CN214228759U - Heat radiation assembly - Google Patents
Heat radiation assembly Download PDFInfo
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- CN214228759U CN214228759U CN202120349800.XU CN202120349800U CN214228759U CN 214228759 U CN214228759 U CN 214228759U CN 202120349800 U CN202120349800 U CN 202120349800U CN 214228759 U CN214228759 U CN 214228759U
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Abstract
An embodiment of the utility model provides a heat radiation assembly, include: a plurality of heat dissipating members arranged side by side; the heat dissipation piece comprises a substrate, a tabling part positioned at the edge of the substrate and a tongue piece bent and extended from the edge of the substrate, wherein the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part; the limiting part of one of the two adjacent heat dissipation parts is embedded in the embedding part of the other heat dissipation part. The embodiment of the utility model provides a radiator unit reduces radiator unit's volume when not reducing radiator unit radiating efficiency to reduce electronic equipment and be used for placing radiator unit's space, in order to reduce electronic equipment's volume.
Description
Technical Field
The embodiment of the utility model provides a relate to heat abstractor technical field, in particular to radiator unit.
Background
With the development of scientific technology, various electronic devices are developed toward miniaturization, and the miniaturization of electronic devices means that the space for accommodating various components is reduced for the housing of the electronic devices. In addition, because the inside components and parts of electronic equipment can produce a large amount of heats when the operation, at present, often through setting up radiator unit near components and parts and promote the radiating efficiency to avoid components and parts to appear damaging because of the high temperature.
The inventor discovers, current radiator unit adopts riveted mode to form a plurality of radiating pieces with the equipment mostly, when riveting a plurality of radiating pieces, need reserve great space between adjacent radiating piece and let the die of tool stretch into between the adjacent radiating piece and press and rivet adjacent radiating piece, make need to remain the space that great radiating piece interval was impressed in order to reserve the tool die when making radiator unit, and then can't reduce radiator unit's product volume, thereby electronic equipment also needs to reserve great space and is used for placing radiator unit, lead to the product volume that can't reduce electronic equipment.
Therefore, it is desirable to provide a heat dissipation assembly that reduces the size of the heat dissipation assembly without reducing the heat dissipation efficiency of the heat dissipation assembly, thereby reducing the space for placing the heat dissipation assembly in the electronic device to reduce the size of the electronic device.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a radiating component reduces radiating component's volume when not reducing radiating component radiating efficiency to reduce electronic equipment and be used for placing radiating component's space, in order to reduce electronic equipment's volume.
In order to solve the above problem, an embodiment of the present invention provides a heat dissipation assembly, including: a plurality of heat dissipating members arranged side by side; the heat dissipation piece comprises a substrate, a tabling part positioned at the edge of the substrate and a tongue piece bent and extended from the edge of the substrate, wherein the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part; the limiting part of one of the two adjacent heat dissipation parts is embedded in the embedding part of the other heat dissipation part.
The utility model provides a pair of heat radiation component, spacing portion gomphosis through one in two adjacent radiating pieces is in another's gomphosis portion, directly fix two adjacent radiating pieces, because spacing portion and gomphosis portion of adjacent radiating piece can be fixed at the position at adjacent radiating piece's base plate edge, thereby the die that need not to use the smelting tool stretches into between two adjacent radiating pieces, make when making heat radiation component, need not to reserve the space that enough tool die impressed between two adjacent radiating pieces, thereby can effectively reduce heat radiation component's product volume, in order to reduce heat radiation component's volume when not reducing heat radiation component's radiating efficiency, reduce the space that electronic equipment is used for placing heat radiation component, in order to reduce electronic equipment's volume.
In addition, each heat dissipation piece comprises two embedded parts and two tongues, the two opposite edges of the substrate are respectively provided with one embedded part, and the two tongues respectively bend and extend from one of the two opposite edges of the substrate; two limiting parts of one of the two adjacent heat dissipation parts are embedded in two embedding parts of the other heat dissipation part. With this arrangement, since the two tongues of one of the two adjacent heat dissipation members are located at the two opposite edges of the other of the two adjacent heat dissipation members, the two tongues of one of the two adjacent heat dissipation members can restrict the movement of the other of the two adjacent heat dissipation members in a direction in which one of the two tongues is directed toward the other.
In addition, the heat dissipation member further comprises a baffle plate bent and extended from the edge of the substrate, wherein the embedding part is positioned among the baffle plate, the tongue piece and the edge of the substrate.
In addition, each heat dissipation member is provided with four baffles and four tongues, wherein two baffles and two tongues are respectively fixed on each of two opposite edges of the substrate.
