CN211702811U - Flat radiator and POE electronic product - Google Patents
Flat radiator and POE electronic product Download PDFInfo
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- CN211702811U CN211702811U CN202020370500.5U CN202020370500U CN211702811U CN 211702811 U CN211702811 U CN 211702811U CN 202020370500 U CN202020370500 U CN 202020370500U CN 211702811 U CN211702811 U CN 211702811U
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- heat dissipation
- flat plate
- heat
- plate body
- radiator
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Abstract
The utility model relates to a radiator technical field particularly, relates to a dull and stereotyped radiator and POE electronic product. The flat plate radiator is arranged in a shell of an electronic product and used for radiating heat of an equipment mainboard, and comprises a radiating plate body, wherein the radiating plate body is provided with a plurality of matching parts, and the matching parts are used for being embedded in the shell to be matched so that the edge of the radiating plate body is close to the inner wall of the shell. The radiating effect can be improved, and the stable operation of electronic products is guaranteed.
Description
Technical Field
The utility model relates to a radiator technical field particularly, relates to a dull and stereotyped radiator and POE electronic product.
Background
The existing electronic product is narrow in space, and a radiator arranged in the electronic product is poor in heat dissipation effect, so that the stability and reliability of the product are affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a dull and stereotyped radiator and POE electronic product, it can improve the radiating effect, ensures electronic product's steady operation, for example.
The embodiment of the utility model discloses a can realize like this:
in a first aspect, an embodiment provides a flat plate heat sink disposed in a housing of an electronic product for dissipating heat from a motherboard of the device, including:
the radiating plate body is provided with a plurality of matching parts, and the matching parts are used for being embedded and matched with the shell so that the edge of the radiating plate body is close to the inner wall of the shell.
In an optional embodiment, the fitting portion includes a groove formed in the heat dissipation plate body, and the groove penetrates through a plate surface of the heat dissipation plate body.
In an alternative embodiment, the fitting portion further includes a first through hole penetrating the plate surface of the heat dissipation plate body;
the first through hole is used for enabling a power plug of the electronic product to pass through.
In an optional embodiment, the flat plate heat sink further includes a heat dissipation boss disposed on a plate surface of the heat dissipation plate body;
the heat dissipation boss is used for being attached to a heat-dissipated part of the equipment main board to dissipate heat.
In an alternative embodiment, the flat plate heat sink further comprises heat dissipating teeth;
the heat dissipation tooth sets up the heat dissipation plate body is kept away from the another side of equipment mainboard, just the heat dissipation tooth extends to the direction of keeping away from the heat dissipation plate body.
In an alternative embodiment, a plurality of said heat dissipation teeth are parallel to each other.
In an alternative embodiment, the flat plate heat sink is made of aluminum alloy by integral molding.
In an alternative embodiment, the flat plate heat sink is made of a cast aluminum alloy.
In a second aspect, an embodiment provides a POE electronic product, including:
an upper cover, an equipment main board, an equipment power supply board, a bottom box and the flat plate radiator of any one of the previous embodiments;
the equipment mainboard, the flat plate radiator and the equipment power panel are sequentially stacked inside the bottom box, and the upper cover seals the opening of the bottom box.
In an optional implementation mode, the equipment main board, the flat plate radiator and the equipment power supply are all clamped inside the bottom box, and the upper cover is clamped with the bottom box to close the opening.
The utility model discloses beneficial effect includes, for example:
the heat dissipation plate body of the flat plate heat radiator is provided with a plurality of matching portions, the matching portions are used for being embedded with the shell to be matched so that the edge of the heat dissipation plate body is close to the inner wall of the shell, so that the heat dissipation area of the heat dissipation plate body is the largest through the residual space inside the equipment, the heat dissipation efficiency is improved, the outstanding heat dissipation effect is guaranteed, and the stability and the reliability of products are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural view of a flat plate heat sink;
FIG. 2 is another schematic view of a flat plate heat sink;
FIG. 3 is a partial schematic view of an electronic product;
fig. 4 is an assembly diagram of an electronic product.
