六、發明說明： 【發明所屬之技術領域】 本發明係有種殼體結構，特別是—種具有散熱功能之 殼體結構。 【先前技術】 隨著電子祕·速提昇，使得各種f子裝置產品之設計皆 朝向t薄、紐、小之目標邁進，但由於此類產品之體積大幅的 減少，因此射出各種電子元件難生之高熱排放的問題 ，若以 筆"己^電細、個人數位助理(pers〇nal digitai assistant，pDA)、掌上 型遊戲機等可赋電子裝置而言，大多於機殼㈣裝設散熱風扇 等方式以解決發熱源(如晶片、中央處理器、積體電路等電子元件） 過熱的問題，—對於諸如超、可獻行種電腦或簡易 型電腦來說，因.其内部可使用空間有限，因此，這—類的電子裝 置1Η更省略了風扇的設置，即所謂的無風扇(fanless)設置方式，而 單純以一般之散熱模組來進行散熱，如散熱板、散熱鰭片或熱管 等，同時會在電子裝置的殼體下方對應於熱源區域周圍設置一些 開孔’以咖域對流之方式來改善其内部所累積的高熱狀態。 一般在可搞式電子裝置的電路板上設置有固定式電子元件， 如中央處理器(central processing unit，CPU)、電晶體或電容器等， 以及插拔式電子元件，例如插拔式的記憶體(mem〇ry)、電視卡、 或其他類型的周邊控制器介面卡^eripherai contr〇uer interface card’PCI card)等’可讓使用者視使用上的需求而自可攜式電子裝 置上移除，或是增設於可攜式電子裝置内，以擴充可攜式電子裝 置的操作效能或功能。雖然在電子裝置内部裝設散熱風扇或散熱 模，'且的方式，可對電路板上大多數的電子元件進行散熱。然而， 每種使用散熱風扇或散熱模組的散熱方式，僅對於電路板上的固 定式電子元件具有較佳的散熱效果，但對於插拔式電子元件之散 熱效果則相當有限。 其原因在於電路板上的插拔式電子元件的設置方式，通常須 藉由電路板上的插槽來與電路板形成電性連接。當插拔式電子元 件插设於插槽時，插拔式電子元件與電路板之間會具有一狹小間 隙’使插拔式電子元件錢作時職生的紐可齡流通於間隙 内的空氣對流進行散熱。㈣於目前電子元件之運行速度日益提 升的發展趨勢下，触式電子元件運行時所產生的熱量大幅度的 增加，使間隙内的空氣對流無法即時的將熱源從插拔式電子元件 上移除，進而造成插拔式電子元件容易因運行溫度過熱而導致運 作效能降低或甚至短路或、燒燬的情形發生。 【發明内容】 鑒於以上的問題，本發明提供一種殼體結構，藉以改良一般 電子裝置所使用之殼體結構無法提升插拔式電子元件的散熱效 率’使插拔式電子元件容易因I作溫度過高而導致運作效能降低 以及短路、燒毁的問題。 本發明為一種殼體結構，用以設置一電路板，並對電路板上 至少一電子元件進行散熱，其中電路板上所設置的電子元件之一 ^75502 侧面與電路板之間具有—間隙。殼體結構包含一本體及一散熱 ，板電路板又置於本體内，散熱板則設置於本體與電路板之間， 且散熱板具有熱料部，此祕導雜於電雜與電子元件之 門的間隙内’並與電子元件的側面相接觸，以藉由熱傳導部對電 子元件進行散熱。 本I月所揭路之殼體結構，藉由散熱板之熱傳導部設置於電 路板與電子it件之間的_内，並且與電子元件的側面相接觸， φ使電子兀件在運作時所產生的熱量可經由熱傳導部傳導至散熱板 上’並藉由散熱板與空氣之間的熱交換侧*發散於空氣中，可 有效卩+低電子70件的溫度，並使電子元件的溫度轉在可運作的 工作溫度I請内。因此可提升電子元件的運作效能，以及避免電 子元件因工作溫度過兩而燒燦。 以上之關於本發啊容之說明及以τ之實施方式之說明係用 、示H、轉本發明之和j|，並且提供本發明之專利_請範圍更 •進一步之解釋。 【實施方式】 如第1圖」所不，本發明實施例所揭露之殼體結構係應用 於可攜式f子裝置10，例如筆記型電腦、個人數㈣理、行動電 話及萃上型遊戲機等，用以設置一電路板2〇,並對電路板上至 電子元件it行散熱。此電子元件為固設於電路板上之固定 式電子兀件22，例如晶片組(chipset)及中央處理器等，或是可視使 用者需求而自電路板20上進行插設或拔除的插拔式電子元件 1375502 24 ’如插拔式的記憶體及周邊控制器介面卡(PCI card)等。插拔式 電子元件24上具有複數個晶片組242，插拔式電子元件24係插設 於電路板20之插槽26的電連接孔262内(如「第3圖」所示），以 措由插槽26與電路板20之間形成電性連接。於本實施例中係以 可攜式電子裝置為筆記型電腦，插拔式電子元件24為插拔式之雙 倍資料速率(double data rate，DDR)記憶體作為舉例說明，但並不 以此為限。 凊同時參閱「第1圖」至「弟3圖」’本發明實施例所揭露之 殼體結構係設置於可攜式電子裝置10中，做為可攜式電子裝置1〇 之底殼’此殼體結構包含一殼板12、一本體14及一散熱板％。 殼板12接合於本體14上’且殼板12之一側邊與可攜式電子裝置 10之上蓋18藉由一柩軸相連接(圖中未示）’使上蓋π可相對於 殼板12進行樞轉，以露出或閉合設置於上蓋18之顯示螢幕(圖中 未示）。本體14具有一容置空間142、一開口 144及一蓋板146。 電路板20係設置於容置空間142内，並以螺絲30鎖固於本體14 上’且電路板20上插槽26之位置與本體之開口 144相對應，使 插拔式電子元件24可經由本體14之開口 144插設或拔除於電路 板20。蓋板146係覆蓋於開口 144上，用以避免本體14外之棉絮 及雜質等進入本體14内’並保持本體14外觀的平坦性，向時在 蓋板146上開設有複數個通氣口 1462’藉以使本體内部空間與 外部環境產生空氣對流，以加強熱交換的效果。 散熱板16設置在本體14與電路板20之間，散熱板16之組 1375502 成材料為石墨或金屬所組成，其中金屬材料為鋁、銅、鎳及此二 者之合金，.或是由其他具有良好熱傳導性質的金屬材料及合金所 組成。散熱板16具有一熱傳導部162、一延伸段164及—熱發散 部166 ’熱傳導部162在散熱板16上的位置與插拔式電子元件％ 組裝於電路板20上的位置相對應，延伸段164連接熱傳導部162 與熱發散部166,熱傳導部162與熱發散部166分別朝向延伸段的 二相反方向彎折，使熱傳導部162與延伸段164在散熱板16上形 #成-彎折結構4〇，其中延伸段m分別與熱傳導部⑹及熱發散 部166之間形成一角度。 並且，延伸段164之寬度與凸設於電路板20上之插槽％的 高度相匹配。因此，使散熱板16裝設至本體14後，散熱板16之 彎折結構40與電路板20之插槽26相對應，且散熱板16的熱發 散部166貼近於本體14上，而熱傳導部162則露出於本體14上 之開口 144，並懸置於電路板2〇相對本體開口 144處的上方，而 •貼近於電路板20 (如「第3圖」所示）。其中散熱板16的熱發散部 166相對於電路板2〇之一側，亦可貼合於一部分凸設在電路板2〇 上的固疋式電子元件表面(圖中未示），藉以使固定式電子元件運作 時所產生的熱源可傳導至熱發散部166而進行散熱作用。 晴參閱「第4圖」和「第5圖」，在插拔式電子元件24設置 於電路板20的操作過程中，先將插拔式電子元件24傾斜一角度 通過本體14之開口 144,並使插拔式電子元件24具有電性接點(圖 中未不)之一端對準並接觸於插槽26之電連接孔加處。請配合「第 1375502 6圖」和「第7圖」’接著施加一朝向電路板20之下壓力於插拔式 電子兀件24上，使減式電子元件24具有電健點⑽中未示) 之一端順勢進入於插槽26之電連接孔262内，並被壓制固定於插 才曰26。此時，插拔式電子元件24與電路板2〇大致上呈相互平行 的關係，同時插拔式電子元件24與電路板2〇之間相隔一間隙d， 且散熱板16之熱傳導部162的位置恰位於此間隙d内，並且與插 拔式電子το件24之晶片組242的-側面相接觸或貼合。最後再將 本體14之蓋板146扣合或鎖固於開口 144處(圖中未示），而完成 安裝插拔式電子元件24於可赋電子裝置丨㈣組麵作。 _ 其中’由於插拔式電子元件24震設至電路板2〇後，插拔式 電子元件24之晶片'组242的一側南露出於本體14之開〇 144，另 側面則與散熱板丨6之贿導部⑹相接觸或貼合，因此當可搞 式電子裝置㈣始運作時’經由插拔式電子播24之晶片組⑽ 所產^的熱源，會藉由熱傳導(或包含部分熱對流，熱對流的比例 需，晶片'组242側面與熱傳導部162的接觸程度決定)的方式傳導 至政熱板I6的熱傳導部啦，然後沿著延伸段π4傳導並擴散分 佈於熱發散部166,以藉由熱發散部166與周遭環境之空氣間的熱 交換作用’而加速熱源發散至空氣中。若進—步地對插拔式電子 兀件24之工作溫度進行财，其結果如下表一所示。 記憶體溫度(。〇 10 1375502 有散熱風扇 無散熱風扇 習知的殼體結構 68 1 89 本發明之殼體結構 53 73 兩者之瀑度差 15 16 由表一中之結果顯示，無論是在有外加散熱風扇輔助散熱或 是在無散熱風扇輔助散熱的狀態下，本發明所揭露之殼體結構皆 能相對於習知的殼體結構降低至少15ΐ(攝氏溫度)的溫度。因此， 鲁本發明所揭露之威體結構能有效的降低插拔式電子元件的工作溫 度’以維持插拔式電子元件的運作效能。 本發明所揭露之殼體結構將散熱板設置於本體與電路板之 間，使散熱板之熱傳導部位於電路板與插拔式電子元件之間的間 隙内，並與滅式電子元件於運作時會產生高熱能的晶片組相接 觸。因此可有效的將插拔式電子元件於運作時所產生的熱源傳導 至散驗的熱料部’以II由熱傳導部將熱轉導並分佈於散熱 板上的其他區域並發散至空氣+。因此提升_式電子S件的散 熱速度，並使插拔式電子元件維持穩定的運作效能。 雖然本發明之實施例揭露如上所述，然並非用以限定本發 明’任何熟習相關技藝者，在不脫離本發明之精神和範圍内，舉 凡依本U中％範g|所述之形狀、構造、特徵及精神當可做些許 之變更’因此本發明之專聰護範_視本賴書職之申請專 利範圍所界定者為準。 【圖式簡單說明】 137^^02 第1圖為本發明實施例之續分解示意圖； 第2圖為本發明實細之局部組合示意圖； 第3圖為本發明實施例之局部剖面示意圖； 第4圖為本發明實施例之組裝操作示意圖； 第5圖為本發明實施例之組裝剖面示意圖； 第6圖為本發明實施例插拔式電子元件插設於插槽内之組合示意 圖；以及 第7圖為本發明實施例插拔式電子元件插設於插槽内之組合剖面 示意圖。 【主要元件符號說明】 10 可攜式電子裝置 12 殼板 14 本體 142 容置空間 144 開口 146 蓋板 1462 通氣口 16 散熱板 162 熱傳導部. 164 延伸段 166 熱發散部 18 上蓋 12VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention has a housing structure, particularly a housing structure having a heat dissipation function. [Prior Art] With the increase in the speed of electronic secrets, the design of various f-sub-device products is moving toward the goal of thin, new, and small. However, due to the large reduction in the volume of such products, it is difficult to shoot various electronic components. The problem of high heat emission is that if the pen is used, such as the electric device, the personal digital assistant (pDA), the handheld game machine, etc., the electronic device is mostly installed in the casing (four). Ways to solve the problem of overheating of heat sources (such as chips, CPUs, integrated circuits, etc.) - for computers such as ultra, deservable computers or simple computers, because of their limited internal space Therefore, this type of electronic device 1 omits the fan setting, that is, the so-called fanless setting method, and simply uses a general heat dissipation module for heat dissipation, such as a heat sink, a heat sink fin, or a heat pipe. At the same time, under the housing of the electronic device, some openings are arranged around the heat source region to improve the high heat state accumulated in the interior by the convection of the coffee field. Generally, fixed electronic components such as a central processing unit (CPU), a transistor or a capacitor, and plug-in electronic components, such as plug-in memory, are disposed on a circuit board of an electronic device. (mem〇ry), TV card, or other type of peripheral controller interface card ^eripherai contr〇uer interface card 'PCI card), etc. 'allows users to remove from the portable electronic device according to the needs of use Or added to the portable electronic device to expand the operational performance or function of the portable electronic device. Although a cooling fan or a heat sink is mounted inside the electronic device, most of the electronic components on the board can be dissipated. However, each type of heat dissipation using a cooling fan or heat sink module has a better heat dissipation effect only for the fixed electronic components on the circuit board, but the heat dissipation effect on the plug-in electronic components is rather limited. The reason for this is that the plug-in electronic components on the board are usually placed in electrical connection with the board by slots on the board. When the plug-in electronic component is inserted into the slot, there will be a narrow gap between the plug-in electronic component and the circuit board, so that the plug-in electronic component can be used as the air of the gap in the gap. Convection heat dissipation. (4) Under the current trend of increasing operating speed of electronic components, the heat generated by the operation of the touch electronic components is greatly increased, so that the air convection in the gap cannot immediately remove the heat source from the plugged electronic components. Therefore, the plug-in electronic component is liable to cause a decrease in operational efficiency due to overheating of the operating temperature or even a short circuit or burnout. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a housing structure, by which the housing structure used in a general electronic device cannot improve the heat dissipation efficiency of the plug-in electronic component, so that the plug-in electronic component is easily subjected to temperature by I. Too high results in reduced operational efficiency and short circuit and burnout. The present invention is a housing structure for disposing a circuit board and dissipating heat from at least one electronic component on the circuit board, wherein one of the electronic components disposed on the circuit board has a gap between the side surface and the circuit board. The housing structure comprises a body and a heat dissipation, wherein the board circuit board is placed in the body, the heat dissipation board is disposed between the body and the circuit board, and the heat dissipation board has a hot material portion, and the secret guide is mixed with the electrical and electronic components. Inside the gap of the door 'and in contact with the side of the electronic component to dissipate the electronic component by the heat conducting portion. The housing structure of the road disclosed in this month is disposed in the _ between the circuit board and the electronic component by the heat conduction portion of the heat dissipation plate, and is in contact with the side surface of the electronic component, and φ causes the electronic component to operate The generated heat can be conducted to the heat dissipation plate via the heat conduction portion and dissipated in the air by the heat exchange side* between the heat dissipation plate and the air, which can effectively 卩 + the temperature of the low electron 70 pieces and turn the temperature of the electronic component Please be within the working temperature I. Therefore, the operational efficiency of the electronic component can be improved, and the electronic component can be prevented from being burnt due to the operating temperature exceeding two. The above description of the present invention and the description of the embodiment of τ are used, show H, transfer the sum of the invention and j|, and provide the patent of the present invention _ please range further • further explanation. [Embodiment] As shown in Fig. 1, the housing structure disclosed in the embodiment of the present invention is applied to a portable f-device 10, such as a notebook computer, a personal number (four), a mobile phone, and a game. The machine is used to set a circuit board 2 〇 and dissipate heat from the circuit board to the electronic component it. The electronic component is a fixed electronic component 22 fixed on the circuit board, such as a chipset and a central processing unit, or plugged or unplugged from the circuit board 20 according to user requirements. Electronic components 1755502 24 'plug-in memory and peripheral controller interface card (PCI card). The plug-in electronic component 24 has a plurality of chip sets 242, and the plug-in electronic components 24 are inserted into the electrical connection holes 262 of the slots 26 of the circuit board 20 (as shown in FIG. 3). An electrical connection is made between the socket 26 and the circuit board 20. In this embodiment, the portable electronic device is a notebook computer, and the plug-in electronic component 24 is a plug-in double data rate (DDR) memory as an example, but not Limited.壳体 凊 第 第 第 第 第 第 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体 壳体The housing structure includes a shell 12, a body 14 and a heat sink %. The cover 12 is bonded to the body 14 and the side of the cover 12 is connected to the upper cover 18 of the portable electronic device 10 by a cymbal (not shown) to make the upper cover π relative to the cover 12 The pivoting is performed to expose or close the display screen (not shown) provided on the upper cover 18. The body 14 has an accommodating space 142, an opening 144 and a cover 146. The circuit board 20 is disposed in the accommodating space 142 and is locked to the body 14 by screws 30. The position of the slot 26 on the circuit board 20 corresponds to the opening 144 of the body, so that the plug-in electronic component 24 can be The opening 144 of the body 14 is inserted or removed from the circuit board 20. The cover 146 is covered on the opening 144 to prevent the batt and impurities from the outside of the body 14 from entering the body 14 and maintaining the flatness of the appearance of the body 14. A plurality of vents 1462' are opened on the cover 146. In order to create air convection between the internal space of the body and the external environment, the effect of heat exchange is enhanced. The heat dissipation plate 16 is disposed between the body 14 and the circuit board 20. The group of 1575502 of the heat dissipation plate 16 is made of graphite or metal, wherein the metal material is aluminum, copper, nickel and alloys of the two, or other It consists of metal materials and alloys with good thermal conductivity properties. The heat dissipating plate 16 has a heat conducting portion 162, an extending portion 164, and a heat dissipating portion 166. The position of the heat conducting portion 162 on the heat dissipating plate 16 corresponds to a position at which the pluggable electronic component is assembled on the circuit board 20, and the extending portion 164, the heat conducting portion 162 is connected to the heat radiating portion 166, and the heat conducting portion 162 and the heat radiating portion 166 are respectively bent in opposite directions of the extending portion, so that the heat conducting portion 162 and the extending portion 164 are formed on the heat radiating plate 16 into a bent structure. 