CN102263066A - Combined structure for radiating module - Google Patents
Combined structure for radiating module Download PDFInfo
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- CN102263066A CN102263066A CN2010102646208A CN201010264620A CN102263066A CN 102263066 A CN102263066 A CN 102263066A CN 2010102646208 A CN2010102646208 A CN 2010102646208A CN 201010264620 A CN201010264620 A CN 201010264620A CN 102263066 A CN102263066 A CN 102263066A
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- heat
- combined structure
- radiation module
- heat radiation
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Abstract
The invention relates to a combined structure for a radiating module. The combined structure comprises a circuit baseboard, at least one heating element, a radiating unit and a heat-conducting combined material, wherein at least one through hole is formed on the circuit baseboard; the through holes penetrate through two opposite surfaces of the circuit baseboard; the heating element is arranged on one surface of the circuit baseboard and is electrically connected to the circuit baseboard; a heat-conducting part is arranged on the circuit baseboard; the radiating unit has a main body; the main body is provided with a combining surface; the radiating unit is combined with the other surface of the circuit baseboard through the combining surface; and the heat-conducting combined material is correspondingly filled in the through holes and is connected with the heat-conducting part and the combining surface. By virtue of the heat-conducting combined material in the through holes, the heating element is directly combined with the radiating unit, thereby improving the whole heat conduction efficiency, efficiently reducing the quantity of components and lowering the production cost.
Description
Technical field
The present invention is about a kind of heat radiation module combined structure, particularly about a kind of simplification integrated member, and the heat radiation module combined structure that reduces production costs.
Background technology
Existing heat radiation module combined structure 9, please refer to shown in Fig. 1 to 3, it comprises a circuit substrate 91, several heater elements 92, a soaking plate 93 and a heat-sink unit 94, and a side of this circuit substrate 91 is provided with several contacts 911, and respectively this heater element 92 is electrically coupled to respectively this contact 911 respectively.This soaking plate 93 has a first surface 931 and a second surface 932, this circuit substrate 91 by hot pressing, stick together or the first surface 931 of mode is incorporated into this soaking plate 93 such as spiral shell is solid, wherein the material of this soaking plate 93 is for having high capacity of heat transmission and low-gravity aluminium sheet.This heat-sink unit 94 is the common metal radiating fin, has an adhesion layer 95 between this heat-sink unit 94 and this soaking plate 93, this adhesion layer 95 is made of the sticker of the high capacity of heat transmission of tool, so that the second surface that is incorporated into this soaking plate 93 932 that this heat-sink unit 94 can be firm.This heat-sink unit 94 is provided with several fins 941, this fin 941 be spaced be formed at this heat-sink unit 94 not with surface that this soaking plate 93 combines on.
Please refer to shown in Fig. 2 and 3, when these heater element 92 work, this soaking plate 93 can continue to absorb the heat energy that this heater element 92 is produced by this circuit substrate 91 with heat exchange pattern indirectly, simultaneously this soaking plate 93 also with the thermal energy conduction that absorbed to this heat-sink unit 94, utilize these several fins 941 to increase area of dissipation, reach the purpose that promotes radiating efficiency whereby, the working temperature of further avoiding this heater element 92 is too high and cause damaging or situation that usefulness reduces takes place.
Because the heat energy that this heater element 92 is produced must be by this circuit substrate 91, just can be conducted to after the multi-ply constructions such as soaking plate 93 and adhesion coating 95 on several fins 941 of this heat-sink unit 94 and be carried out the heat exchange action, and this circuit substrate 91, soaking plate 93 and adhesion coating 95 are the member of unlike material, wherein this circuit substrate 91 is more by the main base material of insulation material conduct, its capacity of heat transmission is lower, thereby badly influence the heat conduction efficiency of this existing heat radiation module combined structure 9, hence one can see that, and the formed sandwich construction of aforementioned many members has not only reduced the integral heat sink effect of this existing heat radiation module combined structure 9, and its too much the number of components has more caused the shortcoming of high production cost.
Again, this soaking plate 93 and heat-sink unit 94 are the member that metal material is made, so that need additionally to set up this adhesion coating 95 between this soaking plate 93 and the heat-sink unit 94, could strengthen between its two in conjunction with reliability; And, this circuit substrate 91 also must be by hot pressing, stick together or the first surface 931 of mode just can be incorporated into this soaking plate 93 such as spiral shell is solid, so increase complexity and the degree of difficulty of this existing heat radiation module combined structure 9 on assembly program simultaneously, and caused production and assembly efficient too low.In view of this, aforementioned existing heat radiation module combined structure 9 still has necessity of being improved really.
