CN106354229A - Vacuum chamber heat sink - Google Patents
Vacuum chamber heat sink Download PDFInfo
- Publication number
- CN106354229A CN106354229A CN201610927138.5A CN201610927138A CN106354229A CN 106354229 A CN106354229 A CN 106354229A CN 201610927138 A CN201610927138 A CN 201610927138A CN 106354229 A CN106354229 A CN 106354229A
- Authority
- CN
- China
- Prior art keywords
- soaking plate
- vacuum chamber
- radiator
- fixed
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a vacuum chamber heat sink. The vacuum chamber heat sink comprises a soaking plate and a cooling fin, wherein a vacuum chamber is formed inside the soaking plate, a phase change working medium is contained in the vacuum chamber, the soaking plate is provided with an upper surface and a lower surface, the cooling fin is connected with the upper surface of the soaking plate in a heat conducting manner, the lower surface of the soaking plate is used for being in contact with one heat source, the vacuum chamber heat sink also comprises a mounting structure which is arranged on the lower surface of the soaking plate, the mounting structure is used for mounting the vacuum chamber heat sink on one element for bearing the heat source so that the lower surface of the soaking plate is in contact with the heat source, the mounting structure comprises a connecting structure arranged on the lower surface of the soaking plate and a fixed structure fixedly connected with the connecting structure, and the fixed structure is used for being fixedly connected with the element for bearing the heat source.
Description
Technical field
The present invention relates to a kind of radiator, meet, particularly to a kind of, the vacuum cavity radiating that installation site change requires
Device.
Background technology
Produce amount of heat during electronic component such as computer cpu work, typically using radiator, it can be radiated.Dissipate
Hot device, with the application of vacuum chamber, serves very big lifting, increasing computer is using band to the system radiating ability such as computer
There is the radiator of vacuum chamber.Traditional radiator with vacuum cavity configuration is all by two side perforates, locks screw, as shown in Figure 9.
Screw hole is larger away from ratio, and for some system requirements, less pitch-row is difficult to meet installation requirements.If by screw hole toward centre
By some, the cavity body structure of vacuum chamber certainly will be affected, thus affecting the heat dispersion of product.Due to vacuum chamber must be one complete
Totally-enclosed and vacuum cavity just can have good heat conductivility it is impossible to directly arbitrarily perforate, if perforate, then seals, just
Have gas leakage risk, and cavity body structure can be changed, its heat conductivility is also deteriorated therewith.
Therefore, how in the case of not affecting vacuum chamber cavity body structure by radiator be attached to require smaller hole away from or
It is those skilled in the art's problem demanding prompt solution on the element of the mainboard of installation site change or other carrying pyrotoxin.
Content of the invention
In view of this, the present invention proposes a kind of vacuum chamber radiator meeting installation site change requirement.
The present invention provides a kind of vacuum chamber radiator, including soaking plate and fin, is provided with vacuum inside described soaking plate
Chamber, accommodates phase-change working substance in described vacuum chamber, and described soaking plate has upper and lower surface, and described fin is equal with described
The upper surface heat conduction of hot plate connects, and described lower surface is used for contact with a pyrotoxin, described in described radiator also includes being arranged at
The mounting structure of soaking plate lower surface, described mounting structure in order to be attached to the unit of the described pyrotoxin of a carrying by described radiator
So that described soaking plate lower surface is contacted with described pyrotoxin on part, described mounting structure includes being arranged under described soaking plate
The attachment structure on surface and the fixed structure being fixedly connected with described attachment structure, described fixed structure is used for and described carrying
The element of described pyrotoxin is fixedly connected.
In one embodiment, described attachment structure includes the sheet metal with intermediate openings, and described sheet metal is fixedly connected
In described soaking plate lower surface, the part that described intermediate openings expose described soaking plate lower surface makes described soaking plate following table
This part in face can be contacted with described pyrotoxin.
In one embodiment, described sheet metal is fixed to the lower surface of described soaking plate by way of welding.
In one embodiment, the side of described sheet metal is extended with hasp portion, the side of described hasp portion and described soaking plate
Edge hasp is fixed.
In certain embodiments, described fixed structure includes the several studs being fixed on described sheet metal.
In one embodiment, described attachment structure is plastic parts, includes having the sheet of central opening and connect to institute
State the clamping part on sheet, described sheet is attached at the lower surface of described soaking plate, described clamping part and described soaking plate
Edge hasp fix, the part that described central opening exposes described soaking plate lower surface makes described soaking plate lower surface
This part can be contacted with described pyrotoxin.
In one embodiment, described clamping part includes some fastening strips extending from the side of described sheet, described
The end of fastening strip is bending structure, and the edge hasp of described bending structure and described soaking plate is fixed.
In one embodiment, described clamping part include the buckling piece integrally extending from the side of described sheet and from
The vertically extending two bending bars of end both sides one of described buckling piece, the edge of described two bending bars and described soaking plate
Hasp is fixed.
In one embodiment, described fixed structure includes the several studs being fixed on described sheet.
In one embodiment, described fixed structure is several studs, and described attachment structure includes being arranged on described soaking plate
Several pits of lower surface, described pit is not run through the diapire of described vacuum chamber and is connected with described vacuum chamber, described several spiral shells
Post is threaded connection, weld or riveting method is fixed in described several pit.
In sum, the present invention provides vacuum chamber radiator some mounting structures additional or simple concave inward structure, example
As be fixed on radiator soaking plate bottom surface sheet metal, using the fixing plastic parts on a heat sink of back-off or by soaking
The bottom surface of plate goes out the pit not connected with vacuum chamber.By arranging stud on these sheet metals, plastic parts or pit, utilize
Stud is connected with mainboard, completes the requirement assembling.The position of stud can be adjusted according to actual installation position, therefore
In the case of not changing vacuum chamber cavity body structure, the radiator installation site of the present invention can meet wanting of installation site change
Ask.The heat spreader structures of the present invention are simple, it is easy to accomplish, with low cost, install and convenient disassembly, applied widely, do not changing
Meet in the case of becoming radiator vacuum cavity configuration mainboard smaller hole away from installation requirement it is ensured that the preferable thermal diffusivity of product
Can, provide for the smaller size of design of mainboard may simultaneously.And, comparing existing mounting means needs to destroy or reduces a part
Fin, the mounting means of the present invention can be accomplished fin not to be had any impact.
Brief description
Fig. 1 is the schematic diagram of an embodiment of radiator of the present invention.
Fig. 2 is the decomposing schematic representation of radiator in Fig. 1.
Fig. 3 is the schematic diagram of another embodiment of radiator of the present invention.
Fig. 4 is the decomposing schematic representation of radiator in Fig. 3.
Fig. 5 is the schematic diagram of another embodiment of radiator of the present invention.
Fig. 6 is the decomposing schematic representation of radiator in Fig. 5.
Fig. 7 is the schematic diagram of another embodiment of radiator of the present invention.
Fig. 8 is the decomposing schematic representation of radiator in Fig. 7.
Fig. 9 is the schematic diagram of traditional heat sinks.
Specific embodiment
Before describing the embodiments in more detail it should be understood that the invention is not restricted in the application institute hereafter or in accompanying drawing
The detailed construction of description or arrangement of elements.The embodiment that the present invention can realize for alternate manner.Furthermore, it is to be understood that this paper institute
The wording using and term are solely for describing purposes, should not being construed as limiting property explain." inclusion " used herein, "comprising",
The similar wording such as " having " means and comprises items listed thereafter, its equivalent and other additional things.Particularly, work as description
When " certain element ", the present invention does not limit the quantity of this element as one it is also possible to include multiple.
The present invention provides a kind of vacuum chamber radiator, including soaking plate, some fin and mounting structure.Inside soaking plate
It is provided with vacuum chamber, in vacuum chamber, accommodates phase-change working substance, to provide good heat dispersion for radiator.Soaking plate has upper table
Face and lower surface.Some fin are connected with the upper surface heat conduction of soaking plate so that the heat in soaking plate can conduct to radiating
Piece is distributed.The lower surface of soaking plate is used for and a pyrotoxin, and such as cpu contacts, the heat absorption that pyrotoxin is produced.
Mounting structure is arranged at the lower surface of soaking plate, in order to radiator to be attached to the element of the described cpu of a carrying, such as computer master
On plate, so that soaking plate lower surface is contacted with described cpu simultaneously.This mounting structure includes being arranged on the connection of soaking plate lower surface
Structure and the fixed structure being fixedly connected with described attachment structure.Wherein said attachment structure as be simultaneously connected with soaking plate and
Fixed structure is fixed together by the intermediate structure of fixed structure with soaking plate, more fixing even by fixed structure and computer main board
Connect, thus radiator is fixed on computer main board.
