TWI830561B - Heat dissipating device - Google Patents

Abstract

A heat dissipating device comprise a base and two heat dissipating units. The base includes a bottom wall and two side walls. The bottom wall and the side walls jointly define an accommodating space for the storage device therein. The inner side of each side wall is depressed to form an upper chute and a lower chute arranged up and down. The heat dissipating units are respectively pressed against the upper and lower surfaces of the storage device. Each heat dissipating unit includes a heat dissipating main part and two connecting parts. The connecting parts of the heat dissipating units are respectively inserted into the upper chute and the lower chute of the side walls, so as to restrict the storage device from moving up and down. With the upper chute and the lower chute of the base are configured to insert the connecting parts of the heat dissipating units, so that the heat dissipating units to restrict the storage device on the base in the manner of pressing upwards and downwards together, thereby the assembler can assemble the heat dissipating device and the storage device without using assembling tools and additional fixing parts.

Description

Cooling device

The present invention relates to a heat dissipation device, and in particular, to a heat dissipation device used to cool a storage device.

With the increase in the speed of server products and the popularization of NVM (Non-Volatile Memory), the storage devices in servers have gradually evolved from 2.5-inch SATA (Serial Advanced Technology Attachment) hard drives to M.2 hard drives and adopted PCIe as a transmission interface. Server products often provide multiple sets of M.2 slots on the motherboard or through expansion cards to provide high-speed storage performance. This specification is more compact in space and faster. As the capacity or performance of existing M.2 hard drives increases, the heat generated by the M.2 hard drives cannot be ignored. In order to keep the computer system from being affected by the heat generated by the M.2 hard drive and operating stably, a cooling module is usually installed on the M.2 hard drive to help the M.2 hard drive cool down and prevent the computer from Overheated and crashed. However, the radiator of a general cooling module is fixed to the base or M.2 hard drive using fasteners such as screws, S-shaped spring buckles or high-temperature resistant rubber rings. In addition to the need to prepare additional fixings, if screws are used for fixing during the assembly process, the assembler needs to bring his own screwdriver, and if the screws are not standard, he must also prepare a screwdriver of specific specifications, making the installation time-consuming and expensive. money; when fixed with high-temperature resistant rubber rings, there is a risk of deterioration and breakage after long-term use; in addition, when fixed with S-shaped spring buckles, greater force is required to install them. Installation is also time-consuming and labor-intensive.

Therefore, an object of the present invention is to provide a heat dissipation device that is easy to assemble and has good heat dissipation effect.

Therefore, the heat dissipation device of the present invention is suitable for use in a storage device. The heat dissipation device includes a base and two heat dissipation units.

The base includes a bottom wall extending in a front-to-back direction, and two side walls extending upward respectively from left and right sides of the bottom wall. The bottom wall and the side walls jointly define a storage space for the storage device. The inner recess of each side wall forms an upper chute and a lower chute extending along the front-rear direction and arranged up and down. The upper chute and the lower chute of the side walls are both connected to the accommodation space.

The heat dissipation units are located between the side walls and pressed against the upper and lower surfaces of the storage device respectively. Each heat dissipation unit includes a heat dissipation main part and two connecting parts extending in opposite directions from the left and right sides of the heat dissipation main part. Among them, the connecting parts of the heat dissipation units are respectively inserted into the upper chute and the lower chute of the side walls to limit the storage device from moving up and down.

In some implementations, the lower chute of each side wall is located below the upper chute of the corresponding side wall. And the sliding groove of each side wall has an opening formed on the open end of the front side of the corresponding side wall. The open ends are respectively used for the connecting portion of the heat dissipation unit located below to be detachably inserted into the sliding grooves to restrict the heat dissipation unit located below from moving up and down.

In some embodiments, at least one of the upper chute and the lower chute of each side wall has a closed end away from the open end.

In some embodiments, the upper chute of each side wall has an insertion opening formed on the top surface of the corresponding side wall and connected to the accommodating space. The openings are respectively used for the connecting portion of the heat dissipation unit located above to be detachably inserted into the upper chute from top to bottom. Each side wall has a groove bottom surface facing upward and defining the corresponding upper chute. The bottom surface of the upper chute is used to restrict the heat dissipation unit located above from moving downward.