Summary of the invention
The invention provides a kind of heat radiation module combined structure, it can be directly conducted to heat-sink unit with the heat energy that heater element produces and carry out heat exchange, to promote integral heat sink efficient, is purpose of the present invention.
The invention provides a kind of heat radiation module combined structure, it can effectively reduce integrated member quantity, to promote packaging efficiency and to reduce production costs, is another object of the present invention.
For reaching aforementioned goal of the invention, technological means that the present invention used and the effect that can reach by this technological means include:
A kind of heat radiation module combined structure, it comprises a circuit substrate, at least one heater element, a heat-sink unit and an operative connection material, relative two surfaces of this circuit substrate are respectively a first surface and a second surface, this circuit substrate has several through holes and several contacts, and this through hole runs through first surface and the second surface that is communicated with this circuit substrate.This heater element is arranged at the first surface of this circuit substrate, and forms electric property coupling with this contact respectively, and respectively this heater element is provided with a heat-conducting part.This heat-sink unit has a body, and this body is provided with a faying face, and this heat-sink unit is incorporated into the second surface of this circuit substrate by this faying face.This operative connection material correspondence is filled in each through hole of this circuit substrate, and joins with the heat-conducting part of this heater element and the faying face of body respectively.
The technological means that the present invention used also can comprise:
A circuit substrate have a through hole, and this through hole runs through this circuit substrate; A heater element is arranged at a surface of this circuit substrate, and with this circuit substrate electric property coupling, this heater element is provided with a heat-conducting part, this heat-conducting part and the contraposition mutually of this through hole; A heat-sink unit has a body, and this body is provided with a faying face, and this heat-sink unit is incorporated into another surface of this circuit substrate by this faying face; And an operative connection material, correspondence is filled in this through hole, and joins with the heat-conducting part of this heater element and the faying face of body respectively.
Useful technique effect of the present invention is: mainly by at this at least one through hole of this circuit substrate setting, and make this heater element directly to combine with this heat-sink unit by the operative connection material in this through hole, make the present invention can effectively improve its overall thermal conduction efficiency, and minimizing the number of components, reach the purpose that reduces production costs.
Description of drawings
Fig. 1: the three-dimensional exploded view of existing heat radiation module combined structure.
Fig. 2: the combination of side view of existing heat radiation module combined structure.
Fig. 3: the broken section and the enlarged drawing of existing heat radiation module combined structure.
Fig. 4: the three-dimensional exploded view of the heat radiation module combined structure of first embodiment of the invention.
Fig. 5: the combination side-looking and the perspective view of the heat radiation module combined structure of first embodiment of the invention.
Fig. 6: the combination top view of the heat radiation module combined structure of first embodiment of the invention.
Fig. 7: the heat radiation module combined structure of first embodiment of the invention is along the assembled sectional view of Figure 67-7 line.
Fig. 8: the combination side-looking and the perspective view of the heat radiation module combined structure of second embodiment of the invention.
Fig. 9: the three-dimensional exploded view of the heat radiation module combined structure of third embodiment of the invention.
Figure 10: the assembled sectional view of the heat radiation module combined structure of third embodiment of the invention.
Figure 11: the three-dimensional exploded view of the heat radiation module combined structure of fourth embodiment of the invention.
Figure 12: the assembled sectional view of the heat radiation module combined structure of fourth embodiment of the invention.
Figure 13: the assembled sectional view of the heat radiation module combined structure of fifth embodiment of the invention.
[main element symbol description]
1 circuit substrate, 11 first surfaces, 12 second surfaces, 13 through holes
14 contacts, 2 heater elements, 21 pins, 22 heat-conducting parts
3 heat-sink units, 31 bodies, 311 faying faces, 32 fins
33 fan element, 34 joint portions, 341 projections, 4 operative connection materials
9 existing heat radiation module combined structure 91 circuit substrates
911 contacts, 92 heater elements, 93 soaking plate, 931 first surfaces
932 second surfaces, 94 heat-sink units, 941 fins, 95 adhesion coatings
Embodiment
For above-mentioned and other purpose of the present invention, feature and advantage can be become apparent, preferred embodiment of the present invention cited below particularly, and cooperate appended graphicly, be described in detail below:
Please refer to shown in Figure 4, the heat radiation module combined structure of first embodiment of the invention is selected with a LED light fixture as a wherein execution mode explanation, but not limited this LED light fixture that is used in of purposes of the present invention also can be widely used in the electronic installation that other need heat-dissipating structure.