The present invention is discussed in detail with reference to multiple embodiments.
Embodiment one
As depicted in figs. 1 and 2, provide a vacuum chamber radiator 2, including soaking plate 4, fin 6 and mounting structure, soaking
It is provided with vacuum chamber (not shown) inside plate 4, in vacuum chamber, accommodate phase-change working substance.Soaking plate 4 has upper surface 8 and lower surface
10, fin 6 is connected so that the heat in soaking plate 4 can conduct and be dissipated to fin 6 with upper surface 8 heat conduction of soaking plate 4
Send out.The lower surface 10 of soaking plate 4 is used for contacting with a computer cpu, the heat absorption that cpu is produced.Mounting structure is arranged at
The lower surface 10 of soaking plate 4, in order to be attached to radiator 2 on the computer main board carry described cpu, makes under soaking plate simultaneously
Surface 10 is contacted with described cpu.This mounting structure include being arranged on soaking plate lower surface 10 attachment structure and with described company
The fixed structure that access node structure is fixedly connected.
In an illustrated embodiment, soaking plate 4 is square structure, and in other embodiments, soaking plate 4 is according to design needs
Can also be other shapes, for example circular.Attachment structure is sheet metal 16, and sheet metal 16 is fixedly connected on the following table of soaking plate 4
On face 10, in the present embodiment, sheet metal 16 is on the lower surface 10 being fixed on soaking plate 4 by way of welding.Real at other
Apply it is also possible to fix by other means in example, for example, be extended hasp portion in the side of sheet metal 16, by hasp portion
Fix with the edge hasp of soaking plate 4, thus sheet metal 16 is fixed on the lower surface 10 of soaking plate 4.
In the present embodiment, fixed structure is the stud 18 being fixed on sheet metal 16, stud 18 in order to computer main board
It is connected.In the present embodiment, stud 18 is weldingly fixed on sheet metal 16, but the present invention does not limit to this, real at other
Apply in example, stud 18 can also be threaded connection or the mode such as rivet is fixedly connected with sheet metal 16.Sheet metal 16 is set to
There are intermediate openings, so that the cpu of computer main board or other pyrotoxins may pass through described opening contacting with soaking plate 4, thus
Reach the purpose of radiating.
In an illustrated embodiment, sheet metal 16 is square structure, and the quantity of stud 18 is set to 4, four studs 18
It is arranged on the both sides of sheet metal 16 with being respectively symmetrically.In other embodiments, sheet metal 16 also may be used according to specific design requirement
To be designed to other shapes, for example circular or polygon.Accordingly, stud 18 is it can also be provided that other quantity, as long as can be by
Radiator 2 is firmly secured on mainboard.
In the present embodiment, the area that the side of sheet metal 16 surrounds is less than the area of soaking plate lower surface, is fixed on gold
The stud 18 belonging on piece 16 therefore can be near the middle part of soaking plate 4.The particular location of stud 18 can be installed according to actual radiator
Require, such as screw is away from determining.Because stud 18 is fixed by sheet metal 16, stud 18 is in the position of sheet metal 16
Put and can arbitrarily adjust according to demand.Therefore, it can in the case of not destroying the vacuum chamber in soaking plate 4, to stud 18
Any adjustment is done in position, drastically increases the installation adaptability of vacuum chamber radiator.
Embodiment two
As Fig. 3 and Fig. 4, in the present embodiment, soaking plate 4, the structure of fin 6 and mounting means are similar with embodiment one,
This repeats no more.
In the present embodiment, mounting structure is included being arranged on the attachment structure of soaking plate lower surface 10 and is consolidated with attachment structure
The fixed fixed structure connecting.Wherein, attachment structure is plastic parts 20, and plastic parts 20 is fixed on soaking plate 4 by way of hasp
Lower surface 10, therefore plastic parts 20 can easily from soaking plate 4 mount and dismount.
Specifically, plastic parts 20 includes the sheet 24 with central opening and the buckle connecting to sheet 24
Portion, sheet 24 is attached at the lower surface 10 of soaking plate 4, and the edge hasp of clamping part and soaking plate 4 is fixed, and central opening exposes
A part for soaking plate lower surface 10 enables this part of soaking plate lower surface 10 to contact with cpu.In shown embodiment
In, soaking plate 4 stretches out along its side and forms a circle protuberance 28.