In addition, in the heat sink, the connecting portion includes a fixing plate fixed to an edge of the substrate and an extending plate extending from an edge of the fixing plate close to the fitting portion in a direction close to the stopper portion, the extending plate is fixedly connected to the stopper portion, and the stopper portion is located on a side of the fitting portion away from the substrate. Because the limiting part is positioned on one side of the embedding part far away from the substrate, the limiting part and the embedding part are sequentially arranged in the direction vertical to the substrate, when the limiting part of one of the two adjacent heat dissipation parts is embedded in the embedding part of the other heat dissipation part, the embedding can be completed without relatively rotating the two adjacent heat dissipation parts.
In addition, two fixed plates of two tongues fixed with the same edge of the substrate are connected, two extension plates of the two tongues fixed with the same edge of the substrate extend along the direction away from each other, and the included angles between the extension directions of the two extension plates and the surface of the substrate are different.
In addition, the connecting part is a connecting plate, and the included angle between the plate surface of the connecting plate and the plate surface of the base plate is 80-140 degrees.
In addition, the face of connecting plate with the contained angle between the face of base plate is 90.
In addition, the heat sink is integrally formed.
In addition, the heat dissipation member is made of aluminum, copper or iron.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic structural diagram of a heat dissipation assembly according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat sink according to a first embodiment of the present invention;
fig. 3 is a flowchart of a manufacturing method of a heat dissipation assembly according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will explain in detail each embodiment of the present invention with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical means claimed in the present application can be realized by various changes and modifications of the following embodiments.
The embodiment of the utility model provides a heat radiation component, spacing portion gomphosis through one in two adjacent radiating pieces is in another's gomphosis portion, directly fix two adjacent radiating pieces, because spacing portion and gomphosis portion of adjacent radiating piece can be fixed at the position at the base plate edge of adjacent radiating piece, thereby the die that need not to use the smelting tool stretches into between two adjacent radiating pieces, make when making heat radiation component, need not to reserve the space that enough tool die impressed between two adjacent radiating pieces, thereby can effectively reduce heat radiation component's product volume, in order to reduce heat radiation component's volume when not reducing heat radiation component's radiating efficiency, reduce the space that electronic equipment is used for placing heat radiation component, in order to reduce electronic equipment's volume. The following detailed description of the present embodiments is provided for ease of understanding and is not intended to limit the scope of the present embodiments.
Referring to fig. 1 and fig. 2, the heat dissipation assembly provided in the present embodiment includes: a plurality of heat sinks 10 arranged side by side; the heat sink 10 includes a substrate 11, a fitting portion 12 located at an edge of the substrate 11, and a tongue piece 13 bent and extended from the edge of the substrate 11, wherein the tongue piece 13 includes a connecting portion 131 connected to the edge of the substrate 11, and a limiting portion 132 connected to the connecting portion 131 and fixed to the substrate 11 through the connecting portion 131; the stopper 132 of one of the two adjacent heat sinks 10 is fitted in the fitting portion 12 of the other.
Specifically, the heat dissipation assembly provided in this embodiment is made of a material with good thermal conductivity (e.g., aluminum, iron, copper, etc.), so as to improve the thermal conductivity of the heat dissipation assembly, and further improve the heat dissipation efficiency of the heat dissipation assembly. In the present embodiment, the heat dissipation assembly is made of copper because copper has high thermal conductivity. In other alternative embodiments, the material of the heat dissipation assembly may also be an aluminum alloy with higher hardness and low manufacturing cost, and in addition, in order to further improve the heat dissipation efficiency of the heat dissipation assembly, the surface of each heat dissipation member of the heat dissipation assembly is further coated with a heat conductive silicone grease, thereby increasing the heat conductivity of the heat dissipation assembly.
Preferably, the heat sink 10 further includes a baffle 14 extending from the edge of the substrate 11, wherein the engaging portion 12 is located between the baffle 14, the tongue 13 and the edge of the substrate 11. In the present embodiment, the engaging portion 12 is an engaging region for engaging the limiting portion 132 between the edge of the baffle 14, the edge of the tongue 13, and the edge of the substrate 11; the stopper 132 of one of the two adjacent heat sinks 10 is fitted between the edge of the baffle plate 14, the edge of the tongue 13, and the edge of the base plate 11 of the other.
In other modified embodiments, the fitting portion is a through hole formed in the tongue piece, and the stopper portion of one of the two adjacent heat dissipating members may be fitted into the fitting portion of the other heat dissipating member.
Further, in the present embodiment, each heat sink 10 is provided with four baffles 14 and four tongues 13, wherein two baffles 14 and two tongues 13 are fixed on each of two opposite edges of the substrate 11, and the four limiting portions 132 of one of the two adjacent heat sinks 10 are embedded in the four embedding portions 12 of the other heat sink; with this arrangement, since the four tongues 13 of one of the two adjacent heat dissipation members 10 are distributed two by two at the opposite edges of the other of the two adjacent heat dissipation members 10, the four tongues 13 of one of the two adjacent heat dissipation members 10 can restrict the movement of the other of the two adjacent heat dissipation members 10 in a direction (i.e., the illustrated X direction) in which one of the opposite edges of the heat dissipation member 10 points toward the other.