Referring again to shown in Figure 4, the heat radiation module combined structure of first embodiment of the invention comprises a circuit substrate 1, several heater elements 2, a heat-sink unit 3 and an operative connection material 4, and these several heater elements 2 and heat-sink unit 3 are engaged in relative two surfaces of this circuit substrate 1 respectively by this operative connection material 4.
Please refer to shown in Fig. 4 and 6, this circuit substrate 1 is general printed circuit board (PCB) (Printed circuit Board, PCB), and preferable FR-4 or the FR-5 substrate of being chosen as, relative two surfaces of this circuit substrate 1 are respectively a first surface 11 and a second surface 12, and this circuit substrate 1 has several through holes 13 and several contacts 14, these several through holes 13 run through first surface 11 and the second surface 12 that is communicated with this circuit substrate 1, and form annular arrangement in the present embodiment on the first surface 11 of this circuit substrate 1.Respectively this contact 14 is also corresponding forms annular arrangement on the first surface 11 of this circuit substrate 1, and contraposition is arranged at the respectively peripheral position of this through hole 13 respectively, and respectively this contact 14 electrically conducts with the circuit formation that is embedded in this circuit substrate 1 respectively.The through hole 13 of present embodiment is selected to be arranged between this corresponding two point 14 as the execution mode explanation.
Please refer to shown in Fig. 4 to 7 the heater element 2 preferable light-emitting diodes (LED), particularly a white light emitting diode of being chosen as of present embodiment.This heater element 2 is provided with two pins 21 and a heat-conducting part 22, and this two pin 21 is in order to the contact 14 of this circuit substrate 1 of electric property coupling; This heat-conducting part 22 is in order to conduct the heat energy that this heater element 2 produces, and the heat-conducting part 22 of present embodiment selects to be arranged at the bottom of this heater element 2, and contraposition is towards the through hole 13 of this circuit substrate 1.In addition, the metal material that this heat-conducting part 22 is preferably the high capacity of heat transmission of tool constitutes, for example aluminium, copper, silver or its alloy etc., and the preferable aperture area of the contact area of this heat-conducting part 22 greater than this through hole 13, so as this heat-conducting part 22 fully contraposition cover this through hole 13.Again, because present embodiment selects to illustrate as execution mode with this LED light fixture, so this heater element 2 be this light-emitting diode, but the category that desire of the present invention is protected is as limit, and this heater element 2 also can be other electronic components.
These heat-sink unit 3 preferable radiating fins that are chosen as, its selection is made by the metal material of the high capacity of heat transmission of tool, for example aluminium, copper, silver or its alloy etc.This heat-sink unit 3 has a body 31 and several fins 32, and this body 31 has a faying face 311, and this faying face 311 is the surface of this body 31 towards this circuit substrate 1, in order to amplexiform mutually with the second surface 12 of this circuit substrate 1.32 corresponding another surfaces that are formed at this body 31 of arranging of these several fins, and leave a gap between each wantonly two adjacent fin 32, so that between each wantonly two adjacent fin 32, form a gas channel, allow gas contact and to carry out heat exchange with this fin 32 respectively whereby, to reduce this fin 32 temperature by this gas channel.
These operative connection material 4 correspondences are filled in each through hole 13 of this circuit substrate 1, these operative connection material 4 preferable materials that are chosen as with the high capacity of heat transmission and high binding ability, for example: heat conductive silica gel or brazing metal (tin cream), and according to the material corresponding selection of this operative connection material 4 by a surface mount technology technology (Surface Mount Technology, SMT) the operative connection material 4 (brazing metal) in this through hole 13 of heating and melting, perhaps high-temperature baking solidifies the operative connection material 4 (heat conductive silica gel) in this through hole 13, so that the firm respectively faying face 311 with heat-conducting part 22 this heater element 2 and this body 31 of this operative connection material 4 joins, this heater element 2 can directly be connected with this heat-sink unit 3 by this operative connection material 4, and this circuit substrate 1 clamping is positioned between this heater element 2 and the heat-sink unit 3.