In some implementations, the heat dissipation device further includes a latch unit. The tenon unit includes at least two blocking blocks extending horizontally and oppositely from the top edges of the side walls respectively. The clamping blocks respectively press against the connecting portion of the heat dissipation unit located above to restrict the heat dissipation unit located above from moving upward.

In some implementations, each clamping block has an inclined surface. The inclined surfaces of the clamping blocks face each other, and the horizontal distance between the top edges of the inclined surfaces is greater than the horizontal distance between the bottom edges of the inclined surfaces.

In some implementations, each heat dissipation unit includes a thermal conductive plate attached to the storage device, and a heat sink attached to the thermal conductive plate. Each radiator has the heat dissipation main part and the connecting parts. The material of these thermal conductive plates is thermal interface material. The heat dissipation main parts are fin structures.

In some embodiments, each side wall has a groove bottom surface facing upward and defining the corresponding upper chute, and a groove top surface facing downward and defining the corresponding lower chute. The heat dissipation main part has a fitting surface adjacent to the connecting parts and facing the storage device, and a heat dissipation surface away from the connecting parts and opposite to the fitting surface. Each connecting portion has a first connecting surface adjacent to the corresponding fitting surface, and a second connecting surface away from the corresponding fitting surface and facing in the opposite direction to the first connecting surface. noodle. The vertical distance between the groove bottom surface of each upper chute and the corresponding groove top surface of the lower chute is smaller than the vertical distance between the heat dissipation surface of each heat dissipation unit and the corresponding second connecting surface of the heat dissipation unit.

In some embodiments, the base further includes at least one ventilation hole formed on the bottom wall and the side walls and penetrating to the accommodation space.

The effect of the present invention is to use the upper chute and the lower chute of the base for the connecting parts of the heat dissipation units to be inserted, so that the upper and lower sides of the heat dissipation units can be pressed together to limit the storage device to the The base cannot move up and down, which facilitates the assembler to assemble the heat sink and the storage device without using assembly tools and additional fixing parts. In addition, by disposing the heat dissipation units at the top and bottom, the two opposite surfaces of the storage device can be heat-conducted at the same time, thereby achieving a better heat dissipation effect.

1: base

11: Bottom wall

12:Side wall

121: Upper chute

1211:Trough bottom

1212:Input port

122: Lower chute

1221:Trough top surface

123:Open end

124: closed end

13: Accommodation space

14:Ventilation hole

2: Cooling unit

2a: First cooling unit

2b: Second cooling unit

21:Thermal conductive plate

22: Radiator

221:Heat dissipation main part

222: Interface Department

2221: First interface

2222: Second interface

223: Fitting surface

224:Heating surface

3: Tenon unit

31: card block

311: Incline

9:Storage device

X: forward and backward direction

L1, L2: spacing

A1, A2, A3: arrows

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a perspective view illustrating the connection relationship between an embodiment of the heat dissipation device of the present invention and a storage device; Figure 2 is a A perspective view illustrating the implementation of a base of this embodiment; Figure 3 is a perspective view from another perspective, illustrating the implementation of the base; Figure 4 is a front view corresponding to Figure 1; Figure 5 is an exploded perspective view Figure 6 illustrates the embodiment and the assembly method of the storage device; and Figure 6 is a partial enlarged view corresponding to the circled portion in Figure 2 .

Referring to FIG. 1 and FIG. 4 , an embodiment of the heat dissipation device of the present invention is shown. First define the directional terms for what is being described here. In the subsequent description, the directions of "front", "rear", "left", and "right" of the structural configuration of the heat dissipation device are based on the usage environment of the heat dissipation device and the front, back, and left directions in the drawing. , defined on the right side. In Figure 4, the left side as shown in the figure is defined as the "left side", the right side as shown in the figure is defined as the "right side", the front side as shown in the figure is defined as the "front side", and the front side as shown in the figure is defined as the "front side". The rear shown is defined as the "rear side". The heat dissipation device is suitable for use in a storage device 9 . The storage device 9 is, for example, but not limited to a hard disk, and can be installed in an electronic device not shown in the figure, and the storage device 9 generates heat when operating. In this embodiment, the storage device 9 is an example of a solid state drive that is in the shape of a long plate and extends along a front-to-back direction X.