In other changeable embodiments, each heat sink includes two engaging portions and two tongues, two opposing edges of the substrate are respectively provided with one engaging portion, the two tongues respectively extend from one of the two opposing edges of the substrate in a bent manner, and two limiting portions of one of two adjacent heat sinks are engaged in the two engaging portions of the other heat sink; since the two tongues of one of the two adjacent heat dissipation members are located at the two opposite edges of the other of the two adjacent heat dissipation members, respectively, the two tongues of one of the two adjacent heat dissipation members may restrict the movement of the other of the two adjacent heat dissipation members in a direction in which one of the two tongues is directed toward the other (i.e., a direction in which one of the two opposite edges of the heat dissipation member is directed toward the other).
Furthermore, in the heat sink 10, the connecting portion 131 includes a fixing plate 133 fixed to the edge of the substrate 11, and an extending plate 134 extending from the edge of the fixing plate 133 close to the engaging portion 12 in a direction close to the limiting portion 132, the extending plate 134 is fixedly connected to the limiting portion 132, and the limiting portion 132 is located on a side of the engaging portion 12 away from the substrate 11; in this way, the stopper portion 132 and the fitting portion 12 can be arranged in order in the direction perpendicular to the substrate 11 (i.e., the Y direction in the figure), and when the stopper portion 132 of one of the two adjacent heat dissipating members 10 is fitted into the fitting portion 12 of the other, the fitting can be completed without relatively rotating the two adjacent heat dissipating members 10.
Preferably, in the present embodiment, the two fixing plates 133 of the two tongues 13 fixed to the same edge of the base plate 11 are connected, and the two extending plates 134 of the two tongues 13 fixed to the same edge of the base plate 11 extend in directions away from each other. With this arrangement, when the position-limiting portion 132 of one of the two adjacent heat dissipating elements 10 is fitted into the fitting portion 12 of the other one, the two fixing plates 133 of the other one of the two adjacent heat dissipating elements 10 are located between the two position-limiting portions 132 of one of the two adjacent heat dissipating elements 10 disposed on the same side.
In addition, in the present embodiment, the extending directions of the two extending plates 134 of the two tongue pieces 13 fixed to the same edge of the substrate 11 are different from the included angle of the substrate 11; thus, when the position-limiting portion 132 of one of the two adjacent heat dissipation members 10 is engaged with the engaging portion 12 of the other one, one of the two adjacent heat dissipation members 10 is offset with respect to the other one of the two adjacent heat dissipation members 10 in a direction (i.e., the illustrated Z direction) from one of the two extending directions of the extending plates 134 having a larger included angle with the surface of the substrate 11 to one of the two extending directions of the extending plates 134 having a smaller included angle with the surface of the substrate 11, and when the heat dissipation assembly is fixed, the heat dissipation air duct formed between the substrate 11 of one of the two adjacent heat dissipation members 10 and the substrate 11 of the other one of the two adjacent heat dissipation members 10 is inclined.
Further, the connecting portion 131 is a connecting plate, and an included angle between a plate surface of the connecting plate and a plate surface of the substrate 11 is 80 ° to 140 °. In the present embodiment, the angle between the plate surface of the connecting plate (i.e., the connecting portion 131) and the plate surface of the substrate 11 is 90 °. In another example, the angle between the plate surface of the connecting plate and the plate surface of the substrate is 130 °.
In addition, when the heat dissipation assembly is fixed, the heat dissipation assembly can be fixed on the electronic equipment shell through fixing modes such as welding or screw thread connection. In the present embodiment, the baffle 14 is fixed to an electronic device case (not shown) by welding. In other modified embodiments, the baffle is provided with a through hole, and the baffle and the electronic equipment shell are fixed through screw threads.
The embodiment of the present invention provides a manufacturing method of a heat dissipation assembly, and specifically, a flowchart of the manufacturing method of the heat dissipation assembly in this embodiment is shown in fig. 3, which includes the steps of:
s201: a plurality of sheets is provided.
Specifically, the plate is made of a material with good thermal conductivity (such as aluminum, steel, copper, and the like) so as to improve the thermal conductivity of the heat dissipation assembly and further improve the heat dissipation efficiency of the heat dissipation assembly. In this embodiment, the plate material is copper. In other alternative embodiments, the plate material may be made of aluminum alloy with high hardness and low manufacturing cost.
S202: the central portion of each plate material is used as a substrate, and the edge portion of each plate material is cut out to form a heat dissipation plate.