Referring again to shown in Fig. 4 to 7, when 2 work of this heater element, the heat energy that this heater element 2 is produced can make the temperature of himself and this heat-conducting part 22 rise gradually.Rising along with temperature, this heat-conducting part 22 by this operative connection material 4 with heat exchange pattern directly with the body 31 of this thermal energy transfer to this heat-sink unit 3, this heat-sink unit 3 increases the heat exchange area of himself by being provided with of these several fins 32, to promote exchange rate, cool off this heater element 2 whereby, this heater element 2 can be maintained under the suitable working temperature, and then promote the task performance and the useful life of this heater element 2.
The present invention is mainly by this several through holes 13 are set at this circuit substrate 1, and make this heater element 2 directly to combine with this heat-sink unit 3 by the operative connection materials 4 in this through hole 13, so this heater element 2 not only can directly conduct to the heat energy that it produced on this heat-sink unit 3 by this operative connection material 4, more because heat-conducting part 22 of the present invention, operative connection material 4 and heat-sink unit 3 constitute by the material of the high capacity of heat transmission, make the present invention not need additionally or set up soaking plate and assist heat conduction by sandwich construction, and then the setting that can omit soaking plate, so can effectively improve its integral heat sink efficient, and minimizing the number of components, reach the purpose that reduces production costs.
In addition, operative connection material 4 in the various embodiments of the present invention is chosen as heat conductive silica gel and illustrates as execution mode, wherein because this heater element 2 directly passes through this operative connection material 4 and these heat-sink unit 3 Joints, and only must can finish this circuit substrate 1 by this high-temperature baking curing process once, the assembling finder of heater element 2 and heat-sink unit 3, allow this circuit substrate 1 be positioned between this heater element 2 and the heat-sink unit 3 by clamping, make that the present invention does not need additionally to fix this circuit substrate 1 and this heater element 2 by technology repeatedly in assembling, perhaps this circuit substrate 1 and this heat-sink unit 3, and the present invention also can allow this heater element 2 and heat-sink unit 3 be attached at respectively on the first surface 11 and second surface 12 of this circuit substrate 1, keep good assembling reliability, the present invention can effectively simplify assembly program really whereby, and further reaches the purpose that promotes overall package efficient.
Please refer to shown in Figure 8, it discloses the heat radiation module combined structure of second embodiment of the invention, compared to first embodiment, the heat-sink unit 3 of second embodiment is provided with a fan element 33 in addition, this fan element 33 may be selected to be general axis streaming or blowing-type fan, its correspondence is placed in the space of these several fin 32 formation that are arranged with, wherein the air-out direction of this fan element 33 or the preferable contraposition of inlet air direction are towards body 31 or this several fins 32 of this heat-sink unit 3, so that promote the radiating efficiency of these several fins 32 by the active cycle of gas, effectively promote the radiating efficiency of these heat-sink unit 3 relative these circuit substrates 1 and heater element 2 whereby, reach the purpose of cooling.
Please refer to shown in Fig. 9 and 10, it discloses the heat radiation module combined structure of third embodiment of the invention, and compared to first embodiment, the circuit substrate 1 of the 3rd embodiment only is provided with single through hole 13, and be provided with contact 14 at the peripheral position of this through hole 13, as the execution mode explanation.Wherein, this through hole 13 runs through this circuit substrate 1, and is arranged at the center of this circuit substrate 1.This through hole 13 is preferable between this corresponding two point 14.Again, the quantity of this heater element 2 is also to being chosen as one by single through hole 13, and the heat-conducting part 22 shape correspondences of this heater element 2 are similar in appearance to the shape of this through hole 13, so as this heater element 2 when being incorporated into the first surface 11 of this circuit substrate 1 this heat-conducting part 22 fully contraposition cover this through hole 13.
Hence one can see that, and the present invention can reach the purpose that is assembled in response to the difference of electronic component quantity, therefore is widely used in easily on various forms of electronic installations.
Please refer to shown in Figure 11 and 12, it discloses the heat radiation module combined structure of fourth embodiment of the invention, compared to first embodiment, the heat-sink unit 3 of the 4th embodiment is provided with several joint portions 34 (also can only be provided with according to actual demand) in addition, these several joint portions 34 are formed on the faying face 311 of this body 31, and the annular arrangement mode of several through holes 13 of the arrangement mode and this of these several joint portions 34 is corresponding mutually, make when this circuit substrate 1 amplexiforms faying face 311 in this body 31 that respectively this through hole 13 can be respectively be communicated with these joint portion 34 mutual contrapositions respectively.In addition, the joint portion 34 of present embodiment is chosen as blind hole structure, but not as limit, this joint portion 34 also may be selected to be other combined structures.So, in this operative connection material 4 is filled at respectively this through hole 13 and high-temperature baking when solidifying, this operative connection material 4 also can be inserted simultaneously and be engaged in this joint portion 34.
The bonded area that present embodiment mainly increases between this operative connection material 4 and this body 31 by this joint portion 34, and then promote between its two in conjunction with reliability, make that this operative connection material 4 is able to firmly respectively engage with heat-conducting part 22 this heater element 2 and this body 31.
Please refer to shown in Figure 13, it discloses the heat radiation module combined structure of fifth embodiment of the invention, compared to first embodiment, joint portion 34 internal faces of the 5th embodiment are provided with several projections 341, and the projection 341 of present embodiment selects to be formed at the bottom surface of this joint portion 34.By the setting of this projection 341, and then increase bonded area between this operative connection material 4 and this joint portion 34 internal faces, promote whereby between its two in conjunction with reliability.
Claims (26)
1. heat radiation module combined structure is characterized in that comprising:
A circuit substrate, its relative two surfaces are respectively a first surface and a second surface, and this circuit substrate has several through holes and several contacts, and this through hole runs through first surface and the second surface that is communicated with this circuit substrate;
Several heater elements are arranged at the first surface of this circuit substrate, and form electric property coupling with this contact respectively, and respectively this heater element is provided with a heat-conducting part, respectively this heat-conducting part respectively with respectively this through hole contraposition mutually;
A heat-sink unit has a body, and this body is provided with a faying face, and this heat-sink unit is incorporated into the second surface of this circuit substrate by this faying face; And
An operative connection material, correspondence are filled in each through hole of this circuit substrate, and join with the heat-conducting part of this heater element and the faying face of body respectively.
2. heat radiation module combined structure as claimed in claim 1 is characterized in that: the contact area of this heat-conducting part is greater than the aperture area of this through hole, and this heat-conducting part contraposition fully covers this through hole.
3. heat radiation module combined structure as claimed in claim 1 is characterized in that: respectively this contact respectively contraposition be arranged at the respectively peripheral position of this through hole.
4. heat radiation module combined structure as claimed in claim 1 is characterized in that: this through hole is arranged between these corresponding two these contacts.
5. heat radiation module combined structure as claimed in claim 1, it is characterized in that: this heat-sink unit is provided with several fins in addition, the corresponding outer peripheral face that is formed at this body of arranging of these several fins, and form a gas channel between each any two adjacent fin.
6. heat radiation module combined structure as claimed in claim 1, it is characterized in that: this heat-sink unit is provided with several joint portions, and these several joint portions are formed at the faying face of this body, and this joint portion is communicated with the mutual contraposition of this through hole respectively.
7. heat radiation module combined structure as claimed in claim 6 is characterized in that: this joint portion is a blind hole.
8. heat radiation module combined structure as claimed in claim 7, it is characterized in that: this joint portion is provided with several projections, and these several projections are formed at the internal face of this joint portion.
9. heat radiation module combined structure as claimed in claim 5, it is characterized in that: this heat-sink unit is provided with a fan element in addition, this fan element is arranged at a side of this body or fin, and the air-out of this fan element or the contraposition of inlet air direction are towards this body or this fin.
10. heat radiation module combined structure as claimed in claim 1, it is characterized in that: this heat-conducting part is made of aluminium, copper, silver or its alloy.
11. heat radiation module combined structure as claimed in claim 1 is characterized in that: this heater element is a light-emitting diode.
12. as claim 1 or 5 described heat radiation module combined structures, it is characterized in that: this heat-sink unit is made by aluminium, copper, silver or its alloy.
13. heat radiation module combined structure as claimed in claim 1 is characterized in that: this operative connection material is heat conductive silica gel or brazing metal.
14. heat radiation module combined structure as claimed in claim 13 is characterized in that: this brazing metal is a tin cream.
15. a heat radiation module combined structure is characterized in that comprising:
A circuit substrate have a through hole, and this through hole runs through this circuit substrate;
A heater element is arranged at a surface of this circuit substrate, and with this circuit substrate electric property coupling, this heater element is provided with a heat-conducting part, this heat-conducting part and the contraposition mutually of this through hole;
A heat-sink unit has a body, and this body is provided with a faying face, and this heat-sink unit is incorporated into another surface of this circuit substrate by this faying face; And
An operative connection material, correspondence is filled in this through hole, and joins with the heat-conducting part of this heater element and the faying face of body respectively.
