US20030070791A1 - Heat sink module - Google Patents
Heat sink module Download PDFInfo
- Publication number
- US20030070791A1 US20030070791A1 US09/976,951 US97695101A US2003070791A1 US 20030070791 A1 US20030070791 A1 US 20030070791A1 US 97695101 A US97695101 A US 97695101A US 2003070791 A1 US2003070791 A1 US 2003070791A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink module
- cpu
- thermal conducting
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat sink module and more particularly to a heat sink module that is adapted to be retained on a CPU with a fast computing speed and effectively carries heat away from the CPU.
- the present invention provides a compact and efficient heat sink module to mitigate and obviate the aforementioned problems.
- the objective of the present invention is to provide an effective heat sink module for quickly dispersing heat from a CPU having fast computing speeds.
- the invention uses a hollow and vacuum thermal conducting body corresponding to the center of the CPU.
- FIG. 1 is an exploded perspective view of a first embodiment of the heat sink module in accordance with the present invention
- FIG. 2 is a perspective view of the heat sink module in FIG. 1;
- FIG. 3 is a cross sectional side plan view of the heat sink module in FIG. 1 mounted on a CPU;
- FIG. 4 is a perspective view of the heat sink module in FIG. 1 with a fan
- FIG. 5 is a perspective view of a second embodiment of the heat sink module in accordance with the present invention.
- FIG. 6 is a cross sectional side plan view of the heat sink module in FIG. 5;
- FIG. 7 is a perspective view of the heat sink module in FIG. 5 with a fan.
- a first embodiment of a heat sink module includes a base ( 10 ), a thermal conducting tube ( 11 ) and a cover ( 12 ).
- the base ( 10 ) is connected separably to a CPU ( 30 ).
- the thermal conducting tube ( 11 ) is hollow, has an open end and a closed end, a chamber ( 110 ) is defined in the thermal conducting tube ( 11 ) and is connected to the base ( 10 ).
- the cover ( 12 ) seals the open end of the thermal conducting tube ( 11 ) to make the chamber ( 110 ) airtight.
- a hole ( 101 ) is defined in the base ( 10 ) to mount the thermal conducting tube ( 11 ).
- the thermal conducting tube ( 11 ) has a rough inner face of to provide a greater area of the thermal conducting tube ( 11 ) to dissipate heat.
- a cooling fluid ( 40 ) is put into the chamber ( 110 ) but does not fill the chamber ( 110 ). Then a vacuum is drawn on the remaining space in the chamber ( 110 ) to conduct the heat quickly to the cooling fluid ( 40 ).
- the hole ( 101 ) corresponds to a center of the CPU ( 30 ).
- the temperature at the center of the CPU ( 30 ) is higher than any other portion of the CPU ( 30 ). Therefore the thermal conducting tube ( 11 ) is able to directly dissipate heat quickly from the CPU ( 30 ), and the temperature of the CPU ( 30 ) can be maintained in a normal range during operation of the CPU.
- a fan ( 20 ) is mounted on the base ( 10 ) near the thermal conducting tube ( 11 ) to disperse heat from the thermal conducting tube ( 11 ).
- a second embodiment of the heat sink module comprises a base ( 10 a ), a thermal conducting tube ( 11 a ), a cover ( 12 a ) and multiple conducting plates ( 13 ).
- the base ( 10 a ), thermal conducting tube ( 11 a ) and cover ( 12 a ) are the same as the first embodiment of the heat sink module.
- the U shape conducting plates are stacked on the base ( 10 a ) and connected to the thermal conducting tube ( 11 a ).
- each conducting plate ( 131 ) is defined in each conducting plate ( 131 ) to fit around the thermal conducting tube ( 11 a ).
- each conducting plate is U shape, when the conducting plates ( 13 ) are stacked together, a gap ( 132 ) is formed between adjacent conducting plates ( 13 ) to facilitate dispersing heat from the conducting plates ( 13 ).
- a fan ( 20 a ) mounted with the conducting plates ( 13 ) to quickly carry heat away from each of the conducting plate ( 13 ) through the gap ( 132 ).
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.
Description
- 1. Field of the Invention
- The present invention relates to a heat sink module and more particularly to a heat sink module that is adapted to be retained on a CPU with a fast computing speed and effectively carries heat away from the CPU.
- 2. Description of Related Art
- As semiconductor technology has developed, CPUs with giga-Hz computing speeds have denser integrated circuitry with an accompanying high heat problem when the CPU is operating.
- Usually, a common heat sink with multiple fins and a fan was mounted on early CPU products so that heat was dissipated from the CPU in a timely manner. However, the common heat sink is not able to effectively dissipate the higher heat from the giga-Hz CPU. If that heat is not dispersed quickly the CPU will quickly overheat and malfunction thereby leading to considerable inconvenience and cost to the user. With the increasing popularity of CPUs with high computing speeds nowadays, a problem arises in that the CPUs generate more heat than the early CPU products.
- The present invention provides a compact and efficient heat sink module to mitigate and obviate the aforementioned problems.
- The objective of the present invention is to provide an effective heat sink module for quickly dispersing heat from a CPU having fast computing speeds. The invention uses a hollow and vacuum thermal conducting body corresponding to the center of the CPU.
- Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- FIG. 1 is an exploded perspective view of a first embodiment of the heat sink module in accordance with the present invention;
- FIG. 2 is a perspective view of the heat sink module in FIG. 1;
- FIG. 3 is a cross sectional side plan view of the heat sink module in FIG. 1 mounted on a CPU;
- FIG. 4 is a perspective view of the heat sink module in FIG. 1 with a fan;
- FIG. 5 is a perspective view of a second embodiment of the heat sink module in accordance with the present invention;
- FIG. 6 is a cross sectional side plan view of the heat sink module in FIG. 5; and
- FIG. 7 is a perspective view of the heat sink module in FIG. 5 with a fan.
