CN117641700A - Circuit board with heat radiation structure and manufacturing method thereof - Google Patents

Abstract

A circuit board with a heat dissipation structure comprises a multi-layer circuit substrate and the heat dissipation structure. A window is formed inwards from a first side of the multilayer circuit substrate along the thickness direction, and the multilayer circuit substrate comprises a heat dissipation area which is arranged at one end, which is opposite to the first side, of the window and is exposed. The heat dissipation structure is located in the window and is separated from the side wall of the window through a gap, the heat dissipation structure comprises a glue part, heat dissipation fins and a heat conduction column, the glue part and the heat dissipation fins are sequentially stacked in the heat dissipation area, and the heat conduction column penetrates through the glue part and is connected with the heat dissipation fins and the heat dissipation area. The width of the heat sink is larger than the width of the adjacent glue portions in a direction perpendicular to the thickness direction. The application also discloses a manufacturing method of the circuit board with the heat dissipation structure.

Description

Circuit board with heat radiation structure and manufacturing method thereof

Technical Field

The present disclosure relates to circuit boards, and particularly to a circuit board with a heat dissipation structure and a method for manufacturing the same.

Background

With the development of 5G technology, electronic products are developed to be highly integrated and miniaturized, so that the packaging density of electronic components is higher and higher, and the power consumption is higher and higher. Therefore, the heat dissipation requirement of the circuit board in the electronic product is also higher and higher. The heat dissipation performance of the current circuit board cannot meet the requirements.

Disclosure of Invention

In view of the above, the present invention provides a circuit board with a heat dissipation structure, which has a good heat dissipation effect.

The manufacturing method of the circuit board with the heat dissipation structure is good in heat dissipation effect and simple in process.

The utility model provides a circuit board with heat radiation structure, includes multilayer circuit substrate and heat radiation structure, follows thickness direction from the inwards opening a window of multilayer circuit substrate's first side, multilayer circuit substrate is including corresponding the one end setting that the opening deviates from first side just exposes the heat dissipation area, heat radiation structure is located in the opening window and with the lateral wall of opening separates through the clearance, heat radiation structure includes glue portion, fin and heat conduction post, glue portion with the fin stacks gradually in the heat dissipation area, the heat conduction post passes glue portion and connect the fin with the heat dissipation area is in along the direction of perpendicular to thickness direction, the width of fin is greater than adjacent glue portion's width.

As an aspect of the present application, the number of the glue portions and the number of the heat dissipation fins are respectively plural, and the glue portions and the heat dissipation fins are alternately arranged in the thickness direction; the heat conduction column penetrates through the plurality of glue parts and is connected with the heat dissipation area and each heat dissipation fin; the width of each glue part is smaller than the width of the radiating fin adjacent to the glue part and positioned between the glue part and the radiating area in the direction perpendicular to the thickness direction.

As an aspect of the present application, a width of each of the heat sinks is 200 μm or more in a direction perpendicular to the thickness direction.

As an aspect of the application, the heat-conducting column includes a plurality of heat-conducting portions, each of which passes through one of the glue portions and connects two adjacent heat-dissipating fins or connects the heat-dissipating fins with the heat-dissipating area.

As an aspect of the application, the heat dissipation structure further includes an insulating layer, and the insulating layer is disposed between the heat dissipation fin and the glue portion.

As an aspect of the present application, a minimum distance between the heat dissipation structure and the side wall of the window is greater than or equal to 100 micrometers in a direction perpendicular to the thickness direction.

As an aspect of the present application, the windowed structure is provided with a plurality of spaced heat dissipation structures.

As an aspect of the present application, a minimum distance between any adjacent two of the heat dissipation structures in a direction perpendicular to the thickness direction is greater than or equal to 100 micrometers.

A manufacturing method of a circuit board with a heat dissipation structure comprises the following steps:

providing a circuit substrate, wherein the circuit substrate comprises a first insulating layer and a first circuit layer which are laminated along the thickness direction, and the circuit substrate is divided into a heat dissipation area and a circuit area connected with the heat dissipation area;

bonding a first single-sided board to one side, away from the first circuit layer, of the first insulating layer through a first insulating adhesive layer, wherein the first insulating adhesive layer comprises a first adhesive part combined with the heat dissipation area and a second adhesive part combined with the circuit area, and the first adhesive part and the second adhesive part are separated through a first gap;

performing circuit manufacture on the first single panel to form a second circuit layer and a first heat conduction column, so that the first single panel correspondingly forms a first circuit board, wherein the second circuit layer comprises a first wiring area and first radiating fins which are separated from the first wiring area, the first wiring area corresponds to the circuit area, and the first radiating fins correspond to the radiating area and cover the first glue part; the width of the first radiating fin is larger than the width of the first glue part in the direction perpendicular to the thickness direction; the first heat conduction column penetrates through the first glue part to be connected with the first radiating fin and the first circuit layer; and

and removing the part of the first circuit board corresponding to the heat dissipation area and not covered by the first heat dissipation sheet.

As an aspect of the present application, before the step of removing the portion of the first circuit board corresponding to the heat dissipation area and not covered by the first heat sink, the method further includes:

bonding a second single-sided board to the first circuit board through a second insulating adhesive layer, wherein the second insulating adhesive layer comprises a third adhesive part combined with the first radiating fin and a fourth adhesive part combined with the first wiring area, and the third adhesive part and the fourth adhesive part are separated through a second gap;

carrying out circuit manufacture on the second single panel to form a third circuit layer and a second heat conduction column, so that the second single panel correspondingly forms a second circuit board, wherein the third circuit layer comprises a second wiring area and second radiating fins which are separated from the second wiring area, the second wiring area corresponds to the circuit area, the second radiating fins correspond to the radiating area and cover the third glue part, and the width of the second radiating fins and the width of the first radiating fins are respectively larger than the width of the third glue part in the direction perpendicular to the thickness direction; the second heat conduction column penetrates through the third glue to be connected with the second radiating fin and the first radiating fin;

and removing the part of the second circuit board corresponding to the heat dissipation area and not covered by the second heat dissipation sheet.

According to the circuit board with the heat radiation structure and the manufacturing method thereof, the heat radiation structure corresponding to the heat radiation area is surrounded by the gap, so that convection of air in the gap is facilitated, and the heat radiation efficiency of the circuit board is improved. And in the direction vertical to the thickness direction, the width of the radiating fin is larger than that of the adjacent glue part, so that the air convection is further increased, and the radiating efficiency of the circuit board is further improved. In addition, the manufacturing method of the circuit board with the heat dissipation structure is simple in flow.

Drawings

Fig. 1 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of a first insulating layer and a first single panel disposed on the circuit substrate shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of the first single-sided board shown in fig. 2 correspondingly forming a first circuit board.

Fig. 4 is a schematic cross-sectional view of the first circuit board shown in fig. 3 with a second insulating adhesive layer and a second single panel.

Fig. 5 is a schematic cross-sectional view of the second single-sided board shown in fig. 4 correspondingly forming a second circuit board.

Fig. 6 is a schematic cross-sectional view of the circuit board and the second circuit board shown in fig. 5, wherein a protective film is provided on the circuit board and the second circuit board.

Fig. 7 is a schematic cross-sectional view of a circuit board with a heat dissipation structure according to an embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of a circuit board with a heat dissipation structure according to an embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of a circuit board with a heat dissipation structure according to another embodiment of the present application.

