CN110337180B - Extensible circuit board assembly - Google Patents
Extensible circuit board assembly Download PDFInfo
- Publication number
- CN110337180B CN110337180B CN201910586603.7A CN201910586603A CN110337180B CN 110337180 B CN110337180 B CN 110337180B CN 201910586603 A CN201910586603 A CN 201910586603A CN 110337180 B CN110337180 B CN 110337180B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit boards
- connecting piece
- self
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses an expandable circuit board assembly, which comprises a plurality of longitudinally superposed circuit boards and connecting pieces positioned on the side parts of the circuit boards; the splicing surface of the connecting piece is connected with the side surface of the circuit board, the splicing surface of the connecting piece extends out of the lower edge of the circuit board, the upper end of the connecting piece is provided with a clamping block extending outwards, the lower end of the connecting piece is provided with a clamping groove, the upper part of the splicing surface is coated with a self-adhesive layer, a protective wax paper layer is coated on the self-adhesive layer, adjacent circuit boards are clamped in the clamping groove through the clamping block to realize connection, and a heat dissipation gap is formed between the adjacent circuit boards. According to the expandable circuit board assembly provided by the invention, the adjacent circuit boards are skillfully connected through the connecting piece, so that not only is the multilayer overlapping expansion of the circuit boards realized, but also a heat dissipation gap is reserved between the adjacent circuit boards, the heat dissipation is convenient, the service life of the circuit boards is prolonged, in addition, the rubber strips on the adjacent circuit boards are extruded mutually, the impact on the circuit boards is effectively reduced, and the reliability and the stability of the multilayer circuit boards are improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an extensible circuit board assembly.
Background
Circuit boards are providers of electrical connections for electronic components. Its development has been for over 100 years, its design is mainly territory design, and the main advantages of adopting circuit board are that the errors of wiring and assembling can be greatly reduced, and the automation level and production labour rate can be raised. The circuit board can be divided into a single-layer board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. The existing multilayer circuit board has fixed structure, single function and high manufacturing cost, and the circuit boards are often connected together in a welding mode, so that the circuit boards are difficult to separate, and therefore, the whole circuit board can be scrapped due to slight failure sometimes, and serious resource waste is caused. The chinese patent of the invention with the publication number CN206024226U discloses a plug-in type multilayer circuit board, which is characterized in that a first circuit board, a second circuit board, a third circuit board and a fourth circuit board are fixedly connected into a whole by a groove and a convex groove in a clamping manner, and a groove ring and the like are arranged on the outer layer.
In view of the above, there is a need for an improved circuit board assembly in the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose an expandable circuit board assembly, which is characterized in that adjacent circuit boards are skillfully connected through a connecting piece, so that not only is the multilayer overlapping expansion of the circuit boards realized, but also a heat dissipation gap is reserved between the adjacent circuit boards, the heat dissipation is convenient, the service life of the circuit boards is prolonged, in addition, rubber strips on the adjacent circuit boards are extruded mutually, the impact on the circuit boards is effectively reduced, and the reliability and the stability of the multilayer circuit boards are improved.
In order to achieve the purpose, the invention provides an expandable circuit board assembly, which comprises a plurality of longitudinally superposed circuit boards and connecting pieces positioned on the side parts of the circuit boards; the splicing surface of the connecting piece is connected with the side surface of the circuit board, the splicing surface of the connecting piece extends out of the lower edge of the circuit board, a clamping block extending outwards is arranged at the upper end of the connecting piece, a clamping groove is arranged at the lower end of the connecting piece, a self-adhesive layer is coated on the upper portion of the splicing surface, a protective wax paper layer is coated on the self-adhesive layer, adjacent circuit boards are clamped in the clamping groove through the clamping block to achieve connection, and a heat dissipation gap is formed between the adjacent circuit boards.
In some embodiments, the splicing face of the connector extends 1mm to 10mm beyond the lower edge of the circuit board.
In some embodiments, the upper surface and the lower surface of the circuit board are provided with rubber strips, the rubber strips are arranged close to the side parts of the circuit boards, and the rubber strips on the adjacent circuit boards are extruded.
In some embodiments, the rubber strip is coated with a self-adhesive layer, and the self-adhesive layer is coated with a protective wax paper layer.
In some embodiments, the connector upper end is flush with the upper edge of the wiring board.
In some embodiments, the self-adhesive layer is coated on the splicing surface corresponding to the side surface of the circuit board.
Compared with the prior art, the invention has the beneficial effects that: according to the expandable circuit board assembly provided by the invention, the adjacent circuit boards are skillfully connected through the connecting piece, so that not only is the multilayer overlapping expansion of the circuit boards realized, but also a heat dissipation gap is reserved between the adjacent circuit boards, the heat dissipation is convenient, the service life of the circuit boards is prolonged, in addition, the rubber strips on the adjacent circuit boards are extruded mutually, the impact on the circuit boards is effectively reduced, and the reliability and the stability of the multilayer circuit boards are improved.
Drawings
FIG. 1 is a schematic diagram of an expandable circuit board assembly according to the present invention;
FIG. 2 is a schematic structural diagram of the wiring board shown in FIG. 1;
Fig. 3 is a partial structural schematic diagram of fig. 2.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
An expandable circuit board assembly as shown in fig. 1-3 comprises a plurality of circuit boards 1 stacked longitudinally, and connectors 2 located at the side of the circuit boards 1.
The splicing surface 20 of the connecting piece 2 is connected with the side surface of the circuit board 1, the upper part of the splicing surface 20 is coated with a self-adhesive layer 31, specifically, the self-adhesive layer 31 is coated on the splicing surface 20 and corresponds to the side surface of the circuit board 1, and a protective wax paper layer 32 is coated on the self-adhesive layer 31. The connection between the connecting piece 2 and the circuit board 1 can be realized only by tearing off the protective wax paper layer 32 and pasting the self-adhesive layer 31 on the side surface of the circuit board 1, the pasting is firm and stable, the connecting piece 2 can be freely pasted on the circuit board 1 needing to be overlapped, and the use is convenient.
