CN115793810A - Server and cabinet - Google Patents

Abstract

The embodiment of the application provides a server and a cabinet, relates to the technical field of computers, and is used for improving the heat dissipation effect of the server. The server comprises a circuit board, at least two functional modules positioned on the circuit board and an air guide cover. The at least two functional modules include a first functional module and a second functional module. The wind scooper is located on one side of the circuit board and is configured to guide the airflow moving from the first end of the circuit board to the second end of the circuit board. The wind scooper comprises a first cover body and a second cover body. The first cover body and the circuit board jointly enclose a first containing cavity, and the first functional module and the second functional module are located in the first containing cavity. The first cover body and the second cover body jointly enclose a second accommodating cavity. The second accommodating cavity is communicated with the first accommodating cavity through the first opening; and the airflow entering the first accommodating cavity from the second accommodating cavity is configured to dissipate heat of the second functional module.

Description

Server and cabinet

Technical Field

Embodiments of the present application relate to the field of computer technologies, and in particular, to a server and a cabinet.

Background

A server is a type of computer, which is a high-performance computer in a network that provides various services to client computers. Under the control of the operating system, the server provides external devices (such as hard disks, printers and the like) connected with the server to client sites on the network for sharing, and can also provide services such as centralized computation, information distribution, data management and the like for network users.

Due to the rapid development of businesses such as artificial intelligence services, cloud computing services, virtualization services, high-performance computing services, big data processing services and the like, the requirements of the businesses on the performance of the server are also sharply improved. When each function module in the server improves the data processing speed and the operation speed to meet the requirements of the service on the performance of the server, the heat productivity of the function modules is greatly increased, which provides a serious challenge for the heat dissipation capacity of the server.

Therefore, a solution for improving the heat dissipation effect of the server is needed.

Disclosure of Invention

The embodiment of the application provides a server and a cabinet, and the heat dissipation effect of the server can be improved.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, a server is provided. The server comprises a circuit board, at least two functional modules and an air guide cover, wherein the functional modules are positioned on the circuit board. The at least two functional modules comprise a first functional module and a second functional module, and the first functional module and the second functional module are arranged in sequence and at intervals in a first direction from the first end of the circuit board to the second end of the circuit board. The wind scooper is located on one side of the circuit board and is configured to guide airflow moving from a first end of the circuit board to a second end of the circuit board. The wind scooper comprises a first cover body and a second cover body. The first cover body and the circuit board jointly enclose into the first chamber that holds, and first function module and second function module are located the first intracavity that holds. The second cover body is positioned on one side of the first cover body far away from the circuit board, and the first cover body and the second cover body jointly enclose a second containing cavity. The first cover body is also provided with a first opening penetrating through the first cover body, and the second accommodating cavity is communicated with the first accommodating cavity through the first opening; and the airflow entering the first accommodating cavity from the second accommodating cavity is configured to dissipate heat of the second functional module.

The server that the embodiment of this application provided forms the second through the second cover body and the cooperation of first cover body and holds the chamber to utilize first opening to make the second hold the air current of intracavity and get into first chamber that holds, with dispel the heat to the second function module, can reduce the temperature of the air current of contact second function module, promote the radiating effect to the second function module, and then promote the holistic radiating effect of server.

In some embodiments, an orthographic projection outline of the first opening on the circuit board is located between an orthographic projection of the first functional module on the circuit board and an orthographic projection of the second functional module on the circuit board.

In this embodiment, the second holds the chamber and gets into the first air current that holds the chamber from first opening, at the in-process to the second end motion of mainboard, can dispel the heat to whole second function module to improve the radiating effect of second function module.

In some embodiments, there is an overlap between an orthographic projection contour of the first opening on the circuit board and an orthographic projection of the second functional module on the circuit board.

In this embodiment, the second holds the chamber and gets into the first air current that holds the chamber from first opening, at the in-process to the second end motion of mainboard, can dispel the heat to at least part second function module to improve the radiating effect of second function module.

In some embodiments, the first cover body is provided with a plurality of first openings, and the plurality of first openings are arranged in an array.

In this embodiment, the air current that the second held the chamber gets into first holding chamber through a plurality of first openings for the air current can disperse and get into first holding chamber uniformly, improves the radiating homogeneity of second function module.

In some embodiments, the second enclosure comprises a wind deflector. The wind deflector is positioned on one side of the first opening close to the second end. The orthographic projection of the wind shield on the circuit board is overlapped with the orthographic projection of the second functional module on the circuit board; or the orthographic projection of the wind shield on the circuit board is positioned between the orthographic projection of the first functional module on the circuit board and the orthographic projection of the second functional module on the circuit board.