4〇, wherein the extension m forms an angle with the heat conduction portion (6) and the heat dissipation portion 166, respectively. Also, the width of the extension 164 matches the height of the slot % of the slot provided on the circuit board 20. Therefore, after the heat dissipation plate 16 is mounted to the body 14, the bending structure 40 of the heat dissipation plate 16 corresponds to the slot 26 of the circuit board 20, and the heat dissipation portion 166 of the heat dissipation plate 16 is adjacent to the body 14, and the heat conduction portion The 162 is exposed to the opening 144 of the body 14 and is suspended above the circuit board 2 〇 opposite the body opening 144, and is adjacent to the circuit board 20 (as shown in FIG. 3). The heat dissipating portion 166 of the heat dissipating plate 16 is opposite to one side of the circuit board 2, and may also be attached to a surface of a solid electronic component (not shown) protruding from the circuit board 2 to be fixed. The heat source generated during operation of the electronic component can be conducted to the heat dissipation portion 166 for heat dissipation. In the operation of the plug-in electronic component 24 disposed on the circuit board 20, the plug-in electronic component 24 is first tilted through an opening 144 of the body 14 during the operation of the plug-in electronic component 24 disposed on the circuit board 20, and The plug-in electronic component 24 has one of the electrical contacts (not shown) aligned with and in contact with the electrical connection holes of the slot 26. Please cooperate with "Picture No. 1375502" and "Fig. 7" to apply a pressure on the plug-in electronic component 24 under the circuit board 20 so that the subtractive electronic component 24 has an electrical point (10). One end enters the electrical connection hole 262 of the slot 26 and is pressed and fixed to the plug 26 . At this time, the plug-in electronic component 24 and the circuit board 2 are substantially parallel to each other, and the plug-in electronic component 24 is separated from the circuit board 2 by a gap d, and the heat conducting portion 162 of the heat sink 16 is The position is located within this gap d and is in contact with or conforms to the side of the wafer set 242 of the plug-in electronic device 24. Finally, the cover 146 of the body 14 is fastened or locked to the opening 144 (not shown), and the insertion and removal of the electronic component 24 is performed on the electronic device (4). After the plug-in electronic component 24 is shocked to the circuit board 2, one side of the wafer 'group 242 of the plug-in electronic component 24 is exposed to the opening 144 of the body 14 and the other side is opposite to the heat sink 丨6 The bribe guide (6) is in contact or fit, so when the electronic device (4) is in operation, the heat source generated by the chipset (10) of the plug-in electronic broadcast 24 will be thermally conducted (or contain some heat). The ratio of convection and heat convection is transmitted to the heat conducting portion of the hot plate I6 in a manner that the degree of contact between the side of the wafer 'group 242 and the heat conducting portion 162 is determined, and then conducted along the extending portion π4 and diffused and distributed in the heat radiating portion 166. The heat source is accelerated to the air by the heat exchange between the heat diverging portion 166 and the air in the surrounding environment. If the operating temperature of the plug-in electronic component 24 is further advanced, the results are shown in Table 1 below. Memory temperature (.10 1375502 has a cooling fan without a cooling fan. The conventional housing structure 68 1 89 The housing structure 53 73 of the present invention has a difference of 15 16 as shown by the results in Table 1, whether in The housing structure disclosed in the present invention can reduce the temperature of at least 15 ΐ (Celsius) relative to the conventional housing structure in the state where the external cooling fan is used to assist the heat dissipation or the heat dissipation fan is not used to assist the heat dissipation. Therefore, Ruben The disclosed structure can effectively reduce the operating temperature of the plug-in electronic component to maintain the operational efficiency of the plug-in electronic component. The housing structure disclosed in the present invention places the heat dissipation plate between the body and the circuit board. The heat conducting portion of the heat dissipating plate is located in the gap between the circuit board and the plug-in electronic component, and is in contact with the chip set which generates high thermal energy during operation of the extinguishing electronic component, thereby effectively inserting and removing the electronic component The heat source generated by the element during operation is conducted to the scattered hot portion 'to be thermally transduced by the heat conducting portion and distributed on other areas of the heat sink and dissipated to the air +. The heat dissipation speed of the electronic device and the stable operation of the plug-in electronic component. Although the embodiments of the present invention are disclosed above, it is not intended to limit the invention to any skilled artisan. Without departing from the spirit and scope of the present invention, the shape, structure, characteristics, and spirit described in the U.S. can be changed somewhat. Therefore, the invention is based on the teachings of the book. The description of the scope of the patent application shall prevail. [Simplified illustration of the drawings] 137^^02 Figure 1 is a schematic exploded view of the embodiment of the present invention; Figure 2 is a schematic view of a partial combination of the actual details of the present invention; 4 is a schematic view of an assembly operation according to an embodiment of the present invention; FIG. 5 is a schematic cross-sectional view showing an assembly according to an embodiment of the present invention; and FIG. 6 is an insertion and insertion of an electronic component according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view showing the plug-in electronic component inserted into the slot according to the embodiment of the present invention. [Main component symbol description] 10 Portable electronic device 12 shell Plate 14 Body 142 Housing space 144 Opening 146 Cover 1462 Vent 16 Heat sink 162 Heat transfer. 164 Extension 166 Heat divergence 18 Upper cover 12