TWM652149U - Electronic device - Google Patents

Abstract

An electronic device includes a circuit board, a heat generating component disposed on a first surface of the circuit board, a first heat dissipation component, an electronic component disposed on a second surface of the circuit board, a stacked substrate disposed above the second surface, a first heat dissipation paste, a second heat dissipation component disposed on the heat generating component, a heat dissipation block and a second heat dissipation paste. The first heat dissipation paste fills between the circuit board and the stacked substrate and encapsulates the electronic device. The second heat dissipation component is disposed at a side of the stacked substrate away from the circuit board. The heat dissipation block penetrates through and is fixed to the stacked substrate, and thermally coupled to the second heat dissipation component. The second heat dissipation paste fills between the second heat dissipation component and the heat dissipation block.

Description

electronic device

The present disclosure relates to an electronic device.

In recent years, as the technology industry has become increasingly developed, information products such as notebook computers, tablet computers, smart phones and other electronic devices have been widely used in daily life. The types and functions of electronic devices are becoming more and more diverse, and their convenience and practicality have made these electronic devices more popular.

The above-mentioned electronic devices include high-power electronic components such as central processing units, Northbridge chips, and graphics cards, which generate a large amount of heat during operation. If this heat cannot be effectively dissipated, it will directly cause the temperature to rise sharply and seriously affect the health of the computer. Affect the normal operation of electronic components. For this reason, heat sinks are needed to dissipate heat from these electronic components. The current practice is usually to install heat dissipation components such as heat sinks and thermal conductive plates on the front side of the electronic components to be dissipated. However, since the electronic components are disposed on the circuit board, and there are often other dissipation components on the other side of the circuit board, Electronic components, so it is difficult to dissipate heat on the back side of the electronic components, which easily causes the waste heat generated by the electronic components to accumulate on the back side of the electronic components and cannot be effectively conducted and dissipated, resulting in the loss of electronic components. The phenomenon of component overheating will seriously affect the operation and performance of electronic devices.

The present disclosure provides an electronic device, which includes a circuit board, a heating component, a first heat dissipation component, a first electronic component, a laminated substrate, a first heat dissipation paste, a second heat dissipation component, a heat dissipation metal block and a second heat dissipation paste. The circuit board includes a first surface and a second surface opposite to each other. The heating element is arranged on the first surface. The first heat dissipation element is disposed on the heating element and forms thermal coupling with the heating element. The first electronic component is disposed on the second surface. The laminated substrate is disposed above the second surface of the circuit board. The first thermal paste is filled between the circuit board and the laminated substrate and covers the first electronic component. The second heat dissipation element is disposed on a side of the laminated substrate away from the circuit board. The heat dissipation metal block penetrates and is fixed on the laminated substrate, and extends to a side away from the circuit board to form thermal coupling with the second heat dissipation element. The second heat dissipation paste is filled between the second heat dissipation element and the heat dissipation metal block.

Based on the above, the heating element of the electronic device of the present disclosure is disposed on the first surface of the circuit board and thermally coupled to the first heat dissipation element, and the laminate substrate is disposed on the second surface of the circuit board, and the heat dissipation metal block penetrates the laminate The second heat dissipation element protrudes toward the side away from the circuit board to form thermal coupling with the second heat dissipation element. With such a configuration, in addition to the heat generated by the heating element being conducted to the first heat dissipation element via its front side, the other part of the heat energy of the heating element can also be conducted from its back side to the heat dissipation metal that penetrates the laminated substrate and protrudes toward the direction away from the circuit board. block, and then conducts the heat energy to the second heat dissipation element through the heat dissipation metal block for heat dissipation. Therefore, the heat energy generated by the heating element of the electronic device of the present disclosure can be conducted from opposite sides to the first heat dissipation element and the second heat dissipation element at the same time. components, thereby improving the heat dissipation efficiency of electronic devices.

100, 100a, 100b, 100c: electronic devices

101:First shell

102:Second shell

110:Circuit board

112: First surface

114: Second surface

120: Heating element

125:Thermal paste

130: First cooling element

140:First electronic component

145:The first thermal paste

150:Laminated substrate

152:Substrate

154: Spacer

170: Second cooling element

180, 180a, 180b, 180c: heat dissipation metal block

182, 184: Engagement part

186:Adhesive

185:Second thermal paste

190: Second electronic component

OP1:Through hole

FIG. 1 is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure.

FIG. 2 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present disclosure.

FIG. 3 is a partial cross-sectional view of an electronic device according to another embodiment of the present disclosure.

FIG. 4 is a partial cross-sectional view of an electronic device according to yet another embodiment of the present disclosure.

The aforementioned technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of each embodiment with reference to the drawings. Directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the disclosure. In addition, in the following embodiments, the same or similar elements will use the same or similar numbers.

FIG. 1 is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure. Referring to FIG. 1 , in some embodiments, the electronic device 100 includes a circuit The board 110 , the heating element 120 , the first heat dissipation element 130 , the first electronic component 140 , the laminated substrate 150 , the first heat dissipation paste 145 , the second heat dissipation element 170 , the heat dissipation metal block 180 and the second heat dissipation paste 185 . In this embodiment, the electronic device 100 can be a notebook computer, but in other embodiments it can also be other electronic devices with heat dissipation components, such as smart phones or tablet computers. In one embodiment, the electronic device 100 may include a first housing 101 and a second housing 102, which may jointly define a receiving space to accommodate components therein. In this embodiment, the first heat dissipation element 130 can be disposed on the first housing 101, and the second heat dissipation element 170 can be disposed on the second housing 102. Of course, this embodiment is only used for illustration, and the present disclosure is not limited thereto. In other embodiments, the first heat dissipation element 130 and the second heat dissipation element 170 can also be respectively disposed on other substrates of the electronic device 100 . In one embodiment, the first heat dissipation element 130 and the second heat dissipation element 170 can be respectively a heat sink, a heat conductive plate, or other suitable heat dissipation elements.

In some embodiments, the circuit board 110 includes a first surface 112 and a second surface 114 opposite to each other, wherein the heating element 120 is disposed on the first surface 112 . In some embodiments, the heating element 120 may include high-power electronic components such as a central processing unit, a chip, a graphics card, etc., which may generate a large amount of heat during operation. In this embodiment, the heating element 120 may be a central processing unit, but the disclosure is not limited thereto. In some embodiments, the heating element 120 is disposed on the first surface (eg, lower surface) 112 of the circuit board 110 and is attached to the first heat dissipation element 130 . In this way, part of the heat generated by the heating element 120 can be conducted to the first heat dissipation element 130 via its front side (the side away from the circuit board 110) for heat dissipation. In one embodiment, the circuit board 110 The first surface 112 may be provided with other electronic components as shown in FIG. 1 .

In some embodiments, the first heat dissipation element 130 can be attached/disposed on the heating element 120 through the heat dissipation paste 125 and form thermal coupling with the heating element 120 through the heat dissipation paste 125 . In one embodiment, the heat dissipation paste 125 may include thermal interface material (TIM), which is used to be coated between the heat dissipation element and the heating element to reduce the contact thermal resistance between the two. All surfaces will have roughness, so when the surface of the heat dissipation element contacts the surface of the heating element, there will always be some air gaps mixed in. The thermal conductivity of air is very small, which results in a relatively large contact thermal resistance, and The thermal interface material can be used to fill the air gap. Therefore, filling the heat dissipation paste 125 between the first heat dissipation element 130 and the heating element 120 can reduce the contact thermal resistance between the two, thereby improving the heat dissipation performance.