16. heat radiation module combined structure as claimed in claim 15 is characterized in that: the contact area of this heat-conducting part is greater than the aperture area of this through hole, and this heat-conducting part contraposition fully covers this through hole.
17. heat radiation module combined structure as claimed in claim 15, it is characterized in that: the peripheral position of this through hole is provided with contact.
18. heat radiation module combined structure as claimed in claim 17 is characterized in that: this through hole is arranged between these corresponding two contacts.
19. heat radiation module combined structure as claimed in claim 15, it is characterized in that: this heat-sink unit is provided with several fins in addition, the corresponding outer peripheral face that is formed at this body of arranging of these several fins, and form a gas channel between each any two adjacent fin.
20. heat radiation module combined structure as claimed in claim 15, it is characterized in that: this heat-sink unit is provided with at least one joint portion, and this at least one joint portion is formed at the faying face of this body, and this joint portion is communicated with the mutual contraposition of this through hole respectively.
21. heat radiation module combined structure as claimed in claim 20 is characterized in that: this joint portion is a blind hole.
22. heat radiation module combined structure as claimed in claim 21, it is characterized in that: this joint portion is provided with several projections, and these several projections are formed at the internal face of this joint portion.
23. heat radiation module combined structure as claimed in claim 19, it is characterized in that: this heat-sink unit is provided with a fan element in addition, this fan element is arranged at a side of this body or fin, and the air-out of this fan element or the contraposition of inlet air direction are towards this body or this fin.
24. heat radiation module combined structure as claimed in claim 15, it is characterized in that: this through hole is arranged at the center of this circuit substrate, and the shape correspondence of this through hole is similar in appearance to the shape of the heat-conducting part of this heater element.
25. heat radiation module combined structure as claimed in claim 15 is characterized in that: this operative connection material is heat conductive silica gel or brazing metal.
26. heat radiation module combined structure as claimed in claim 25 is characterized in that: this brazing metal is a tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010264620.8A CN102263066B (en) | 2010-05-24 | 2010-08-27 | Combined structure for radiating module |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010180564.X | 2010-05-24 | ||
| CN201010180564 | 2010-05-24 | ||
| CN201010264620.8A CN102263066B (en) | 2010-05-24 | 2010-08-27 | Combined structure for radiating module |
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| Publication Number | Publication Date |
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| CN102263066A true CN102263066A (en) | 2011-11-30 |
| CN102263066B CN102263066B (en) | 2015-03-25 |
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| CN201010264620.8A Expired - Fee Related CN102263066B (en) | 2010-05-24 | 2010-08-27 | Combined structure for radiating module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107906382A (en) * | 2017-12-21 | 2018-04-13 | 哈尔滨哈普电气技术有限责任公司 | Cross-linking radiation ultraviolet leds generating means and processing, method of work |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| CN1829415A (en) * | 2006-03-16 | 2006-09-06 | 友达光电股份有限公司 | Composite structure of flexible printed circuit and electronic component |
| CN201225594Y (en) * | 2008-03-26 | 2009-04-22 | 杰创科技有限公司 | Heat conductance improved structure of substrate |
-
2010
- 2010-08-27 CN CN201010264620.8A patent/CN102263066B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| CN1829415A (en) * | 2006-03-16 | 2006-09-06 | 友达光电股份有限公司 | Composite structure of flexible printed circuit and electronic component |
| CN201225594Y (en) * | 2008-03-26 | 2009-04-22 | 杰创科技有限公司 | Heat conductance improved structure of substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107906382A (en) * | 2017-12-21 | 2018-04-13 | 哈尔滨哈普电气技术有限责任公司 | Cross-linking radiation ultraviolet leds generating means and processing, method of work |
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| CN102263066B (en) | 2015-03-25 |
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Address after: The new Taiwan China Ya Lu Kaohsiung City No. 30 Lane 296 Patentee after: Sunonwealth Electric Machine Industry Co.,Ltd. Address before: Are China Taiwan Lingya Kaohsiung No. 120 12 floor 1 Patentee before: Sunonwealth Electric Machine Industry Co.,Ltd. |
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Granted publication date: 20150325 Termination date: 20210827 |