CN113066397B - LED display module assembly stable in structure, roughness are good - Google Patents
LED display module assembly stable in structure, roughness are good Download PDFInfo
- Publication number
- CN113066397B CN113066397B CN202110405683.9A CN202110405683A CN113066397B CN 113066397 B CN113066397 B CN 113066397B CN 202110405683 A CN202110405683 A CN 202110405683A CN 113066397 B CN113066397 B CN 113066397B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- bottom shell
- glue
- glue filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000012943 hotmelt Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 239000011324 bead Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
Abstract
The invention provides an LED display module with stable structure and good flatness, which comprises a bottom shell, a printed circuit board and an LED, wherein the LED is arranged on the printed circuit board, the printed circuit board is fixedly arranged on the bottom shell, and a glue filling layer is filled between the printed circuit board and the bottom shell. The beneficial effects of the invention are as follows: the glue filling layer is filled between the printed circuit board and the bottom shell, the height difference of the assembled printed circuit board is balanced by utilizing the advantage of adjustable thickness of the glue filling layer, the flatness is improved, the display effect is improved, the glue filling layer can form an adhesive effect on the printed circuit board and the bottom shell, the structural stability of the printed circuit board and the bottom shell can be further reinforced, and particularly, when the structure of the patch copper column is loose and falls, the printed circuit board and the bottom shell can be firmly combined.
Description
Technical Field
The invention relates to an LED display module, in particular to an LED display module with stable structure and good flatness.
Background
Traditional LED display module, as shown in FIG. 1, usually include drain pan 101, PCB102 and LED103 assemble into the LED display panel, with polylith LED display panel through the mode of concatenation, install and fix on drain pan 101, wherein, PCB102 passes through paster copper post 104 and mounting screw 105 and installs on drain pan 101, because screw locking is hard structure, the firm degree of paster copper post 104 on the PCB is limited, after transportation or collision, easily appear becoming flexible or drop, lead to drain pan 101 to break away from with PCB102, structural stability is relatively poor, and, because the thickness of different PCB102 is inconsistent, some possible thin points, some possible thick points, there is thickness difference (the thickness difference of different PCBs with the specification can reach 0.2-0.3 mm), can lead to there is the difference in height between the PCB102 after the concatenation equipment, make the step appear in the display surface (appear, when looking at the wide angle, bright line or shadow, see FIG. 2, the roughness has been reduced, the effect of showing has been influenced.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides the LED display module with stable structure and good flatness.
The invention provides an LED display module with stable structure and good flatness, which comprises a bottom shell, a printed circuit board and an LED, wherein the LED is arranged on the printed circuit board, the printed circuit board is fixedly arranged on the bottom shell, and a glue filling layer is filled between the printed circuit board and the bottom shell.
As a further improvement of the invention, the bottom shell is provided with glue injection holes.
As a further improvement of the invention, the glue outlet of the glue injection hole is arranged between the printed circuit board and the bottom shell.
As a further improvement of the invention, at least two printed circuit boards are assembled on the bottom shell, and each printed circuit board is provided with at least one glue injection hole.
As a further improvement of the invention, the glue injection hole is in a horn hole shape.
As a further improvement of the invention, the glue filling layer is filled with a fast curing glue.
As a further improvement of the invention, the glue filling layer is filled by high-performance hot melt glue.
As a further improvement of the invention, the printed circuit board is connected with the patch copper column, the bottom shell is provided with the mounting fastening screw, and the mounting fastening screw is connected with the patch copper column.
As a further improvement of the invention, the LED and the printed circuit board form an LED display board, the LED display board is of a surface patch structure or a chip-on-board packaging structure, the surface patch structure is to paste an LED device on the printed circuit board, and the chip-on-board packaging structure is to bond the LED chip directly on the printed circuit board.
