 3.

The utility model discloses a theory of operation: after cooling frame 3 slided into main part 2, the inside device of main part 2 is hugged closely to absorber plate 6, then under the drive of circulating pump 9, the coolant liquid is at circulating pipe 5 and hollow fin 7 inner loop flow, radiator fan 13 carries out the heat dissipation of blowing to hollow fin 7 again, when radiator fan dispels the heat, outside air gets into main part 2 through dust guard 1, dust in the air is intercepted, prevented that the dust from getting into and causing the harm in main part 2, be equipped with circulating pipe 5 and hollow fin 7 in cooling frame 3, after the heat in main part 2 has been absorbed to circulating pipe 5, the coolant liquid gets into in hollow fin 7, make the coolant liquid in hollow fin 7 and external area of contact increase, then under radiator fan 13's work, the coolant liquid has obtained quick cooling, the cooling efficiency of coolant liquid has been strengthened to this design, and the specific heat capacity of coolant liquid is great, can absorb a large amount of heat, the radiating efficiency of the thing networking of server has been improved.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only the preferred embodiments of the present invention, and is not intended to limit the present invention, and that there may be various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a built-in liquid cooling structure of thing networking server, includes main part (2), its characterized in that: the surface of main part (2) is equipped with cooling frame (3), and cooling frame (3) and main part (2) swing joint, and cooling frame (3) run through main part (2) surface, the inboard of cooling frame (3) is equipped with circulating pipe (5), the inboard array of cooling frame (3) is equipped with hollow fin (7), and hollow fin (7) and circulating pipe (5) are connected, be equipped with backup pad (12) between hollow fin (7) and circulating pipe (5), be equipped with heat dissipation fan (13) between backup pad (12), the back of main part (2) is equipped with baffle (10), be equipped with dust guard (1) between baffle (10), and dust guard (1) and baffle (10) swing joint.

2. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: the dust guard (1) runs through the back of main part (2), the bottom of baffle (10) is equipped with limiting plate (11), and limiting plate (11) are connected with main part (2).

3. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: connecting pipes (8) are arranged between the hollow fins (7), the connecting pipes (8) penetrate through the hollow fins (7), and the connecting pipes (8) are alternately arranged among the hollow fins (7).

4. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: the surface of the circulating pipe (5) is provided with a heat absorbing plate (6), and the heat absorbing plate (6) is formed by punching and polishing a copper sheet.

5. The built-in liquid cooling structure of the server of the internet of things according to claim 1, wherein: a circulating pump (9) is arranged in the cooling frame (3), and the output end and the input end of the circulating pump (9) are respectively connected with the hollow fins (7) and the circulating pipe (5).

6. The built-in liquid cooling structure of the server of the internet of things of claim 1, characterized in that: the surface of the cooling frame (3) is provided with heat dissipation ports (4) in an array mode, and the heat dissipation ports (4) penetrate through the surface of the cooling frame (3).