Icon: 10-a flat plate heat sink; 100-a heat sink body; 101-a mating portion; 110-a groove; 121-first passing hole; 122-a second through hole; 200-radiating bosses; 300-heat dissipation teeth; 20-an electronic product; 21-a housing; 21 a-upper cover; 21 b-bottom box; 22-equipment mainboard; 23-device power panel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, the description is only for convenience of description and simplification, but the indication or suggestion that the indicated device or element must have a specific position, be constructed and operated in a specific orientation, and thus, should not be interpreted as a limitation of the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, the present embodiment provides a flat plate heat sink 10 disposed in a housing 21 of an electronic product 20 for dissipating heat from an apparatus main board 22, including a heat dissipating plate 100.
The heat dissipation plate 100 is provided with a plurality of engaging portions 101, and the engaging portions 101 are used for being embedded and engaged with the housing 21 so as to enable the edge of the heat dissipation plate 100 to approach the inner wall of the housing 21.
The stability and reliability of the electronic product 20 are largely determined by whether the heat dissipation process of the product is good or not. The natural heat dissipation scheme of the metal radiator is generally adopted in the household terminal product due to the limitation of the size and the cost of the equipment. If the heating devices in the equipment are more frequently completed by adopting a flat plate heat dissipation plate. Especially in the case of high device density, only the flat plate heat spreader 10 approach can be adopted due to space limitations.
Even if the flat plate radiator 10 is adopted, heat dissipation of a heating device in a narrow space is very difficult, and due to space limitation, the size and the heat dissipation area of a common radiator are small, the heat dissipation effect is poor, and the stability and the reliability of a product are seriously influenced.
In view of the above, the heat dissipating plate body 100 of the flat plate heat sink 10 of the present scheme is provided with the plurality of matching portions 101, the plurality of matching portions 101 are used for being embedded with the casing 21 to be matched so as to enable the edge of the heat dissipating plate body 100 to be close to the inner wall of the casing 21, so that the heat dissipating area of the heat dissipating plate body is maximized by making full use of the remaining space inside the equipment, thereby improving the heat dissipating efficiency, ensuring the superior heat dissipating effect and improving the stability and reliability of the product.
Please continue to refer to fig. 1 to 4 for further structural details.
In the present embodiment of the invention, the fitting portion 101 includes a groove 110 formed on the heat dissipating plate body 100, and the groove 110 runs through the surface of the heat dissipating plate body 100. As can be seen from the figure, the inner wall of the housing 21 includes a plurality of protrusions extending toward the center of the housing 21, and the protrusions are engaged with the grooves 110, so that the plate surface of the heat dissipation plate body 100 can be maximally extended into the housing 21, thereby enlarging the area of the heat dissipation plate body 100.
As can also be seen from the figures, the heat dissipation plate body 100 is a square plate, and the fitting portion 101 includes two grooves 110, and the grooves 110 are recessed inward from the edges of the heat dissipation plate body 100 to form the grooves 110. The two protrusions respectively correspond to the two protrusions in the housing 21 of the electronic product 20, and the grooves 110 are embedded and matched with the protrusions, so that the area of the heat dissipation plate body 100 is maximized.
Further, in the present embodiment of the present invention, the fitting portion 101 further includes a first through hole 121 penetrating the panel surface of the heat dissipating plate 100; the first through hole 121 is for passing a power plug of the electronic product 20 therethrough. The provision of the first passing holes 121 can prevent the reduction of the area of the heat dissipation plate body 100 caused by the slots (through which the power plugs pass) formed in the heat dissipation plate body 100, because the slots occupy more area than the holes.
As can also be seen, on the opposite side of the first through hole 121, a second through hole 122 is also started on the heat dissipation plate body 100 for the use and the penetration of other structures.