- With reference to FIGS. 1, 2 and3, a first embodiment of a heat sink module includes a base (10), a thermal conducting tube (11) and a cover (12). The base (10) is connected separably to a CPU (30). The thermal conducting tube (11) is hollow, has an open end and a closed end, a chamber (110) is defined in the thermal conducting tube (11) and is connected to the base (10). The cover (12) seals the open end of the thermal conducting tube (11) to make the chamber (110) airtight.
- A hole (101) is defined in the base (10) to mount the thermal conducting tube (11). The thermal conducting tube (11) has a rough inner face of to provide a greater area of the thermal conducting tube (11) to dissipate heat. A cooling fluid (40) is put into the chamber (110) but does not fill the chamber (110). Then a vacuum is drawn on the remaining space in the chamber (110) to conduct the heat quickly to the cooling fluid (40).
- When the base (10) is mounted on the CPU (30), the hole (101) corresponds to a center of the CPU (30). The temperature at the center of the CPU (30) is higher than any other portion of the CPU (30). Therefore the thermal conducting tube (11) is able to directly dissipate heat quickly from the CPU (30), and the temperature of the CPU (30) can be maintained in a normal range during operation of the CPU. With reference to FIG. 4, a fan (20) is mounted on the base (10) near the thermal conducting tube (11) to disperse heat from the thermal conducting tube (11).
- With reference to FIG. 5, a second embodiment of the heat sink module comprises a base (10 a), a thermal conducting tube (11 a), a cover (12 a) and multiple conducting plates (13). The base (10 a), thermal conducting tube (11 a) and cover (12 a) are the same as the first embodiment of the heat sink module. The U shape conducting plates are stacked on the base (10 a) and connected to the thermal conducting tube (11 a).
- With reference to FIG. 6, a through hole (131) is defined in each conducting plate (131) to fit around the thermal conducting tube (11 a). Besides, because each conducting plate is U shape, when the conducting plates (13) are stacked together, a gap (132) is formed between adjacent conducting plates (13) to facilitate dispersing heat from the conducting plates (13).
- With reference to FIG. 7, a fan (20 a) mounted with the conducting plates (13) to quickly carry heat away from each of the conducting plate (13) through the gap (132).
- Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.
Claims (9)
1. A heat sink module, comprising:
a base adapted to be mounted on a CPU;
a thermal conducting body secured to the base, which is hollow and airtight and has a vacuum chamber, wherein cooling fluid is put into the vacuum chamber to dissipate heat from the CPU quickly.
2. The heat sink module as claimed in claim 1 , wherein a hole corresponding to a center of the CPU is defined in the base, and the thermal conducting body is retained in the hole and corresponds to the center of the CPU.
3. The heat sink module as claimed in claim 1 , wherein conducting plates are stacked together on the base and each connects to the thermal conducting body.
4. The heat sink module as claimed in claim 1 , wherein a through hole is defined in each of the conducting plates to pass around the thermal conducting body.
5. The heat sink module as claimed in claim 3 , wherein each conducting plate is U shape, when stacked together a gap is defined between two adjacent conducting plates.
6. The heat sink module as claimed in claim 1 , wherein combinations of the thermal conducting body comprise a thermal conducting tube having an open end and a cover sealed on the open end.
7. The heat sink module as claimed in claim 6 , wherein the tube further comprises a rough inner face.
8. The heat sink module as claimed in claim 1 , further comprising a fan connecting to the base and corresponds to the thermal conducting body.
9. The heat sink module as claimed in claim 3 , further comprising a fan connecting to the base and corresponds to the thermal conducting body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/976,951 US20030070791A1 (en) | 2001-10-12 | 2001-10-12 | Heat sink module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/976,951 US20030070791A1 (en) | 2001-10-12 | 2001-10-12 | Heat sink module |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030070791A1 true US20030070791A1 (en) | 2003-04-17 |
Family
ID=25524659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/976,951 Abandoned US20030070791A1 (en) | 2001-10-12 | 2001-10-12 | Heat sink module |
Country Status (1)
Country | Link |
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US (1) | US20030070791A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6725909B1 (en) * | 2003-01-06 | 2004-04-27 | Chin-Kuang Luo | Heat-dissipating device and method for fabricating the same |
US20050263267A1 (en) * | 2004-05-26 | 2005-12-01 | Hon Hai Precision Industry Co., Ltd. | Cooling apparatus and method for manufacturing the same |
CN106354229A (en) * | 2016-10-31 | 2017-01-25 | 东莞泓创五金制品有限公司 | Vacuum chamber heat sink |
-
2001
- 2001-10-12 US US09/976,951 patent/US20030070791A1/en not_active Abandoned
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6725909B1 (en) * | 2003-01-06 | 2004-04-27 | Chin-Kuang Luo | Heat-dissipating device and method for fabricating the same |
US20050263267A1 (en) * | 2004-05-26 | 2005-12-01 | Hon Hai Precision Industry Co., Ltd. | Cooling apparatus and method for manufacturing the same |
CN106354229A (en) * | 2016-10-31 | 2017-01-25 | 东莞泓创五金制品有限公司 | Vacuum chamber heat sink |
CN107589813A (en) * | 2016-10-31 | 2018-01-16 | 东莞市立川五金制品有限公司 | The mounting structure of vacuum chamber radiator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: AURAS TECHNOLOGY LTD, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, YU-SHEN;REEL/FRAME:012258/0583 Effective date: 20011002 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |