CN218350839U

CN218350839U - Heat sink device

Info

Publication number: CN218350839U
Application number: CN202222689820.9U
Authority: CN
Inventors: 程枫; 张盈盈; 徐江鑫; 印玮; 倪健斌; 李伟祖
Original assignee: Zhongke Controllable Information Industry Co Ltd
Current assignee: Zhongke Controllable Information Industry Co Ltd
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-01-20
Anticipated expiration: 2032-10-12

Abstract

The utility model relates to a heat dissipation device. This heat abstractor is used for dispelling the heat to the memory module, and the memory module includes the memory board that two at least intervals set up, and heat abstractor includes: a top plate; at least one group of radiating components arranged on one side plate surface of the top plate; each heat dissipation component comprises two heat conduction plates and a heat dissipation piece connected between the two heat conduction plates; wherein, two heat-conducting plates all one end connect in the roof, and the other end stretches out to the one side that deviates from the roof, and two heat-conducting plates deviate from the surface of heat-dissipating piece and be used for respectively laminating with two adjacent RAM boards. The utility model discloses a heat abstractor is to memory module's heat dispersion preferred.

Description

Heat sink device

Technical Field

The utility model relates to a heat abstractor technical field of electronic product especially relates to a heat abstractor.

Background

The memory bank is an important component of computers and digital devices as an internal memory for directly exchanging data with the CPU. Because the memory bank can generate a large amount of heat during operation, in order to ensure the working performance of the memory bank, a memory heat dissipation structure must be arranged to carry out heat dissipation treatment on the memory bank. The existing memory heat dissipation structure generally arranges a heat dissipation plate on the surface of the memory bank, so that the heat generated by the memory bank is dissipated to the air through the heat dissipation plate. However, with the development of the memory bank towards high energy and high power, the existing heat dissipation method cannot meet the heat dissipation requirement of the high power memory bank, resulting in poor working stability and reliability of the memory bank.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a heat dissipation device for the memory heat dissipation structure of the prior art with poor heat dissipation effect.

The embodiment of the application provides a heat abstractor for dispel the heat to the memory module, the memory module includes the memory board that two at least intervals set up, and heat abstractor includes:

a top plate;

at least one group of radiating components arranged on one side plate surface of the top plate;

each radiating component comprises two heat-conducting plates and a radiating piece connected between the two heat-conducting plates;

wherein, two heat-conducting plates all one end is connected in the roof, and the other end stretches out to the one side that deviates from the roof, and two heat-conducting plates deviate from the surface of heat-dissipating piece and be used for respectively laminating with two adjacent RAM boards.

In above-mentioned scheme, all be connected with the roof through the one end of two heat-conducting plates, the heat-conducting plate passes through the roof to be connected as a whole promptly to the surface that deviates from the heat dissipation piece of two heat-conducting plates is used for laminating with two adjacent RAM respectively, makes two heat-conducting plates insert between two RAM like this, and still makes two heat-conducting plates contact with two RAM respectively, spreads the heat of two RAM to the air through the heat-conducting plate. In addition, a heat dissipation part is connected between the two heat conduction plates, heat on the heat conduction plates is further diffused to the air through the heat dissipation part, the heat dissipation efficiency is improved, and even under the condition that a memory module with high power consumption or a gap between two adjacent memories is small, the heat dissipation effect can be enhanced through increasing the heat dissipation area of the heat dissipation structure as much as possible.

In one embodiment, two heat conducting plates contained in the same group of heat dissipation assemblies are arranged at intervals in a first direction;

the heat dissipation piece comprises a plurality of heat dissipation pieces which are arranged at intervals and extend along the first direction, and two end parts of each heat dissipation piece along the first direction are respectively connected to the two heat conduction plates.

Because the radiating fins are arranged at intervals, flowing air can easily flow through the intervals between the adjacent radiating fins, and the radiating fins can be in full contact with the air for heat exchange. In addition, each radiating fin extends along the first direction F, namely, the extending direction of each radiating fin is perpendicular to the surface of the heat conducting plate, so that the radiating effect is better. In addition, the arrangement of the radiating fins also improves the radiating performance of the gaps between the adjacent memory boards. In the embodiment of the application, due to the existence of the heat dissipation device, under the condition that the system memory is not fully configured, the bypass loss of air between the memories is reduced, and the heat dissipation effect on the residual memories and the CPU under the condition that the memories are not fully configured is well achieved.

In one embodiment, each fin is configured in a wave shape.