In embodiment as shown in Figure 3 and Figure 4, clamping part include from the side of sheet 24 integrally extend some
Fastening strip 26, the end of fastening strip 26 is set to bending structure 30, and this bending structure 30 snaps over the protuberance 28 of soaking plate 4
Upper limb is to be fixed on plastic parts 20 in soaking plate 4.
In the present embodiment, protuberance 28 cooperation that clamping part and soaking plate 4 are formed is realized hasp and is fixed.It should be understood that
It is that in other embodiments, clamping part can also be fixing with soaking plate 4 by other means, and for example the side in soaking plate 4 is opened
If the hole with clamping part cooperation, as long as clamping part can be made fixing with soaking plate 4 hasp, the present invention does not limit to this.
In the present embodiment, fixed structure is the stud 22 being fixed on sheet 24, stud 22 in order to described computer
Mainboard is connected.Wherein, the mode that stud 22 is fixed on sheet 24 can have multiple, such as riveting or integrated injection molding
Molding etc..In the present embodiment, stud 22 is to be fixedly connected with sheet 24 by way of integrated injection molding.
In the present embodiment, sheet 24 is square structure, and the fastening strip 26 extending from each side of sheet 24 is
Article two,.Certainly, the fastening strip 26 of each side of sheet 24 be designed as two only exemplary, in other embodiments, each
The quantity of the fastening strip 26 of side can also be other numbers, as long as meeting design needs and can fixing plastic parts 20 well
To soaking plate 4.The quantity of stud 22 is set to 4, and four studs 22 are arranged on the two of sheet 24 with being respectively symmetrically
Side.In other embodiments, sheet 24 can also be designed to other shapes according to specific design requirement, for example circular or many
Side shape.Accordingly, stud 22 is it can also be provided that other quantity, as long as radiator 2 can be firmly secured on computer main board
?.
Fig. 5 and Fig. 6 is exemplified with another embodiment of clamping part.As Fig. 5 and Fig. 6, clamping part is included from sheet 24
Two bending bars 34 that the buckling piece 32 that middle side edge is integrally extended one vertical with the end both sides from buckling piece 32 extends,
Buckling piece 32 fits in soaking plate lower surface 10, and bending bar 34 snaps over the upper limb of the protuberance 28 of soaking plate 4 with by plastic parts
20 are fixed in soaking plate 4.
In the present embodiment, the buckling piece 32 extending from each side of sheet 24 is one, extends from buckling piece 32
The bending bar 34 going out is two.Certainly, bending bar 34 be designed as two only exemplary, in other embodiments, in order to strengthen
Bending bar 34 is designed as bent sheet it is also possible to increase the quantity of bending bar 34, or directly, only by the buckle ability of clamping part
Meet design needs and plastic parts 20 can be fixed in soaking plate 4 well.
Equally, in the present embodiment, the area that the side of sheet 24 surrounds is less than the area of soaking plate lower surface 10, Gu
The stud 22 being scheduled on sheet 24 therefore can be near the middle part of soaking plate 4.The particular location of stud 22 can be according to actual radiating
Device installation requirement, such as screw are away from determining.Because stud 22 is integrally formed with sheet 24, stud 22 is in sheet
24 position can arbitrarily adjust according to demand.Therefore, it can in the case of not destroying the vacuum chamber in soaking plate 4, to spiral shell
Any adjustment is done in the position of post 22, drastically increases the installation adaptability of vacuum chamber radiator.
Embodiment three
As shown in Figure 7 and Figure 8, soaking plate 4, the structure of fin 6 and mounting means and embodiment one class in the present embodiment
Seemingly, will not be described here.
In the present embodiment, mounting structure is included being arranged on the attachment structure of soaking plate lower surface 10 and is consolidated with attachment structure
The fixed fixed structure connecting.Wherein, attachment structure is to be arranged on the pit 36 of soaking plate lower surface 10, and pit 36 does not run through soaking
The diapire of the vacuum chamber of plate 4 and connect with vacuum chamber.Fixed structure is stud 38, and stud 38 is solid in order to be connected with computer main board
Fixed.
Stud 38 mode such as can be threaded connection, welds or rivet and be fixed in pit 36.In the present embodiment be
It is threaded on the inwall of pit 36, then stud 38 is screwed in pit 36.In other embodiments it is also possible to adopt
With first stud 38 being put into the method recycling solder welding in pit 36, or by the way of riveting tightly, as long as can be by stud
38 are securely seated between in pit 36.