The deep bead is configured to, blocks that the second holds the air current in the intracavity and continues to hold the intracavity at the second and hold the second end motion to the mainboard for receive the air current that blocks and get into first chamber of holding from first opening, promote the second and hold the efficiency that the air current in chamber got into first chamber of holding, further improve the radiating effect of second function module.

The orthographic projection of the wind shield on the main board and the orthographic projection of the second functional module on the main board are overlapped. In this way it is ensured that the first opening at the first side of the wind deflector is at the first side of at least part of the second functional module. The second accommodating cavity enters the first accommodating cavity from the first opening, at least part of the second functional modules are cooled, and the cooling effect of the second functional modules is ensured.

The orthographic projection of the wind shield on the mainboard is positioned between the orthographic projection of the first functional module on the mainboard and the orthographic projection of the second functional module on the mainboard. Like this, can ensure that the first opening that is located deep bead first side is in the first side of second function module for the second holds the chamber and gets into the first air current that holds the chamber from first opening, dispels the heat to whole second function module, ensures the radiating effect to the second function module.

In some embodiments, the server further comprises a function board. The function integrated circuit board is located the wind shield and is close to one side of second end. The wind shield is provided with a second opening.

In this embodiment, the second holds the chamber and can pass through second opening and function integrated circuit board intercommunication for the second holds the air current of intracavity and can pass the second opening, dispels the heat to the function integrated circuit board, improves the operating characteristic of function integrated circuit board.

In some embodiments, the first functional module includes a plurality of first processors arranged at intervals along the second direction, and first memory modules located at two sides of each first processor in the second direction. The second functional module comprises a plurality of second processors which are arranged at intervals along the second direction, and second memory modules which are positioned at two sides of each second processor in the second direction. The first processor is arranged opposite to at least part of the second memory module, and/or the second processor is arranged opposite to at least part of the first memory module. The first direction intersects the second direction.

In this embodiment, through with first function module and the at least partial dislocation set of second function module, can reduce the temperature of the air current of contact second function module to promote the radiating effect to the second function module.

In some embodiments, the server further comprises a heat sink. The radiator is located in the first accommodating cavity and located on one side, far away from the circuit board, of the functional module. The heat sink is configured to dissipate heat of the functional module.

The airflow in the first accommodating cavity can dissipate heat of the radiator of the functional module while dissipating heat of each functional module. Similarly, the airflow in the second accommodating cavity dissipates heat of the functional module and also dissipates heat of the radiator of the functional module.

Therefore, the air flow in the air guide cover can radiate the heat of the radiator, the temperature of the radiator can be reduced, and the radiating effect of the radiator on the functional module is further improved.

In some embodiments, the server further comprises a fan module. The fan module is positioned on one side of the wind scooper close to the first end. The fan module is configured to convey airflow to the first accommodating cavity and the second accommodating cavity respectively.

Fan module can last hold chamber and second to first hold the chamber and provide the external cold wind of server, keep first chamber and the second of holding to hold the intracavity portion air current and maintain at lower temperature to promote the radiating effect to the function module.

In a second aspect, a cabinet is provided. The cabinet includes a power supply source and a server. The server is coupled with the power supply; wherein the server is the server in any of the above embodiments.

The technical effects of the second aspect can be referred to the technical effects of the first aspect, and are not described herein again.

Drawings

Fig. 1 is a schematic structural diagram of a cabinet provided in accordance with some embodiments;

FIG. 2 is a schematic perspective diagram of a server according to some embodiments;

fig. 3A is a schematic structural diagram of a motherboard in another server according to some embodiments;

fig. 3B is a schematic structural diagram of a motherboard in another server according to some embodiments;

FIG. 4 is a schematic illustration of an alternative wind scooper in a server according to some embodiments;

FIG. 5 is a schematic view of an alternative wind scooper in a server according to some embodiments;

FIG. 6 is a schematic perspective diagram of another server provided in accordance with some embodiments;

FIG. 7 is a schematic illustration of an alternative wind scooper in a server according to some embodiments;

fig. 8A is a schematic structural diagram of a motherboard in another server according to some embodiments;

fig. 8B is a schematic structural diagram of a motherboard in another server according to some embodiments.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

The technical solutions in some embodiments of the present application will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided in the present application are within the scope of protection of the present application.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, the expressions "connected," "connected," and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct or indirect physical contact with each other. For example, a and B may be connected to each other, or a and B may be connected to each other by another member. Furthermore, the term "coupled" may be a manner of making electrical connections that communicate signals.

"at least one of A, B and C" has the same meaning as "at least one of A, B or C" and includes combinations of the following A, B and C: a alone, B alone, C alone, a combination of A and B, A and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

As used herein, "parallel," "perpendicular," and "equal" include the recited case and cases that approximate the recited case to within an acceptable range of deviation as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where an acceptable deviation from approximately parallel may be, for example, within 5 °; "perpendicular" includes absolute perpendicular and approximately perpendicular, where an acceptable deviation from approximately perpendicular may also be, for example, within 5 °. "equal" includes absolute and approximate equality, where the difference between the two, which may be equal within an acceptable deviation of approximately equal, is less than or equal to 5% of either.

The embodiment of the application provides a cabinet. As shown in fig. 1, the cabinet 1000 includes a power supply source 200, and a server 100. The power supply 200 receives an Alternating Current (AC) signal provided from an external AC power source, converts the AC signal into a Direct Current (DC) signal, and outputs the DC signal. The server 100 receives a dc signal from a power supply to operate.

One rack 1000 may include at least one server 100, and in the case where the number of servers 100 in one rack 1000 is plural, the plural servers 100 in one rack 1000 may be stacked on each other.

A plurality of servers 100 in the same cabinet 1000 may be coupled to each other through a cable or a wireless communication module (e.g., a bluetooth module or a WIFI module) to transmit data signals, thereby implementing data communication between different servers 100 in one cabinet 1000. The servers 100 in different cabinets 1000 may also be coupled to each other through cables or wireless communication modules to transmit data signals, so as to implement data communication between different cabinets 1000. Thus, the servers 100 in the racks 1000 cooperate with each other to cooperatively operate to execute large operation items.

The server 100 may be a server device of a network provider or a content provider.

Based on the shape of the server, the server may be a rack server, a blade server, or a tower server, which is not limited herein. For convenience of subsequent description, the rack server is taken as an example for the following description.

The rack server may be mounted in a cabinet. Generally, a rack server may include a variety of models with various external dimensions, for example, 1U standard rack server, 2U standard rack server, 3U standard rack server, 4U standard rack server, 5U standard rack server, 6U standard rack server, 8U standard rack server, etc. may be included. The rack is provided with installation spaces matched with different external dimensions, the rack is provided with screw holes for fixing the rack-mounted servers so as to be aligned with the screw holes of the servers, and the rack-mounted servers are fixed on the rack by utilizing screws to penetrate through the two screw holes, so that the installation position of each rack-mounted server is defined.

The server provided by the embodiment of the application can comprise a shell, a mainboard and a plurality of functional modules, wherein the mainboard and the functional modules are arranged in the shell. The functional modules may include a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a memory module, a heat dissipation module, an input/output (I/O) module, a patch panel module, a power module, and a hard disk module, and each functional module may be electrically connected to a motherboard or a cable to implement its function, so as to enable the server to function as a whole. Some structures of the server 100 are explained below.

As shown in fig. 2, the housing 110 may be a plastic housing or a metal housing. The housing 110 has an accommodating space therein for accommodating a plurality of functional modules such as the motherboard 120, the CPU130, and the memory module 140. The housing 110 can define the installation position of each functional module inside the server 100, and protect the functional modules inside the accommodating space from the outside.

In some examples, the server 100 may be a cuboid server and the housing 110 is a cuboid housing. The housing 110 may include a bottom cover and a top cover disposed opposite to each other, and a surrounding frame 111 connecting the bottom cover and the top cover, respectively. The bottom cover, the top cover and the enclosure 111 may enclose a closed or open receiving space. In addition, the housing 110 may be provided with a plurality of positioning holes, and each functional module may be fixed in the accommodating space of the housing 110 by using the positioning holes, and the mounting position of the functional module is limited.

The motherboard 120 is one of the most core components of the server 100. The main board 120 may have a positioning hole, and the main board 120 is fixedly mounted on the bottom cover through the positioning hole on the main board 120 and the positioning hole on the bottom cover in the housing.

The main board 120 can provide a plurality of slots, and the main board 120 is equipped with a circuit trace coupled to the slots, after the functional modules are inserted into the slots, the functional modules coupled to the slots can be coupled to each other by using the circuit trace in the main board 120, so as to achieve signal interaction between the functional modules.

Illustratively, the motherboard 120 has a CPU socket and a memory socket, a pin of the CPU130 is inserted into the CPU socket and mounted on the motherboard 120, and a pin of the memory module 140 is inserted into the memory socket and mounted on the motherboard 120. The CPU130 and the memory module 140 may be disposed at intervals, and coupled by a circuit trace inside the motherboard 120, so as to realize signal interaction between the CPU130 and the memory module 140. Of course, in other embodiments, the motherboard 120 may not have a CPU socket, and the CPU130 is directly mounted on the surface of the motherboard 120.

