CN107589813B - Mounting structure of vacuum cavity radiator - Google Patents
Mounting structure of vacuum cavity radiator Download PDFInfo
- Publication number
- CN107589813B CN107589813B CN201710874541.0A CN201710874541A CN107589813B CN 107589813 B CN107589813 B CN 107589813B CN 201710874541 A CN201710874541 A CN 201710874541A CN 107589813 B CN107589813 B CN 107589813B
- Authority
- CN
- China
- Prior art keywords
- soaking plate
- vacuum chamber
- heat sink
- heat
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an installation structure of vacuum cavity radiator, vacuum cavity radiator includes the soaking plate, the inside vacuum cavity that is equipped with of soaking plate, the vacuum cavity holds phase change working medium, the soaking plate has upper surface and lower surface, the lower surface be used for with a heat source contact, installation structure be used for with vacuum cavity radiator is installed to one and is born on the component in the source that generates heat, makes the soaking plate lower surface with the source contact that generates heat, installation structure is including setting up the connection structure of soaking plate lower surface and with connection structure fixed connection's fixed knot constructs, fixed knot construct be used for with bear the component fixed connection in the source that generates heat.
Description
Technical Field
The invention relates to a radiator, in particular to a vacuum cavity radiator capable of meeting the requirement of installation position change.
Background
Electronic components such as computer CPUs generate a large amount of heat during operation, and a heat sink is generally used to dissipate the heat. Along with the application of the vacuum cavity, the heat radiator greatly improves the heat radiating capacity of systems such as computers, and more computers adopt the heat radiator with the vacuum cavity. The conventional heat sink with vacuum chamber structure has holes on two sides and screws, as shown in fig. 9. The pitch of the screw holes is large, and the pitch of the screw holes which are required to be small for some systems is difficult to meet the installation requirement. If the screw holes are close to the middle, the cavity structure of the vacuum cavity is influenced, and therefore the heat dissipation performance of the product is influenced. Because the vacuum cavity is required to be completely closed and the vacuum cavity can have good heat-conducting property, holes cannot be directly and randomly opened, if the holes are opened and then sealed, the risk of air leakage exists, the structure of the cavity can be changed, and the heat-conducting property of the cavity is also deteriorated.
Therefore, how to mount the heat sink on a motherboard or other components carrying a heat generating source, which requires smaller pitch or mounting position change, without affecting the structure of the vacuum chamber is a problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a vacuum chamber heat sink capable of meeting the requirement of mounting position change.
The invention provides a vacuum cavity radiator, which comprises a soaking plate and a radiating fin, wherein a vacuum cavity is arranged in the soaking plate, a phase change working medium is contained in the vacuum cavity, the soaking plate is provided with an upper surface and a lower surface, the radiating fin is in heat conduction connection with the upper surface of the soaking plate, the lower surface is used for being in contact with a heating source, the radiator also comprises a mounting structure arranged on the lower surface of the soaking plate, the mounting structure is used for mounting the radiator on an element bearing the heating source, so that the lower surface of the soaking plate is in contact with the heating source, the mounting structure comprises a connecting structure arranged on the lower surface of the soaking plate and a fixing structure fixedly connected with the connecting structure, and the fixing structure is used for being fixedly connected with the element bearing the heating source.
In one embodiment, the connection structure comprises a metal sheet having a central opening, the metal sheet being fixedly connected to the lower surface of the soaking plate, the central opening exposing a portion of the lower surface of the soaking plate such that the portion of the lower surface of the soaking plate can contact the heat generating source.
In one embodiment, the metal sheet is fixed to the lower surface of the soaking plate by means of welding.
In one embodiment, a buckle part extends from the side edge of the metal sheet, and the buckle part is fixed with the edge of the soaking plate in a buckle mode.
In some embodiments, the securing structure includes a plurality of studs secured to the sheet metal.
In an embodiment, the connection structure is a plastic part, and includes a plastic sheet with a central opening and a fastening portion connected to the plastic sheet, the plastic sheet is attached to the lower surface of the soaking plate, the fastening portion is fixed to the edge buckle of the soaking plate, and the central opening exposes a portion of the lower surface of the soaking plate so that the portion of the lower surface of the soaking plate can contact with the heat source.
In one embodiment, the fastening part comprises a plurality of fastening strips extending from the side edge of the plastic sheet, the end parts of the fastening strips are bent structures, and the bent structures are fastened with the edge of the soaking plate.