The splicing surface 20 of the connecting piece 2 extends out of the lower edge of the circuit board 1, specifically, the splicing surface 20 of the connecting piece 2 extends out of the lower edge of the circuit board 1 by 1-10 mm, and preferably 6mm, so that a heat dissipation gap 5 is reserved between adjacent circuit boards 1, heat dissipation is facilitated, and the service life of the circuit board 1 is prolonged.
The upper end of the connecting piece 2 is flush with the upper edge of the circuit board 1, so that the circuit board 1 at the bottom can be kept horizontal, and the placing stability is improved.
The upper end of the connecting piece 2 is provided with a clamping block 21 extending outwards, the lower end of the connecting piece 2 is provided with a clamping groove 22, the adjacent circuit boards 1 are clamped in the clamping groove 22 through the clamping block 21 to realize connection, the structure is simple, the disassembly and the assembly are flexible, therefore, multilayer overlapping expansion of the circuit boards 1 can be realized, and the use convenience is improved.
All be equipped with rubber strip 4 below the circuit board 1, rubber strip 4 is close to 1 lateral part of circuit board and arranges, does not influence the use of circuit board 1. The rubber strips 4 on the adjacent circuit boards 1 are extruded mutually, so that the impact on the circuit boards 1 is effectively reduced, and the reliability and the stability of the multilayer circuit board 1 are improved.
The rubber strip 4 is coated with a self-adhesive layer 31, and a protective wax paper layer 32 is coated on the self-adhesive layer 31. Only the protective wax paper layer 32 needs to be torn off, and the self-adhesive layer 31 is adhered to the circuit board 1, so that the adhesive is firm and stable in adhesion and convenient and flexible to use. The connecting piece 2 and the rubber strip 4 are both pasted on the circuit board 1 through the self-adhesive layer 31, and are also detachable at the later stage, so that the usable range of the circuit board 1 is enlarged.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. An expandable circuit board assembly is characterized by comprising a plurality of longitudinally superposed circuit boards (1) and connecting pieces (2) positioned on the side parts of the circuit boards (1); the splicing surface (20) of the connecting piece (2) is connected with the side surface of the circuit board (1), the splicing surface (20) of the connecting piece (2) extends out of the lower edge of the circuit board (1), a clamping block (21) extending outwards is arranged at the upper end of the connecting piece (2), a clamping groove (22) is arranged at the lower end of the connecting piece (2), a self-adhesive layer (31) is coated on the splicing surface (20), a protective wax paper layer (32) is coated on the self-adhesive layer (31), adjacent circuit boards (1) are clamped in the clamping groove (22) through the clamping block (21) to realize connection, and a heat dissipation gap (5) is formed between the adjacent circuit boards (1);
Rubber strips (4) are arranged on the upper surface and the lower surface of the circuit board (1), the rubber strips (4) are arranged close to the side parts of the circuit board (1), and the rubber strips (4) on the adjacent circuit boards (1) are extruded;
the rubber strip (4) is coated with a self-adhesive layer (31), and a protective wax paper layer (32) is coated on the self-adhesive layer (31).
2. The expandable circuit board assembly according to claim 1, wherein the splicing face (20) of the connector (2) extends 1-10 mm beyond the lower edge of the circuit board (1).
3. The scalable circuit board assembly according to claim 1, wherein the upper ends of the connectors (2) are flush with the upper edge of the circuit board (1).
4. The expandable circuit board assembly according to claim 1, wherein the self-adhesive layer (31) is applied to the splice face (20) at a portion corresponding to a side of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910586603.7A CN110337180B (en) | 2019-07-01 | 2019-07-01 | Extensible circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910586603.7A CN110337180B (en) | 2019-07-01 | 2019-07-01 | Extensible circuit board assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110337180A CN110337180A (en) | 2019-10-15 |
| CN110337180B true CN110337180B (en) | 2022-07-29 |
Family
ID=68142966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910586603.7A Expired - Fee Related CN110337180B (en) | 2019-07-01 | 2019-07-01 | Extensible circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110337180B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511095B (en) * | 2020-04-21 | 2020-11-10 | 揭阳空港区拓思电子科技有限公司 | Integrated circuit module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5910885A (en) * | 1997-12-03 | 1999-06-08 | White Electronic Designs Corporation | Electronic stack module |
| JP2004281908A (en) * | 2003-03-18 | 2004-10-07 | Mitsubishi Electric Corp | Substrate frame assembly structure |
| CN101341809A (en) * | 2005-12-22 | 2009-01-07 | 皇家飞利浦电子股份有限公司 | An electronic device, a housing part, and a method of manufacturing a housing part |
| CN208724252U (en) * | 2018-07-27 | 2019-04-09 | 刘文旭 | A kind of multilayer printed circuit board |
-
2019
- 2019-07-01 CN CN201910586603.7A patent/CN110337180B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5910885A (en) * | 1997-12-03 | 1999-06-08 | White Electronic Designs Corporation | Electronic stack module |
| JP2004281908A (en) * | 2003-03-18 | 2004-10-07 | Mitsubishi Electric Corp | Substrate frame assembly structure |
| CN101341809A (en) * | 2005-12-22 | 2009-01-07 | 皇家飞利浦电子股份有限公司 | An electronic device, a housing part, and a method of manufacturing a housing part |
| CN208724252U (en) * | 2018-07-27 | 2019-04-09 | 刘文旭 | A kind of multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110337180A (en) | 2019-10-15 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220729 |