In the embodiment of the present application, the number of CPUs on the motherboard 120 is at least two. For example: as shown in fig. 3A, the main board 120 is provided with CPU-1 and CPU-2, and the CPU-1 and CPU-2 are respectively located in different columns (a direction parallel to the second direction Y) on the main board 120; another example is: as shown in FIG. 3B, CPU-3, CPU-4, CPU-5 and CPU-6 are disposed on the motherboard 120, wherein CPU-3 and CPU-5 are located in the same column on the motherboard 120, and CPU-4 and CPU-6 are located in the other column on the motherboard 120. The CPU-3 and the CPU-4 may be located in the same row (direction parallel to the first direction X) on the main board 120, or may not be located in the same row, which is not limited herein.

In addition, as shown in fig. 3A and 3B, each CPU is provided with memory modules 140 on both sides in the second direction Y. The CPUs and the memory modules 140 in the same row are alternately arranged along the second direction Y.

In some examples, the motherboard 120 may also have other slots, such as a south bridge slot, a GPU slot, a hard disk slot, an integrated sound card slot, an integrated network card slot, and so forth. The CPU130 may also utilize the motherboard 120 to perform signal interaction with functional modules such as a south bridge chip, a GPU, a hard disk module, an integrated sound card, and an integrated network card.

In other examples, the motherboard 120 may further integrate an expansion slot such as a Peripheral Component Interconnect Express (PCIE) slot. PCIE belongs to peripheral interconnection point-to-point double-channel high-bandwidth transmission, and connected equipment distributes independent channel bandwidth and does not share bus bandwidth. The PCIE has the advantage of high data transmission rate, and can improve the signal interaction efficiency of two functional modules coupled by the PCIE, thereby improving the data interaction efficiency inside the server.

The CPU130 is an arithmetic core of the server 100. CPU130 may include at least arithmetic logic units, register units, and control units. The arithmetic logic unit is mainly capable of performing relevant logic operations, such as: the multi-functional arithmetic unit can execute shifting operation and logic operation, can execute fixed point or floating point arithmetic operation, address operation and conversion and other commands. Register units may be used to temporarily store the locations of instructions, data, and addresses. The control unit can be used to analyze the instructions and can issue corresponding control signals.

As shown in fig. 2 and 4, the server 100 may further include a fan module 160. The fan module 160 may be located on a first side of the motherboard 120. It is understood that the motherboard 120, the CPU130, and the memory module 140 are disposed on the second side of the fan module 160.

The fan module 160 may be coupled to the motherboard 120 to obtain an operating voltage. The fan module 160 can dissipate heat from the inside of the server by using the air-cooling heat dissipation principle. The fan module 160 may include a plurality of fans, and the plurality of fans may be disposed close to each other or disposed in a distributed manner. The fans can be disposed side by side or stacked, and are not limited herein.

Since the fan is bulky, the size of the fan module 160 in the server is larger than that of the CPU130 in the direction perpendicular to the motherboard 120 (the third direction Z).

As shown in fig. 4, the server 100 may also include a wind scooper 170. The wind scooper 170 may be located on one side of the circuit board and cover at least a portion of the circuit board and some functional modules thereon. The air inlet of the air guiding cover 170 close to the first end of the circuit board is an air inlet, the air inlet of the air guiding cover 170 close to the second end of the circuit board is an air outlet, and the air guiding cover 170 is configured to guide air flow blown to the second end of the circuit board from the first end of the circuit board, so that the air quantity of the air flow flowing through the functional module is increased, and the heat dissipation effect of the functional module is improved.

Illustratively, the circuit board may include a motherboard 120, and the functional modules on the circuit board may include a CPU130 on the motherboard 120. The wind scooper 170 may be located on one side of the motherboard 120 and cover at least a portion of the motherboard 120 and the CPU130 on the motherboard 120. The air guiding cover 170 is configured to guide the airflow moving from the first end of the motherboard 120 to the second end of the motherboard 120, so as to increase the air volume of the airflow flowing through the CPU and improve the heat dissipation effect on the CPU. For the convenience of understanding, the circuit board includes the motherboard 120, and the functional modules include CPUs (in fig. 4, 2 CPUs are respectively the first functional module and the second functional module, for example, CPU-1 and CPU-2, or CPU-5 and CPU-6), which are described below as an example, but should not be construed as limiting the present application.