In the present embodiment of the present invention, the flat plate heat sink 10 further includes a heat dissipating boss 200 disposed on the plate surface of the heat dissipating plate body 100; the heat dissipation boss 200 is used for being attached to a heat-dissipated part of the device motherboard 22 to dissipate heat.
In the prior art, the conventional flat plate heat sink 10 can only be completed by adding the heat conductive material under the condition of non-uniform height of the heat-dissipated devices, but the heat dissipation effect is affected. In this embodiment, the heat dissipating boss 200 is used to directly contact the heat dissipating member with the heat dissipating body, thereby ensuring the heat dissipating effect.
It should be noted that, this embodiment only shows one heat dissipation boss 200, in other embodiments of the present invention, the design may be adapted according to different positions and numbers of the devices to be heat dissipated, so as to ensure the heat dissipation effect, which is merely an example and is not limited herein.
Further, in the present embodiment of the present invention, the plate radiator 10 further includes a heat dissipation tooth 300, the heat dissipation tooth 300 is disposed on the other side of the heat dissipation plate body 100 away from the equipment motherboard 22, and the heat dissipation tooth 300 extends toward the direction away from the heat dissipation plate body 100.
The plurality of groups of the protruding radiating teeth 300 radiate heat outwards, so that good heat dissipation of a plurality of radiated devices at different positions and different heights in the equipment is realized. In the flat plate heat sink 10 of the prior art, only the heat dissipation plate body 100 is provided with no heat dissipation teeth 300, so that the heat dissipation effect is further enhanced, and the stability and reliability of the product are guaranteed.
Optionally, in this embodiment, the plurality of heat dissipation teeth 300 are parallel to each other. The heat dissipation teeth 300 parallel to each other ensure that the dissipated hot air can stably circulate without turbulent flow affecting the heat dissipation effect.
Further, in the present embodiment of the present invention, the plate radiator 10 is made of aluminum alloy by integral molding. Alternatively, the flat plate heat sink 10 is made of a cast aluminum alloy.
The heat dissipation plate body 100, the heat dissipation boss 200 and the heat dissipation teeth 300 are all manufactured by integrally molding aluminum alloy through casting and pressing, so that the structure integrity is good, the structure is light, the heat dissipation effect is good, and the complete heat dissipation effect is guaranteed.
In use, the device main board 22, the flat plate heat sink 10 and the device power board 23 are stacked in sequence inside the bottom case 21b, and the upper cover 21a closes the opening of the bottom case 21 b. The heat generated when the equipment main board 22 generates heat can be quickly radiated from the heat-radiating fins on the housing 21 (here, the bottom case 21b) through the flat plate heat sink 10.
In a second aspect, an embodiment provides a POE electronic product 20, including:
an upper cover 21a, a device main board 22, a device power supply board 23, a bottom case 21b, and the flat plate heat sink 10 of any of the foregoing embodiments; the device main board 22, the flat heat sink 10, and the device power supply board 23 are stacked in this order inside the bottom case 21b, and the upper cover 21a closes the opening of the bottom case 21 b.
Here, the upper cover 21a and the bottom case 21b together enclose the housing 21.
The utility model discloses an in this embodiment, inside equipment mainboard 22, flat plate radiator 10 and the equal joint of equipment power was inside end box 21b, upper cover 21a and end box 21b joint were in order to seal the opening.
Generally, the assembly method of the radiator is mostly in a bonding or screw connection mode, and the bonding mode is easy to generate the risk of adhesive failure to cause the radiator to fall off under the conditions of high temperature and vibration; the screw connection will reduce the assembly efficiency. The flat plate radiator 10 of the scheme is fixed inside a product by utilizing an assembly mode that the equipment body structure is clamped and naturally matched, and does not need glue or screws, so that the assembly efficiency and the assembly reliability are greatly improved.