Description of the main reference signs

Circuit board 20

Thickness direction X

First insulating layer 21

First circuit layer 23

Heat dissipation areas 201, 103

Line area 203

First single panel 30

First insulating adhesive layer 35

First adhesive portion 351

Second glue portion 353

First gap 355

First metal foil 33

Second insulating layer 31

Second circuit layer 330

Heat conductive posts 36, 46, 95

First circuit board 30a

First wiring region 331

First heat sink 333

Second single panel 40

Second insulating adhesive layer 45

Third glue portion 451

Fourth glue portion 453

Second gap 455

Second metal foil 43

Third insulating layer 41

Third circuit layer 430

Second circuit board 40a

Second wiring region 431

Second heat sink 433

Protective film 50

Opening 51

Circuit board 100 with heat dissipation structure

Multilayer circuit board 10

Heat dissipation structure 90

First side 10a

Windowing 101

Gap 105

Glue portion 91

Radiating fin 93

Insulating layer 96

First wiring layer 11

Second wiring layer 13

Heat conduction portion 951

Protective film 80

Second side 10b

Electronic component 82

Reinforcing sheet 83

The invention will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.

Referring to fig. 1 to 7, an embodiment of the present application provides a method for manufacturing a circuit board with a heat dissipation structure, which includes the following steps:

in step S1, referring to fig. 1, a circuit substrate 20 is provided, which includes a first insulating layer 21 and a first circuit layer 23 stacked along a thickness direction X. The circuit substrate 20 is divided into a heat dissipation area 201 and a circuit area 203 connected to the heat dissipation area 201.

In this embodiment, the circuit board 20 is a single-sided circuit board, that is, is composed of the first insulating layer 21 and the first circuit layer 23. In some embodiments, the circuit substrate 20 may be a multi-layer circuit board, that is, may further include at least one circuit layer.

In step S2, referring to fig. 2, a first single panel 30 is bonded to a side of the first insulating layer 21 facing away from the first circuit layer 23 through a first insulating adhesive layer 35. The first insulating adhesive layer 35 includes a first adhesive portion 351 combined with the heat dissipation area 201 and a second adhesive portion 353 combined with the circuit area 203, and the first adhesive portion 351 and the second adhesive portion 353 are separated by a first gap 355.

The first single panel 30 includes a first metal foil 33, and the first metal foil 33 is combined with the first insulating adhesive layer 35. The first single panel 30 may further include a second insulating layer 31 laminated with the first metal foil 33, the second insulating layer 31 being located between the first metal foil 33 and the first insulating adhesive layer 35.

Preferably, the first insulating adhesive layer 35 may be an insulating heat-conducting adhesive.

The width of the first adhesive 351 is preferably 200 μm or more in a direction perpendicular to the thickness direction, so that the first adhesive 351 covers the heat conductive pillars 36 when the heat conductive pillars 36 are formed later (refer to fig. 3), thereby reducing the risk of the material forming the heat conductive pillars 36 entering the first gaps 355.

The first adhesive 351 may have any shape in a plan view along the thickness direction X, for example, but not limited to, a regular shape such as a circle, a polygon, an ellipse, etc., and may have other irregular shapes.

In step S3, referring to fig. 2 and 3, a circuit is fabricated on the first single panel 30 to form the second circuit layer 330 and the heat conductive pillars 36, so that the first single panel 30 correspondingly forms the first circuit board 30a. The second circuit layer 330 includes a first wiring area 331 and a first heat sink 333 spaced apart from the first wiring area 331, the first wiring area 331 corresponds to the circuit area 203, and the first heat sink 333 corresponds to the heat sink area 201 and covers the first adhesive portion 351. The width of the first heat sink 333 is larger than the width of the first adhesive portion 351 in a direction perpendicular to the thickness direction. The heat conductive post 36 passes through the first adhesive 351 to connect the first heat sink 333 and the first circuit layer 23.

In the direction perpendicular to the thickness direction, the width of the first heat dissipating fin 333 is preferably greater than or equal to 200 micrometers, so that the first heat dissipating fin 333 has a certain heat dissipating area, which is beneficial to improving heat dissipating efficiency.

The minimum distance between the first heat sink 333 and the first wiring area 331 in the direction perpendicular to the thickness direction is preferably greater than or equal to 100 micrometers.