As mentioned above, the wave-shaped radiating fins have the characteristic of easy heat transfer, the relatively straight radiating fins also increase the radiating area, and meanwhile, the wave-shaped radiating fins increase the heat convection coefficient of air at the surface of the heat conducting plate. From the formula Q = Ah (T1-T2) of the convective heat transfer, it can be known that the larger the surface area of the structure for heat transfer, the larger the convective heat transfer coefficient, and the larger the heat transfer amount. Therefore, the wave-shaped radiating fins are adopted, and the radiating capacity is good.

In one embodiment, the heat sink is configured as a resilient structure to generate a resilient force away from each other against the two thermally conductive plates to which the heat sink is attached.

Therefore, the heat-conducting plate is conveniently pressed onto the memory plate, the contact between the heat-conducting plate and the memory plate is more reliable, and the heat dissipation performance is also improved.

In one embodiment, the two heat-conducting plates included in the same group of heat-radiating assemblies are oppositely arranged in the first direction, and the spacing size of the surfaces of the two heat-conducting plates, which face away from the heat-radiating member, is equal to the spacing size of the two adjacent internal memory plates.

When two heat-conducting plates are inserted into the space between two adjacent memory boards, the surfaces of the heat-conducting plates, which deviate from the heat-radiating piece, can be tightly attached to the corresponding memory boards.

In one embodiment, the number of the heat dissipation assemblies is at least two, all the heat conduction plates in the at least two heat dissipation assemblies are arranged in a line along the first direction, and the spacing dimension between two adjacent heat conduction plates in different heat dissipation assemblies is the same as the thickness dimension of the memory board.

Therefore, when the number of the heat dissipation assemblies is larger than one group, a space for inserting the memory board can be defined between two adjacent heat conduction plates which are positioned in different heat dissipation assemblies.

In one embodiment, the end of each heat-conducting plate facing away from the top plate is turned up towards the side of the heat-conducting plate to which the heat sink is attached.

Because the end part of the heat-conducting plate is provided with the tilting structure, the insertion assisting structure can be formed, namely, when the heat-conducting plate of the heat-radiating device is inserted between the memory boards, the heat-radiating device can be conveniently inserted between the memory boards.

In one embodiment, the surface of each heat conducting plate facing away from the heat sink is provided with a heat conducting glue.

Thus, when the heat dissipation device is matched with the memory board, the heat conduction plate is attached to the memory board through the heat conduction glue, the heat conduction glue has the advantages of reducing the tolerance between the memory board and the heat conduction plate, reducing the thermal resistance, and simultaneously having the lubricating effect when the heat dissipation device is inserted into the memory.

In one embodiment, the side of the top plate facing away from the heat-conducting plate is provided with a plurality of heat-dissipating fins.

Therefore, the heat dissipation device provided by the embodiment of the application is divided into the upper part and the lower part, and the upper part sufficiently utilizes the heat dissipation fins and the air above the memory board to carry out heat exchange so as to dissipate heat; the lower part of the heat conducting plate not only conducts heat dissipation treatment on components on the memory board, but also conducts heat to the heat radiating fins, so that the heat radiating effect is better.

In one embodiment, the thermally conductive plate is a vapor chamber.

When the heat conducting plate is a temperature equalizing plate, the temperature equalizing plate can perform temperature equalizing treatment on the memory plate and can conduct heat to the radiating fins and the radiating fins above the radiating device.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram illustrating a heat dissipation device and a memory module provided in an embodiment of the present disclosure;

fig. 3 is a cross-sectional view illustrating a heat dissipation device and a memory module according to an embodiment of the disclosure;

fig. 4 is a schematic structural diagram of another angle of the heat dissipation device according to the embodiment of the present application.

The reference numbers illustrate:

100. a heat sink; 10. a top plate; 20. a heat dissipating component; 21. a heat conducting plate; 22. a heat sink; 221. a heat sink; 30. a heat dissipating fin;

40. a memory module; 41. a memory board; 42. a memory slot; 43. a main board.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms different from those described herein and similar modifications may be made by those skilled in the art without departing from the spirit and scope of the invention and, therefore, the invention is not to be limited to the specific embodiments disclosed below.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The heat dissipation device according to the embodiment of the present application is described below with reference to the drawings.

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application, fig. 2 is a schematic structural diagram of a heat dissipation device and a memory module according to an embodiment of the present application, fig. 3 is a cross-sectional view of a heat dissipation device and a memory module according to an embodiment of the present application, and fig. 4 is a schematic structural diagram of another angle of the heat dissipation device according to an embodiment of the present application.