The utility model discloses beneficial effect includes, for example:
the heat dissipation plate body 100 of the flat plate heat sink 10 is provided with a plurality of matching portions 101, the matching portions 101 are used for being embedded in the shell 21 to enable the edge of the heat dissipation plate body 100 to be close to the inner wall of the shell 21, so that the heat dissipation area of the heat dissipation plate body is the largest through fully utilizing the residual space in the equipment, the heat dissipation efficiency is improved, the superior heat dissipation effect is guaranteed, and the stability and the reliability of the product are improved.
Specifically, the method comprises the following steps:
1. the radiator is made of die-casting aluminum alloy materials, the shape of the radiator is completely attached to the available space inside the equipment, and the heat dissipation area is maximized.
2. The heat sink has heat dissipating bosses 200 (which can be designed according to different positions and numbers of the components to be dissipated) corresponding to the positions of the components to be dissipated, and the heat dissipating bosses are in contact with the components to be dissipated in the equipment. Meanwhile, the radiator is provided with a plurality of groups of protruding radiating teeth 300 for radiating heat outwards, so that good heat radiation of a plurality of radiated devices at different positions and different heights in the equipment is realized.
3. This radiator utilizes equipment body structure to clamp the assembly mode of natural fit tightly and is fixed inside the product, need not viscose and screw, improves assembly efficiency and assembly reliability greatly.
The above embodiments are only specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a flat plate radiator, its setting is used for dispelling the heat to the equipment mainboard in the casing of electronic product, its characterized in that includes:
the radiating plate body is provided with a plurality of matching parts, and the matching parts are used for being embedded and matched with the shell so that the edge of the radiating plate body is close to the inner wall of the shell.
2. The flat plate heat sink according to claim 1, wherein:
the matching part comprises a groove formed in the heat dissipation plate body, and the groove penetrates through the plate surface of the heat dissipation plate body.
3. The flat plate heat sink according to claim 1, wherein:
the matching part also comprises a first through hole which penetrates through the plate surface of the heat dissipation plate body;
the first through hole is used for enabling a power plug of the electronic product to pass through.
4. The flat plate heat sink according to any of claims 1-3, wherein:
the flat plate radiator also comprises a radiating boss arranged on the plate surface of the radiating plate body;
the heat dissipation boss is used for being attached to a heat-dissipated part of the equipment main board to dissipate heat.
5. The flat plate heat sink according to any of claims 1-3, wherein:
the flat plate heat sink also comprises heat dissipation teeth,
the heat dissipation tooth sets up the heat dissipation plate body is kept away from the another side of equipment mainboard, just the heat dissipation tooth extends to the direction of keeping away from the heat dissipation plate body.
6. The flat plate heat sink according to claim 5, wherein:
the plurality of heat dissipation teeth are parallel to each other.
7. The flat plate heat sink according to any of claims 1-3, wherein:
the flat plate radiator is integrally made of aluminum alloy.
8. The flat plate heat sink according to claim 7, wherein:
the flat plate radiator is made of cast aluminum alloy.
9. A POE electronic product, comprising:
an upper cover, a device main board, a device power board, a bottom case and the flat plate heat sink of any one of claims 1-8;
the equipment mainboard, the flat plate radiator and the equipment power panel are sequentially stacked inside the bottom box, and the upper cover seals the opening of the bottom box.
10. The POE electronic product of claim 9, wherein:
the equipment mainboard the dull and stereotyped radiator with the equal joint of equipment power is in inside the end box, the upper cover with end box joint is in order to seal the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020370500.5U CN211702811U (en) | 2020-03-20 | 2020-03-20 | Flat radiator and POE electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020370500.5U CN211702811U (en) | 2020-03-20 | 2020-03-20 | Flat radiator and POE electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702811U true CN211702811U (en) | 2020-10-16 |
Family
ID=72781112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020370500.5U Active CN211702811U (en) | 2020-03-20 | 2020-03-20 | Flat radiator and POE electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211702811U (en) |
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2020
- 2020-03-20 CN CN202020370500.5U patent/CN211702811U/en active Active
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