In one embodiment, the fastening portion includes a fastening piece integrally extending from a side edge of the plastic piece and two bending strips integrally and vertically extending from two sides of an end portion of the fastening piece, and the two bending strips are fastened with the edge of the soaking plate.
In one embodiment, the fixing structure includes a plurality of studs fixed on the plastic sheet.
In one embodiment, the fixing structures are studs, the connecting structures comprise pits arranged on the lower surface of the soaking plate, the pits do not penetrate through the bottom wall of the vacuum cavity and are communicated with the vacuum cavity, and the studs are fixed in the pits in a threaded connection, welding or riveting mode.
In summary, the vacuum chamber heat sink provided by the present invention is additionally provided with some mounting structures or simple concave structures, such as a metal sheet fixed on the bottom surface of the soaking plate of the heat sink, a plastic piece fixed on the heat sink by using an inverted buckle, or a concave pit punched on the bottom surface of the soaking plate and not communicated with the vacuum chamber. The studs are arranged on the metal sheets, the plastic parts or the pits, and the studs are connected and fixed with the main board, so that the assembly requirement is met. The position of the stud can be adjusted according to the actual installation position, so that the installation position of the radiator can meet the requirement of the change of the installation position under the condition of not changing the structure of the vacuum cavity. The radiator has the advantages of simple structure, easy realization, low cost, convenient installation and disassembly and wide application range, meets the installation requirement of smaller hole pitch of the mainboard under the condition of not changing the vacuum cavity structure of the radiator, ensures better heat radiation performance of products, and provides possibility for the design of smaller size of the mainboard.
Drawings
FIG. 1 is a schematic view of one embodiment of a heat sink of the present invention.
Fig. 2 is an exploded view of the heat sink of fig. 1.
Fig. 3 is a schematic view of another embodiment of the heat sink of the present invention.
Fig. 4 is an exploded view of the heat sink of fig. 3.
Fig. 5 is a schematic view of another embodiment of the heat sink of the present invention.
Fig. 6 is an exploded view of the heat sink of fig. 5.
Fig. 7 is a schematic view of another embodiment of the heat sink of the present invention.
Fig. 8 is an exploded view of the heat sink of fig. 7.
Fig. 9 is a schematic view of a conventional heat sink.
Detailed Description
Before the embodiments are described in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangements of components set forth in the following description or illustrated in the drawings. The invention is capable of embodiments in other forms of implementation. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," "having," and the like, herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. In particular, when "a certain element" is described, the present invention is not limited to the number of the element being one, and may include a plurality of the elements.
The invention provides a vacuum cavity radiator, which comprises a soaking plate, a plurality of radiating fins and a mounting structure. The vapor chamber is internally provided with a vacuum chamber, and the vacuum chamber is internally provided with a phase change working medium to provide good heat dissipation performance for the radiator. The vapor chamber has an upper surface and a lower surface. The plurality of radiating fins are in heat conduction connection with the upper surface of the soaking plate, so that heat on the soaking plate can be conducted to the radiating fins for radiation. The lower surface of the soaking plate is used to contact a heat generating source, such as a CPU, to absorb heat generated by the heat generating source. The mounting structure is arranged on the lower surface of the soaking plate and used for mounting the radiator on a component bearing the CPU, such as a computer mainboard, and simultaneously enabling the lower surface of the soaking plate to be in contact with the CPU. The mounting structure comprises a connecting structure arranged on the lower surface of the soaking plate and a fixing structure fixedly connected with the connecting structure. The connecting structure is used as an intermediate structure for simultaneously connecting the soaking plate and the fixing structure to fix the fixing structure and the soaking plate together, and then is fixedly connected with the computer mainboard through the fixing structure, so that the radiator is fixed on the computer mainboard.
The present invention will be described in detail below with reference to various embodiments.
