CN216848678U - Built-in radiator of notebook computer - Google Patents
Built-in radiator of notebook computer Download PDFInfo
- Publication number
- CN216848678U CN216848678U CN202123392333.8U CN202123392333U CN216848678U CN 216848678 U CN216848678 U CN 216848678U CN 202123392333 U CN202123392333 U CN 202123392333U CN 216848678 U CN216848678 U CN 216848678U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- conducting plate
- radiator
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a built-in radiator of a notebook computer, which relates to the technical field of computer radiators and comprises a heat conducting plate and a heat pipe; a fixing groove is formed on the heat conducting plate, and at least one part of the heat pipe is embedded in the fixing groove of the heat conducting plate; at least one side inner wall of the fixing groove is provided with a fixing convex position which can be embedded into the surface of the heat pipe. The utility model mainly solves the problem that the heat pipe of the built-in radiator of the notebook computer is easy to be dislocated from the fixed groove of the heat conducting plate; the built-in radiator of the notebook computer can better fix the heat conducting plate and the heat pipe through the fixing convex position, so that the heat pipe is not easy to dislocate, and the performance and the service life of the built-in radiator of the notebook computer are improved.
Description
Technical Field
The utility model relates to a computer radiator technical field specifically is a built-in radiator of notebook computer.
Background
The notebook computer has the characteristics of portability, capability of being separated from a power supply for a period of time, capability of realizing mobile office and high integration level.
The performance of the notebook computer has gradually leveled up the desktop computer, along with the enhancement of the performance, the heat productivity of the central processing unit and the display core is also increased, and the built-in radiators at the heat sources such as the central processing unit and the display core of the notebook computer have become standard configurations.
The heat-conducting plate presses the heat pipe on heat sources such as a central processing unit and a display core, and the heat pipe is forced to be in contact with the heat source, so that the heat pipe can absorb heat from the heat source.
The built-in radiator of the notebook computer with the structure is characterized in that a fixing groove is punched at the position of the heat conduction plate, a circular or oval heat pipe is placed in the fixing groove, the heat pipe is beaten by a punching machine and is flat, so that the heat pipe is fixed in the fixing groove of the heat conduction plate, the surface of the heat pipe is flush with the bottom surface of the heat conduction plate, a plane which can be in close contact with a heat source is formed, and the heat conduction plate and the heat pipe are welded into a whole in a reflow soldering mode.
According to the built-in radiator of the notebook computer with the structure, as the fixing structure is not arranged between the heat pipe and the fixing groove of the heat conducting plate, after the built-in radiator is used for a long time, the heat pipe is easy to dislocate from the fixing groove of the heat conducting plate, so that the performance and the service life of the built-in radiator of the notebook computer are reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a built-in radiator of notebook computer, its heat pipe is difficult for taking off a position from the fixed slot of heat-conducting plate.
In order to achieve the above object, the utility model provides a following technical scheme: a built-in radiator of a notebook computer comprises a heat conducting plate and a heat pipe; a fixing groove is formed on the heat conducting plate, and at least one part of the heat pipe is embedded in the fixing groove of the heat conducting plate; and a fixing convex position capable of being embedded into the surface of the heat pipe is formed on the inner side wall of at least one surface of the fixing groove.
In the technical scheme, the inner side walls of the two sides of the fixing groove are both provided with fixing convex positions.
In the technical scheme, the fixed convex positions are arranged on the inner side wall of the fixed groove at equal intervals and are 2-5.
In the above technical solution, the fixing convex positions on the inner side walls of the two sides of the fixing groove are opposite to each other or are staggered with each other.
In the technical scheme, the heat-conducting plate is in the two sides of the fixing groove form first contact planes, the heat pipe faces away from one side of the heat-conducting plate is a second contact plane, and the first contact plane of the heat-conducting plate is flush with the second contact plane of the heat pipe.
In the above technical solution, a surface of the heat pipe facing the heat conducting plate is a third contact plane, and the third contact plane of the heat pipe is in close contact with a groove bottom of the fixing groove of the heat conducting plate.
In the above technical solution, a surface of the heat pipe contacting with an inner side wall of the fixing groove of the heat conducting plate is a fixing side surface, and the fixing protrusion is embedded into a surface of the fixing side surface of the heat pipe.
In the above technical scheme, the heat conducting plate forms mounting wings on both sides of the first contact plane respectively, and the mounting wings are provided with screw holes.
In the above technical solution, at least one end of the heat pipe is bent to form a bent portion.