Referring to FIGS. 1 to 3 and 6 , the heat dissipation device is used to cool the storage device 9 and includes a base 1 and two heat dissipation units 2 installed in the base 1 . The base 1 includes a bottom wall 11 extending along the front-rear direction The vent holes 14 are spaced apart from each other in the front and rear direction X. The bottom wall 11 and the side walls 12 jointly define an accommodation space 13 for accommodating the storage device 9 and communicating with the ventilation holes 14 . The inner side of each side wall 12 is recessed to form an upper slide groove 121 and a lower slide groove 122 extending along the front-rear direction X and arranged vertically. The upper chute 121 and the lower chute 122 of the side walls 12 are both connected to the accommodating space 13 . The lower chute 122 of each side wall 12 is located below the upper chute 121 of the corresponding side wall 12 . Specifically, as shown in FIG. 6 , each side wall 12 has a groove bottom surface 1211 facing upward and defining the corresponding upper chute 121 , and a groove top surface facing downward and defining the corresponding lower chute 122 . 1221. As shown in Figure 1, the ventilation holes 14 are used to allow the The heat dissipation unit 2 is exposed outside the base 1 to achieve ventilation and cooling effects. In this embodiment, the number of the ventilation holes 14 is three. The more the number of the ventilation holes 14 , the better the heat dissipation effect of the heat dissipation device. However, the number of the ventilation holes 14 can also be only One, two or more than four, depending on actual needs.

Referring to FIG. 4 , the heat dissipation units 2 are located between the side walls 12 and pressed against the upper and lower surfaces of the storage device 9 respectively. The heat dissipation units 2 are used to conduct the heat energy generated by the storage device 9 to the outside world. Specifically, each heat dissipation unit 2 includes a heat conduction plate 21 attached to the surface of the storage device 9 , and a heat sink 22 attached to a side of the heat conduction plate 21 away from the storage device 9 . The thermally conductive plates 21 are, for example, thermally conductive paste, used to fill the gap between the radiators 22 and the storage device 9 , and can absorb the heat energy generated by the storage device 9 and then conduct it to the radiators 22 . The material of the thermal conductive plate 21 is a thermal interface material, such as silicone grease, silicone gel, epoxy resin, iron, silver, and nickel, but is not limited thereto.

Referring to Figures 1, 4 and 5, each radiator 22 has a heat dissipation main part 221 extending along the front-rear direction X, and two connections extending horizontally and inversely from the left and right sides of the heat dissipation main part 221. Department 222. Each heat dissipation main part 221 has a fitting surface 223 adjacent to the corresponding heat conducting plate 21 , and a heat dissipating surface 224 away from the corresponding heat conducting plate 21 and opposite to the fitting surface 223 . Each bonding surface 223 is used to conduct heat energy from the adjacent heat conduction plate 21 to the corresponding heat dissipation main part 221 . Each heat dissipation surface 224 is used to radiate the heat energy from the fitting surface 223 to the external environment to achieve a heat dissipation effect. Each connecting portion 222 has a first connecting surface 2221 adjacent to the corresponding fitting surface 223, and a first connecting surface 2221 away from the corresponding fitting surface 223 and facing in the opposite direction to the first connecting surface 2221. The second connecting surface 2222. In this embodiment, the connecting portions 222 are disposed on the heat dissipation main portion 221 in such a manner that the first connecting surfaces 2221 are flush with the corresponding fitting surfaces 223 . That is to say, the fitting surface 223 is closer to the connecting portions 222 than the heat dissipation surface 224, but the first connecting surfaces 2221 may also be non-flush with the corresponding fitting surface 223, which is not limited to the above description. The heat dissipation main parts 221 are fin structures and have a large surface area to quickly radiate the heat energy from the heat conduction plates 21 to the external environment.

Subsequently, for the convenience of explanation and to simplify the description, the heat dissipation unit 2 located below the storage device 9 is exemplified by a first heat dissipation unit 2a, and the heat dissipation unit 2 located above the storage device 9 is exemplified by a second heat dissipation unit 2b. Specifically, the first heat dissipation unit 2 a and the second heat dissipation unit 2 b are installed on the base 1 in an up-and-down symmetrical manner and press against the upper and lower surfaces of the storage device 9 respectively. That is to say, the bonding surfaces 223 of the heat dissipation units 2 are bonded to the adjacent heat conduction plate 21 in a manner facing the storage device 9, while the heat dissipation surfaces 224 of the heat dissipation units 2 are oriented away from the storage device 9. The device 9 is exposed to the external environment. In this way, the heat dissipation main part 221 of the first heat dissipation unit 2a will be exposed in the ventilation holes 14, and the heat dissipation main part 221 of the second heat dissipation unit 2b will be exposed in the accommodation space. 13, and has better heat dissipation effect.