The beneficial effects of the invention are as follows: through above-mentioned scheme, pack one deck glue filling layer between printed circuit board and drain pan, utilize the thickness adjustable advantage of glue filling layer, the difference in height of printed circuit board that will assemble balances, be favorable to improving the roughness, improve the display effect, and glue filling layer can form the bonding effect to printed circuit board and drain pan, can further consolidate the structural stability of both, especially when the structure of paster copper post appears becoming flexible and drops, still can guarantee firmly combining printed circuit board and drain pan.
Drawings
Fig. 1 is a schematic diagram of a conventional LED display module in the prior art.
Fig. 2 is a partial enlarged view of a conventional LED display module according to the related art.
Fig. 3 is a schematic diagram of an LED display module with stable structure and good flatness.
Fig. 4 is a partial enlarged view of an LED display module with stable structure and good flatness.
Detailed Description
The invention is further described with reference to the following description of the drawings and detailed description.
As shown in fig. 3 to 4, an LED display module with stable structure and good flatness comprises a bottom shell 1, a plurality of printed circuit boards 2 and an LED3, wherein the LED3 is arranged on the printed circuit boards 2, the printed circuit boards 2 are assembled and fixed on the bottom shell 1, glue filling layers 6 are filled between each printed circuit board 2 and the bottom shell 1, and the flat assembly of the printed circuit boards 2 can be realized by utilizing the advantage of adjustable thickness of the glue filling layers 6, so as to meet the requirement of a flat display surface.
And the bottom shell 1 is provided with a glue injection hole 7.
The glue outlet of the glue injection hole 7 is arranged between the printed circuit board 2 and the bottom shell 1, and glue can be injected into a gap between the printed circuit board 2 and the bottom shell 1 through the glue injection hole 7 to form a glue filling layer 6.
Each printed circuit board 2 is provided with at least one glue injection hole 7.
The glue injection hole 7 is in a horn hole shape.
The glue filling layer 6 is filled with a fast curing glue.
The glue filling layer 6 is formed by filling high-performance hot-melt glue.
The printed circuit board 2 is connected with a patch copper column 4, a mounting fastening screw 5 is arranged on the bottom shell, and the mounting fastening screw is connected with the patch copper column 4.
The LED3 and the printed circuit board 2 form an LED display board, one LED display board can adopt two different structures, one is a surface patch structure, the LED3 is preferably an LED lamp bead, namely, the LED lamp bead (namely, a PCB and an LED packaging device) is pasted on the PCB, commonly called an SMD (surface mount device) display lamp board, the other is chip-on-board packaging, namely, a COB (chip on Board), the LED3 is preferably an LED chip, namely, the LED chip is directly bonded on the PCB, and a layer of protective glue is sealed on the surface.
According to the LED display module with stable structure and good flatness, the glue filling layer 6 which is rapidly solidified (such as high-performance hot melt glue) is added between the bottom shell 1 and the printed circuit board 2, and the height difference of the printed circuit board 2, the bottom shell 1 and the LEDs 3 is balanced by utilizing the advantage of adjustable thickness of the glue filling layer 6, so that the consistency of the whole thickness of the whole LED display module is ensured; meanwhile, the glue filling layer 6 can form an adhesive effect on the bottom shell 1 and the printed circuit board 2, so that the structural stability of the bottom shell 1 and the printed circuit board 2 is further reinforced, and particularly, when the structure of the patch copper column 4 is loose and falls, the printed circuit board 2 and the bottom shell 1 can be firmly combined.
The LED display module provided by the invention has the advantages that the structure is stable, the flatness is good, the LED display module is in a lamp bead structure or COB integrated packaging structure, different display plates are flat after being assembled, the steps are obviously reduced, the LED display module has a flat display surface, and the display effect is improved.