As shown in fig. 4, the wind scooper 170 may include a first shroud 171. The first cover 171 may enclose a first receiving cavity Q1 together with the main board 120. Illustratively, the first cover 171 and the main board 120 together enclose a rectangular receiving cavity.

In some examples, as shown in connection with FIG. 3A, the first functional module includes CPU-1 and the second functional module includes CPU2. The first receiving cavity may receive CPU-1 and CPU-2 on the motherboard 120. In other examples, as shown in connection with FIG. 3B, the first functional module includes CPU-3 and CPU-5 in the same row in the second direction, and the second functional module includes CPU-4 and CPU-6 in the same row in the second direction. The first receiving cavity may receive CPU-3, CPU-5, CPU-4, and CPU-6 on the main board 120.

As shown in fig. 4, the wind scooper 170 may further include a second shroud 172. The second cover 172 is located on a side of the first cover 171 away from the circuit board, and the second cover 172 and the first cover 171 jointly enclose a second accommodating cavity Q2. Illustratively, the second cover 172 and the first cover 171 together enclose a rectangular receiving cavity.

In some examples, as shown in fig. 4 and 5, the dimension of the second cover 172 in the first direction X may be smaller than the dimension of the first cover 171 in the first direction X. In other examples, the size of the second cover 172 in the first direction X may be equal to or greater than the size of the first cover 171 in the first direction X. Similarly, the volume of the second accommodating cavity may be smaller than, equal to, or larger than the volume of the first accommodating cavity, which is not limited herein.

A first opening H1 penetrating through the first cover 171 is opened at a portion of the first cover 171 that is used to form a second accommodating cavity with the second cover 172. First opening H1 intercommunication is first holds chamber Q1 and second and holds chamber Q2 for the second holds in the chamber Q2 air current can get into first chamber Q1 that holds through first opening H1, in order to dispel the heat to the second function module.

The second holds the function module that does not generate heat in the chamber Q2, consequently holds chamber Q2 from the second and gets into the first air current that holds chamber Q1 and keep lower temperature, and the air current contact second function module of lower temperature is in order to dispel the heat to the second function module, promotes the radiating effect to the second function module, and then promotes the holistic radiating effect of server.

The airflow in the first accommodating cavity Q1 and the airflow in the second accommodating cavity Q2 may be provided by the fan module 160 located at the first end of the motherboard 120, and the fan module 160 blows the external cold air of the server from the first end of the motherboard to the second end of the motherboard. Therefore, no matter the airflow in the first accommodating cavity Q1 or the second accommodating cavity Q2 moves along the first end of the circuit board to the second end of the circuit board, the airflow entering the first accommodating cavity Q1 from the second accommodating cavity Q2 also moves to the second end of the circuit board.

Fan module 160 can last hold chamber Q1 and second and hold chamber Q2 and provide the external cold wind of server to first holding, keep first holding chamber Q1 and second and hold the inside air current of chamber Q2 and maintain at lower temperature to promote the radiating effect to the function module.

In some aspects, the airflow within the first receiving cavity moves along the first end of the circuit board toward the second end of the circuit board. And because the first functional module is positioned at one side of the second functional module close to the first end of the circuit board, the airflow in the first accommodating cavity can firstly contact the first functional module, and then contact the second functional module to dissipate heat of the second functional module after the first functional module dissipates heat. However, because the first airflow that holds the intracavity has absorbed the heat that first function module sent earlier, just later contacts the second function module, the temperature that leads to contacting the air current of second function module is higher, has reduced the radiating effect to the second function module, leads to the relatively poor problem of the whole radiating effect of server.

And the server that the embodiment of this application provided forms the second through the second cover body 172 and the cooperation of the first cover body 171 and holds chamber Q2 to utilize first opening H1 to make the second hold the air current entering first chamber Q1 that holds in the chamber Q2, in order dispel the heat to the second function module, can reduce the temperature of the air current of contact second function module, promote the radiating effect to the second function module, and then promote the holistic radiating effect of server.

For example, as shown in fig. 3B, in a 4U standard rack server, the CPU-4 and the CPU-6 are cooled by 2 to 5 ℃ more by using the second accommodating chamber Q2 in the wind scooper 170 to enter the first accommodating chamber Q1 from the first opening H1, compared with the scheme that the CPU-4 and the CPU-6 are cooled by only the airflow in the first accommodating chamber without the second accommodating chamber. The temperature of the CPU-4 and the CPU-6 is lower, and meanwhile, the running performance of the CPU-4 and the CPU-6 is improved (the running power is improved by 10W-30W).