Example one
As shown in fig. 1 and 2, a vacuum chamber heat sink 2 is provided, which includes a soaking plate 4, a heat sink 6 and a mounting structure, wherein a vacuum chamber (not shown) is provided inside the soaking plate 4, and a phase-change working medium is contained in the vacuum chamber. The vapor chamber 4 has an upper surface 8 and a lower surface 10, and the heat sink 6 is in heat-conducting connection with the upper surface 8 of the vapor chamber 4, so that heat on the vapor chamber 4 can be conducted to the heat sink 6 for dissipation. The lower surface 10 of the soaking plate 4 is used to contact a computer CPU to absorb heat generated from the CPU. The mounting structure is disposed on the lower surface 10 of the heat spreader 4 for mounting the heat spreader 2 to a computer motherboard carrying the CPU while the heat spreader lower surface 10 is in contact with the CPU. The mounting structure comprises a connecting structure arranged on the lower surface 10 of the soaking plate and a fixing structure fixedly connected with the connecting structure.
In the illustrated embodiment, the vapor chamber 4 has a square configuration, and in other embodiments, the vapor chamber 4 may have other shapes, such as circular, as desired by design. The connecting structure is a metal sheet 16, the metal sheet 16 is fixedly connected to the lower surface 10 of the soaking plate 4, and in the embodiment, the metal sheet 16 is fixed on the lower surface 10 of the soaking plate 4 by welding. In other embodiments, the metal sheet 16 may be fixed on the lower surface 10 of the soaking plate 4 by other means, for example, by extending a buckle portion at the side of the metal sheet 16 and fastening the buckle portion to the edge of the soaking plate 4 by buckling.
The fixing structure is a stud 18 fixed on the metal sheet 16, and the stud 18 is used for connecting and fixing with a computer mainboard. In the present embodiment, the stud 18 is welded and fixed to the metal plate 16, but the present invention is not limited thereto, and in other embodiments, the stud 18 may be fixedly connected to the metal plate 16 by means of screwing, riveting, or the like. The metal sheet 16 is provided with a central opening so that a CPU or other heat generating source of the computer motherboard can pass through the opening to contact the soaking plate 4, thereby achieving the purpose of heat dissipation.
In the illustrated embodiment, the metal sheet 16 has a square structure, the number of the studs 18 is set to 4, and four studs 18 are symmetrically disposed on both sides of the metal sheet 16. In other embodiments, the metal sheet 16 may be designed in other shapes, such as circular or polygonal, according to specific design requirements. Correspondingly, the studs 18 may be provided in other numbers as long as the heat sink 2 can be stably fixed to the main board.
In this embodiment, the side edges of the metal sheet 16 define an area smaller than the area of the lower surface of the soaking plate, and the stud 18 fixed to the metal sheet 16 can be therefore close to the middle of the soaking plate 4. The specific location of the studs 18 may be determined based on actual heat sink mounting requirements, such as the pitch of the studs. Since the stud 18 is fixed by the metal sheet 16, the position of the stud 18 on the metal sheet 16 can be adjusted arbitrarily according to requirements. Therefore, the position of the stud 18 can be arbitrarily adjusted without damaging the vacuum chamber in the soaking plate 4, and the mounting adaptability of the vacuum chamber radiator is greatly improved.
Example two
As shown in fig. 3 and 4, the structures and the installation manners of the soaking plate 4 and the heat sink 6 in the present embodiment are similar to those in the present embodiment, and are not described herein again.
In this embodiment, the mounting structure includes a connection structure provided on the lower surface 10 of the soaking plate and a fixing structure fixedly connected to the connection structure. Wherein, the connecting structure is a plastic part 20, and the plastic part 20 is fixed on the lower surface 10 of the soaking plate 4 by means of a hasp, so that the plastic part 20 can be conveniently installed and detached from the soaking plate 4.
Specifically, the plastic part 20 includes a plastic sheet 24 having a central opening and a locking portion connected to the plastic sheet 24, the plastic sheet 24 is attached to the lower surface 10 of the soaking plate 4, the locking portion is locked to the edge of the soaking plate 4 by locking, and the central opening exposes a portion of the lower surface 10 of the soaking plate so that the portion of the lower surface 10 of the soaking plate can contact with the CPU. In the embodiment shown, the upper surface 8 of the soaking plate 4 is extended outwardly along its side edges to form a ring of protrusions 28.
In the embodiment shown in fig. 3 and 4, the fastening part comprises a plurality of fastening strips 26 integrally extending from the side edges of the plastic sheet 24, and the ends of the fastening strips 26 are provided with bending structures 30, and the bending structures 30 are fastened on the upper edges of the protruding parts 28 of the soaking plate 4 to fix the plastic piece 20 on the soaking plate 4.