Specifically, in this embodiment, the plate material is cut into the heat dissipation plate by stamping and cutting, and the heat dissipation plate includes a substrate, an engaging portion located at an edge of the substrate, and a tongue piece connected to the edge of the substrate, where the tongue piece includes a connecting portion connected to the edge of the substrate and a stopper portion connected to the connecting portion and fixed to the substrate by the connecting portion.
In other modified embodiments, the plate material may be cut into the heat dissipation plate in other cutting manners, but the embodiment is not limited thereto. In one example, the heat dissipation plate is cut by laser cutting.
S203: a plurality of heat dissipation plates are arranged side by side.
Specifically, the heat dissipation plates are bent at the edge of the substrate as a bending position, the substrate and the tongue piece are bent in a V-shape, and the stopper portion of one of the two adjacent heat dissipation plates is fitted into the fitting portion of the other heat dissipation plate.
In this embodiment, in the process of press-bending the heat dissipation plate with the edge of the substrate as the bending position to bend the substrate and the tongue piece into the V shape, the stopper portion of one of the two adjacent heat dissipation plates is press-fitted into the fitting portion of the other heat dissipation plate in the press mold. Therefore, the limiting part of one of the two adjacent heat dissipation plates can be embedded into the embedding part of the other heat dissipation plate through press riveting in the process of bending the heat dissipation plates, so that the manufacturing steps of assembling the heat dissipation plate are reduced, and the hidden quality trouble caused by the fact that the heat dissipation plates need to be turned around in an assembly line for many times is avoided.
In addition, it should be noted that, in other alternative embodiments, only step S203 may be provided, and in this case, the heat sink may be formed by casting, so as to avoid cutting a plate, thereby further reducing the manufacturing steps for manufacturing the heat sink assembly.
It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in its practical application. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A heat sink assembly, comprising: a plurality of heat dissipating members arranged side by side;
the heat dissipation piece comprises a substrate, a tabling part positioned at the edge of the substrate and a tongue piece bent and extended from the edge of the substrate, wherein the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part;
the limiting part of one of the two adjacent heat dissipation pieces is embedded in the embedding part of the other heat dissipation piece.
2. The heat dissipating assembly of claim 1, wherein each of the heat dissipating members comprises two of the engaging portions and two of the tongues, one of the engaging portions is disposed at each of two opposite edges of the base plate, and the two tongues are bent and extended from one of the two opposite edges of the base plate;
the two limiting parts of one of the two adjacent heat dissipation parts are embedded in the two embedding parts of the other heat dissipation part.
3. The heat sink assembly of claim 1, further comprising a baffle extending from the edge of the base plate, wherein the engagement is located between the baffle, the tongue, and the edge of the base plate.
4. A heat dissipation assembly as defined in claim 3, wherein each heat dissipation member is provided with four baffles and four tabs, and wherein two baffles and two tabs are secured to each of two opposing edges of the base plate.
5. The heat dissipating assembly of claim 4, wherein the connecting portion includes a fixing plate fixed to an edge of the substrate and an extending plate extending from an edge of the fixing plate close to the engaging portion in a direction close to the position limiting portion, the extending plate being fixedly connected to the position limiting portion, and the position limiting portion being located on a side of the engaging portion away from the substrate.
6. The heat dissipation assembly of claim 5, wherein the two fixing plates of the two tongues fixed to the same edge of the substrate are connected, the two extension plates of the two tongues fixed to the same edge of the substrate extend in directions away from each other, and the extension directions of the two extension plates are different from the included angle of the substrate surface.
7. The heat dissipating assembly of any of claims 1-6, wherein the connecting portion is a connecting plate, and an angle between a plate surface of the connecting plate and a plate surface of the base plate is 80 ° to 140 °.
8. The heat sink assembly of claim 7, wherein the angle between the plate surface of the connecting plate and the plate surface of the base plate is 90 °.
9. A heat dissipation assembly as defined in any one of claims 1-6, wherein the heat dissipation member is integrally formed.
10. A heat sink assembly as claimed in any one of claims 1 to 6, wherein the heat sink is made of aluminium, copper or iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120349800.XU CN214228759U (en) | 2021-02-07 | 2021-02-07 | Heat radiation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120349800.XU CN214228759U (en) | 2021-02-07 | 2021-02-07 | Heat radiation assembly |
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| CN214228759U true CN214228759U (en) | 2021-09-17 |
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| CN202120349800.XU Active CN214228759U (en) | 2021-02-07 | 2021-02-07 | Heat radiation assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112969345A (en) * | 2021-02-07 | 2021-06-15 | 宁波兴瑞电子科技股份有限公司 | Heat radiation assembly and manufacturing method thereof |
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- 2021-02-07 CN CN202120349800.XU patent/CN214228759U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112969345A (en) * | 2021-02-07 | 2021-06-15 | 宁波兴瑞电子科技股份有限公司 | Heat radiation assembly and manufacturing method thereof |
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