In an illustrated embodiment, the quantity of pit 36 and stud 38 is disposed as 4, four pit 36 rows of being square
Cloth.In other embodiments, pit 36 and stud 38 can also be other quantities according to actual design demand, as long as can will radiate
Device 2 is firmly secured on computer main board.
In the present embodiment, pit 36 is formed on soaking plate lower surface 10, and stud 38 is fixed in pit 36.Due to
Pit 36 is formed at the lower surface 10 of soaking plate 4, and the position of setting pit 36 can arbitrarily adjust according to demand.Therefore,
Can be in the case of not destroying the vacuum chamber in soaking plate 4, to pit 36, namely any adjustment, pole are done in the position of stud 18
The earth improves the installation adaptability of vacuum chamber radiator.
It should be appreciated that in the above-described embodiments, it is, using mounting structure, radiator 2 is fixed to a computer main board
On, but the present invention is not defined to this, in other embodiments, described mounting structure, and or using described, knot is installed
The radiator 2 of structure can also be applied to the components and parts of other electronic installations, such as led chip mainboard.
It should also be understood that in above-described embodiment adopt fixed structure be stud, in other embodiments, according to
The design and installation demand of motherboard type and reality, it would however also be possible to employ other kinds of fixed structure.
In sum, the present invention provides vacuum chamber radiator some mounting structures additional or simple concave inward structure, example
As be fixed on radiator soaking plate bottom surface sheet metal, using the fixing plastic parts on a heat sink of back-off or by soaking
The bottom surface of plate goes out the pit not connected with vacuum chamber.By arranging stud on these sheet metals, plastic parts or pit, utilize
Stud is connected with mainboard, completes the requirement assembling.The position of stud can be adjusted according to actual installation position, therefore
In the case of not changing vacuum chamber cavity body structure, the radiator installation site of the present invention can meet wanting of installation site change
Ask.The heat spreader structures of the present invention are simple, it is easy to accomplish, with low cost, install and convenient disassembly, applied widely, do not changing
Meet in the case of becoming radiator vacuum cavity configuration mainboard smaller hole away from installation requirement it is ensured that the preferable thermal diffusivity of product
Can, provide for the smaller size of design of mainboard may simultaneously.And, comparing existing mounting means needs to destroy or reduces a part
Fin, the mounting means of the present invention can be accomplished fin not to be had any impact.
Concepts described herein may be embodied to other forms in the case of without departing from its spirit and characteristic.Disclosed
Specific embodiment should be considered exemplary rather than restricted.Therefore, the scope of the present invention is by appended claim,
Rather than be determined according to these descriptions before.Any change in the letter of claim and equivalency range is all
The scope of these claim should be belonged to.
Claims (10)
1. a kind of vacuum chamber radiator, including soaking plate and fin, is provided with vacuum chamber inside described soaking plate, described vacuum chamber
Inside accommodate phase-change working substance, described soaking plate has upper and lower surface, the upper surface of described fin and described soaking plate
Heat conduction connects, described lower surface be used for contact with a pyrotoxin it is characterised in that described radiator also include being arranged at described equal
The mounting structure of hot plate lower surface, described mounting structure in order to be attached to the element of the described pyrotoxin of a carrying by described radiator
Above so that described soaking plate lower surface is contacted with described pyrotoxin, described mounting structure includes being arranged on described soaking plate following table
The attachment structure in face and the fixed structure being fixedly connected with described attachment structure, described fixed structure is used for and described carrying institute
The element stating pyrotoxin is fixedly connected.
2. the vacuum chamber radiator as described in right 1 is it is characterised in that described attachment structure includes the metal with intermediate openings
Piece, described sheet metal is fixedly connected on described soaking plate lower surface, and described intermediate openings expose the one of described soaking plate lower surface
Part enables this part of described soaking plate lower surface to contact with described pyrotoxin.
3. vacuum chamber radiator as claimed in claim 2 is it is characterised in that described sheet metal is fixed to by way of welding
The lower surface of described soaking plate.
4. vacuum chamber radiator as claimed in claim 2 is it is characterised in that the side of described sheet metal is extended with hasp portion,
The edge hasp of described hasp portion and described soaking plate is fixed.