Referring to fig. 1 and 2, an embodiment of the present application provides a heat dissipation apparatus 100 for dissipating heat of a memory module 40, where the memory module 40 includes at least two memory boards 41 arranged at intervals.

Specifically, the memory module 40 further includes at least two memory slots 42, the memory slots 42 may be disposed on the motherboard 43 at intervals along the first direction F, the number of the memory boards 41 is the same as that of the memory slots 42, and the memory boards 41 may be inserted into the memory slots 42 in a one-to-one correspondence.

In the embodiment of the present application, the heat dissipation device 100 includes a top plate 10 and at least one set of heat dissipation assemblies 20. At least one set of heat dissipation assemblies 20 is disposed on one side of the top plate 10. Each heat dissipation assembly 20 includes two heat conduction plates 21 and a heat dissipation member 22 connected between the two heat conduction plates 21, wherein the uniform end of each of the two heat conduction plates 21 is connected to the top plate 10, the other end of each of the two heat conduction plates 21 extends out to one side away from the top plate 10, and the surfaces of the two heat conduction plates 21 departing from the heat dissipation member 22 are respectively used for being attached to two adjacent memory plates 41.

In the heat dissipation device 100, one end of each of the two heat conduction plates 21 is connected to the top plate 10, that is, the heat conduction plates 21 are connected to the top plate 10 as a whole, and the surfaces of the two heat conduction plates 21 facing away from the heat dissipation member 22 are respectively used for being attached to the two adjacent internal memory plates 41, which is equivalent to the two heat conduction plates 21 being inserted between the two internal memory plates 41, and the two heat conduction plates 21 being respectively in contact with the two internal memory plates 41, so as to dissipate the heat of the two internal memory plates 41 to the air through the heat conduction plates 21. In addition, the heat dissipation member 22 is connected between the two heat conduction plates 21, and the heat on the heat conduction plates 21 is further dissipated to the air through the heat dissipation member 22, so that the heat dissipation efficiency is improved, and even if the memory module 40 with high power consumption or the space between two adjacent memories is small, the heat dissipation area of the heat dissipation structure can be increased as much as possible to enhance the heat dissipation effect.

The at least one set of heat dissipation assemblies 20 is disposed on one side of the top plate 10, which means that all the heat dissipation assemblies 20 are disposed on the same side of the top plate 10, for example, on the surface of the top plate 10 facing the main plate 43, no matter how many sets of heat dissipation assemblies 20 are. In addition, the two heat conducting plates 21 have one end connected to the top plate 10 and the other end extending to the side away from the top plate 10, which means that the two heat conducting plates 21 are both vertically arranged on the same side surface of the top plate 10.

Further, the heat conducting plate 21 and the top plate 10 may be integrally formed or may be separately formed and detachably connected, and the present application does not limit the connection manner of the heat conducting plate 21 and the top plate 10 as long as the requirements for structural strength and heat conduction are satisfied.

In the embodiment of the present application, referring to fig. 2 and 3, the two heat conducting plates 21 included in the same group of heat dissipation assemblies 20 are arranged at intervals in the first direction F, and the heat dissipation assembly 20 located on the left side of the drawing in fig. 3 is taken as an example for explanation, the heat dissipation member 22 includes a plurality of heat dissipation fins 221 arranged at intervals and extending along the first direction, and two end portions of each heat dissipation fin 221 along the first direction F are respectively connected to the two heat conducting plates 21. Since the respective fins 221 are arranged at intervals, the flowing air is easily flowed through the intervals between the adjacent fins 221, facilitating the fins 221 to be sufficiently contacted with the air for heat exchange. In addition, each of the heat dissipation fins 221 extends along the first direction F, that is, the extension direction of the heat dissipation fins 221 is perpendicular to the surface of the heat conduction plate 21, so that the heat dissipation effect is better. In addition, the heat dissipation performance of the gap between adjacent memory plates 41 is also improved by the provision of the heat dissipation fins 221. In the embodiment of the present application, due to the existence of the heat dissipation device 100, when the system memory is not fully configured, the bypass loss of air between memories is reduced, and the heat dissipation function is performed on the remaining memories and the CPU when the memory is not fully configured.