The first heat sink 333 may have any shape in a plan view along the thickness direction X, for example, but not limited to, a regular shape such as a circle, a polygon, an ellipse, etc., and may have other irregular shapes.

In step S4, referring to fig. 4, a second single panel 40 is bonded to the first circuit board 30a through a second insulating adhesive layer 45. Wherein the second insulating adhesive layer 45 includes a third adhesive portion 451 bonded to the first heat sink 333 and a fourth adhesive portion 453 bonded to the first wiring region 331, and the third adhesive portion 451 is separated from the fourth adhesive portion 453 by a second gap 455.

The second single panel 40 includes a second metal foil 43, and the second metal foil 43 is combined with the second insulating adhesive layer 45. The second single panel 40 may further include a third insulating layer 41 laminated with the second metal foil 43, the third insulating layer 41 being located between the second metal foil 43 and the second insulating adhesive layer 45.

Preferably, the second insulating adhesive layer 45 may be an insulating heat-conducting adhesive.

The width of the third glue portion 451 in the direction perpendicular to the thickness direction X is preferably 200 μm or more, so that the third glue portion 451 covers the heat conductive pillars 46 when the heat conductive pillars 46 are formed later (see fig. 5), thereby reducing the risk of the material forming the heat conductive pillars 46 entering the second gap 455.

The third glue portion 451 may have any shape in a plan view along the thickness direction X, for example, but not limited to, a regular shape such as a circle, a polygon, an ellipse, etc., and may have other irregular shapes. The shape of the third adhesive part 451 in the plan view along the thickness direction X may be the same as or different from the shape of the first adhesive part 351 in the plan view along the thickness direction X.

In step S5, referring to fig. 5, a circuit is formed on the second single panel 40 to form a third circuit layer 430 and a heat conductive post 46, so that the second single panel 40 correspondingly forms a second circuit board 40a. The third circuit layer 430 includes a second wiring region 431 and a second heat sink 433 spaced apart from the second wiring region 431, the second wiring region 431 corresponds to the circuit region 203, and the second heat sink 433 corresponds to the heat sink 201 and covers the third adhesive 451. The width of the second heat sink 433 and the width of the first heat sink 333 are larger than the width of the third glue portion 451, respectively, in a direction perpendicular to the thickness direction X. The heat conductive post 46 passes through the third glue portion 451 to connect the second heat sink 433 and the first heat sink 333.

In the direction perpendicular to the thickness direction X, the width of the second heat dissipation fin 433 is preferably greater than or equal to 200 micrometers, so that the second heat dissipation fin 433 reaches a certain heat dissipation area, which is beneficial to improving heat dissipation efficiency.

The minimum distance between the second heat sink 433 and the second wiring region 431 in the direction perpendicular to the thickness direction X is preferably greater than or equal to 100 μm.

The width of the second heat sink 433 may be the same as or different from the width of the first heat sink 333 in the same direction perpendicular to the thickness direction X, and the width of the first adhesive portion 351 may be the same as or different from the width of the third adhesive portion 451.

In the thickness direction X, the thickness of the second heat sink 433 may be the same as or different from the thickness of the first heat sink 333, and the thickness of the first adhesive 351 may be the same as or different from the thickness of the third adhesive 451.

The second heat sink 433 may have any shape in the top view along the thickness direction X, for example, but not limited to, a regular shape such as a circle, a polygon, an ellipse, etc., and may have other irregular shapes. The shape of the top view of the second heat sink 433 along the thickness direction X may be the same as or different from the shape of the top view of the first heat sink 333 along the thickness direction X.

In step S6, referring to fig. 6, a protective film 50 is disposed on a side of the circuit substrate 20 facing away from the second circuit layer 330 and a side of the second circuit board 40a facing away from the circuit substrate 20, and the second heat sink 433 and the gap between the second heat sink 433 and the second wiring area 431 are exposed from the opening 51 of the protective film 50.