In some embodiments, the electronic device 100 further includes at least one first electronic component 140 disposed on the second surface 114 of the circuit board 110 opposite to the first surface 112 . That is to say, the heating element 120 and the first electronic component 140 are respectively disposed on two opposite surfaces of the circuit board 110 . In this embodiment, the number of first electronic components 140 is multiple, and they may be suitable active or passive components. The laminated substrate 150 is disposed above the second surface 114 of the circuit board 110 . Specifically, the laminated substrate 150 includes a substrate 152 and a spacer 154, wherein the spacer 154 is disposed on the circuit board 110, and the substrate 152 is disposed on the spacer 154. Specifically, the spacer 154 is supported between the circuit board 110 and the substrate 152 to maintain the distance between the substrate 152 and the circuit board 110 so that the first electronic component 140 can be accommodated therebetween. In one embodiment, the spacer 154 can completely surround the periphery of the substrate 152 to form a spacer together with the substrate 152 . A cover is provided to cover the first electronic component 140 . In other embodiments, the number of spacers 154 may be multiple, and they are respectively disposed in peripheral areas of the substrate 152 (such as but not limited to multiple corners of the substrate 152). The present disclosure is not limited to the form of the laminated substrate 150 .

In some embodiments, the first thermal paste 145 may be filled between the circuit board 110 and the laminate substrate 150 to cover the first electronic component 140 . Specifically, the first thermal paste 145 can fill the space defined by the laminated substrate 150 to encapsulate the first electronic component 140 therein, and can fill the air between the circuit board 110 and the laminated substrate 150 The gap allows the heat generated by the heating element 120 and the first electronic component 140 to be conducted from the circuit board 110 to the laminated substrate 150 through the first heat dissipation paste 145 .

Please continue to refer to FIG. 1 . In some embodiments, the heat dissipation metal block 180 penetrates and is fixed on the laminated substrate 150 , and the second heat dissipation element 170 is disposed on a side of the laminated substrate 150 away from the circuit board 110 . Furthermore, the substrate 152 of the laminated substrate 150 includes a through hole OP1, and the heat dissipation metal block 180 is fitted into the through hole OP1. In this way, the heat dissipation metal block 180 penetrates the substrate 152 of the laminated substrate 150 and goes to a point away from the circuit board 110. The side extends to form thermal coupling with the second heat dissipation element 170 . In this embodiment, the heat dissipation metal block 180 penetrates the laminated substrate 150 and contacts the first heat dissipation paste 145 to form thermal coupling. In one embodiment, the electronic device 100 further includes a second electronic component 190 , which is disposed on a side (eg, an upper side) of the laminated substrate 150 away from the circuit board 110 and located between the laminated substrate 150 and the second heat dissipation element 170 .

In this embodiment, the second heat dissipation element 170 can be disposed on the second housing 102 , and the height of the heat dissipation metal block 180 is substantially higher than the height of the highest second electronic component 190 , that is to say, the heat dissipation metal block 180 Compared to the second electronic component 190, the Close to the second heat dissipation element 170, and the second heat dissipation paste 185 is filled between the second heat dissipation element 170 and the heat dissipation metal block 180 to fill the air gap between the second heat dissipation element 170 and the heat dissipation metal block 180 to improve heat dissipation efficiency. . With such a configuration, in addition to the heat generated by the heating element 120 and the first electronic component 140 being transmitted to the first heat dissipation element 130 through the thermal paste 125, the other part of the heat energy of the heating element 120 and the heat energy generated by the first electronic component 140 is more The heat energy can be conducted through the first heat dissipation paste 145 to the heat dissipation metal block 180 that penetrates the laminated substrate 150 and protrudes toward the second heat dissipation element 170 , and then conducts the heat energy to the second heat dissipation element 170 through the heat dissipation metal block 180 for heat dissipation. In one embodiment, the heat generated by the second electronic component 190 can also be conducted to the heat dissipation metal block 180 through the substrate 152 of the laminated substrate 150, and then the heat energy can be conducted to the second heat dissipation element 170 through the heat dissipation metal block 180 to perform heat dissipation. With this configuration, the heat energy generated by the heating element can be simultaneously conducted from opposite sides of the heating element to the first heat dissipation element 130 and the second heat dissipation element 170 respectively, thereby improving the heat dissipation efficiency of the electronic device 100 .

FIG. 2 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present disclosure. It must be noted here that the electronic device 100a of this embodiment is similar to the electronic device of the previous embodiment. Therefore, this embodiment follows the component numbers and part of the content of the previous embodiment, where the same numbers are used to represent the same or similar components. components, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in this embodiment. In addition, this embodiment omits the first housing 101 and the second housing 102 in FIG. 1 to make the drawing simpler.

Please refer to Figure 2. In this embodiment, the substrate 152 of the laminated substrate 150 includes The through-hole OP1 is included, and the heat dissipation metal block 180 is fitted with the through-hole OP1. Moreover, the electronic device 100a further includes an adhesive 186, which is disposed on the side (for example, the upper side) of the laminated substrate 150 away from the circuit board 110 and surrounds the coating. Distributed at the interface between the heat dissipation metal block 180 and the through hole OP1. For example, the adhesive 186 can be applied around the space between the heat dissipation metal block 180 and the laminated substrate 150 by dispensing to further stabilize the fixed relationship between the heat dissipation metal block 180 and the laminated substrate 150 .

FIG. 3 is a partial cross-sectional view of an electronic device according to another embodiment of the present disclosure. It must be noted here that the electronic device 100b of this embodiment is similar to the electronic device of the previous embodiment. Therefore, this embodiment follows the component numbers and part of the content of the previous embodiment, where the same numbers are used to represent the same or similar parts. components, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in this embodiment. In addition, this embodiment omits the first housing 101 and the second housing 102 in FIG. 1 to make the drawing simpler.

Please refer to Figure 3. In this embodiment, the substrate 152 of the laminated substrate 150 includes a through hole OP1, and the heat dissipation metal block 180b is fitted with the through hole OP1, and the heat dissipation metal block 180b further includes a heat dissipation metal block 180b protruding from the heat dissipation metal block 180b. The engaging portion 182 is formed on the outer periphery, and the engaging portion 182 is engaged with the side (for example, the upper side) of the laminate substrate 150 away from the circuit board 110 . Alternatively, in other embodiments, the engaging portion 182 may also be bonded to the side of the laminate substrate 150 away from the circuit board 110 via surface mount technology (SMT). In this embodiment, the engaging portion 182 may be, for example, a skirt-shaped flange surrounding the outer periphery of the heat dissipation metal block 180 , so that the heat dissipation metal block 180 c can be attached to the second heat dissipation element 170 through the second heat dissipation paste 185 . At the same time, you can also use the card to The engaging portion 182 is engaged with the substrate 152 of the laminate substrate 150 , but the present disclosure is not limited thereto. In other embodiments, the number of engaging portions 182 can be multiple, and can be symmetrically arranged on the heat dissipation device, for example. The outer periphery of the metal block 180b is used to fix the heat dissipation metal block 180b on the substrate 152 of the laminated substrate 150.

FIG. 4 is a partial cross-sectional view of an electronic device according to yet another embodiment of the present disclosure. It must be noted here that the electronic device 100c of this embodiment is similar to the electronic device of the previous embodiment. Therefore, this embodiment follows the component numbers and part of the content of the previous embodiment, where the same numbers are used to represent the same or similar components. components, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in this embodiment. In addition, this embodiment omits the first housing 101 and the second housing 102 in FIG. 1 to make the drawing simpler.

Please refer to FIG. 4 . In this embodiment, the laminated substrate 150 includes one side away from the circuit board 110 and another side opposite to this side, which is closer to the circuit board 110 . The substrate 152 of the laminated substrate 150 includes a through hole OP1, and the heat dissipation metal block 180c is fitted with the through hole OP1, and the heat dissipation metal block 180c further includes an engaging portion 184 protruding from the outer periphery of the heat dissipation metal block 180c. The portion 184 is engaged with the other side (for example, the lower side) of the laminate substrate 150 that is closer to the circuit board 110 . In this embodiment, the engaging portion 184 can be, for example, a skirt-shaped flange surrounding the outer periphery of the heat dissipation metal block 180c, so that the heat dissipation metal block 180c can be attached to the second heat dissipation element 170 through the second heat dissipation paste 185. At the same time, the heat dissipation metal block 180c can also be fastened to the substrate 152 of the laminated substrate 150 through the engaging portion 184, but the present disclosure is not limited thereto. In other embodiments, the heat dissipation metal block 180c can also be coupled through the engaging portion 184. The substrate is bonded to the laminated substrate 150 using surface mount technology. 152 on. In addition, in other embodiments, the number of the engaging portions 184 may be multiple, and may, for example, be symmetrically arranged on the outer periphery of the heat dissipation metal block 180 c to fasten the heat dissipation metal block 180 to the substrate 152 of the laminated substrate 150 .