It should be understood that the heat dissipation element 22 is exemplified to include heat dissipation fins, the application is not limited thereto, and the heat dissipation element 22 may include a plurality of heat dissipation wires arranged at intervals and extending along the first direction, and two end portions of each heat dissipation wire along the first direction F are respectively connected to the two heat conduction plates 21. The case where the heat sink 22 includes heat radiation wires is similar to a heat sink, and is not described in detail here.

In some examples, all the fins 221 between two heat-conducting plates 21 included in the same group of heat dissipation assemblies 20 may be arranged in parallel, and the spacing between adjacent fins 221 is equal in size. This makes the heat dissipation effect of the memory plate 41 uniform throughout the height direction. In addition, exemplarily, referring to fig. 4, the length dimension of the heat radiating fin 221 in the first direction F is the same as the length dimension of the heat conductive plate 21 in the first direction F.

In addition, in the present embodiment, referring to fig. 3, each of the fins 221 is formed in a wave shape.

As described above, the heat dissipating fins 221 are formed in a wave shape, the wave-shaped heat dissipating fins 221 have a characteristic of easily transferring heat, the heat dissipating area is increased compared with the flat heat dissipating fins, and the heat convection coefficient of the air at the surface of the heat conducting plate 21 is increased due to the wave-shaped heat dissipating fins 221. From the formula Q = Ah (T1-T2) of the convective heat transfer, it can be known that the larger the surface area of the structure for heat transfer, the larger the convective heat transfer coefficient, and the larger the heat transfer amount. Therefore, the structure using the corrugated fins 221 has a good heat dissipation capability.

Wherein Q is the heat exchange amount, A is the surface area, h is the convective heat transfer coefficient, T1 is the air temperature, and T2 is the temperature of the heat-conducting plate 21.

In the embodiment of the present application, as described above, the heat-conducting member 21 needs to be tightly attached to the internal memory board 41. For example, the heat sink 221 may be constructed in an elastic structure so that the two heat conductive plates 21 to which the heat sink 221 is connected generate an elastic force away from each other. This facilitates the pressing of the heat-conducting plate 21 against the memory plate 41, making the contact therebetween more reliable, and also improves heat dissipation performance.

With continued reference to fig. 3, in the embodiment of the present application, the two heat-conducting plates 21 included in the same heat dissipation assembly 20 are oppositely arranged in the first direction F, and the spacing dimension of the surfaces of the two heat-conducting plates 21 facing away from the heat dissipation member 22 is equal to the spacing dimension of the two adjacent internal memory plates 41. This ensures that the surfaces of the heat-conducting plates 21 facing away from the heat-dissipating member 22 can be closely fitted to the corresponding memory plates 41 when two heat-conducting plates 21 are inserted into the space between two adjacent memory plates 41.

Further, the number of the heat dissipation assemblies 20 is at least two, all the heat conduction plates 21 in at least two sets of heat dissipation assemblies 20 are arranged in a row along the first direction F, and the distance between two adjacent heat conduction plates 21 in different heat dissipation assemblies 20 is the same as the thickness of the internal memory plate 41. Thus, when the number of the heat dissipation assemblies 20 is larger than one, a space for inserting the internal memory board 41 can be defined between two heat conduction boards 21 (for example, in fig. 3, two heat conduction boards 21 located in the middle of the drawing) which are located in different heat dissipation assemblies 20 and are adjacently arranged. In addition, the heat-conducting plate 21 may be disposed parallel to the memory plate 41, so that the heat-conducting plate 21 and the memory plate 41 can be reliably contacted.

It can be understood that the heat dissipation apparatus 100 provided in the embodiment of the present application is convenient and fast to install, stable and reliable, and can be used without adding any additional structure compared with the conventional memory structure. Moreover, when the high-power-consumption memory of the original machine type needs to be upgraded in the future, only the memory heat dissipation device 100 is needed to be installed on the memory board, and the original structure and the electrical performance of the equipment cannot be influenced.

In the present embodiment, with continued reference to fig. 3, in order to facilitate the insertion of the heat dissipation device 100 into the memory module 40, the end portion of each heat conduction plate 21 facing away from the top plate 10 is tilted toward the side of the heat conduction plate 21 where the heat dissipation member 22 is connected. Because the end of the heat-conducting plate 21 is provided with the tilting structure, an insertion-assisting structure can be formed, that is, when the heat-conducting plate 21 of the heat dissipation device 100 is inserted between the memory boards 41, the heat dissipation device 100 can be conveniently inserted between the memory boards 41.