Compared with the prior art, the beneficial effects of the utility model are that: this kind of built-in radiator of note this computer, the heat pipe embedding is in the fixed slot of heat-conducting plate, is formed with the fixed protruding position that can imbed the heat pipe surface on the inside wall of fixed slot, can fix heat-conducting plate and heat pipe better through fixed protruding position, makes the difficult dislocation of heat pipe, has improved the performance and the life of this kind of built-in radiator of note this computer.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is an exploded view of the present invention.
Fig. 3 is a perspective view of the present invention in another direction.
Fig. 4 is an exploded view of the present invention in another orientation.
Fig. 5 is a partially enlarged view a in fig. 4.
The reference signs are: 1. a heat conducting plate; 11. fixing grooves; 12. an inner sidewall; 13. fixing the convex position; 14. the bottom of the tank; 15. a first contact plane; 16. installing wings; 17. screw holes; 2. a heat pipe; 21. a second contact plane; 22. a fixed side; 23. a third contact plane; 24. a bending part.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 5, a heat sink built in a notebook computer includes a heat conducting plate 1 and a heat pipe 2.
The heat conducting plate 1 is a metal plate with good heat conductivity coefficient, such as an aluminum alloy plate or a copper plate; the heat pipe 2 is strip-shaped and has a copper shell, and the shell is filled with a refrigerant, so that the heat pipe 2 can rapidly absorb external heat and rapidly and uniformly distribute the heat in each part of the heat pipe.
The heat conducting plate 1 is formed with a fixing groove 11, in this embodiment, the fixing groove 11 is a strip-shaped groove formed by stamping, and at least a part of the heat pipe 2 is embedded in the fixing groove 11 of the heat conducting plate 1.
A fixing protrusion 13 capable of being fitted into the surface of the heat pipe 2 is formed on at least one inner sidewall 12 of the fixing groove 11.
In the present embodiment, a frame-shaped notch is cut in the side wall of the fixing groove 11, and the portion of the side wall of the fixing groove 11 is pushed into the inside of the fixing groove 11 along the notch, that is, the fixing protrusion 13 is formed on the inner side wall 12 of the fixing groove 11, and the fixing protrusion 13 formed in this way is in a hook shape.
In other possible embodiments, the fixing projections 13 are formed integrally with the plate 1 by die-casting or machining, and the fixing projections 13 formed in this way may be hook-shaped, or may be truncated, circular, arched or tapered.
Further, the fixing protrusions 13 are formed on both inner sidewalls 12 of the fixing groove 11, so that the fixing protrusions 13 can be fitted into at least both surfaces of the heat pipe 2.
Further, the number of the fixing protrusions 13 is 2-5, and in this embodiment, three fixing protrusions 13 are equidistantly arranged on the inner side wall 12 of the fixing groove 11.
In this embodiment, the fixing protrusions 13 on the inner side walls 12 of the fixing grooves 11 are opposite to each other, that is, the three fixing protrusions 13 on the inner side walls 12 of each of the fixing grooves 11 are aligned with each other.
In other possible embodiments, the fixing protrusions 13 on the inner sidewalls 12 of the fixing grooves 11 are offset from each other.
Specifically, the surface of the heat pipe 2 contacting the inner wall 12 of the fixing groove 11 of the heat conducting plate 1 is a fixing side surface 22, and the fixing protrusion 13 is embedded into the surface of the fixing side surface 22 of the heat pipe 2.
Further, the heat conducting plate 1 forms the first contact plane 15 on both sides of the fixing groove 11, the side of the heat pipe 2 facing away from the heat conducting plate 1 is the second contact plane 21, the first contact plane 15 of the heat conducting plate 1 is flush with the second contact plane 21 of the heat pipe 2, and the first contact plane 15 of the heat conducting plate 1 and the second contact plane 21 of the heat pipe 2 can be in close contact with the heat source.
Further, the surface of the heat pipe 2 facing the heat conducting plate 1 is a third contact plane 23, the third contact plane 23 of the heat pipe 2 is in close contact with the groove bottom 14 of the fixing groove 11 of the heat conducting plate 1, and the heat absorbed by the heat conducting plate 1 can be conducted from the fixing groove 11 and the groove bottom 14 to the third contact plane 23 of the heat pipe 2, so that the heat pipe 2 absorbs the part of the heat.
Specifically, the heat conducting plate 1 forms mounting wings 16 on two sides of the first contact plane 15, and the mounting wings 16 are provided with screw holes 17 for facilitating the mounting of the heat conducting plate 1.
