CN219997541U - Samming board and lock attaches structure thereof - Google Patents
Samming board and lock attaches structure thereof Download PDFInfo
- Publication number
- CN219997541U CN219997541U CN202320087686.7U CN202320087686U CN219997541U CN 219997541 U CN219997541 U CN 219997541U CN 202320087686 U CN202320087686 U CN 202320087686U CN 219997541 U CN219997541 U CN 219997541U
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- China
- Prior art keywords
- plate
- locking
- locking part
- cover plate
- heat dissipation
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 238000005242 forging Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a temperature equalizing plate and a locking structure thereof, wherein the temperature equalizing plate comprises a plate body and a heat dissipation layer; a cavity is arranged in the plate body; a locking part is arranged on one side of the plate body; the locking part is used for connecting an external structure; the heat dissipation layer is positioned in the cavity. According to the technical scheme, the locking part is arranged on one side of the plate body, and the locking part is detachably connected with the external structure, so that the temperature equalizing plate is fixed on the external structure, the heat dissipation area of the temperature equalizing plate is prevented from being reduced, and the heat dissipation efficiency of the temperature equalizing plate is improved; the locking part is additionally arranged on the temperature equalizing plate, so that the effect of fixing the temperature equalizing plate and an external structure can be realized, and the heat dissipation area utilization rate of the temperature equalizing plate can be maximized.
Description
Technical Field
The utility model relates to the technical field of heat transfer devices, in particular to a temperature equalizing plate and a locking structure thereof.
Background
At present, the thickness of a notebook tends to be thinner and thinner, and meanwhile, the packaging size of a chip is reduced, the power consumption is improved, and in order to improve the heat dissipation efficiency, the use frequency of a heat dissipation device with a temperature equalization plate is higher and higher because the occupied space of the heat dissipation device with the temperature equalization plate is small; the temperature equalizing plate is a widely used element capable of efficiently diffusing a small area heat source into a larger heat transfer surface.
The samming board is generally used for heat dissipation of a main board, and through arranging a through hole on the samming board as a locking hole, and matching with a nut structure and bolts or screws on the main board, the samming board Wen Bansuo is attached to the main board. But the through hole on the samming board can influence the inside runner of samming board, still need to handle the trompil department banding of samming board simultaneously, add the locking hole and not only reduced samming board's usable floor area, still reduced samming board's radiating efficiency.
Disclosure of Invention
The utility model mainly aims to provide a temperature equalization plate and aims to solve the technical problem that the temperature equalization plate has low heat dissipation efficiency.
In order to achieve the above object, the present utility model provides a temperature equalization plate, comprising:
the plate body is internally provided with a cavity; a locking part is arranged on one side of the plate body; the locking part is used for being detachably connected with an external structure;
and the heat dissipation layer is positioned in the cavity.
Preferably, the plate body comprises a first cover plate and a second cover plate which are connected with each other, and the cavity is formed between the first cover plate and the second cover plate; one side of the first cover plate far away from the heat dissipation layer is provided with the locking part.
Preferably, the first cover plate is provided with a plurality of locking parts, and the locking parts are all arranged on the first cover plate; the locking part comprises a plurality of threaded holes.
Preferably, the locking part further comprises a plurality of protrusions, and the threaded holes are formed in the protrusions.
Preferably, the locking part and the first cover plate are in an integral structure.
Preferably, the locking part may be integrally formed on the first cover plate by stamping, forging or pouring.
Preferably, the heat dissipation layer comprises a heat conduction net, and the heat conduction net is made of a plurality of copper wires.
Preferably, the first cover plate and the second cover plate are both made of copper alloy materials.
The utility model also provides a locking structure of the temperature equalizing plate, which comprises the temperature equalizing plate and a main plate, wherein the main plate is attached to one side of the plate body, which is provided with the locking part; the main board is detachably connected with the locking part.
Preferably, the locking structure of the temperature equalization plate further comprises locking pieces, wherein the main plate is provided with a plurality of connecting holes, and the positions and the number of the locking parts correspond to those of the connecting holes; the locking part is positioned in the connecting hole, and the locking piece passes through the connecting hole and is in threaded connection with the locking part.