A heat conductive adhesive (not shown) is provided on the surface of each heat conductive plate 21 facing away from the heat sink 22. Thus, when the heat dissipation device 100 is matched with the memory board 41, the heat-conducting plate 21 is attached to the memory board 41 through the heat-conducting glue, and the heat-conducting glue can reduce the tolerance between the memory board 41 and the heat-conducting plate 21, reduce the thermal resistance, and simultaneously has a lubricating effect when the heat dissipation device 100 is inserted into a memory.

Illustratively, in order to further improve the heat dissipation effect of the heat dissipation device 100, a plurality of heat dissipation fins 30 are disposed on the side of the top plate 10 facing away from the heat conduction plate 21. It is understood that when the heat dissipation device 100 is mounted on the memory module 40, the top plate 10 may be selected to abut against the top end surface of the memory plate 41 for increasing the heat dissipation effect.

Thus, the heat dissipation device 100 provided in the embodiment of the present application is divided into an upper portion and a lower portion, and the upper portion sufficiently utilizes the heat exchange between the heat dissipation fins 30 and the air above the memory board to dissipate heat; the lower heat conducting plate 21 not only dissipates heat of the components on the memory board, but also conducts heat to the heat sink 221, so that the heat dissipation effect is better.

In addition, it can be understood that the heat conducting plate 21 in the present application may be made of a high thermal conductivity material such as copper, and the heat conducting plate 21 in the present application may be a temperature equalizing plate, and the thickness and width of the heat conducting plate 21 are not limited, as long as the heat conducting plate can cover the components on the memory board 41, so as to perform the functions of temperature equalization and heat conduction.

When the heat transfer plate 21 is a vapor chamber, the vapor chamber may perform vapor treatment on the memory board 41, and may conduct heat to the heat dissipation fins 30 and the heat dissipation fins 221 above the heat dissipation device 100. Further, the material of the top plate 10 may be aluminum, copper, or other material having high thermal conductivity.

In addition, the material of the heat sink 221 is not limited in the embodiments of the present application, and any material having high thermal conductivity and satisfying the requirement of elasticity may be used.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a heat abstractor for dispel the heat to the memory module, the memory module includes the memory board that two at least intervals set up, its characterized in that, heat abstractor includes:

a top plate;

the at least one group of radiating assemblies are arranged on one side plate surface of the top plate;

each heat dissipation component comprises two heat conduction plates and a heat dissipation piece connected between the two heat conduction plates;

wherein, the equal one end of two heat-conducting plates connect in the roof, the other end is to keeping away from one side of roof stretches out, just deviating from of two heat-conducting plates the surface of heat-radiating piece is used for respectively with adjacent two the laminating of RAM.

2. The heat dissipating device of claim 1, wherein said two heat conducting plates included in the same set of heat dissipating assemblies are spaced apart in a first direction;

the heat dissipation member comprises a plurality of heat dissipation fins which are arranged at intervals and extend along a first direction, and two end parts of each heat dissipation fin along the first direction are respectively connected to the two heat conduction plates.

3. The heat dissipating device of claim 2, wherein each of the fins is configured in a wave shape.

4. The heat sink as claimed in claim 2, wherein the heat sink is configured as a resilient structure to generate a resilient force on the two thermally conductive plates to which the heat sink is connected away from each other.

5. The heat dissipating device according to any one of claims 2 to 4, wherein the two heat conducting plates included in the same heat dissipating assembly are arranged oppositely in the first direction, and a distance dimension between surfaces of the two heat conducting plates facing away from the heat dissipating member is equal to a distance dimension between two adjacent internal memory plates.

6. The heat dissipating device of claim 5, wherein the number of the heat dissipating assemblies is at least two, all the heat conducting plates in the at least two sets of heat dissipating assemblies are arranged in a row along the first direction, and the distance between two adjacent heat conducting plates in different heat dissipating assemblies is the same as the thickness of the memory board.

7. The heat sink according to any one of claims 1-4, wherein the end of each heat conducting plate facing away from the top plate is turned up towards the side of the heat conducting plate where the heat sink is attached.

8. The heat dissipating device according to any one of claims 1 to 4, wherein a surface of each of the heat conducting plates facing away from the heat dissipating member is provided with a heat conducting glue.

9. The heat sink according to any of claims 1 to 4, wherein a side of the top plate facing away from the heat-conducting plate is provided with a plurality of heat-dissipating fins.

10. The heat sink according to any one of claims 1 to 4, wherein the thermally conductive plate is a vapor chamber.