It should be understood that, in the present embodiment, the fastening portion cooperates with the protruding portion 28 formed on the soaking plate 4 to achieve fastening, and in other embodiments, the fastening portion may also be fixed with the soaking plate 4 by other means, for example, a hole cooperating with the fastening portion is formed on a side edge of the soaking plate 4, as long as the fastening portion can be fastened with the soaking plate 4, and the present invention is not limited thereto.
The fixing structure is a stud 22 fixed on a plastic sheet 24, and the stud 22 is used for connecting and fixing with the computer mainboard. The stud 22 may be fixed to the plastic sheet 24 in various ways, such as riveting or integral injection molding. In this embodiment, the stud 22 is fixedly connected to the plastic sheet 24 by integral injection molding.
In the embodiment, the plastic sheet 24 has a square structure, and two fastening strips 26 extend from each side of the plastic sheet 24. Of course, the two strips 26 on each side of the plastic sheet 24 are only exemplary, and in other embodiments, the number of strips 26 on each side may be other, as long as the plastic member 20 can be well fixed to the soaking plate 4 according to the design requirement. The number of the studs 22 is 4, and four studs 22 are respectively and symmetrically arranged on two sides of the plastic sheet 24. In other embodiments, the plastic sheet 24 may be designed in other shapes, such as circular or polygonal, according to specific design requirements. Correspondingly, the studs 22 may be provided in other numbers as long as the heat sink 2 can be stably fixed on the computer motherboard.
In the embodiment shown in fig. 5 and 6, the fastening portion includes a fastening piece 32 integrally extending from the middle of the side edge of the plastic piece 24 and two bending strips 34 vertically and integrally extending from two sides of the end portion of the fastening piece 32, the fastening piece 32 is attached to the lower surface 10 of the soaking plate, and the bending strips 34 are fastened to the upper edge of the protruding portion 28 of the soaking plate 4 to fix the plastic piece 20 on the soaking plate 4.
In this embodiment, there is one buckling piece 32 extending from each side of the plastic piece 24, and there are two bending strips 34 extending from the buckling piece 32. Of course, the design of the two bending strips 34 is merely exemplary, and in other embodiments, in order to enhance the buckling capability of the buckling portion, the number of the bending strips 34 may be increased, or the bending strips 34 may be directly designed as bending pieces, as long as the plastic part 20 can be well fixed on the soaking plate 4 according to the design requirement.
In the embodiment, the area enclosed by the side edges of the plastic sheet 24 is smaller than the area of the lower surface 10 of the soaking plate, and the stud 22 fixed on the plastic sheet 24 can be close to the middle of the soaking plate 4. The specific location of the studs 22 may be determined based on actual heat sink mounting requirements, such as the pitch of the studs. Because the studs 22 are integrally formed with the plastic sheet 24, the positions of the studs 22 on the plastic sheet 24 can be arbitrarily adjusted according to requirements. Therefore, the position of the stud 22 can be arbitrarily adjusted without damaging the vacuum chamber in the soaking plate 4, and the mounting adaptability of the vacuum chamber radiator is greatly improved.
EXAMPLE III
As shown in fig. 7 and 8, the structures and the installation manners of the soaking plate 4 and the heat sink 6 in this embodiment are similar to those in the embodiment, and are not described herein again.
In this embodiment, the mounting structure includes a connection structure provided on the lower surface 10 of the soaking plate and a fixing structure fixedly connected to the connection structure. Wherein, the connecting structure is a pit 36 arranged on the lower surface 10 of the soaking plate, and the pit 36 does not penetrate through the bottom wall of the vacuum cavity of the soaking plate 4 and is communicated with the vacuum cavity. The fixing structure is a stud 38, and the stud 38 is used for connecting and fixing with a computer main board.
The studs 38 may be secured within the pockets 36 by screwing, welding or riveting, etc. In this embodiment, threads are provided on the inner wall of the recess 36, and then the stud 38 is threaded into the recess 36. In other embodiments, the stud 38 may be placed in the recess 36 and then soldered or riveted, so long as the stud 38 is firmly fixed in the recess 36.
In the illustrated embodiment, the number of pockets 36 and studs 38 is 4, and four pockets 36 are arranged in a square arrangement. In other embodiments, the number of the concave recesses 36 and the studs 38 may be other according to the actual design requirement, as long as the heat sink 2 can be stably fixed on the computer motherboard.