According to the technical scheme, the locking part is arranged on one side of the plate body, and the locking part is detachably connected with the external structure, so that the temperature equalizing plate is fixed on the external structure, the heat dissipation area of the temperature equalizing plate is prevented from being reduced, and the heat dissipation efficiency of the temperature equalizing plate is improved; the locking part is additionally arranged on the temperature equalizing plate, so that the effect of fixing the temperature equalizing plate and an external structure can be realized, and the heat dissipation area utilization rate of the temperature equalizing plate can be maximized.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of an embodiment of a temperature uniformity plate according to the present utility model.
Fig. 2 is a schematic structural diagram of an embodiment of a temperature equalizing plate according to the present utility model.
Fig. 3 is a schematic cross-sectional view of fig. 2 at A-A.
Fig. 4 is a partially enlarged schematic view at B in fig. 3.
Fig. 5 is a schematic structural view of an embodiment of the locking structure of the present utility model.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 1 | Board body | 13 | Second cover plate |
| 11 | Locking part | 2 | Heat dissipation layer |
| 111 | Threaded hole | 3 | Main board |
| 12 | First cover plate | 4 | Locking piece |
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, if a directional indication (such as up, down, left, right, front, and rear … …) is involved in the embodiment of the present utility model, the directional indication is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional indication is correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
The utility model provides a temperature equalizing plate.
Referring to fig. 1 to 4, in an embodiment of the present utility model, the temperature equalizing plate includes a plate body 1 and a heat dissipation layer 2; a cavity is arranged in the plate body 1; a locking part 11 is arranged on one side of the plate body 1, and the locking part 11 is used for being detachably connected with an external structure; the heat dissipation layer 2 is located in the cavity.
In the structure, the locking part 11 is arranged on one side of the plate body 1, and the temperature equalizing plate is fixed on the external structure through the detachable connection of the locking part 11 and the external structure, so that the heat dissipation area of the temperature equalizing plate is prevented from being reduced, and the heat dissipation efficiency of the temperature equalizing plate is improved; the locking part 11 is additionally arranged on the temperature equalizing plate, so that the effect of fixing the temperature equalizing plate and an external structure can be realized, and the heat dissipation area utilization rate of the temperature equalizing plate can be maximized.
Preferably, the plate body 1 includes a first cover plate 12 and a second cover plate 13 connected to each other, and the cavity is formed between the first cover plate 12 and the second cover plate 13; the first cover 12 is far away from the locking part 11 at one side of the heat dissipation layer 2.
In the above structure, the first cover plate 12 and the second cover plate 13 are integrally connected by welding; or the first cover plate 12 and the second cover plate 13 are connected into a whole in a pressing mode, so that the sealing performance of the cavity is ensured.
Preferably, the first cover plate 12 is provided with a plurality of locking parts 11, and the locking parts 11 are all arranged on the first cover plate 12; the locking part 11 comprises a plurality of threaded holes 111.
In the above structure, the locking part 11 includes a plurality of screw holes 111, and the external structure is screwed with the screw holes 111 to achieve fixation.
Preferably, the locking portion 11 further includes a plurality of protrusions, and the threaded holes 111 are formed on the protrusions.
In the above structure, the protrusion protrudes from the side of the first cover plate 12 away from the heat dissipation layer 2; a bolt structure corresponding to the screw hole 111 should be provided, and the outer structure is screwed with the screw hole 111 through the bolt structure, so that the temperature equalization plate is fixed on the outer structure.
Preferably, the locking portion 11 and the first cover 12 are integrally formed.
In the above structure, the locking portion 11 and the first cover plate 12 are integrally formed, so that the connection stability of the locking portion 11 and the first cover plate 12 can be improved, and the mass production is facilitated.
Preferably, the locking portion 11 may be integrally formed on the first cover 12 by stamping, forging or pouring.
In the above-described structure, after confirming the hole position, a protrusion is formed by punching with a punching device at the corresponding position of the first cover plate 12, and a screw hole 111 is formed in the middle of the protrusion. The nut is not required to be arranged on the main board 3, the first cover board 12 is formed into a bulge through stamping, and additional nuts are not required to be used, so that the consumption of parts is reduced; avoid wholly seting up the through-hole at the samming board, increased samming board's radiating area, improved samming board's work efficiency.
Preferably, the heat dissipation layer 2 comprises a heat conduction net, and the heat conduction net is made of a plurality of copper wires; the first cover plate 12 and the second cover plate 13 are both made of copper alloy materials.
In the structure, the heat conductivity of the pure copper material is better than that of the copper alloy, so that the heat conduction net can transfer heat energy more effectively.
According to the technical scheme, the locking part 11 is arranged on one side of the plate body 1, and the temperature equalization plate is fixed on the external structure through the detachable connection of the locking part 11 and the external structure, so that the heat dissipation area of the temperature equalization plate is prevented from being reduced, and the heat dissipation efficiency of the temperature equalization plate is improved; the locking part 11 is additionally arranged on the temperature equalizing plate, so that the effect of fixing the temperature equalizing plate and an external structure can be realized, and the heat dissipation area utilization rate of the temperature equalizing plate can be maximized.
The utility model also provides a locking structure of the temperature equalization plate, as shown in fig. 1 to 5, the locking structure of the temperature equalization plate comprises the temperature equalization plate, and the specific structure of the temperature equalization plate refers to the above embodiment. The novel lock comprises a lock body 1, a lock part 11 and a main board 3, wherein the lock body 1 is provided with a lock body; the main board 3 is detachably connected with the locking part 11.
When the common temperature equalization plate is installed, the common temperature equalization plate is firstly locked with the main plate 3 and then locked with the radiator, and in the installation process, the problem of radiator locking leakage exists; the locking structure needs to lock the temperature equalization plate with the main board 3 in advance and realize fixation, can effectively check the problem of leakage lock, and avoids the situation that the radiator is contacted with the main board 3 due to leakage lock of the radiator.
Preferably, the locking structure of the temperature equalization plate further comprises a locking piece 4, wherein a plurality of connecting holes are formed in the main board 3, and the positions and the number of the locking parts 11 correspond to those of the connecting holes; the locking part 11 is positioned in the connecting hole, and the locking piece 4 passes through the connecting hole and is in threaded connection with the locking part 11.
Specifically, the locking member 4 is of a bolt structure or a screw structure, and a stud portion of the bolt structure or the screw structure passes through the connection hole and is screwed with the screw hole 111.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (9)
1. A temperature equalization plate, comprising:
the plate body is internally provided with a cavity; a locking part is arranged on one side of the plate body; the locking part is used for being detachably connected with an external structure;
the heat dissipation layer is positioned in the cavity; the heat dissipation layer comprises a heat conduction net, and the heat conduction net is made of a plurality of copper wires.
2. The temperature uniformity plate according to claim 1, wherein said plate body comprises a first cover plate and a second cover plate connected to each other, said first cover plate and said second cover plate forming said cavity therebetween; the locking part is arranged on one side of the first cover plate far away from the heat dissipation layer.
3. The temperature equalization plate as recited in claim 2, wherein a plurality of said locking portions are provided on said first cover plate, and a plurality of said locking portions are provided on said first cover plate; the locking part comprises a plurality of threaded holes.
4. The temperature uniformity plate according to claim 3, wherein the locking part further comprises a plurality of protrusions, and the threaded holes are formed in the protrusions.
5. The temperature uniformity plate according to any one of claims 2 to 4, wherein the locking part and the first cover plate are integrally formed.
6. The temperature equalization plate of any one of claims 2 to 4, wherein said locking portion is integrally formed on said first cover plate by stamping or forging or pouring.
7. The temperature uniformity plate according to any one of claims 2 to 4, wherein the first cover plate and the second cover plate are made of copper alloy material.
8. The locking structure of the temperature equalization plate is characterized by comprising the temperature equalization plate as claimed in any one of claims 1 to 7, and further comprising a main plate, wherein the main plate is attached to one side of the plate body, on which the locking part is arranged; the main board is detachably connected with the locking part.
9. The locking structure of claim 8, further comprising a locking member, wherein the main board is provided with a plurality of connecting holes, and the positions and the number of the locking parts correspond to the positions and the number of the connecting holes; the locking part is positioned in the connecting hole, and the locking piece passes through the connecting hole and is in threaded connection with the locking part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320087686.7U CN219997541U (en) | 2023-01-30 | 2023-01-30 | Samming board and lock attaches structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320087686.7U CN219997541U (en) | 2023-01-30 | 2023-01-30 | Samming board and lock attaches structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219997541U true CN219997541U (en) | 2023-11-10 |
Family
ID=88604587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320087686.7U Active CN219997541U (en) | 2023-01-30 | 2023-01-30 | Samming board and lock attaches structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219997541U (en) |
-
2023
- 2023-01-30 CN CN202320087686.7U patent/CN219997541U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |