CN218630716U

CN218630716U - Combined type high-boss VC heat dissipation assembly and heat dissipation device

Info

Publication number: CN218630716U
Application number: CN202222749478.7U
Authority: CN
Inventors: 吴宜强
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-03-14
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses a high boss VC radiator unit of combined type and heat abstractor, including casing and boss, casing and boss are interconnect's two parts, and the casing is independent two individualities with the boss, processes respectively, need not tensile formation boss on the casing, effectively reduces the casing because tensile excessive cracked emergence. The arch is hollow holding tank, and the holding tank is used for holding the radiating piece, for example the copper powder, is provided with the through-hole on the casing, and in the radiating piece in the holding tank flowed into the casing, the reinforcing was to mainboard, CPU and electronic components's heat dissipation. The shell and the boss are two parts which are connected with each other, and compared with the case which is provided with the bulge, the shell and the boss can not only ensure the heat dissipation problem of the mainboard, the CPU and the electronic components, but also effectively reduce the occurrence of the shell due to the excessive stretching and breaking. The shell and the boss are respectively and independently formed, the process is simple, the function is ensured, and the process problem of integral forming is solved.

Description

Combined type high boss VC radiator unit and heat abstractor

Technical Field

The utility model relates to electronic equipment technical field particularly involves a high boss VC radiator unit of combined type and heat abstractor.

Background

A circuit board is arranged in a box body of a host of electronic equipment such as a computer, and electronic components such as a CPU, a resistor, a capacitor and the like are arranged on the circuit board, the electronic components such as the resistor, the capacitor and the like can generate heat in the working process, the work of the CPU and the circuit board is influenced by the excessive heat, and in order to ensure the normal work of the CPU, the circuit board and the like, a composite VC (VC is an abbreviation of a vapor chamber) component with a good heat dissipation effect is adopted for heat dissipation. The composite VC component is determined to have a good heat dissipation effect by the material and the manufacturing process of the composite VC component, if the resistance and the capacitance are equidistant from a CPU, the CPU is inconvenient to supply power for the resistance, the capacitance and the like, and if the CPU is better for supplying power for the resistance, the capacitance and the like, the resistance and the capacitance are equidistant from the CPU, but the resistance, the capacitance and the like are larger in height, the composite VC component is provided with bulges which are convenient to contain and dissipate heat, the existing composite VC component is the composite high-boss VC heat dissipation component, the existing composite high-boss VC heat dissipation component comprises a flat plate and a convex plate with stretching, copper columns, copper nets and copper powder are welded into a whole by high-temperature sintering, and then pure water is injected, vacuum pumping and sealing are carried out. The VC is a closed whole, when in use, the VC is taken as a foundation and then is welded with other radiating fins, a fan, a screw and a spring are arranged, heat-conducting paste is coated on the VC to form a radiator or a radiating module, one of the existing composite high-boss VC radiating assemblies is provided with a stretched convex plate, the convex plate is of an integral structure, a bulge is stretched out of one plate and forms avoidance for electronic components on the peripheral side of a CPU on a main plate, the requirement on a product forming process is high, the requirement is difficult to meet, the height of some capacitors is large, the bulge needs to be made high, and the plate is easy to break due to over-stretching.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high boss VC radiator unit of combined type and heat abstractor aims at solving the board because tensile excessive, the technical problem who breaks easily.

In order to realize the purpose, the utility model adopts the following technical proposal:

a high boss VC radiator unit of combined type for CPU, electronic components's heat dissipation, includes:

the device comprises a shell, a first fixing piece and a second fixing piece, wherein one end of the shell is provided with a through hole;

the boss is a hollow accommodating groove which is used for accommodating a heat dissipation piece, and the boss seals the through hole;

wherein, the shell and the boss are two parts which are connected with each other.

Further, the boss is fixed at one end of the shell, where the through hole is formed, through welding.

Further, the boss includes arch and mounting, the arch is hollow the holding tank, the mounting set up in the open end of holding tank, the mounting welded fastening be in the casing is provided with the one end of through-hole.

Further, the mounting is followed the circumference setting of holding tank, and follows the circumference of through-hole welds in on the casing.

Further, the housing includes a first portion and a second portion, the first portion and the second portion assembled to form the housing; the second part is provided with the through hole, and the second part protrudes out of the edge of the boss.

Further, one end of the second portion, which is close to the first portion, extends in a direction away from the first portion to form a groove.

Further, the first part is provided with a plurality of first mounting holes, the plurality of first mounting holes are arranged along the circumferential direction of the first part, the second part is provided with a plurality of second mounting holes corresponding to the first mounting holes, and the first part and the second part are assembled and connected through the first mounting holes and the second mounting holes.

Further, the corner of recess passes through the circular arc board transition, just the circular arc board to recess is inside to be salient.

Further, the corners of the second part are provided with arc-shaped hand carrying positions.

The utility model also discloses a heat abstractor, heat abstractor includes above-mentioned arbitrary high boss VC radiator unit of combined type.

Has the advantages that:

a shell and a boss are two parts which are connected with each other, the shell and the boss are two independent bodies which are processed respectively, the boss does not need to be formed by stretching the shell, and the occurrence of excessive stretching breakage of the shell is effectively reduced. The arch is hollow holding tank, and the holding tank is used for holding the radiating piece, for example the copper powder, is provided with the through-hole on the casing, and the reinforcing is to mainboard, CPU and electronic components's heat dissipation in the radiating piece in the holding tank flows into the casing. The shell and the boss are two parts which are connected with each other, and compared with the case provided with the protrusion, the shell and the boss are two parts which are connected with each other, so that the heat dissipation problem of a mainboard, a CPU and an electronic component can be ensured, and the occurrence of excessive stretching and cracking of the shell can be effectively reduced. The shell and the boss are respectively formed independently, the process is simple, and the process problem of integral forming can be solved while the function is ensured.

Drawings

Fig. 1 is a schematic structural view of a composite high-boss VC heat dissipation assembly according to an embodiment of the present invention;

fig. 2 is an exploded view of the composite high-convex VC heat sink assembly according to an embodiment of the present invention;

fig. 3 is an exploded view of another embodiment of the composite high-convex VC heat sink assembly of the present invention.

Wherein: 1. a housing; 11. a first portion; 111. a first mounting hole; 12. a second portion; 121. a second mounting hole; 122. a groove; 1221. a circular arc plate; 123. a through hole; 124. carrying a hand; 2. a boss; 21. a protrusion; 22. and a fixing member.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that the terms "one end," "another end," "first," "second," and the like as used herein are for illustrative purposes only and are not to be construed as indicating or implying relative importance.

The technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to use the basis that those skilled in the art can realize the combination, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should be considered to be absent, and the present invention is not within the protection scope of the present invention.

Referring to fig. 1 and fig. 2, in an embodiment, the utility model discloses a composite high-boss VC heat dissipation assembly for heat dissipation of CPU and electronic components, comprising a housing 1 and a boss 2; one end of the shell 1 is provided with a through hole 123; the boss 2 is a hollow accommodating groove which is used for accommodating the heat dissipation piece, and the boss 2 seals the through hole 123; wherein, the shell 1 and the boss 2 are two parts connected with each other.

In the above embodiment, the housing 1 and the boss 2 are two parts connected to each other, and the housing 1 and the boss 2 are two independent bodies and are processed respectively, so that the boss 2 does not need to be formed on the housing 1 by stretching, and the occurrence of excessive stretching fracture of the housing 1 is effectively reduced. Protruding 21 is hollow holding tank, and the holding tank is used for holding the radiating piece, for example the copper powder, is provided with the through-hole on the casing, and the radiating piece in the holding tank flows into in the casing, and the reinforcing is to mainboard, CPU and electronic components's heat dissipation. The shell 1 and the boss 2 are two mutually connected parts, and compared with the case 1 provided with the bulge 21, the shell 1 and the boss 2 are two mutually connected parts, so that the heat dissipation problem of a mainboard, a CPU and an electronic component can be ensured, and the occurrence of excessive stretching and cracking of the shell 1 can be effectively reduced. The shell 1 and the boss 2 are respectively formed independently, the process is simple, and the process problem of integral forming can be solved while the function is ensured.

The boss 2 seals the through hole 123, prevents that the heat sink in holding tank and the casing from flowing out, ensures the radiating effect.

The shell 1 and the boss 2 are separately manufactured into two parts, are respectively molded and are integrally manufactured with common VC. The shell 1 and the boss 2 are separately manufactured into two parts which are respectively formed to be more beneficial to the stretching forming of the high boss, so that the stamping and stretching process is simple and the manufacturing process is stable.

The periphery of the CPU on the installed mainboard is provided with a plurality of relatively high resistance-capacitance elements which need to be avoided and cannot interfere with the CPU, and the lug boss 2 protrudes out of the shell 1 to effectively avoid the periphery of the CPU on the mainboard, which is provided with a plurality of relatively high resistance-capacitance elements.

Referring to fig. 1 and 2, in one embodiment, the boss 2 is fixed to an end of the case 1 provided with the through-hole 123 by welding.

In the above embodiment, the casing 1 and the boss 2 are separately formed, and the boss 2 and the casing 1 are welded to form a composite high boss VC heat dissipation assembly for dissipating heat of the CPU and the electronic component. The boss 2 is welded at one end of the housing 1 where the through hole 123 is formed, so that the boss 2 is firmer.

Referring to fig. 1 and 2, in an embodiment, the boss 2 includes a protrusion 21 and a fixing element 22, the protrusion 21 is a hollow receiving groove, the fixing element 22 is disposed at an opening end of the receiving groove, and the fixing element 22 is welded and fixed at an end of the housing 1 where the through hole 123 is disposed.

In the above embodiment, the fixing member 22 is fixed on the housing 1 by welding, which effectively increases the contact area between the boss 2 and the housing 1, and the welding is firmer. Fixing piece 22 sets up in the open end of holding tank, and is located protruding 21's side, and fixing piece 22 welds on casing 1, and boss 2 is better to the sealed effect of through-hole, prevents that the radiating piece from flowing.

Referring to fig. 1 and 3, in an embodiment, the fixing element 22 is disposed along a circumferential direction of the receiving groove and welded to the housing 1 along a circumferential direction of the through hole 123.

In the above embodiment, the fixing members 22 are welded on the circumferential direction of the through hole 123, so that the boss 2 can be more stably fixed on the casing 1, and the heat dissipation member is effectively prevented from being dissipated to the outside of the composite high boss VC heat dissipation assembly through the through hole 123 and the boss 2, thereby ensuring the heat dissipation effect.

Referring to fig. 1 to 3, in an embodiment, the housing 1 comprises a first part 11 and a second part 12, the first part 11 and the second part 12 being assembled to form the housing 1; the second part 12 is provided with a through hole 123, and the second part 12 protrudes from the boss 2.

In the above embodiment, after long-term use, the heat dissipation effect of the heat dissipation member in the accommodating tank is weakened, in order to achieve the heat dissipation effect, the heat dissipation members such as copper powder need to be replaced, the housing 1 is formed by assembling the first portion 11 and the second portion 12, and the housing 1 and the heat dissipation member inside the accommodating tank are not integrally formed, so that the heat dissipation members are convenient to detach and replace.

Install CPU and electronic components on the mainboard, electronic components is located CPU's side, and some electronic components can protrusion in CPU, when the installation of dispelling the heat, the one end that the second part was kept away from to boss 2 contradicts with CPU, and second part 12 protrusion provides the space in the edge of boss 2 (refer to figure 1), boss 2 for protrusion in CPU's electronic components.

Referring to fig. 1 to 3, in an embodiment, an end of the second portion 12 close to the first portion 11 extends in a direction away from the first portion 11 to form a groove 122.

In the above embodiment, the second portion 12 extends outward to form the recess 122 for accommodating the heat dissipating member, and the space for accommodating the heat dissipating member is increased to ensure the heat dissipating effect.

Referring to fig. 1 to 3, in an embodiment, the first portion 11 is provided with a plurality of first mounting holes 111, the plurality of first mounting holes 111 are arranged along a circumferential direction of the first portion 11, the second portion 12 is provided with a plurality of second mounting holes 121 corresponding to the first mounting holes 111, and the first portion 11 and the second portion 12 are assembled and connected through the first mounting holes 111 and the second mounting holes 121.

In the above embodiments, the composite high-boss VC heat dissipation assembly is fixed inside an electronic device, here, taking a computer as an example, and the composite high-boss VC heat dissipation assembly is fixed inside a host. Four corners of the first portion 11 are provided with first mounting holes 111, four corners of the second portion 12 are provided with second mounting holes 121, and screws fix the composite high boss VC heat dissipation assembly in the host through the first mounting holes 111 and the second mounting holes 121, so that the installation of the composite high boss VC heat dissipation assembly can be completed, and the assembly of the first portion 11 and the second portion 12 can be completed. The four corners of the first part 11 and the second part 12 are fixed by screws, so that the mounting stability of the composite high-boss VC radiating component can be ensured, and the assembling stability of the first part 11 and the second part 12 can also be ensured.

Referring to fig. 1 to 3, in an embodiment, corners of the groove 122 are transited by circular arc plates 1221, and the circular arc plates 1221 protrude toward the inside of the groove 122.

In the above embodiment, the corners of the groove 122 are transited through the arc plates 1221, and the arc plates 1221 protrude towards the inside of the groove 122, so as to provide a larger space for electronic components at the edge of the main board.

In one embodiment, the corners of the second portion 12 are provided with curved hand grips 124.

In the above embodiment, the corners of the second portion 12 are provided with the arc-shaped carrying locations 124 to facilitate the detachment of the second portion 12 from the first portion 11. The handle 124 is curved to prevent injury to the hand during removal.

In an embodiment, the utility model also discloses a heat abstractor, heat abstractor include the high boss VC radiator unit of combined type of above-mentioned arbitrary item.

The above only is the preferred embodiment of the present invention, and the patent scope of the present invention is not limited thereby, and all the equivalent structures or equivalent processes made by the contents of the specification and the drawings are utilized, or directly or indirectly applied to other related technical fields, and all the same principles are included in the patent protection scope of the present invention.

Claims

1. The utility model provides a high boss VC radiator unit of combined type which characterized in that for CPU, electronic components's heat dissipation, include:

2. The VC heat dissipation assembly with composite high bosses according to claim 1, wherein said bosses are fixed at the end of said shell where said through holes are provided, by welding.

3. The VC heat dissipation assembly with composite high bosses according to claim 2, wherein the bosses comprise protrusions and fixing pieces, the protrusions are hollow accommodating grooves, the fixing pieces are arranged at the open ends of the accommodating grooves, and the fixing pieces are welded and fixed at one ends of the shells, where the through holes are formed.

4. The VC heat dissipation assembly with composite high bosses according to claim 3, wherein the fixing pieces are arranged along the circumferential direction of the accommodating groove and welded on the shell along the circumferential direction of the through holes.

5. The composite high bay VC heat sink assembly of claim 1, wherein said housing comprises a first portion and a second portion, said first portion and said second portion assembled to form said housing; the second part is provided with the through hole, and the second part protrudes out of the edge of the boss.

6. The VC heat sink assembly as recited in claim 5, wherein an end of the second portion proximate to the first portion extends away from the first portion to form a groove.

7. The composite high boss VC heat dissipation assembly of claim 5, wherein the first portion is provided with a plurality of first mounting holes, the plurality of first mounting holes are arranged along the circumferential direction of the first portion, the second portion is provided with a plurality of second mounting holes corresponding to the first mounting holes, and the first portion and the second portion are assembled and connected through the first mounting holes and the second mounting holes.

8. The VC heat dissipation assembly with high convex platform of claim 6, wherein the corners of the groove are transited by arc plates, and the arc plates are protruded towards the inside of the groove.

9. The VC heat sink assembly with composite high bosses of claim 6, wherein the corners of the second portion are provided with arc-shaped carrying positions.

10. A heat sink comprising the composite high-bay VC heat sink assembly of any one of claims 1 to 9.