On the other hand, the connecting portions 222 of the first heat dissipation unit 2a are respectively inserted into the sliding grooves 122 of the side walls 12, which will cause the first heat dissipation unit 2a to be restricted by the sliding grooves 122 and unable to move relative to the base 1 Move up and down. In the same way, the connecting portions 222 of the second heat dissipation unit 2b are respectively inserted into the upper slide grooves 121 of the side walls 12, so that the second heat dissipation unit 2b is positioned on the base 1. In addition, the first heat dissipation unit 2a and the second heat dissipation unit 2b will also press against the storage device 9 respectively. In this way, the storage device 9 will be clamped and fixed on the base 1 by the first heat dissipation unit 2a and the second heat dissipation unit 2b and cannot move up and down relative to the base 1, thereby saving During assembly, additional fasteners (such as screws) are used to fix the heat dissipation units 2 to the base 1 .

Referring to FIG. 4 , preferably, the vertical distance L1 between the groove bottom surface 1211 of the upper chute 121 of each side wall 12 and the groove top surface 1221 of the corresponding lower chute 122 is smaller than the heat dissipation surface 224 of each heat dissipation unit 2. Correspondingly, the vertical spacing L2 between the second connecting surfaces 2222 of the heat dissipation unit 2. When the connecting portions 222 of the heat dissipation units 2 are inserted into the upper chute 121 and the lower chute 122 respectively, and the heat dissipation units 2 are installed in such a way that the heat dissipation surfaces 224 are away from each other and facing opposite directions. On the base 1, the heat dissipation units 2 will not interfere with each other; on the contrary, when the assembler installs one of the heat dissipation units 2 with the corresponding heat dissipation surface 224 facing the other heat dissipation unit 2 On the base 1, the heat dissipation units 2 will interfere with each other, causing the heat dissipation units 2 to be unable to be inserted into the upper chute 121 and the lower chute 122, thereby allowing the assembler to determine the assembly process. The accuracy can prevent the assembler from being inverted and misplaced when assembling the heat dissipation device, thereby having a fool-proof effect.

Referring to Figures 2, 3, 5 and 6, further, at least one of the upper chute 121 and the lower chute 122 of each side wall 12 has an opening formed on the open end 123 of the front side of the corresponding side wall 12, and a closed end 124 away from the open end 123 . In this embodiment, the upper chute 121 and the lower chute 122 of each side wall 12 have the open end 123 and the closed end 124 . The open ends 123 allow the heat dissipation units 2 to be detachably inserted into the upper slide grooves 121 and the lower slide grooves 122 from front to back respectively. The closed ends 124 are used to restrict the heat dissipation units 2 from further moving backward, and have the effect of positioning the heat dissipation units 2 during assembly, making it easier for the assembler to assemble. In addition, the upper part of each side wall 12 The chute 121 has an insertion opening 1212 formed on the top surface of the corresponding side wall 12 and connected to the accommodating space 13 (see FIG. 6 ). Specifically, the insertion openings 1212 of the upper chute 121 face upward and extend to one side of the side walls 12 facing each other. The insertion openings 1212 of the upper chute 121 allow the second heat dissipation unit 2b to be detachably inserted into the upper chute 121 from top to bottom as shown in FIG. 5. In this way, the second heat dissipation unit 2b can be inserted longitudinally ( It is assembled into the upper chutes 121 in two ways: from top to bottom) or laterally (from front to back), allowing the assembler to have more diverse assembly methods.