The LED display module provided by the invention has the advantages of stable structure and good flatness, and is particularly suitable for small-spacing and micro-spacing. More LED display products have touch interaction requirements, have a smooth display surface, and can well improve product quality without assembling steps.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (2)
1. The utility model provides a stable in structure, excellent LED display module assembly of roughness, includes drain pan, printed circuit board and LED, the LED sets up on the printed circuit board, printed circuit board fixed mounting is in on the drain pan, its characterized in that: the LED display device comprises a bottom shell, a printed circuit board and a plurality of LED display devices, wherein a glue filling layer is filled between the printed circuit board and the bottom shell, glue filling holes are formed in the bottom shell, glue outlets of the glue filling holes are formed between the printed circuit board and the bottom shell, at least two printed circuit boards are assembled on the bottom shell, each printed circuit board at least corresponds to one glue filling hole, the glue filling holes are in a horn hole shape, glue is filled into gaps between the printed circuit board and the bottom shell through the glue filling holes to form the glue filling layer, the glue filling layer is formed by filling glue which is fast to be solidified, the advantage of adjustable thickness of the glue filling layer is utilized, the flat assembly of a plurality of printed circuit boards is achieved, the requirement of a flat display surface is met, the printed circuit board is connected with a patch copper column, an installation fastening screw is arranged on the bottom shell, the installation fastening screw is connected with the patch copper column, the LED display device is in a surface patch structure or a chip-on-board packaging structure, and the surface patch structure is formed by bonding an LED chip on the printed circuit board.
2. The stable in structure, excellent in flatness LED display module according to claim 1, wherein: the glue filling layer is formed by filling high-performance hot-melt glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110405683.9A CN113066397B (en) | 2021-04-15 | 2021-04-15 | LED display module assembly stable in structure, roughness are good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110405683.9A CN113066397B (en) | 2021-04-15 | 2021-04-15 | LED display module assembly stable in structure, roughness are good |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113066397A CN113066397A (en) | 2021-07-02 |
| CN113066397B true CN113066397B (en) | 2024-03-15 |
Family
ID=76566779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110405683.9A Active CN113066397B (en) | 2021-04-15 | 2021-04-15 | LED display module assembly stable in structure, roughness are good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113066397B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114333573B (en) * | 2021-12-03 | 2023-11-21 | 昆山国显光电有限公司 | Display module and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752275A (en) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN201859623U (en) * | 2010-11-05 | 2011-06-08 | 深圳利亚德光电有限公司 | LED (light-emitting diode) display screen |
| CN102122463A (en) * | 2011-03-24 | 2011-07-13 | 李海涛 | Chip LED (light emitting diode) display screen and manufacturing method thereof |
| CN102163392A (en) * | 2011-03-09 | 2011-08-24 | 深圳雷曼光电科技股份有限公司 | Light emitting diode (LED) assembled screen |
| CN103280164A (en) * | 2013-05-30 | 2013-09-04 | 创维光电科技(深圳)有限公司 | Led display screen module and led display screen |
| CN210411366U (en) * | 2019-06-19 | 2020-04-28 | 深圳雷曼光电科技股份有限公司 | Glue filling head assembly, glue filling machine and display module needing glue filling |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109841165B (en) * | 2017-11-29 | 2021-11-16 | 利亚德光电股份有限公司 | Small-spacing LED display module and manufacturing method thereof |
-
2021
- 2021-04-15 CN CN202110405683.9A patent/CN113066397B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752275A (en) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN201859623U (en) * | 2010-11-05 | 2011-06-08 | 深圳利亚德光电有限公司 | LED (light-emitting diode) display screen |
| CN102163392A (en) * | 2011-03-09 | 2011-08-24 | 深圳雷曼光电科技股份有限公司 | Light emitting diode (LED) assembled screen |
| CN102122463A (en) * | 2011-03-24 | 2011-07-13 | 李海涛 | Chip LED (light emitting diode) display screen and manufacturing method thereof |
| CN103280164A (en) * | 2013-05-30 | 2013-09-04 | 创维光电科技(深圳)有限公司 | Led display screen module and led display screen |
| CN210411366U (en) * | 2019-06-19 | 2020-04-28 | 深圳雷曼光电科技股份有限公司 | Glue filling head assembly, glue filling machine and display module needing glue filling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113066397A (en) | 2021-07-02 |
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