In some embodiments, the edge of the wind scooper 170 in the second direction Y may be fixedly installed with the enclosure frame 111 of the housing, so that the wind scooper 170 is stably held on one side of the main board 120.

When the wind scooper 170 is fixed to the enclosure frame 111, the wind scooper 170 has a supporting force. Therefore, some functional modules can be further installed on the wind scooper 170. For example, a functional module with a small calorific value, such as electrophoresis, may be installed in the second accommodating chamber Q2, and the spatial design of the installation position of the functional module inside the server may be optimized while keeping the temperature of the airflow in the second accommodating chamber Q2 low.

As shown in fig. 4, in some embodiments, an orthographic projection of the first opening H1 on the motherboard 120 is located between an orthographic projection of the first functional module on the motherboard 120 and an orthographic projection of the second functional module on the motherboard 120.

Like this, the second holds chamber Q2 and gets into the first air current that holds chamber Q1 from first opening H1, at the in-process to the second end motion of mainboard 120, can dispel the heat to whole second function module to the improvement is to the radiating effect of second function module.

As shown in fig. 5, in other embodiments, there is an overlap between the orthographic projection of the first opening H1 on the main board 120 and the orthographic projection of the second functional module on the main board 120.

Like this, the second holds chamber Q2 and gets into the first air current that holds chamber Q1 from first opening H1, at the in-process to the second end motion of mainboard 120, can dispel the heat to at least part second function module to improve the radiating effect to the second function module.

In some embodiments, as shown in fig. 6, the number of the first openings H1 formed in the first cover 171 may be multiple, the multiple first openings H1 are arranged in an array, and the airflow of the second accommodating cavity Q2 enters the first accommodating cavity Q1 through the multiple first openings H1, so that the airflow can enter the first accommodating cavity Q1 dispersedly and uniformly, and the uniformity of heat dissipation of the second functional module is improved.

In addition, the apertures of the first openings H1 are small, so that the object in the second accommodating cavity Q2 can be prevented from passing through the first openings H1 to damage the motherboard 120 and the CPU on the motherboard.

In some examples, the shape of the first opening H1 may be at least one of a rectangle, a circle, an ellipse, a regular pentagon, a regular hexagon, and a triangle. The plurality of first openings H1 arranged in an array may be first openings including one shape, or first openings including a plurality of shapes.

In some embodiments, as shown in fig. 4 and 5, second enclosure 172 further includes a windshield 1721. Wind deflector 1721 is located on a side of first opening H1 near the second end.

The wind shield 1721 is configured to block the airflow in the second accommodating cavity Q2 to continue to move towards the second end of the main board 120 in the second accommodating cavity Q2, so that the blocked airflow enters the first accommodating cavity Q1 from the first opening H1, the efficiency of the second accommodating cavity Q2 for the airflow enters the first accommodating cavity Q1 is improved, and the effect of heat dissipation of the second functional module is further improved.

In some examples, there is an overlap between the orthographic projection of the windshield 1721 on the motherboard 120 and the orthographic projection of the second functional module on the motherboard 120. Like this, can ensure that the first opening H1 that is located deep bead 1721 first side is in the first side of at least part second function module for second holds chamber Q2 and gets into the first air current that holds chamber Q1 from first opening H1, dispels the heat to at least part second function module, ensures the radiating effect to the second function module.

In other examples, the orthographic projection of the wind deflector 1721 on the motherboard 120 is located between the orthographic projection of the first functional module on the motherboard 120 and the orthographic projection of the second functional module on the motherboard 120. Thus, it can be ensured that the first opening H1 on the first side of the wind deflector 1721 is located on the first side of the second functional module, so that the second accommodating cavity Q2 enters the airflow of the first accommodating cavity Q1 from the first opening H1 to dissipate heat of the whole second functional module, and the heat dissipation effect of the second functional module is ensured.

Wind deflector 1721 may be disposed perpendicular to main board 120, or may be inclined to the plane of main board 120, which is not limited herein.

In some embodiments, as shown in fig. 2 and 7, I/O module 150 is located on a side of windshield 1721 proximate to the second end of motherboard 120. The I/O module includes an expansion card (riser card) coupled to the motherboard 120, and a function card 151 plugged into an expansion slot of the expansion card. The function board 151 communicates with the motherboard 120 to expand the functions of the server. During the operation of the functional board 151, the functional board 151 generates heat.

Therefore, as shown in fig. 6 and 7, a second opening H2 may be opened in the wind deflector 1721. The second holds chamber Q2 and can pass through the second opening H2 and the function integrated circuit board 151 intercommunication in the I/O module for the second holds the air current in the chamber Q2 and can pass second opening H2, dispels the heat to the function integrated circuit board 151 in the I/O module, improves function integrated circuit board 151's operating characteristic.