Further, at least one end of the heat pipe 2 is bent to form a bent portion 24, the bent portion 24 is pre-bent before the heat pipe 2 is assembled with the heat conducting plate 1, in this embodiment, both ends of the heat pipe 2 are bent to form the bent portion 24.
When the built-in radiator of the notebook computer is manufactured, a heat conduction plate 1 and a heat pipe 2 are respectively prefabricated; when the heat conducting plate 1 is manufactured, a stamping device is used for stamping a fixing groove 11 and a mounting wing 16, wherein the part which is not stamped is a first contact plane 15, then a side wall of the fixing groove 11 is cut into a door frame-shaped notch, the part of the side wall of the fixing groove 11 is pushed towards the inner side of the fixing groove 11 along the notch, and a fixing convex position 13 is formed on an inner side wall 12 of the fixing groove 11; the unassembled heat pipe 2 is circular or elliptical, and two ends of the heat pipe 2 are respectively pre-bent to form two bent parts 24; placing a heat conduction plate 1 on a jig, placing a heat pipe 2 on a fixing groove 11 of the heat conduction plate 1, fixing the part of the heat pipe 2 exposed out of the fixing groove 11 of the heat conduction plate 1 by using the jig, beating the heat pipe 2 by using a punching machine, and beating the heat pipe 2 to be flat, so that the heat pipe 2 is fixed in the fixing groove 11 of the heat conduction plate 1; at this time, due to the limitation of the fixing groove 11, a third contact plane 23 is formed on one surface of the heat pipe 2 facing the heat conducting plate 1 and is tightly contacted with the groove bottom 14 of the fixing groove 11 of the heat conducting plate 1, meanwhile, a fixing side surface 22 is formed on the surface of the heat pipe 2 contacted with the inner side wall 12 of the fixing groove 11 of the heat conducting plate 1, and the heat pipe 2 is deformed under the extrusion of a punching machine, so that the outer wall of the fixing side surface 22 of the heat pipe 2 wraps each fixing convex part 13, and an effect that the fixing convex part 13 is embedded into the surface of the fixing side surface 22 of the heat pipe 2 is formed; under the beating of the punching machine, one side of the heat pipe 2, which is back to the heat conducting plate 1, forms a second contact plane 21, and the second contact plane 21 is flush with the first contact plane 15 of the heat conducting plate 1; and finally, welding the combination of the heat conducting plate 1 and the heat pipe 2 into a whole in a reflow soldering mode, thus forming the complete built-in radiator of the notebook computer.
When the built-in radiator of the notebook computer is applied to the notebook computer, the first contact plane 15 of the heat conduction plate 1 and the second contact plane 21 of the heat pipe 2 are contacted with heat sources such as a central processing unit or a display core of the notebook computer, heat conduction silicone grease is coated between the first contact plane and the second contact plane, and a screw penetrates through a screw hole 17 on an installation wing 16 of the heat conduction plate 1 and then is locked into a mainboard of the notebook computer, so that the built-in radiator of the notebook computer and the mainboard of the notebook computer are fixed; the two bent parts 24 of the heat pipe 2 can be in contact with other heat sources such as memory particles of the notebook computer, so as to absorb heat for the other heat sources, or can surround the turbine type heat dissipation fan of the notebook computer after the fins are arranged, and the heat pipe 2 is dissipated through the air outlet of the turbine type heat dissipation fan, so as to dissipate heat for the heat sources.
When the heat source generates heat, the second contact plane 21 of the heat pipe 2 directly absorbs heat from the heat source, the first contact plane 15 of the heat conduction plate 1 also absorbs heat from the heat source, and part of the heat is conducted to the third contact plane 23 of the heat pipe 2 through the groove bottom 14 of the fixing groove 11; the heat pipes 2 can distribute heat in each part of the heat pipes rapidly and evenly, and the air outlet of the turbine type cooling fan of the notebook computer can dissipate heat of the heat pipes 2, so that heat of a heat source is dissipated.