Referring to Figures 2 and 4, preferably, the heat dissipation device further includes a tenon unit 3. The tenon unit 3 includes two pairs of blocking block groups spaced apart in the front-rear direction X on the side walls 12 . Each pair of clamping block groups has two clamping blocks 31 extending horizontally and oppositely from the top edges of the side walls 12 respectively. That is to say, the horizontal distance between the clamping blocks 31 is greater than the horizontal distance between the side walls 12. In this way, when the top walls of the upper chute 121 are penetrated (to form the insertion opening 1212), there is no To limit the function of the second heat dissipation unit 2b, the clamping blocks 31 protrude from the groove walls of the upper chute 121 and can jointly limit the connecting portion of the second heat dissipation unit 2b with the groove bottom 1211 of the upper chute 121. 222, so that the second heat dissipation unit 2b cannot move up and down. It is worth mentioning that in other embodiments, the open end 123 or the closed end 124 of the upper chute 121 of the side walls 12 can be omitted, and the upper chute 121 of the side walls 12 only has this position. The inlet 1212 is for the second heat dissipation unit 2b to be inserted, and the heat dissipation units 2 can be positioned only by relying on the closed ends 124 of the sliding grooves 122 during assembly, which is not limited to the above description.

In this embodiment, the number of the clamping blocks 31 is four (two pairs of clamping block groups) for fixing the front and rear of the second heat dissipation unit 2b to achieve a better fixing effect. But these blocks The number of blocks 31 can also be two, three or more than five, and the configuration of the blocking blocks 31 can also be distributed in a staggered manner on the top edges of the side walls 12, depending on actual needs. On the other hand, the blocking blocks 31 have a trapezoidal structure. That is to say, each block 31 has an inclined surface 311 . The inclined surfaces 311 of the clamping blocks 31 face each other, and the horizontal distance between the top edges of the inclined surfaces 311 is greater than the horizontal distance between the bottom edges of the inclined surfaces 311. In this way, when the second heat dissipation unit 2b moves from top to bottom Insert the upper chute 121 through the space between the clamping blocks 31, and the connecting portion 222 of the second heat dissipation unit 2b will first slide downward along the inclined surfaces 311, and then gradually move the second heat dissipation unit 2b horizontally. The clamping blocks 31 allow the tops of the clamping blocks 31 to swing toward opposite sides respectively, and allow the second heat dissipation unit 2b to pass through the space between the clamping blocks 31 . In addition, when the connecting portion 222 of the second heat dissipation unit 2b is located in the upper chute 121, the blocking blocks 31 will return to the position before being pushed, thereby restricting the second heat dissipation unit 2b from moving upward.

Referring to Figures 4 and 5, the assembly method of the heat dissipation device will be described in detail below. First, the storage device 9 is attached to the side of the heat conduction plate 21 of the first heat dissipation unit 2a away from the radiator 22 as shown by arrow A1 in FIG. 5 . Then, the first heat dissipation unit 2a is positioned in such a manner that the corresponding heat conduction plate 21 and the storage device 9 are located above the corresponding radiator 22, as shown by the arrow A2 in FIG. 5 by opening the lower grooves 122. The end 123 is horizontally inserted into the sliding grooves 122 and the accommodating space 13 until the connecting portion 222 of the first heat dissipation unit 2a contacts the closed ends 124 of the sliding grooves 122 to ensure that the installation position is correct. Then, the second heat dissipation unit 2b is positioned vertically from the upward openings of the upper chute 121 in such a manner that the corresponding heat conduction plate 21 is located below the corresponding radiator 22 as shown by arrow A3 in FIG. 5 Insert the upper chutes 121 downward and press against the top of the storage device 9 surface to complete the assembly of the heat sink.

Through the design of the inclined surfaces 311 of the clamping blocks 31, when the second heat dissipation unit 2b is inserted into the upper slide grooves 121 in a longitudinal (vertical downward) manner, the second heat dissipation unit 2b will not The blocking blocks 31 can be pushed open by the interference of the blocking blocks 31 , and then smoothly inserted into the upper slide grooves 121 and closely attached to the storage device 9 . In this way, compared with the interference problem that may occur when the second heat dissipation unit 2b is inserted laterally (horizontally backward) and assembled with the clamping blocks 31 (the connecting portion 222 of the second heat dissipating unit 2b is blocked by the clamping blocks 31 31 is stuck and cannot continue to move backward), the longitudinal insertion of the second heat dissipation unit 2b can make the second heat dissipation unit 2b easier to assemble and fit better with the storage device 9 , which is beneficial to improving the assembly speed of the heat dissipation device.

To sum up, by using the upper chute 121 and the lower chute 122 of the base 1 for the connecting portions 222 of the heat dissipation units 2 to be inserted, the upper and lower sides of the heat dissipation units 2 can be pressed together to press the heat dissipation units 2 together. The storage device 9 is limited to the base 1 and cannot move up and down, which facilitates the assembler to assemble the heat sink and the storage device 9 without using assembly tools and additional fasteners. In addition, by disposing the heat dissipation units 2 at the top and bottom, the two opposite surfaces of the storage device 9 can be heat-conducted at the same time, thereby achieving a better heat dissipation effect, so that the purpose of the present invention can be achieved.

However, the above are only examples of the present invention. They cannot be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the contents of the patent specification are still within the scope of the present invention. within the scope covered by the patent of this invention.

1: base

2: Cooling unit

3: Tenon unit

31: card block

9:Storage device

X: forward and backward direction

Claims (9)

A heat dissipation device suitable for use in a storage device. The heat dissipation device includes: A base includes a bottom wall extending in a front-to-back direction, and two side walls extending upward respectively from the left and right sides of the bottom wall. The bottom wall and the side walls jointly define a space for accommodating the storage device. In the accommodation space, the inner recess of each side wall forms an upper chute and a lower chute extending along the front-rear direction and arranged up and down, and the upper chute and lower chute of the side walls are connected to the accommodation space; and Two heat dissipation units are located between the side walls and pressed against the upper and lower surfaces of the storage device respectively. Each heat dissipation unit includes a heat dissipation main part and two reversely extending from the left and right sides of the heat dissipation main part. The connecting parts of the heat dissipation units are respectively inserted into the upper chute and the lower chute of the side walls to limit the storage device from moving up and down. The heat dissipation device according to claim 1, wherein the lower groove of each side wall is located below the upper chute of the corresponding side wall, and the lower groove of each side wall has an opening formed on the front side of the corresponding side wall. The open ends are respectively used for the connecting parts of the heat dissipation unit located below to be detachably inserted into the sliding grooves to restrict the heat dissipation unit located below from moving up and down. The heat dissipation device of claim 2, wherein at least one of the upper chute and the lower chute of each side wall has a closed end away from the open end. The heat dissipation device according to claim 2, wherein the upper chute of each side wall has an inlet formed on the top surface of the corresponding side wall and connected to the accommodation space, and the inlets are respectively provided for the upper chute. The connecting portion of the heat dissipation unit is detachably inserted into the upper chute from top to bottom. Each side wall has a bottom surface facing upward and defining the corresponding upper chute. The bottom surface of the upper chute is used to limit The cooling unit located above cannot be moved downwards. The heat dissipation device according to claim 4, further comprising a latch unit, the latch unit including at least two blocks extending horizontally and oppositely from the top edges of the side walls, and the blocks are respectively pressed against the top edges of the side walls. The connecting portion of the heat dissipation unit is used to restrict the upward movement of the heat dissipation unit located above. The heat dissipation device of claim 5, wherein each of the clamping blocks has an inclined surface, the inclined surfaces of the clamping blocks face each other, and the horizontal distance between the top edges of the inclined surfaces is greater than the horizontal distance between the bottom edges of the inclined surfaces. horizontal spacing. The heat dissipation device according to claim 1, wherein each heat dissipation unit includes a heat conduction plate that is bonded with the storage device, and a radiator that is bonded with the heat conduction plate, and each of the heat sinks has the heat dissipation main part and The connection parts and the heat conduction plates are made of thermal interface material, and the heat dissipation main parts are fin structures. The heat dissipation device according to claim 1, wherein each side wall has a groove bottom surface facing upward and defining the corresponding upper chute, and a groove top surface facing downward and defining the corresponding lower chute, each The heat dissipation main part has a fitting surface adjacent to the connecting parts and facing the storage device, and a heat dissipation surface away from the connecting parts and opposite to the fitting surface, and each connecting part has a corresponding one adjacent to the fitting surface. The first connecting surface of the fitting surface, and a second connecting surface that is away from the corresponding fitting surface and facing the opposite direction to the first connecting surface, the bottom surface of each upper chute and the corresponding groove of the lower chute. The vertical distance between the top surfaces is smaller than the vertical distance between the heat dissipation surface of each heat dissipation unit and the corresponding second connecting surface of the heat dissipation unit. The heat dissipation device according to claim 1, wherein the base further includes at least one ventilation hole formed on the bottom wall and the side walls and penetrating to the accommodation space.

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