As shown in fig. 6, the number of the second openings H2 formed in the wind shield 1721 may be multiple, the second openings H2 are arranged in an array, and the airflow of the second accommodating cavity Q2 blows to the functional board card through the second openings H2, so that the airflow can disperse and uniformly dissipate the heat of the functional board card.

In order to show the structures and positions of the first opening H1 and the second opening H2, only a wind deflector 1721 is shown in the second cover 172 in fig. 6.

In some examples, the shape of the second opening H2 may be at least one of a rectangle, a circle, an ellipse, a regular pentagon, a regular hexagon, and a triangle. The plurality of second openings H2 arranged in an array may be second openings including one shape, or second openings including a plurality of shapes.

The shape of the first opening H1 and the shape of the second opening H2 may be the same or different; similarly, the opening area of the first opening H1 and the opening area of the second opening H2 may be the same or different; this is not a limitation of the present application.

In some embodiments, the server 100 also includes a heat sink 180. The heat sink 180 is configured to dissipate heat of the functional module. Illustratively, as shown in fig. 4, 5, and 7, each CPU on the motherboard 120 is configured with a heat sink 180. The heat sink 180 is located in the first receiving cavity Q1 and on a side of the CPU away from the motherboard 120.

The size of the heat sink 180 in the direction perpendicular to the motherboard 120 is larger than the size of the CPU in the direction perpendicular to the motherboard 120, which can increase the heat dissipation area of the heat sink 180 to dissipate heat of the CPU.

On this basis, the airflow in the first accommodating cavity Q1 dissipates heat of each CPU and also dissipates heat of the heat sink 180 of the CPU. Similarly, the air flow in the second accommodating cavity Q2 dissipates heat of the CPU and also dissipates heat of the heat sink 180 of the CPU.

In this way, the air flow inside the air guide cover 170 dissipates heat to the heat sink 180, and the temperature of the heat sink 180 can be reduced, thereby further improving the heat dissipation effect of the heat sink 180 on the CPU.

In some embodiments, as shown in fig. 3A and 3B, the first functional module and the second functional module are oppositely disposed. Illustratively, as shown in FIG. 3A, CPU-1 and CPU-2 are disposed opposite one another. At this time, the high-temperature airflow after the heat dissipation of the CPU-1 is directly blown to the CPU2, so that the problem of poor heat dissipation effect of the CPU-2 is caused. Similarly, as shown in FIG. 3B, CPU-3 and CPU-4 are disposed opposite to each other, and CPU-5 and CPU-6 are disposed opposite to each other. At this time, the high-temperature airflow after the heat dissipation of the CPU-3 is directly blown to the CPU4, and the high-temperature airflow after the heat dissipation of the CPU-5 is directly blown to the CPU6, so that the problem of poor heat dissipation effects on the CPU-4 and the CPU-6 is caused.

In some embodiments, as shown in fig. 8A and 8B, the first functional module and the second functional module are at least partially disposed in a staggered manner in the first direction X. Exemplarily, in the first direction X, the first functional module and the second functional module are partially arranged in a staggered manner; or, in the first direction X, the first functional module and the second functional module are completely arranged in a staggered manner.

Take the complete dislocation of first functional module and second functional module to set up as the example: as shown in FIG. 8A, CPU-1 and CPU-2 are completely displaced, for example, CPU-2 is not opposite to CPU-1, but opposite to the memory module on the side of CPU-1. At this time, the air flow blown to the CPU-2 includes air flow mainly for dissipating heat to the memory module. Because the heating temperature of the memory module is lower than that of the CPU-1, the temperature of the airflow for radiating the memory module is lower than that of the airflow for radiating the CPU-1. Thus, compared with fig. 3A, the temperature of the air flow blowing to the CPU-2 can be reduced, and the heat dissipation effect on the CPU2 can be improved.

Take the dislocation of first functional module and second functional module part to set up as the example: as shown in FIG. 8B, CPU-3 and CPU-4 are at least partially disposed in a staggered manner, for example, CPU-4 is opposite to a portion of CPU-3 and opposite to the memory module on the side of CPU-3. At this time, the air flow blown to the CPU-4 includes a part of the air flow for dissipating heat to the CPU-3 and a part of the air flow for dissipating heat to the memory module. Because the heating temperature of the memory module is lower than that of the CPU-3, the temperature of the airflow for radiating the memory module is lower than that of the airflow for radiating the CPU-3. Thus, compared with fig. 3B, the temperature of the air flow blowing to the CPU-4 can be reduced, and the heat dissipation effect on the CPU4 can be improved. Similarly, the CPU-5 and the CPU-6 are arranged in a staggered manner, so that the heat dissipation effect of the CPU-6 can be improved, and the principle is the same and is not repeated herein.