In summary, the heating element of the electronic device of the present disclosure is disposed on the first surface of the circuit board and thermally coupled to the first heat dissipation element, and the laminated substrate is disposed on the second surface of the circuit board, and the heat dissipation metal block It penetrates the laminate substrate and protrudes toward the side away from the circuit board to form thermal coupling with the second heat dissipation element. With this configuration, in addition to the heat generated by the heating element being conducted to the first heat dissipation element via its front side, another part of the heat energy of the heating element can also be conducted from its back side to the heat dissipation metal that penetrates the laminated substrate and protrudes toward the direction away from the circuit board. block, and then conducts the heat energy to the second heat dissipation element through the heat dissipation metal block for heat dissipation. Therefore, the heat energy generated by the heating element of the electronic device of the present disclosure can be simultaneously conducted from opposite sides to the first heat dissipation element and the second heat dissipation element, thereby improving the heat dissipation efficiency of the electronic device.

100: Electronic devices

101:First shell

102:Second shell

110:Circuit board

112: First surface

114: Second surface

120: Heating element

125:Thermal paste

130: First cooling element

140:First electronic component

145:The first thermal paste

150:Laminated substrate

152:Substrate

154: Spacer

170: Second cooling element

180:Heating metal block

185:Second thermal paste

190: Second electronic component

OP1:Through hole

Claims (10)

An electronic device including: A circuit board including a first surface and a second surface opposite each other; A heating element is provided on the first surface; The first heat dissipation element is disposed on the heating element and forms thermal coupling with the heating element; The first electronic component is disposed on the second surface; A laminated substrate disposed above the second surface of the circuit board; A first heat dissipation paste is filled between the circuit board and the laminated substrate and covers the first electronic component; A second heat dissipation element is disposed on the side of the laminated substrate away from the circuit board; The heat dissipation metal block penetrates and is fixed on the laminated substrate, and extends to the side away from the circuit board to form thermal coupling with the second heat dissipation element; and The second heat dissipation paste is filled between the second heat dissipation element and the heat dissipation metal block. The electronic device of claim 1 further includes a third heat dissipation paste filled between the first heat dissipation element and the heating element. The electronic device according to claim 1, wherein the laminated substrate includes a spacer provided on the circuit board and a substrate provided on the spacer, the spacer being supported between the circuit board and the substrate, It is used to maintain the distance between the substrate and the circuit board to accommodate the first electronic component, and the heat dissipation metal block penetrates the substrate. The electronic device according to claim 1, further comprising a second electronic component disposed on the side of the laminated substrate away from the circuit board and located between the laminated substrate and the second heat dissipation element. The electronic device of claim 4, wherein the height of the heat dissipation metal block is substantially higher than the height of the second electronic component. The electronic device of claim 1, wherein the heat dissipation metal block is in contact with the first heat dissipation paste to form thermal coupling. The electronic device according to claim 1, wherein the laminated substrate includes a through hole, and the heat dissipation metal block is fitted into the through hole. The electronic device according to claim 7, further comprising an adhesive disposed on the side of the laminated substrate away from the circuit board and coated around the interface between the heat dissipation metal block and the through hole. The electronic device according to claim 1, wherein the heat dissipation metal block further includes an engaging portion protruding from an outer periphery of the heat dissipating metal block, and the engaging portion is engaged with the side of the laminated substrate away from the circuit board. . The electronic device according to claim 1, wherein the heat dissipation metal block further includes an engaging portion protruding from an outer periphery of the heat dissipating metal block, and the engaging portion is engaged with another side of the laminate substrate opposite to the side. side.

Images