5. the vacuum chamber radiator as described in claim 2 to 4 any one is it is characterised in that described fixed structure is included admittedly
It is scheduled on the several studs on described sheet metal.
6. vacuum chamber radiator as claimed in claim 1 is it is characterised in that described attachment structure is plastic parts, including having
The sheet of central opening and the clamping part connecting to described sheet, described sheet is attached at the following table of described soaking plate
Face, the edge hasp of described clamping part and described soaking plate is fixed, and described central opening exposes the one of described soaking plate lower surface
Part enables this part of described soaking plate lower surface to contact with described pyrotoxin.
7. vacuum chamber radiator as claimed in claim 6 is it is characterised in that described clamping part includes the side from described sheet
While some fastening strips extending, the end of described fastening strip is bending structure, the side of described bending structure and described soaking plate
Edge hasp is fixed.
8. vacuum chamber radiator as claimed in claim 6 is it is characterised in that described clamping part includes the side from described sheet
Buckling piece that side is integrally extended and from the vertically extending two bending bars of the end both sides of described buckling piece one, described two
The edge hasp of individual bending bar and described soaking plate is fixed.
9. the vacuum chamber radiator as described in claim 6 to 8 any one is it is characterised in that described fixed structure is included admittedly
It is scheduled on the several studs on described sheet.
10. vacuum chamber radiator as claimed in claim 1 it is characterised in that described fixed structure be several studs, described company
Access node structure includes being arranged on several pits of described soaking plate lower surface, described pit do not run through described vacuum chamber diapire and with
The connection of described vacuum chamber, described several studs are threaded connection, weld or riveting method is fixed in described several pit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710874541.0A CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
| CN201610927138.5A CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610927138.5A CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710874541.0A Division CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106354229A true CN106354229A (en) | 2017-01-25 |
| CN106354229B CN106354229B (en) | 2017-12-05 |
Family
ID=57864889
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710874541.0A Expired - Fee Related CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
| CN201610927138.5A Expired - Fee Related CN106354229B (en) | 2016-10-31 | 2016-10-31 | Vacuum chamber radiator |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710874541.0A Expired - Fee Related CN107589813B (en) | 2016-10-31 | 2016-10-31 | Mounting structure of vacuum cavity radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN107589813B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021160060A1 (en) * | 2020-02-10 | 2021-08-19 | 华为技术有限公司 | Heat sink, single board, electronic device, and manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030070791A1 (en) * | 2001-10-12 | 2003-04-17 | Yu-Shen Lin | Heat sink module |
| CN201007627Y (en) * | 2006-11-28 | 2008-01-16 | 范公瑞 | Vacuum superconducting heat radiator |
| CN206178630U (en) * | 2016-10-31 | 2017-05-17 | 东莞泓创五金制品有限公司 | Vacuum cavity radiator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2768202Y (en) * | 2004-01-16 | 2006-03-29 | 佛山市顺德区汉达精密电子科技有限公司 | Fastener and heat sink using the same |
| CN101039566A (en) * | 2006-03-17 | 2007-09-19 | 富准精密工业(深圳)有限公司 | Heat abstractor and electronic device using the same |
| CN101346051B (en) * | 2007-07-11 | 2011-01-19 | 建碁股份有限公司 | Fastener and heat radiating device with the same |
| CN204042816U (en) * | 2014-08-30 | 2014-12-24 | 杭州桑帝照明电器有限公司 | A kind of LED radiator based on vapor chamber heat dissipation technology |
-
2016
- 2016-10-31 CN CN201710874541.0A patent/CN107589813B/en not_active Expired - Fee Related
- 2016-10-31 CN CN201610927138.5A patent/CN106354229B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030070791A1 (en) * | 2001-10-12 | 2003-04-17 | Yu-Shen Lin | Heat sink module |
| CN201007627Y (en) * | 2006-11-28 | 2008-01-16 | 范公瑞 | Vacuum superconducting heat radiator |
| CN206178630U (en) * | 2016-10-31 | 2017-05-17 | 东莞泓创五金制品有限公司 | Vacuum cavity radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021160060A1 (en) * | 2020-02-10 | 2021-08-19 | 华为技术有限公司 | Heat sink, single board, electronic device, and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107589813A (en) | 2018-01-16 |
| CN106354229B (en) | 2017-12-05 |
| CN107589813B (en) | 2019-12-20 |
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Granted publication date: 20171205 Termination date: 20211031 |