From this, through setting up first function module and the at least partial dislocation of second function module, can reduce the temperature of the air current of contact second function module to promote the radiating effect to the second function module.

On this basis, in some examples, in the second direction Y, the first cover 171 and the second cover 172 may also be partially disposed in a staggered manner, so that the first accommodating chamber Q1 and the second accommodating chamber Q2 are partially disposed in a staggered manner.

In addition, in some examples, the first opening H1 may be located in the same row as the second functional module. For example, in the case where the CPU-2 is not opposed to the CPU-1 but is opposed to the memory module on the side of the CPU-1, the first opening H1 may be located between the CPU-2 and the memory module. Like this, get into the first low temperature air current that holds chamber Q1 from first opening H1 and can directly just fully dispel the heat to the second function module, improve the radiating effect to the second function module.

To sum up, the server that the embodiment of this application provided forms the second through the second cover body 172 and the cooperation of the first cover body 171 and holds chamber Q2 to utilize first opening H1 to make the second hold the air current entering first chamber Q1 that holds in the chamber Q2, in order to dispel the heat to the second function module, can reduce the temperature of the air current that contacts the second function module, promote the radiating effect to the second function module, and then promote the holistic radiating effect of server.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A server, comprising:

the circuit board and at least two functional modules positioned on the circuit board; the at least two functional modules comprise a first functional module and a second functional module, and the first functional module and the second functional module are arranged in sequence and at intervals in a first direction from a first end of the circuit board to a second end of the circuit board;

the air guide cover is positioned on one side of the circuit board; configured to direct an airflow moving from a first end of the circuit board to a second end of the circuit board;

the wind scooper includes:

the first cover body and the circuit board jointly enclose a first accommodating cavity, and the first functional module and the second functional module are positioned in the first accommodating cavity;

the second cover body is positioned on one side, far away from the circuit board, of the first cover body, and the first cover body and the second cover body jointly enclose a second accommodating cavity;

the first cover body is further provided with a first opening penetrating through the first cover body, and the second accommodating cavity is communicated with the first accommodating cavity through the first opening; wherein the airflow entering the first accommodating cavity from the second accommodating cavity is configured to dissipate heat of the second functional module.

2. The server of claim 1, wherein an orthographic projection of the first opening on the circuit board is located between an orthographic projection of the first functional module on the circuit board and an orthographic projection of the second functional module on the circuit board.

3. The server of claim 1, wherein an overlap exists between an orthographic projection of the first opening on the circuit board and an orthographic projection of the second functional module on the circuit board.

4. The server according to any one of claims 1 to 3, wherein the first cover defines a plurality of first openings, and the plurality of first openings are arranged in an array.

5. The server according to any one of claims 1 to 4, wherein the second enclosure comprises a wind deflector located on a side of the first opening adjacent to the second end;

the orthographic projection of the wind shield on the circuit board is overlapped with the orthographic projection of the second functional module on the circuit board; or the orthographic projection of the wind shield on the circuit board is positioned between the orthographic projection of the first functional module on the circuit board and the orthographic projection of the second functional module on the circuit board.

6. The server according to claim 5, further comprising a function board located on a side of the wind deflector proximate the second end;

and a second opening is formed in the wind shield.

7. The server according to any one of claims 1 to 6, wherein the first function module includes a plurality of first processors arranged at intervals in a second direction, and first memory modules located on both sides of each of the first processors in the second direction; the second functional module comprises a plurality of second processors which are arranged at intervals along the second direction and second memory modules which are positioned at two sides of each second processor in the second direction;

the first processor and at least part of the second memory module are arranged oppositely, and/or the second processor and at least part of the first memory module are arranged oppositely; the first direction intersects the second direction.

8. The server according to any one of claims 1 to 7, further comprising a heat sink located in the first accommodating cavity and located on a side of the functional module away from the circuit board; the heat sink is configured to dissipate heat of the functional module.

9. The server according to any one of claims 1-8, further comprising a fan module;

the fan module is positioned on one side of the wind scooper close to the first end; the fan module is configured to deliver air flow to the first accommodating cavity and the second accommodating cavity respectively.

10. A cabinet comprising a power supply and a server, the server coupled to the power supply; wherein the server is a server according to any one of claims 1 to 9.

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