In step S7, referring to fig. 6 and 7, a portion of the second circuit board 40a corresponding to the heat dissipation area 201 and not covered by the second heat sink 333 and a portion of the first circuit board 30a corresponding to the heat dissipation area 201 and not covered by the first heat sink 333 are removed, so as to obtain a heat dissipation structure corresponding to the heat dissipation area 201 and a wiring area corresponding to the wiring area 203, where the heat dissipation structure is separated from the wiring area by a gap. The heat dissipation structure includes the first heat sink 333, the second heat sink 433, the heat conduction column 36, and the heat conduction column 46.

In some embodiments, the surfaces of the second heat sink 433 and the first heat sink 333 exposed from the opening 51 may be further treated to form a metal protection layer (not shown), such as a gold-plating layer, to prevent oxidation of the second heat sink 433 and the first heat sink 333.

In some embodiments, the step S6 may be omitted.

In some embodiments, the layering may also continue before step S6 described above, i.e., step S4 and step S5 are repeated. Correspondingly, in step S7, the part of the circuit board formed by the build-up layer corresponding to the heat dissipation area 201 and not covered by the heat dissipation fins is further removed, and the number of heat dissipation fins and the number of heat conduction columns are correspondingly increased by the heat dissipation structure.

In some embodiments, the above step S4 and step S5 may be omitted, that is, the fins in the finally formed heat dissipating structure have only the first fins 333.

Referring to fig. 8, an embodiment of the present application further provides a circuit board 100 with a heat dissipation structure, including a multi-layer circuit substrate 10 and a heat dissipation structure 90. The multilayer circuit board 10 is provided with a window 101 from a first side 10a of the multilayer circuit board 10 in a thickness direction X to expose a heat dissipation area 103 of the laminated circuit board 10. The heat dissipation structure 90 is located in the window 101 and is spaced apart from the side wall of the window 101 by a gap 105, the heat dissipation structure 90 includes a glue portion 91 and a heat dissipation fin 93, and the glue portion 91 and the heat dissipation fin 93 are sequentially stacked in the heat dissipation area 103. The circuit board 100 with a heat dissipation structure further includes a heat conduction post 95, and the heat conduction post 95 passes through the glue portion 91 and connects the heat dissipation fin 93 and the heat dissipation area 103. The width of the heat sink 93 is larger than the width of the adjacent glue portion 91 in the direction perpendicular to the thickness direction X.

In the above circuit board, the gap 105 is formed between the heat dissipation structure 90 and the side wall of the window 101, so that air convection is increased, thereby being beneficial to improving heat dissipation efficiency of the circuit board. In the direction perpendicular to the thickness direction X, the width of the heat dissipation fin 93 is greater than the width of the adjacent glue portion 91, so that air convection is further increased, thereby further facilitating the improvement of heat dissipation efficiency of the circuit board.

The heat dissipation structure 90 may further include an insulating layer 96, where the insulating layer 96 is disposed on a side of the heat dissipation sheet 93 facing the heat dissipation area 103 and located between the heat dissipation sheet 93 and the glue portion 91. The insulating layer 96 may have a shape and size corresponding to those of the heat sink 93, respectively. The heat conductive posts 95 further penetrate through the insulating layer 96 to be connected with the heat sink 93.

The multi-layered circuit substrate 10 may be a flexible circuit substrate, a rigid circuit substrate, or a soft and hard combined circuit substrate.

In some embodiments, the multilayer circuit substrate 10 includes a first wiring layer 11 and a second wiring layer 13 stacked and spaced apart in the thickness direction X. The window 101 penetrates through the first wiring layer 11 and corresponds to a partial region of the second wiring layer 13, that is, the window 101 does not penetrate through the second wiring layer 13. The heat sink 93 is flush with the first wiring layer 11.

In some embodiments, the number of the glue portions 91 and the number of the heat dissipation fins 93 are plural, respectively, and the glue portions 91 and the heat dissipation fins 93 are alternately arranged in the thickness direction X. The heat-conducting posts 95 penetrate through the plurality of glue portions 91 and connect the heat dissipation areas 103 with each of the heat dissipation fins 93. When the heat dissipation structure 90 has a plurality of heat dissipation fins 93, in the direction perpendicular to the thickness direction, the width of the heat dissipation fins 93 is greater than the width of the adjacent glue portion 91, so that the area of the adjacent heat dissipation fins 93 is exposed more, thereby increasing the heat dissipation area of the heat dissipation structure 90, and further being beneficial to improving the heat dissipation efficiency of the circuit board. Specifically, the heat of the heat dissipation area 103 is transferred to each heat dissipation plate 93 through the heat conduction columns 95, and each heat dissipation plate 93 rapidly spreads the heat to the external environment through the heat dissipation plate 93 toward the end surface of the side wall of the window 101 and the exposed area of the glue portion 91.

The number of the insulating layers 96 may be plural, and each insulating layer 96 is located between the adjacent heat sink 93 and the glue portion 91. The shape and size of each insulating layer 96 are identical to those of the adjacent heat sink 93, respectively.

The number of the first wiring layers 11 may be plural, and the plural first wiring layers 11 may be stacked and spaced apart in the thickness direction X. The window 101 penetrates each of the first wiring layers 11 in the thickness direction X. Each of the heat sinks 93 may be flush with one of the driller's wiring layers 11.

The number of the second wiring layers 13 may be plural, and plural and the second wiring layers 13 may be stacked and spaced apart in the thickness direction X.

In the same direction, the width of each heat dissipation fin 93 is greater than the width of two adjacent glue portions 91, or the width of each heat dissipation fin 93 is greater than the width of each glue portion 91 on one side of the heat dissipation fin 93 facing away from the heat dissipation area 103, so as to increase the contact area between the heat dissipation fin 93 and air and improve the heat dissipation efficiency.

In the same direction, the widths of any two of the heat dissipation fins 93 may be the same or different, and the widths of any two of the glue portions 91 may be the same or different. In the present embodiment, as shown in fig. 8, the number of the glue portions 91 is two, and the widths of the two glue portions 91 are the same in the same direction; the number of the heat dissipation fins 93 is two, and the widths of the two heat dissipation fins 93 are the same in the same direction.

The width of each heat sink 93 is preferably greater than or equal to 200 μm in the direction perpendicular to the thickness direction, so that the heat sink 93 has a certain heat dissipation area, which is advantageous for the heat dissipation structure 90 to have a good effect.

The width of each of the glue portions 91 is preferably 200 μm or more in the direction perpendicular to the thickness direction so that the heat conductive pillars 95 can be covered by each of the glue portions 91 when forming the heat conductive pillars 95, thereby reducing the risk of the material forming the heat conductive pillars 95 entering the gaps 105.

In the thickness direction X, the thicknesses of any two of the heat dissipation fins 93 may be the same or different, and the thicknesses of any two of the glue portions 91 may be the same or different.

Each of the heat sinks 93 may have any shape in a plan view along the thickness direction X, such as, but not limited to, a regular shape such as a circle, a polygon, an ellipse, etc., and may have other irregular shapes. The shape of the top view of any two of the heat dissipation fins 93 in the thickness direction X may be the same or different.

Each glue portion 91 may have any shape in a plan view along the thickness direction X, for example, but not limited to, a regular shape such as a circle, a polygon, an ellipse, etc., and may have other irregular shapes. The shape of the top view of any two of the glue portions 91 in the thickness direction X may be the same or different. The shape of the top view of any one of the glue portions 91 in the thickness direction X may be the same as or different from the shape of the top view of any one of the heat dissipation fins 93 in the thickness direction X.

The minimum distance between the heat dissipation structure 90 and the side wall of the window 101 in the direction perpendicular to the thickness direction is preferably greater than or equal to 100 micrometers.

In some embodiments, referring to fig. 9, a plurality of the heat dissipation structures 90 may be disposed in the window 101 at intervals. Wherein a minimum distance between any adjacent two of the heat dissipation structures 90 in a direction perpendicular to the thickness direction is preferably 100 μm or more.

In some embodiments, referring to fig. 9, the heat-conducting post 95 may include a plurality of heat-conducting portions 951, where each heat-conducting portion 951 passes through one of the glue portions 91 and connects two adjacent heat dissipation fins 93 or connects the heat dissipation fins 93 and the heat dissipation area 103.

The circuit board 100 having a heat dissipation structure may further include a protective film 80, the protective film 80 covering both sides of the multilayer circuit substrate 10 spaced apart in the thickness direction X, and the window 101 being exposed from the protective film 80.

The multilayer circuit substrate 10 includes a second side 10b opposite the first side 10 a. The circuit board 100 with a heat dissipation structure may further include an electronic component 82 connected to the multilayer circuit substrate 10, where the electronic component 82 is disposed on the second side 10b of the multilayer circuit substrate 10 and corresponds to the heat dissipation area 103. Preferably, the electronic component 82 is disposed corresponding to the heat dissipating structure 90, so that heat generated by the electronic component 82 is advantageously transferred to the heat dissipating structure 90 through the heat dissipating area 103, and is rapidly diffused to the outside through the heat dissipating structure 90. The electronic component 82 may be, but is not limited to, a chip.

The circuit board 100 with a heat dissipation structure may further include a reinforcing sheet 83, where the reinforcing sheet 83 is disposed on the first side 10a of the multilayer circuit substrate 10 and corresponds to the electronic component 82, so as to increase the strength of the multilayer circuit substrate 10, so as to facilitate the installation of the electronic component 82. The window 101 is exposed from the reinforcing sheet 83, so that the heat dissipating structure 90 is communicated with the outside, thereby facilitating rapid dissipation of heat on the heat dissipating structure 90, and facilitating rapid reduction of the temperature of the circuit board 100. The reinforcing sheet 83 may be, but is not limited to, a metal sheet, an alloy sheet, a hard plastic sheet, or the like, such as a steel sheet.

According to the circuit board with the heat radiation structure and the manufacturing method thereof, the heat radiation structure corresponding to the heat radiation area is surrounded by the gap, so that convection of air in the gap is facilitated, and the heat radiation efficiency of the circuit board is improved. And in the direction vertical to the thickness direction, the width of the radiating fin is larger than that of the adjacent glue part, so that the air convection is further increased, and the radiating efficiency of the circuit board is further improved. In addition, the manufacturing method of the circuit board with the heat dissipation structure is simple in flow.

The present invention is not limited to the above-mentioned embodiments, but is capable of other and obvious modifications and equivalents of the above-mentioned embodiments, which will be apparent to those skilled in the art from consideration of the present invention without departing from the scope of the present invention.

Claims (10)

1. The utility model provides a circuit board with heat radiation structure, includes multilayer circuit substrate and heat radiation structure, its characterized in that follows the thickness direction from the inward window of seting up of first side of multilayer circuit substrate, multilayer circuit substrate is including corresponding the window deviates from the one end setting of first side and the radiating area that exposes, heat radiation structure is located in the window and with the lateral wall of windowing separates through the clearance, heat radiation structure includes glue portion, fin and heat conduction post, glue portion with the fin stacks gradually in the radiating area, the heat conduction post passes glue portion and connect the fin with the radiating area is in along being perpendicular to in the direction of thickness direction, the width of fin is greater than adjacent glue portion's width.

2. The circuit board with a heat dissipation structure as recited in claim 1, wherein the number of the glue portions and the number of the heat dissipation fins are plural, respectively, and the glue portions and the heat dissipation fins are alternately arranged in the thickness direction; the heat conduction column penetrates through the plurality of glue parts and is connected with the heat dissipation area and each heat dissipation fin; the width of each glue part is smaller than the width of the radiating fin adjacent to the glue part and positioned between the glue part and the radiating area in the direction perpendicular to the thickness direction.

3. The circuit board with a heat dissipating structure of claim 2, wherein the width of each of said heat sinks is 200 μm or more in a direction perpendicular to said thickness direction.

4. The circuit board with heat dissipation structure as defined in claim 2, wherein the heat conduction posts comprise a plurality of heat conduction parts, each of the heat conduction parts penetrates through one of the glue parts and connects two adjacent heat dissipation fins or connects the heat dissipation fins with the heat dissipation area.

5. The circuit board with heat dissipation structure as recited in claim 1, further comprising an insulating layer disposed between the heat sink and the glue portion.

6. The circuit board with a heat dissipating structure of claim 1, wherein a minimum distance between the heat dissipating structure and the windowed side wall in a direction perpendicular to the thickness direction is greater than or equal to 100 micrometers.

7. The circuit board with heat dissipation structure as recited in any one of claims 1-6, wherein a plurality of spaced apart heat dissipation structures are provided within the fenestration.

8. The circuit board with heat dissipating structure of claim 7, wherein a minimum distance between any adjacent two of said heat dissipating structures in a direction perpendicular to said thickness direction is greater than or equal to 100 micrometers.

9. A manufacturing method of a circuit board with a heat dissipation structure comprises the following steps:

providing a circuit substrate, wherein the circuit substrate comprises a first insulating layer and a first circuit layer which are laminated along the thickness direction, and the circuit substrate is divided into a heat dissipation area and a circuit area connected with the heat dissipation area;

bonding a first single-sided board to one side, away from the first circuit layer, of the first insulating layer through a first insulating adhesive layer, wherein the first insulating adhesive layer comprises a first adhesive part combined with the heat dissipation area and a second adhesive part combined with the circuit area, and the first adhesive part and the second adhesive part are separated through a first gap;

performing circuit manufacture on the first single panel to form a second circuit layer and a first heat conduction column, so that the first single panel correspondingly forms a first circuit board, wherein the second circuit layer comprises a first wiring area and first radiating fins which are separated from the first wiring area, the first wiring area corresponds to the circuit area, and the first radiating fins correspond to the radiating area and cover the first glue part; the width of the first radiating fin is larger than the width of the first glue part in the direction perpendicular to the thickness direction; the first heat conduction column penetrates through the first glue part to be connected with the first radiating fin and the first circuit layer; and

and removing the part of the first circuit board corresponding to the heat dissipation area and not covered by the first heat dissipation sheet.

10. The method of manufacturing a circuit board with a heat dissipation structure as defined in claim 9, further comprising, before the step of removing a portion of the first circuit board corresponding to the heat dissipation area and not covered by the first heat sink:

bonding a second single-sided board to the first circuit board through a second insulating adhesive layer, wherein the second insulating adhesive layer comprises a third adhesive part combined with the first radiating fin and a fourth adhesive part combined with the first wiring area, and the third adhesive part and the fourth adhesive part are separated through a second gap;

carrying out circuit manufacture on the second single panel to form a third circuit layer and a second heat conduction column, so that the second single panel correspondingly forms a second circuit board, wherein the third circuit layer comprises a second wiring area and second radiating fins which are separated from the second wiring area, the second wiring area corresponds to the circuit area, the second radiating fins correspond to the radiating area and cover the third glue part, and the width of the second radiating fins and the width of the first radiating fins are respectively larger than the width of the third glue part in the direction perpendicular to the thickness direction; the second heat conduction column penetrates through the third glue to be connected with the second radiating fin and the first radiating fin;

and removing the part of the second circuit board corresponding to the heat dissipation area and not covered by the second heat dissipation sheet.