CN102264213B - Method for combining thermal module - Google Patents
Method for combining thermal module Download PDFInfo
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- CN102264213B CN102264213B CN201010185853.9A CN201010185853A CN102264213B CN 102264213 B CN102264213 B CN 102264213B CN 201010185853 A CN201010185853 A CN 201010185853A CN 102264213 B CN102264213 B CN 102264213B
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- circuit board
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- sink unit
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Abstract
The invention relates to a method for combining a thermal module. The method comprises the following steps of: preforming at least one through hole in a circuit board, and making the through hole pass through two opposite surfaces of the circuit board; fixing a heat radiating unit or at least one heating element on one surface of the circuit board, and aligning to cover one end of the through hole; filling a metal solder into the through hole; fixing the unset heat radiating unit or heating element on the other surface of the circuit board, and aligning to cover the other end of the through hole; and heating to melt the metal solder in the through hole to make the metal solder welded to the heating element and the heat radiating unit respectively. Therefore, the heating element can be directly combined with the heat radiating unit through the metal solder in the through hole, so that the overall heat conduction efficiency and the overall assembly efficiency are improved.
Description
Technical field
The present invention is about a kind of associated methods of radiating module, particularly about a kind of associated methods of radiating module that can improving heat radiation efficiency.
Background technology
The associated methods of existing radiating module, please refer to shown in Fig. 1 and 2, its step comprises: utilize the locate modes such as hot pressing, bonding or spiral shell be solid to be incorporated into a first surface 921 of a soaking plate 92 circuit board 91, jointly to form a substrate, wherein the material of this soaking plate 92 is for having high capacity of heat transmission and low-gravity aluminium sheet; (for example: thermal grease) on a faying face 931 of a heat-sink unit 93, apply in advance the sticker of the high capacity of heat transmission of tool, by this sticker, between this soaking plate 92 and heat-sink unit 93, form a heat conduction articulamentum 94, so that a second surface 922 of this soaking plate 92 can amplexiform on the faying face 931 of this heat-sink unit 93, make several screws 95 of this substrate and the 932 phase contrapositions of several screws of this heat-sink unit 93 simultaneously; Then, utilize several lock member 96 contrapositions to be fixed in this screw 932,95, make on the faying face that is incorporated into this heat-sink unit 93 931 that this substrate can be firm; Finally, several pins 971 of several heater elements 97 are welded in to a surface of this circuit board 91, make this heater element 97 and the circuit being embedded in this circuit board 91 form electric connection.
When this heater element 97 work, this soaking plate 92 can continue to absorb the heat energy that this heater element 97 is produced with heat exchange pattern by this circuit board 91 indirectly, and this soaking plate 92 also conducts to this heat-sink unit 93 by absorbed heat energy by this heat conduction articulamentum 94 simultaneously.Again, because this heat-sink unit 93 is provided with several fins 933, and respectively this fin 933 is spaced and is formed on the surface that this heat-sink unit 93 do not combine with this soaking plate 92, increase whereby the area of dissipation of this heat-sink unit 93, to reach the object of improving heat radiation efficiency, further avoid the working temperature situation too high and that cause damage or usefulness to reduce of this heater element 97 to occur.
In the formed combined structure of existing radiating module, because the heat energy that this heater element 97 produces must be via this circuit board 91, the multi-ply constructions such as soaking plate 92 and heat conduction articulamentum 94 rear just can be conducted on several fins 933 of this heat-sink unit 93 carries out heat exchange action, and this circuit board 91, soaking plate 92 and heat conduction articulamentum 94 are the member of unlike material, wherein this circuit board 91 more by insulation material (such as epoxy resin or phenolic resins etc.) as main base material, its capacity of heat transmission is lower, thereby badly influence the heat conduction efficiency of this existing radiating module, hence one can see that, and the formed multilayer combined structure of aforementioned many members has not only reduced the integral heat sink effect of this existing radiating module, its too much the number of components has more caused the shortcoming of high production and assembly cost.
Again, because this soaking plate 92 and heat-sink unit 93 are the member that metal material is made, so that need additionally to set up this heat conduction articulamentum 94 between this soaking plate 92 and heat-sink unit 93, could strengthen the combination reliability between its two, thereby increased assembling complexity and the degree of difficulty of the associated methods of this existing radiating module, cause production and assembly efficiency too low.In view of this, the associated methods of aforementioned existing radiating module still has necessity of being improved really.
Summary of the invention
The invention provides a kind of associated methods of radiating module, its heat energy that heater element can be produced is directly conducted to heat-sink unit and carries out heat exchange, to promote integral heat sink efficiency, is object of the present invention.
The invention provides a kind of associated methods of radiating module, it can omit unnecessary member, simplifies assembly program simultaneously, to promote packaging efficiency and to reduce production costs, is another object of the present invention.
For reaching aforementioned goal of the invention, the technological means that the present invention uses and the effect that can reach by this technological means include:
An associated methods for radiating module, its step comprises: on a circuit board, be pre-formed at least one through hole, and make this through hole run through relative two surfaces of this circuit board; One heat-sink unit or at least one heater element are fixed on to a surface of this circuit board, and contraposition covers one end of this through hole; Then, insert a brazing metal in this through hole; Another surface that this heat-sink unit not arranging or heater element are fixed on to this circuit board, and contraposition covers the other end of this through hole; Finally, the brazing metal in this through hole of heating and melting, makes this brazing metal be fused to respectively this heater element and heat-sink unit.
The present invention is mainly by this at least one through hole is set at this circuit board, and by the brazing metal in this through hole, this heater element can directly be combined with this heat-sink unit, make the present invention can effectively improve its overall thermal conduction efficiency, and reduce the number of components, reach the object reducing production costs.
Accompanying drawing explanation
Fig. 1: the schematic side view before the assembling of the associated methods of existing radiating module.
Fig. 2: the associated methods of existing radiating module complete the schematic side view after assembling.
Fig. 3: the schematic flow sheet of the associated methods of the radiating module of first embodiment of the invention.
Fig. 4: the cross-sectional schematic of the first step of the associated methods of the radiating module of first embodiment of the invention.
Fig. 5: the assembling of the second step of the associated methods of the radiating module of first embodiment of the invention and cross-sectional schematic.
Fig. 6: the third step of the associated methods of the radiating module of first embodiment of the invention is filled the cross-sectional schematic of brazing metal.
Fig. 7: assembling and the cross-sectional schematic of the 4th step of the associated methods of the radiating module of first embodiment of the invention.
Fig. 8: the associated methods of the radiating module of first embodiment of the invention first carries out the schematic side view of finder before implementing the 5th step.
Fig. 9: the associated methods of the radiating module of first embodiment of the invention completes the schematic side view of finder before implementing the 5th step.
Figure 10: the schematic diagram of the enforcement of the associated methods of the radiating module of first embodiment of the invention the 5th step.
Figure 11: assembling and the cross-sectional schematic of the 4th step of the associated methods of the radiating module of second embodiment of the invention.
Figure 12: the third step of the associated methods of the radiating module of second embodiment of the invention is filled the cross-sectional schematic of brazing metal.
Figure 13: the assembling of the second step of the associated methods of the radiating module of second embodiment of the invention and cross-sectional schematic.
Figure 14: before the assembling of the associated methods of the radiating module of third embodiment of the invention and cross-sectional schematic.
Figure 15: the associated methods of the radiating module of third embodiment of the invention complete finder and insert brazing metal and cross-sectional schematic.
Figure 16: the associated methods of the radiating module of third embodiment of the invention complete the cross-sectional schematic after assembling.
Figure 17: before the assembling of the associated methods of the radiating module of fourth embodiment of the invention and cross-sectional schematic.
Figure 18: the associated methods of the radiating module of fourth embodiment of the invention complete the cross-sectional schematic after assembling.
Figure 19: the associated methods of the radiating module of fifth embodiment of the invention first applies the cross-sectional schematic of a viscose glue on heat-sink unit before carrying out second step.
Figure 20: the associated methods of the radiating module of fifth embodiment of the invention carries out assembling and the cross-sectional schematic of second step and finder simultaneously.
Figure 21: the associated methods of the radiating module of fifth embodiment of the invention complete the cross-sectional schematic after assembling.
[main element symbol description]
1 circuit board 11 through hole 12 first surface 13 second surfaces
14 contact 15 second top 16 first location division 2 heat-sink units
21 faying face 22 fin 23 second location division 3 brazing metals
4 heater element 41 heat-conducting part 42 pin 5 localization tools
51 first top 6 supply unit 7 reflow stove 8 lock members
91 circuit board 92 soaking plate 921 first surface 922 second surfaces
93 heat-sink unit 931 faying face 932 screw 933 fins
94 heat conduction articulamentum 95 screw 96 lock member 97 heater elements
971 pin T adhesion coatings
Embodiment
For above-mentioned and other object of the present invention, feature and advantage can be become apparent, preferred embodiment of the present invention cited below particularly, and coordinate appended graphicly, be described in detail below:
Please refer to shown in Fig. 3 to 10, the associated methods of the radiating module of first embodiment of the invention selects to using the associated methods of a LED light fixture as a wherein execution mode explanation, but purposes of the present invention is limited, be not used in being assembled of this LED light fixture, can be widely used in the electronic installation that other need heat-dissipating structure yet.
Referring again to shown in Fig. 3 to 10, the associated methods of the radiating module of first embodiment of the invention comprises the following step: on a circuit board 1, be pre-formed at least one through hole 11, this through hole 11 runs through relative two surfaces of circuit board 1; One surface conjunction of this circuit board 1, on a faying face 21 of a heat-sink unit 2, and is made to 2 pairs of one end that are not covered in this through hole 11 of this heat-sink unit; Insert a brazing metal 3 in this through hole 11; Then, at least one heater element 4 is fixed on to another surface of this circuit board 1, and these heater element 4 contrapositions are simultaneously covered in the other end of this through hole 11; Finally, the brazing metal 3 in this through hole 11 of heating and melting, makes this brazing metal 3 be fused to respectively this heat-sink unit 2 and heater element 4.
In more detail, please refer to shown in Fig. 4, the first step S1 of the associated methods of the radiating module of first embodiment of the invention utilize mechanical-moulded mode (such as: punching etc.) on this circuit board 1, form in advance this through hole 11, wherein this circuit board 1 is general printed circuit board (PCB) (Printed circuitBoard, PCB), and better FR-4 or the FR-5 substrate of being chosen as, the relative two side faces of this circuit board 1 is respectively a first surface 12 and a second surface 13, and two ends of this through hole 11 run through first surface 12 and the second surface 13 that is communicated with this circuit board 1.
Please refer to shown in Fig. 5, the second step S 2 of the associated methods of the radiating module of first embodiment of the invention is positioned this circuit board 1 on this heat-sink unit 2, and the first surface 12 of this circuit board 1 and the faying face 21 of this heat-sink unit 2 are combined, by an end opening of these heat-sink unit 2 these through holes 11 of sealing.Wherein, the better radiating fin that is chosen as of this heat-sink unit 2, its selection is made by the metal material of the high capacity of heat transmission of tool, such as aluminium, copper, silver or its alloy etc.This heat-sink unit 2 is formed with several fins 22 on another surface with respect to this faying face 21, increases whereby the heat exchange area between this heat-sink unit 2 and air, promotes its radiating efficiency.
Please refer to shown in Fig. 6, because having utilized the faying face 21 of this heat-sink unit 2, aforementioned second step S2 seals an end opening of these through holes 11, therefore the third step S3 of the associated methods of the radiating module of first embodiment of the invention inserts this brazing metal 3 in this through hole 11 via the untight end opening of this through hole 11, also corresponding this brazing metal 3 that applies on several contacts 14 of this circuit board 1 simultaneously, wherein this brazing metal better be chosen as have the high capacity of heat transmission scolder (such as: tin cream etc.).
Please refer to shown in Fig. 7, the 4th step S4 of the associated methods of the radiating module of first embodiment of the invention is arranged at this heater element 4 second surface 13 of this circuit board 1, and heat-conducting part 41 contrapositions that make this heater element 4 are covered in the other end opening of this through hole 11, whereby this brazing metal 3 is closed in this through hole 11.Now, several pins 42 contrapositions of this heater element 4 are incorporated on several contacts 14 of this circuit board 1.Again, the better metal material by the high capacity of heat transmission of tool of this heat-conducting part 41 forms, such as aluminium, copper, silver or its alloy etc., and the better aperture area that is greater than this through hole 11 of the contact area of this heat-conducting part 41, so as this heat-conducting part 41 completely contraposition cover this through hole 11.In addition, because the present embodiment is selected to using this LED light fixture and illustrated as execution mode, so this heater element 4 is better is chosen as a light-emitting diode, but the category of wish of the present invention protection is as limit, and this heater element 4 also can be other electronic components.
Please refer to shown in Fig. 8 to 10, before the 5th step S5 of associated methods of radiating module that carries out first embodiment of the invention, first carry out certain position program, it utilizes several first top 51 contrapositions of a localization tool 5 to press on several second tops 15 of this circuit board 1, so that this localization tool 5 can accurately be positioned the second surface 13 of this circuit board 1.And 5 pairs of these circuit boards 1 of this localization tool are bestowed an external force, what make that this circuit board 1 can be firm amplexiforms on the faying face 21 of this heat-sink unit 2.Then, carry out again the 5th step S5 of the present invention, by a surface adhering technical technique, (Surface Mount Technology, SMT, such as the brazing metal 3 in this through hole 11 of heating and melting and be coated on the brazing metal 3 on the contact 14 of this circuit board 1 reflow etc.).
In more detail, after this localization tool 5 faying face that presses on this heat-sink unit 2 21 that this circuit board 1 is firm, by a supply unit 6 (for example: conveyer belt) by this circuit board 1, heat-sink unit 2, brazing metal 3 and heater element 4 are sent into the interior heating of a reflow stove 7 together with this localization tool 5, this brazing metal 3 of heating and melting whereby, so that this brazing metal 3 is distinguished heat-conducting part 41 phase weldings firm and faying face 21 this heat-sink unit 2 and this heater element 4, this brazing metal 3 also makes on the second surface that is welded in this circuit board 1 13 that this heater element 4 is firm simultaneously, and this heater element 4 electrically conducts with the circuit formation being embedded in this circuit board 1.Whereby, the present invention can make this heater element 4 directly via this brazing metal 3, be connected with this heat-sink unit 2 in single surface adhering technical technique, and be positioned between this heat-sink unit 2 and heater element 4 this circuit board 1 is clamping, also reach the object that allows this heater element 4 be welded in this circuit board 1 and mutually to electrically conduct simultaneously.
In addition, the first top 51 of the localization tool 5 of the present embodiment and the second top 15 of this circuit board 1 are chosen as the male and female location structure of concavo-convex form, but not as limit, other forms of Sustain structure or mode also belong in protection category of the present invention.
Associated methods of the present invention is mainly by advance at these several through holes 11 of this circuit board 1 moulding, and this heater element 4 can directly be combined by the brazing metal 3 in this through hole 11 with this heat-sink unit 2, the heat energy that so this heater element 4 not only can produce it directly conducts on this heat-sink unit 2 via this brazing metal 3, more because heat-conducting part 41 of the present invention, brazing metal 3 and heat-sink unit 2 form by the metal material of the high capacity of heat transmission, rising along with these heater element 4 working temperatures like this, 41 of this heat-conducting parts can directly dispel the heat thermal energy transfer with heat exchange pattern by this brazing metal 3 to this heat-sink unit 2, reach whereby the object of cooling this heater element 4, this heater element 4 can be maintained under suitable working temperature, and then promote task performance and the useful life of this heater element 4.
In addition, because combination of the present invention can promote integral heat sink usefulness, so radiating module must additionally not assist heat conduction by setting up soaking plate, and then can omit the setting of soaking plate, therefore can effectively reduce the number of components, reach the object reducing production costs.
Again, because associated methods of the present invention only must can complete this circuit board 1 by this surface adhering technical technique of single, the assembling finder of heat-sink unit 2 and heater element 4, allow this circuit board 1 be positioned between this heat-sink unit 2 and heater element 4 by clamping, also allow this heater element 4 be incorporated into this circuit board 1 and form electrically conducts simultaneously, make the present invention must be not additionally in assembling by technique repeatedly, not fix respectively this circuit board 1 and this heat-sink unit 2, or this circuit board 1 and this heater element 4, and the present invention can also allow this heat-sink unit 2 and heater element 4 respectively on the firm first surface that is attached at this circuit board 1 12 and second surface 13, maintain good assembling reliability, the present invention can effectively simplify assembly program really whereby, and further reach the object that promotes overall package efficiency.
Please refer to shown in Figure 11 to 13, it discloses the associated methods of the radiating module of second embodiment of the invention, compared to the first embodiment, the second embodiment is pre-formed this at least one through hole 11 (first step S1) afterwards on this circuit board 1, select to implement aforementioned the 4th step S4, this heater element 4 is arranged to the second surface 13 of this circuit board 1, and heat-conducting part 41 contrapositions that make this heater element 4 are covered in an end opening of this through hole 11, several pins 42 of this heater element 4 also (as shown in figure 11) on the corresponding several contacts 14 that are welded in this circuit board 1 simultaneously.Then, carry out aforementioned third step S3, via the untight end opening of this through hole 11, this brazing metal 3 is inserted in this through hole 11 (as shown in figure 12).Again, carry out aforementioned second step S2, the faying face of this heat-sink unit 2 21 is amplexiformed on the first surface 12 of this circuit board 1, whereby this brazing metal 3 is closed in this through hole 11 (as shown in figure 13).Finally, carry out aforementioned the 5th step S5, by this localization tool 5, by the firm faying face that presses on this heat-sink unit 2 21 of this circuit board 1, and sent into the interior heating of this reflow stove 7 (as shown in Figures 8 to 10) by this supply unit 6, with this brazing metal 3 of melting, complete in conjunction with program.
The present invention can further adjust the enforcement order of the aforementioned second to the 4th step S2-S4 according to the member binding sequence demand of radiating module, make combination of the present invention be applied to being widely assembled of various radiating modules.
Please refer to shown in Figure 14 to 16, it discloses the associated methods of the radiating module of third embodiment of the invention, compared to the first embodiment, the finder of the 3rd embodiment is implemented in while carrying out aforementioned second step, wherein when the first surface 12 of this circuit board 1 amplexiforms the faying face 21 in this heat-sink unit 2, via several first location division 16 contrapositions of this circuit board 1, be incorporated into several second location divisions 23 of this heat-sink unit 2, what make that this circuit board 1 can be firm is incorporated on this heat-sink unit 2 and unlikely any skew, to carry out follow-up this brazing metal 3 of inserting, locate this heater element 4 and this brazing metal 3 is carried out to other integrating steps such as surface adhering technical technique.
Again, first location division 16 of the present embodiment and the second location division 23 are chosen as respectively the corresponding buckle structure of buckle slot and fastener, but its form of implementation is as limit, and other forms of location structure or mode also belong in protection category of the present invention.
Please refer to shown in Figure 17 and 18, it discloses the associated methods of the radiating module of fourth embodiment of the invention, compared to the 3rd embodiment, the first location division 16 and the second location division 23 of the 4th embodiment are chosen as respectively a screw, when the first surface 12 of this circuit board 1 amplexiforms the faying face 21 in this heat-sink unit 2, also make this first location division 16 and these the second location division 23 phase contrapositions simultaneously, and utilize several lock member 8 correspondences to be fixed in this first location division 16 and the second location division 23, what make that this circuit board 1 can be firm is incorporated on this heat-sink unit 2 and unlikely any skew.
Please refer to shown in Figure 19 to 21, it discloses the associated methods of the radiating module of fifth embodiment of the invention, compared to the first embodiment, the finder of the 5th embodiment is implemented in while carrying out aforementioned second step S2, wherein before this circuit board 1 correspondence is incorporated into this heat-sink unit 2, pre-prior to applying a viscose glue on the first surface 12 of this circuit board 1 or the faying face 21 of this heat-sink unit 2, the present embodiment selects the first surface 12 that this viscose glue is coated on to this circuit board 1 as execution mode explanation, so that follow-up, carry out aforementioned second step S2 while allowing first surface 12 correspondences of this circuit board 1 amplexiform the faying face 21 in this heat-sink unit 2, this viscose glue can form an adhesion coating T simultaneously between this circuit board 1 and heat-sink unit 2, what make that this circuit board 1 can be firm is incorporated on this heat-sink unit 2 and unlikely any skew, to carry out follow-up this brazing metal 3 of inserting, locate this heater element 4 and this brazing metal 3 is carried out to other integrating steps such as surface adhering technical technique.
Claims (18)
1. an associated methods for radiating module, is characterized in that, comprises step:
On a circuit board, be pre-formed at least one through hole, and make this through hole run through relative two surfaces of this circuit board;
This circuit board is positioned on a heat-sink unit, a surface of this circuit board and a faying face of this heat-sink unit are joined, make the faying face contraposition of this heat-sink unit be covered in one end of this through hole;
Insert a kind of brazing metal in this through hole;
At least one heater element is fixed on to another surface of this circuit board, and the contraposition simultaneously of this heater element is covered in the other end of this through hole; And
Brazing metal in this through hole of heating and melting, makes this brazing metal be fused to respectively this heater element and heat-sink unit;
Wherein: when this circuit board is positioned the faying face of this heat-sink unit, by several fastener contrapositions of heat-sink unit, be incorporated into several buckle slots of this circuit board, make the faying face that is positioned this heat-sink unit that this circuit board can be firm.
2. the associated methods of radiating module as claimed in claim 1, it is characterized in that: before the brazing metal in this through hole of heating and melting, utilize a localization tool to press on the surface of this circuit board, and this localization tool is bestowed external force to this circuit board, make the faying face that is positioned this heat-sink unit that this circuit board is firm.
3. the associated methods of radiating module as claimed in claim 2, is characterized in that: this localization tool utilizes several the first top contrapositions to press on several second tops of this circuit board, makes this localization tool can accurately be positioned the surface of this circuit board.
4. the associated methods of radiating module as claimed in claim 1, it is characterized in that: be positioned the faying face of this heat-sink unit at this circuit board before, in advance prior to applying viscose glue on the surface of this circuit board or the faying face of this heat-sink unit, while making this circuit board amplexiform the faying face in this heat-sink unit, between this circuit board and heat-sink unit, can form an adhesion coating, make the faying face that is positioned this heat-sink unit that this circuit board can be firm.
5. the associated methods of radiating module as claimed in claim 1, is characterized in that: when this heater element is fixed on another surface of this circuit board, a heat-conducting part contraposition of this heater element is covered in the other end opening of this through hole.
6. the associated methods of radiating module as claimed in claim 5, it is characterized in that: this circuit board, heat-sink unit, brazing metal and heater element are sent into heating in a reflow stove, with this brazing metal of heating and melting, make the heat-conducting part phase welding of this brazing metal and faying face and this heater element of this heat-sink unit.
7. the associated methods of radiating module as claimed in claim 1, is characterized in that: before fixing this heater element, the end opening not sealed by this heat-sink unit via this through hole is inserted this brazing metal in this through hole.
8. the associated methods of radiating module as claimed in claim 1, is characterized in that: in punching mode, directly on this circuit board, form this through hole.
9. the associated methods of radiating module as claimed in claim 1, is characterized in that: this brazing metal is tin cream.
10. an associated methods for radiating module, is characterized in that, comprises step:
On a circuit board, be pre-formed at least one through hole, and make this through hole run through relative two surfaces of this circuit board;
At least one heater element is fixed on to a surface of this circuit board, and contraposition covers one end of this through hole;
Insert a kind of brazing metal in this through hole;
A heat-sink unit is fixed on to another surface of this circuit board, and a faying face contraposition of this heat-sink unit covers the other end of this through hole; And
Brazing metal in this through hole of heating and melting, makes this brazing metal be fused to respectively this heater element and heat-sink unit;
Wherein: when this heat-sink unit is attached at another when surface of this circuit board, by several fastener contrapositions of heat-sink unit, be incorporated into several buckle slots of this circuit board, make another surface that is positioned this circuit board that this heat-sink unit can be firm.
The associated methods of 11. radiating modules as claimed in claim 10, it is characterized in that: before the brazing metal in this through hole of heating and melting, first utilize a localization tool to press on the surface of this circuit board, and this localization tool is bestowed external force to this circuit board, make the faying face that is positioned this heat-sink unit that this circuit board is firm.
The associated methods of 12. radiating modules as claimed in claim 10, is characterized in that: this localization tool utilizes several the first top contrapositions to press on several second tops of this circuit board, makes this localization tool accurately be positioned the surface of this circuit board.
The associated methods of 13. radiating modules as claimed in claim 10, it is characterized in that: be attached at another surface of this circuit board at this heat-sink unit before, in advance prior to applying viscose glue on the surface of this circuit board or the faying face of this heat-sink unit, while making this circuit board amplexiform the faying face in this heat-sink unit, between this circuit board and heat-sink unit, can form an adhesion coating, make the faying face that is positioned this heat-sink unit that this circuit board can be firm.
The associated methods of 14. radiating modules as claimed in claim 10, is characterized in that: when this heater element is fixed on this circuit board surperficial, a heat-conducting part contraposition of this heater element is covered in an end opening of this through hole.
The associated methods of 15. radiating modules as claimed in claim 14, it is characterized in that: this circuit board, heat-sink unit, brazing metal and heater element are sent into heating in a reflow stove, with this brazing metal of heating and melting, make the heat-conducting part phase welding of this brazing metal and faying face and this heater element of this heat-sink unit.
The associated methods of 16. radiating modules as claimed in claim 10, is characterized in that: before fixing this heat-sink unit, the end opening not sealed by this heater element via this through hole is inserted this brazing metal in this through hole.
The associated methods of 17. radiating modules as claimed in claim 10, is characterized in that: in punching mode, directly on this circuit board, form this through hole.
The associated methods of 18. radiating modules as claimed in claim 10, is characterized in that: this brazing metal is tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010185853.9A CN102264213B (en) | 2010-05-28 | 2010-05-28 | Method for combining thermal module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010185853.9A CN102264213B (en) | 2010-05-28 | 2010-05-28 | Method for combining thermal module |
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| CN102264213A CN102264213A (en) | 2011-11-30 |
| CN102264213B true CN102264213B (en) | 2014-04-02 |
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| CN102466206A (en) * | 2010-11-15 | 2012-05-23 | 黄家兴 | Manufacture procedure of LED (light emitting diode) lamp module |
| CN106535481A (en) * | 2016-12-08 | 2017-03-22 | 苏州长风航空电子有限公司 | Method for pasting heat dissipating board |
| CN106535468A (en) * | 2016-12-13 | 2017-03-22 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
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| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
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| CN1375867A (en) * | 2001-03-16 | 2002-10-23 | Lg电子有限公司 | Radiating structure of integrated circuit (IC) |
| CN1489432A (en) * | 2002-08-23 | 2004-04-14 | 阿尔卑斯电气株式会社 | Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element |
| US6892449B1 (en) * | 2002-10-09 | 2005-05-17 | Cypress Semiconductor Corp. | Method of manufacturing electro-optical devices |
| JP2009088008A (en) * | 2007-09-27 | 2009-04-23 | Mitsubishi Electric Corp | Tool and method for manufacturing semiconductor device |
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| CN102264213A (en) | 2011-11-30 |
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Address after: The new Taiwan China Ya Lu Kaohsiung City No. 30 Lane 296 Patentee after: Jianzhun Electric Motor Industry Co., Ltd. Address before: Are China Taiwan Lingya Kaohsiung No. 120 12 floor 1 Patentee before: Jianzhun Electric Motor Industry Co., Ltd. |
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