This kind of built-in radiator of note book computer, heat pipe 2 embedding are formed with the fixed protruding position 13 that can imbed into heat pipe 2 surface in the fixed slot 11 of heat-conducting plate 1 on the inside wall 12 of fixed slot 11, can fix heat-conducting plate 1 and heat pipe 2 better through fixed protruding position 13, make heat pipe 2 be difficult for dislocating, have improved the performance and the life of this kind of built-in radiator of note book computer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A built-in radiator of a notebook computer comprises a heat conducting plate and a heat pipe; a fixing groove is formed on the heat conducting plate, and at least one part of the heat pipe is embedded in the fixing groove of the heat conducting plate; it is characterized in that the preparation method is characterized in that,
and a fixing convex position capable of being embedded into the surface of the heat pipe is formed on the inner side wall of at least one surface of the fixing groove.
2. The built-in radiator of the notebook computer according to claim 1, wherein: fixed convex positions are formed on the inner side walls of the two sides of the fixed groove.
3. The built-in radiator of the notebook computer according to claim 1 or 2, characterized in that: the fixed convex positions are arranged on the inner side wall of the fixed groove at equal intervals and are 2-5.
4. The built-in radiator of the notebook computer according to claim 2, wherein: the fixing convex positions on the inner side walls of the two sides of the fixing groove are opposite to each other or staggered with each other.
5. The built-in radiator of the notebook computer according to claim 1, wherein: the heat-conducting plate is in the both sides of fixed slot form first contact plane, the heat pipe dorsad the one side of heat-conducting plate is second contact plane, the first contact plane of heat-conducting plate with the second contact plane looks parallel and level of heat pipe.
6. The built-in radiator of the notebook computer according to claim 1 or 5, wherein: one surface of the heat pipe, which faces the heat conducting plate, is a third contact plane, and the third contact plane of the heat pipe is in close contact with the groove bottom of the fixing groove of the heat conducting plate.
7. The built-in radiator of the notebook computer according to claim 1, wherein: the surface of the heat pipe, which is contacted with the inner side wall of the fixing groove of the heat conducting plate, is a fixing side surface, and the fixing convex position is embedded into the surface of the fixing side surface of the heat pipe.
8. The built-in radiator of the notebook computer according to claim 5, wherein: the heat conducting plate is arranged on two sides of the first contact plane and respectively forms mounting wings, and screw holes are formed in the mounting wings.
9. The built-in radiator of the notebook computer according to claim 1, wherein: at least one end of the heat pipe is bent to form a bent part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123392333.8U CN216848678U (en) | 2021-12-30 | 2021-12-30 | Built-in radiator of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123392333.8U CN216848678U (en) | 2021-12-30 | 2021-12-30 | Built-in radiator of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216848678U true CN216848678U (en) | 2022-06-28 |
Family
ID=82112661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123392333.8U Active CN216848678U (en) | 2021-12-30 | 2021-12-30 | Built-in radiator of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216848678U (en) |
-
2021
- 2021-12-30 CN CN202123392333.8U patent/CN216848678U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108151187B (en) | Electrical apparatus box refrigerant heat radiation structure and air condensing units | |
| CN216848678U (en) | Built-in radiator of notebook computer | |
| US20100134982A1 (en) | Memory heat dissipating structure and memory device having the same | |
| CN216437872U (en) | Improved heat dissipation type variable frequency controller | |
| CN218450979U (en) | Semiconductor refrigerating sheet type heat radiator | |
| CN216250709U (en) | Uniform temperature heat dissipation device | |
| JP3209591U (en) | Heat dissipation device assembly structure | |
| CN214228759U (en) | Heat radiation assembly | |
| CN212064713U (en) | Radiating fin convenient to install and replace | |
| CN212588569U (en) | Flexible circuit board with heat abstractor | |
| CN114449850A (en) | Close-fitting riveting structure of heat dissipation aluminum bottom and heat pipe | |
| CN213343145U (en) | Electronic device | |
| CN210183763U (en) | Heat dissipation device and heat dissipation wireless communication module | |
| CN210157562U (en) | Quick heat abstractor is used to electronic product | |
| CN216218422U (en) | Radiator and air conditioner | |
| CN215335835U (en) | Rapid Assembly LED lamps and lanterns heat radiation structure | |
| JP3153291U (en) | Heat sink unit | |
| CN219741124U (en) | Radiating fin for heat exchanger | |
| CN215735124U (en) | Heat dissipation plastic casing | |
| CN219395398U (en) | Gateway equipment with good heat dissipation effect | |
| CN214477398U (en) | Plug-in type radiating fin | |
| CN214172183U (en) | High-power LED light source radiator | |
| CN211702811U (en) | Flat radiator and POE electronic product | |
| CN213840823U (en) | Lamp radiator and lamp | |
| CN215808918U (en) | Air conditioner and heat radiation structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |