CN101841993B - Dissipation device - Google Patents

Dissipation device Download PDF

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Publication number
CN101841993B
CN101841993B CN200910300965.1A CN200910300965A CN101841993B CN 101841993 B CN101841993 B CN 101841993B CN 200910300965 A CN200910300965 A CN 200910300965A CN 101841993 B CN101841993 B CN 101841993B
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CN
China
Prior art keywords
fan
radiator
fixed
heat abstractor
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200910300965.1A
Other languages
Chinese (zh)
Other versions
CN101841993A (en
Inventor
孔程
杨红成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RUGAO BAXIN CASING CO Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200910300965.1A priority Critical patent/CN101841993B/en
Priority to US12/503,018 priority patent/US20100236764A1/en
Publication of CN101841993A publication Critical patent/CN101841993A/en
Application granted granted Critical
Publication of CN101841993B publication Critical patent/CN101841993B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a dissipation device. The dissipation device comprises a radiator, a fan arranged on the radiator and a plurality of fastening tools used for fixing the fan on the radiator, wherein each fastening tool comprises a fixing arm, an elastic arm formed by bending and extending one end of the fixing arm and a clasp formed by the free end of the elastic arm; the clasp is fastened on the fan, and the fixing arm is fixed on the radiator. Compared with the prior art, the assembly and disassembly of the dissipation device of the invention can be realized only by separating the fixing arms of the fastening tools from the radiator; and the operation is convenient without using any tool.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, refer to especially a kind of heat abstractor to electronic element radiating.
Background technology
Along with the quickening of electronic component arithmetic speed, the heat of its generation also is on the increase.Industry usually adopts a heat abstractor to adhere on this electronic component with to electronic element radiating.This radiator comprises a radiator that is sticked with electronic component and a fan that is installed in the radiator top.Thereby some screws pass the fan frame of fan and coordinate with fin fan is fixed on radiator.This kind heat abstractor install and unloading process in, need to adopt more specific instrument with screw by be mounted on radiator or on radiator and pull down, need cost a large amount of man-hour, thereby increased the installation cost of heat abstractor.
Summary of the invention
In view of this, be necessary to provide a kind of loading, unloading simple heat abstractor.
A kind of heat abstractor, comprise a radiator, be installed on the fan on radiator and fan is fixed to some fasteners on radiator, described each fastener comprises a fixed arm, bends by fixed arm one end the elastic arm that extends to form, an and clasp that is formed by the free end of elastic arm, described clasp is buckled on fan, and described fixed arm is fixed on radiator.
Compared with prior art, the present invention only needs the fixed arm with fastener to break away from radiator can to realize the dress of heat abstractor of the present invention, tear open, and is easy to operate and need not by any instrument.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of the heat abstractor of one embodiment of the invention.
Fig. 2 is the three-dimensional exploded view of heat abstractor in Fig. 1.
Fig. 3 is the inversion figure of heat abstractor in Fig. 1.
Embodiment
See also Fig. 1, the heat abstractor of one embodiment of the invention is used for the electronic component (not shown) on the circuit board (not shown) is dispelled the heat.This heat abstractor comprises a radiator 10, be positioned over a fan 20 on radiator 10 tops and fan 20 is fixed on two fasteners 30 on radiator 10.
Please consult Fig. 2, radiator 10 is made by heat conductivility good material such as copper, aluminium etc. again, and it comprises a substrate 11 and 2 first fins 12 that extend vertically upward from the both sides of substrate 11.Each first fin 12 extends to form one first horizontal part 123 in the outside horizontal buckling of its end.The first horizontal part 123 extends to form one first vertical portion 124 vertically upward in its end.The first vertical portion 124 in its end more outwards horizontal buckling extend to form one second horizontal part 125.The second horizontal part 125 extends to form one second vertical portion 126 vertically upward in its end.The bottom of the first horizontal part 123 forms a groove 121 parallel with the first fin 12.This radiator 10 also comprise by substrate 11 extend upward form and be placed in some the second fins 13 between 2 first fins 12 and extend upward by the first horizontal part 123 some the 3rd fins 14 that form.First, second, third fin 12,13,14 parallel to each other.Second, third fin 13,14 all is positioned under the second horizontal part 125.
In the present embodiment, the 3rd fin 14 is upwards extended to form towards fan by the first horizontal part 123.Understandably, in other embodiments, the 3rd fin 14 is not limited to this, for example, can also be extended to form downwards by the first horizontal part 123, to increase the area of dissipation of radiator 10.
Each fastener 30 is bent to form by a metal wire.Each fastener 30 comprises a fixed arm 31, two elastic arms 32, two clasps 33 and leader 34.Elastic arm 32 is bent to form to the same side by the two ends of fixed arm 31.Clasp 33 is formed at the end of elastic arm 32 and inwardly is bent to form towards fixed arm 31.Handle 34 is bent to form in the centre of fixed arm 31, and extends along the direction opposite with elastic arm 32.Two elastic arms 32 and two clasps 33 are symmetrical along the centre (being handle 34) of fixed arm 31.
Fan 20 comprises a fan frame 21 and is placed in the interior impeller 22 of fan frame 21.Four corners of fan frame 21 are provided with fixing hole 23.
Please also refer to Fig. 3, during the assembling of this heat abstractor, fan 20 is placed on 2 second horizontal parts 125 of radiator 10 and is placed between 2 second vertical portions 126.The movement of fan 20 on two side directions can be limited in the second vertical portion 126.Two clasps 33 of fastener 30 are buckled in the fixing hole 23 of two correspondences of fan 20.Then pull the handle 34 of fastener 30 downwards, make elastic arm 32 produce distortion, and fixed arm 31 is contained in the groove 121 of bottom of the first horizontal part 123 of radiator 10.Elastic arm 32 can limit the movement of fan 20 on fore-and-aft direction, restriction fan 20 movement in vertical direction of fixed arm 31 and clasp 33.Thus, fan 20 has been fixed on radiator 10.
When dismantling this heat abstractor, only need pull handle 34, break away from the groove 121 with fixed arm 31 from radiator 10 and get final product.Hence one can see that, and the dismounting of this heat abstractor is easy, need not can complete by any instrument, time saving and energy saving.
The fastener 20 of the heat abstractor in above-described embodiment comprises elastic arm 32 and the clasp 33 of two symmetries.Understandably, in other embodiments, above-mentioned fastener 20 can be divided into two at handle 34 places, a clasp 33 that is also each fastener 20 elastic arm 32 of comprising a fixed arm 31, being bent to form by fixed arm 31 1 ends, is formed by elastic arm 32 ends and the leader 34 who is bent to form by fixed arm 31 other ends, four corners that are buckled in fan 30 by four fasteners 20 are realized the fixing of fan 30.

Claims (6)

1. heat abstractor, comprise a radiator, be installed on the fan on radiator and fan is fixed to some fasteners on radiator, it is characterized in that: described each fastener comprises a fixed arm, bend by fixed arm one end the elastic arm that extends to form, an and clasp that is formed by the free end of elastic arm, described clasp is buckled on fan, described fixed arm is fixed on radiator, described radiator comprises a substrate and 2 first fins that extended to form by substrate both sides, the end of each the first fin all bends and upwards forms successively the first horizontal part, the first vertical portion, the second horizontal part and the second vertical portion, described fan is placed between the second vertical portion and is fixed on the second horizontal part, the fixed arm of described fastener is fixed on the bottom of the first horizontal part, described radiator comprises some the 3rd fins that extended and be placed in some the second fins between 2 first fins and extended by the first horizontal part by substrate.
2. heat abstractor as claimed in claim 1, it is characterized in that: described each fastener also comprises another elastic arm that is extended to form by the bending of the fixed arm other end, and another clasp that is formed by the free end of this another elastic arm, described two elastic arms and two clasps are symmetric along the centre of fixed arm.
3. heat abstractor as claimed in claim 1, it is characterized in that: described each fastener also comprises the leader who is bent to form on fixed arm.
4. heat abstractor as claimed in claim 1 is characterized in that: described fan comprises a fan frame, and the fan frame is provided with some fixing holes, and described clasp is buckled in the fixing hole of fan.
5. heat abstractor as claimed in claim 1, is characterized in that: the groove of the fixed arm of the bottom formation one accommodating fastener of described the first horizontal part.
6. heat abstractor as claimed in claim 1, it is characterized in that: described the 3rd fin is upwards extended to form towards fan by the first horizontal part.
CN200910300965.1A 2009-03-19 2009-03-19 Dissipation device Expired - Fee Related CN101841993B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910300965.1A CN101841993B (en) 2009-03-19 2009-03-19 Dissipation device
US12/503,018 US20100236764A1 (en) 2009-03-19 2009-07-14 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910300965.1A CN101841993B (en) 2009-03-19 2009-03-19 Dissipation device

Publications (2)

Publication Number Publication Date
CN101841993A CN101841993A (en) 2010-09-22
CN101841993B true CN101841993B (en) 2013-06-05

Family

ID=42736482

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910300965.1A Expired - Fee Related CN101841993B (en) 2009-03-19 2009-03-19 Dissipation device

Country Status (2)

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US (1) US20100236764A1 (en)
CN (1) CN101841993B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417028B (en) * 2011-03-31 2013-11-21 Wistron Corp Fixing mechanism of fixing an electronic module and supporting device therewith
CN104760763B (en) * 2015-03-20 2017-09-26 孙建群 A kind of refrigerating box

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581442A (en) * 1995-06-06 1996-12-03 Wakefield Engineering, Inc. Spring clip for clamping a heat sink module to an electronic module
CN2473667Y (en) * 2001-01-08 2002-01-23 林世仁 Non-balance radiation fin
CN2484639Y (en) * 2001-07-03 2002-04-03 林世仁 Radiating apparatus
CN2498645Y (en) * 2001-09-03 2002-07-03 林世仁 Unbalanced radiating ribs
TW509348U (en) * 2001-06-18 2002-11-01 Global Win Technology Co Ltd Heat dissipation apparatus
CN2602203Y (en) * 2003-02-18 2004-02-04 陈峰益 Package assembly for thermal fan and radiating fins of central processing unit
US6768641B2 (en) * 2002-06-28 2004-07-27 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
CN101203123A (en) * 2006-12-11 2008-06-18 台达电子工业股份有限公司 Radiating module and heat radiator

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5251101A (en) * 1992-11-05 1993-10-05 Liu Te Chang Dissipating structure for central processing unit chip
US6101091A (en) * 1998-12-30 2000-08-08 Orient Co., Ltd. Clip for clamping heat sink and semiconductor
TW458384U (en) * 2000-01-25 2001-10-01 Global Win Technology Co Ltd Fixing device of heat sink
US6992889B1 (en) * 2000-01-25 2006-01-31 Fujitsu Limited Retention module, heat sink and electronic device
TW479935U (en) * 2000-06-02 2002-03-11 Yau-Huei Lai Fastening apparatus of heat dissipation fan
TW586647U (en) * 2001-08-01 2004-05-01 Aopen Inc Clipping tool of heat dissipation plate
TW532516U (en) * 2002-04-18 2003-05-11 Hon Hai Prec Ind Co Ltd Fastener for heat sink
TWI306385B (en) * 2006-12-01 2009-02-11 Delta Electronics Inc Heat dissipating module and heat sink thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581442A (en) * 1995-06-06 1996-12-03 Wakefield Engineering, Inc. Spring clip for clamping a heat sink module to an electronic module
CN2473667Y (en) * 2001-01-08 2002-01-23 林世仁 Non-balance radiation fin
TW509348U (en) * 2001-06-18 2002-11-01 Global Win Technology Co Ltd Heat dissipation apparatus
CN2484639Y (en) * 2001-07-03 2002-04-03 林世仁 Radiating apparatus
CN2498645Y (en) * 2001-09-03 2002-07-03 林世仁 Unbalanced radiating ribs
US6768641B2 (en) * 2002-06-28 2004-07-27 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly
CN2602203Y (en) * 2003-02-18 2004-02-04 陈峰益 Package assembly for thermal fan and radiating fins of central processing unit
CN101203123A (en) * 2006-12-11 2008-06-18 台达电子工业股份有限公司 Radiating module and heat radiator

Also Published As

Publication number Publication date
US20100236764A1 (en) 2010-09-23
CN101841993A (en) 2010-09-22

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Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666

Patentee after: RUGAO BAXIN CASING Co.,Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Patentee before: Fuzhun Precision Industry (Shenzhen) Co.,Ltd.

Patentee before: Foxconn Technology Co.,Ltd.

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Effective date of registration: 20170907

Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666

Patentee after: NANTONG HENGHUA BOND MATERIAL TECHNOLOGY CO.,LTD.

Address before: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666

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Effective date of registration: 20200429

Address after: 226500, Rugao City, Jiangsu province Nantong City, such as Huimin Road No. 666

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Address before: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666

Patentee before: NANTONG HENGHUA BOND MATERIAL TECHNOLOGY Co.,Ltd.

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Granted publication date: 20130605