In this embodiment, the dimples 36 are formed on the lower surface 10 of the soaking plate, and the studs 38 are fixed in the dimples 36. Since the dimples 36 are formed on the lower surface 10 of the soaking plate 4, the positions where the dimples 36 are provided can be arbitrarily adjusted as required. Therefore, the positions of the concave pits 36, namely the studs 18 can be adjusted at will without damaging the vacuum cavity in the soaking plate 4, and the installation adaptability of the vacuum cavity radiator is greatly improved.
It should be understood that, in the above embodiments, the heat sink 2 is fixed to a computer motherboard by using the mounting structure, but the invention is not limited thereto, and in other embodiments, the mounting structure, or the heat sink 2 using the mounting structure, may also be applied to components of other electronic devices, such as a motherboard of an LED chip.
It should also be understood that the fixing structures used in the above embodiments are all studs, and in other embodiments, other types of fixing structures may also be used according to the type of the main board and the actual design and installation requirements.
In summary, the vacuum chamber heat sink provided by the present invention is additionally provided with some mounting structures or simple concave structures, such as a metal sheet fixed on the bottom surface of the soaking plate of the heat sink, a plastic piece fixed on the heat sink by using an inverted buckle, or a concave pit punched on the bottom surface of the soaking plate and not communicated with the vacuum chamber. The studs are arranged on the metal sheets, the plastic parts or the pits, and the studs are connected and fixed with the main board, so that the assembly requirement is met. The position of the stud can be adjusted according to the actual installation position, so that the installation position of the radiator can meet the requirement of the change of the installation position under the condition of not changing the structure of the vacuum cavity. The radiator has the advantages of simple structure, easy realization, low cost, convenient installation and disassembly and wide application range, meets the installation requirement of smaller hole pitch of the mainboard under the condition of not changing the vacuum cavity structure of the radiator, ensures better heat radiation performance of products, and provides possibility for the design of smaller size of the mainboard.
The concepts described herein may be embodied in other forms without departing from the spirit or characteristics thereof. The particular embodiments disclosed should be considered illustrative rather than limiting. The scope of the invention is, therefore, indicated by the appended claims rather than by the foregoing description. Any changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (10)
1. The utility model provides an installation structure of vacuum cavity radiator, the vacuum cavity radiator includes the soaking plate, the inside vacuum cavity that is equipped with of soaking plate, the vacuum cavity holds phase transition working medium, the soaking plate has upper surface and lower surface, the lower surface is used for contacting with a source of generating heat, a serial communication port, installation structure is used for with the vacuum cavity radiator is installed to one and is born on the component in the source of generating heat, makes the soaking plate lower surface with the source of generating heat contacts, installation structure is including setting up the connection structure of soaking plate lower surface and with connection structure fixed connection's fixed knot constructs, fixed knot construct be used for with bear the component fixed connection in the source of generating heat.
2. The mounting structure of a vacuum chamber heat sink according to claim 1, wherein the attachment structure is a metal sheet having a central opening, the metal sheet being fixedly attached to the lower surface of the soaking plate, the central opening exposing a portion of the lower surface of the soaking plate so that the portion of the lower surface of the soaking plate can be brought into contact with the heat generating source.
3. The mounting structure of the vacuum chamber heat sink according to claim 2, wherein the metal sheet is fixed to the lower surface of the soaking plate by means of welding.
4. The mounting structure for a heat sink in a vacuum chamber according to claim 2, wherein a buckle portion is extended from a side of the metal plate, and the buckle portion is fastened to an edge of the heat equalizing plate.
5. The vacuum chamber radiator mounting structure as claimed in any one of claims 2 to 4, wherein said fixing structure is a plurality of studs fixed to said metal plate.
6. The mounting structure of a heat sink in a vacuum chamber according to claim 1, wherein the connecting structure is a plastic member including a plastic sheet having a central opening and a locking portion connected to the plastic sheet, the plastic sheet is attached to the lower surface of the soaking plate, the locking portion is fastened to the edge of the soaking plate by a snap, and the central opening exposes a portion of the lower surface of the soaking plate so that the portion of the lower surface of the soaking plate can contact the heat generating source.
7. The mounting structure of a heat sink in a vacuum chamber according to claim 6, wherein the fastening portion comprises a plurality of fastening strips extending from the side of the plastic sheet, the ends of the fastening strips are bent, and the bent structure is fastened to the edge of the soaking plate.
8. The mounting structure of a heat sink in a vacuum chamber according to claim 6, wherein the locking portion comprises a locking piece integrally extending from a side of the plastic piece and two bending strips integrally extending perpendicularly from both sides of an end of the locking piece, and the two bending strips are fastened to the edge of the soaking plate.
9. The vacuum chamber heat sink mounting structure according to any one of claims 6 to 8, wherein the fixing structure is a plurality of studs fixed on the plastic sheet.
10. The mounting structure for a heat sink in a vacuum chamber according to claim 1, wherein the fixing structure is a plurality of studs, the connecting structure is a plurality of recesses formed in the lower surface of the soaking plate, the recesses do not penetrate through the bottom wall of the vacuum chamber and communicate with the vacuum chamber, and the studs are fixed in the recesses by screwing, welding or riveting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710874541.0A CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710874541.0A CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
| CN201610927138.5A CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610927138.5A Division CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107589813A CN107589813A (en) | 2018-01-16 |
| CN107589813B true CN107589813B (en) | 2019-12-20 |
Family
ID=57864889
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610927138.5A Expired - Fee Related CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
| CN201710874541.0A Expired - Fee Related CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610927138.5A Expired - Fee Related CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106354229B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113257759A (en) * | 2020-02-10 | 2021-08-13 | 华为技术有限公司 | Radiator, single board, electronic equipment and manufacturing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030070791A1 (en) * | 2001-10-12 | 2003-04-17 | Yu-Shen Lin | Heat sink module |
| CN2768202Y (en) * | 2004-01-16 | 2006-03-29 | 佛山市顺德区汉达精密电子科技有限公司 | Fastener and heat sink using the same |
| CN101039566A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor and electronic device using the same |
| CN201007627Y (en) * | 2006-11-28 | 2008-01-16 | 范公瑞 | Vacuum superconducting heat radiator |
| CN101346051B (en) * | 2007-07-11 | 2011-01-19 | 建碁股份有限公司 | Fastener and heat radiating device with the same |
| CN204042816U (en) * | 2014-08-30 | 2014-12-24 | 杭州桑帝照明电器有限公司 | A kind of LED radiator based on vapor chamber heat dissipation technology |
| CN206178630U (en) * | 2016-10-31 | 2017-05-17 | 东莞泓创五金制品有限公司 | Vacuum cavity radiator |
-
2016
- 2016-10-31 CN CN201610927138.5A patent/CN106354229B/en not_active Expired - Fee Related
- 2016-10-31 CN CN201710874541.0A patent/CN107589813B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN106354229B (en) | 2017-12-05 |
| CN106354229A (en) | 2017-01-25 |
| CN107589813A (en) | 2018-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7684187B1 (en) | Heat dissipation device | |
| US7426112B2 (en) | Heat dissipating module | |
| US7579687B2 (en) | Circuit module turbulence enhancement systems and methods | |
| US6860321B2 (en) | Heat-dissipating device | |
| US8854819B2 (en) | Cooling device | |
| US20090309214A1 (en) | Circuit Module Turbulence Enhancement | |
| US20060274504A1 (en) | Heat dissipation device | |
| US20110310565A1 (en) | Heat sink for memory module | |
| US20130306291A1 (en) | Strip heatsink | |
| TW201319786A (en) | Heat dissipation device | |
| KR20180001949U (en) | Assembly for a radiator | |
| CN107589813B (en) | Mounting structure of vacuum cavity radiator | |
| US7841388B2 (en) | Radiating fin assembly for thermal module | |
| KR20200032427A (en) | Heat sink body with heat pipe and heat sink using the same | |
| CN116075110A (en) | Liquid cooling module and electronic device | |
| TWM531125U (en) | Heat sink board assembly and electronic device | |
| CN206178630U (en) | Vacuum cavity radiator | |
| US7757750B2 (en) | Integrated cooling system for electronic components | |
| JP2019003965A (en) | Electronic device | |
| CN203814120U (en) | Heat radiation assembly | |
| US9072176B2 (en) | Assembling structure of heat dissipation device | |
| CN218630716U (en) | Combined type high-boss VC heat dissipation assembly and heat dissipation device | |
| CN204904192U (en) | Mainboard subassembly | |
| CN211702811U (en) | Flat radiator and POE electronic product | |
| CN219181917U (en) | Heat radiation structure of high heating electric appliance element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191220 Termination date: 20211031 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |