CN210411366U - Glue filling head assembly, glue filling machine and display module needing glue filling - Google Patents
Glue filling head assembly, glue filling machine and display module needing glue filling Download PDFInfo
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- CN210411366U CN210411366U CN201920929003.1U CN201920929003U CN210411366U CN 210411366 U CN210411366 U CN 210411366U CN 201920929003 U CN201920929003 U CN 201920929003U CN 210411366 U CN210411366 U CN 210411366U
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Abstract
The utility model relates to a glue-pouring head subassembly, glue-pouring machine and need carry out the display module assembly of encapsulating. The encapsulating head subassembly for carry out the encapsulating to the product that has the encapsulating hole, the encapsulating head subassembly includes: a mounting frame; the glue filling head is arranged on the mounting frame; and the sealing element is arranged on the mounting frame or the glue filling head, and the glue filling head is operatively inserted into the glue filling hole until the sealing element abuts against the edge of the glue filling hole and seals the glue filling hole. Among the foretell encapsulating head subassembly, the encapsulating head is arranged in carrying out the encapsulating to the product that has the encapsulating hole, before the encapsulating, the encapsulating head need insert the encapsulating hole of the product that has the encapsulating hole in, and after the encapsulating head inserted the encapsulating hole, the clearance between the pore wall that the sealing member can sealed encapsulating head and encapsulating hole for the encapsulating hole is sealed. Therefore, when the product with the glue pouring hole is filled with glue, the pressure applied to the glue poured into the product with the glue pouring hole is larger because the glue pouring hole is sealed, and the flowing speed of the product is improved.
Description
Technical Field
The utility model relates to a encapsulating technical field especially relates to a glue filling head subassembly, glue filling machine and need carry out the display module assembly of encapsulating.
Background
When the LED (Light Emitting Diode) display module is applied outdoors, the driving circuit board and other devices may be aged in advance in the harsh outdoor environment, and the service life of the driving circuit board may be prolonged by pouring a sealant into the driving circuit board. At present, the time required by the way of filling the driving circuit board with glue is longer, which is not beneficial to industrial mass production.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a glue filling head assembly that reduces the time required for filling glue into a display module.
The technical scheme is as follows:
a potting head assembly for potting a product having a potting aperture, the potting head assembly comprising: a mounting frame; the glue filling head is arranged on the mounting frame; and the sealing element is arranged on the mounting frame or the glue filling head, and the glue filling head is operatively inserted into the glue filling hole until the sealing element abuts against the edge of the glue filling hole and seals the glue filling hole.
Among the foretell encapsulating head subassembly, the encapsulating head is arranged in carrying out the encapsulating to the product that has the encapsulating hole, before the encapsulating, the encapsulating head need insert the encapsulating hole of the product that has the encapsulating hole in, and after the encapsulating head inserted the encapsulating hole, the clearance between the pore wall that the sealing member can sealed encapsulating head and encapsulating hole for the encapsulating hole is sealed. So, when the product encapsulating that has the encapsulating hole, because the encapsulating hole is sealed, the pressure that seals glue that has poured into in the product that has the encapsulating hole receives can be bigger to make its flow velocity obtain improving, thereby reduce the required encapsulating time of product that has the encapsulating hole. The product with the glue filling hole can be a display module which needs to be filled with glue.
The technical solution is further explained below:
in one embodiment, the seal is a resilient member.
In one embodiment, the sealing element is provided with a through hole, the glue filling head comprises a glue filling end, and one end of the glue filling head, which is far away from the glue filling end, penetrates through the through hole and is tightly attached to the hole wall of the through hole.
In one embodiment, the number of the glue filling heads is at least two, and the at least two glue filling heads are arranged on the mounting frame at intervals.
This technical scheme still provides a glue-pouring machine, includes as above the glue-pouring head subassembly.
In foretell glue-pouring machine possessed foretell glue-pouring head subassembly, the glue-pouring head was used for carrying out the encapsulating to the product that has the encapsulating hole, before the encapsulating, the glue-pouring head need insert the encapsulating hole of the product that has the encapsulating hole, and after the glue-pouring head inserted the encapsulating hole, the clearance between the pore wall of sealing glue-pouring head and encapsulating hole was sealed to the sealing member for the encapsulating hole is sealed. So, when the product encapsulating that has the encapsulating hole, because the encapsulating hole is sealed, the pressure that seals glue that has poured into in the product that has the encapsulating hole receives can be bigger to make its flow velocity obtain improving, thereby reduce the required encapsulating time of product that has the encapsulating hole. The product with the glue filling hole can be a display module which needs to be filled with glue.
This technical scheme still provides a display module assembly that needs carry out the encapsulating, includes: the bottom shell is provided with glue filling holes penetrating through two sides of the bottom shell and exhaust holes penetrating through two sides of the bottom shell, and the exhaust holes and the glue filling holes are arranged at intervals; and the driving circuit board is arranged on one side of the bottom shell, a cavity to be filled with glue is formed between the driving circuit board and the bottom shell, and the glue filling hole and the exhaust hole are communicated with the cavity.
Foretell display module assembly that need carry out the encapsulating is before the encapsulating, and the encapsulating head needs insert the encapsulating hole, and after the encapsulating head inserted the encapsulating hole, the clearance between the pore wall of encapsulating head and encapsulating hole can be sealed to the sealing member for the encapsulating hole is sealed. So, when carrying out the display module assembly encapsulating of encapsulating to needs, because the encapsulating hole is sealed, seal the glue and enter into the die cavity after, original gas is discharged by the exhaust hole in the die cavity, the pressure that seals glue that has poured into in the die cavity receives can be bigger to make its flow velocity obtain improving, thereby reduce the required encapsulating time of display module assembly.
The technical solution is further explained below:
in one embodiment, an anti-overflow protrusion is arranged on one side of the bottom shell, which is far away from the driving circuit board, and the anti-overflow protrusion surrounds the glue pouring hole.
In one embodiment, the display module comprises at least two glue filling hole groups formed by matching at least two glue filling holes, the number of the glue filling hole groups is at least two, the at least two glue filling hole groups are arranged on the bottom shell at intervals, and the exhaust hole is arranged between every two adjacent glue filling hole groups.
In one embodiment, the display module further includes a power supply disposed on the bottom case, a power line connected to the power supply, and a wire pressing plate disposed on the bottom case, wherein a wire passage for the power line to pass through is formed between the wire pressing plate and the bottom case, and two sides of the power line are respectively abutted to the wire pressing plate and the bottom case.
In one embodiment, the display module further comprises an adjusting bolt, the wire pressing plate is provided with a first assembling hole, the bottom shell is provided with a second assembling hole opposite to the first assembling hole, and the adjusting bolt is movably arranged in the first assembling hole and the second assembling hole in a penetrating mode.
Drawings
Fig. 1 is a schematic structural view of the working principle of the glue-pouring head assembly in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present invention;
fig. 3 is a schematic view of a partial cross-sectional structure of a display module according to an embodiment of the present invention.
Description of reference numerals:
10. encapsulating head subassembly, 100, mounting bracket, 110, encapsulating head, 111, encapsulating end, 120, sealing member, 20, the display module assembly that needs to carry out the encapsulating, 200, drain pan, 201, encapsulating hole, 202, die cavity, 203, anti-overflow arch, 204, encapsulating hole group, 205, exhaust hole, 210, drive circuit board, 220, power lid, 230, line ball board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the present invention, the terms "first" and "second" do not denote any particular quantity or order, but are merely used to distinguish names.
As shown in fig. 1, an embodiment relates to a glue filling head assembly 10 for filling a product having a glue filling hole 201, which includes a mounting frame 100, a glue filling head 110 and a sealing member 120. The glue filling head 110 is arranged on the mounting frame 100, the sealing element 120 is arranged on the mounting frame 100 or the glue filling head 110, and the glue filling head 110 is operatively inserted into the glue filling hole until the sealing element 120 abuts against the edge of the glue filling hole and seals the glue filling hole.
In the above-mentioned glue filling head assembly 10, the glue filling head 110 is used for filling glue to a product (a display module 20 that needs to be filled with glue) having a glue filling hole, before filling glue, the glue filling head 110 needs to be inserted into the glue filling hole 201, and after the glue filling head 110 is inserted into the glue filling hole 201, the sealing element 120 can seal a gap between the glue filling head 110 and a hole wall of the glue filling hole 201, so that the glue filling hole 201 is sealed. So, when the product that has the encapsulating hole is encapsulating, because encapsulating hole 201 is sealed, the pressure that seals glue that has poured into in the product that has encapsulating hole 201 receives can be bigger to make its flow velocity obtain improving, thereby reduce the encapsulating time that the product that has the encapsulating hole needs.
In one embodiment, the seal 120 is a resilient member. So, after encapsulating head 110 stretched into in the encapsulating hole 201 of the product that has the encapsulating hole (need carry out the display module assembly 20 of encapsulating), sealing member 120 received the extrusion of the product that has the encapsulating hole and warp and enter into the aperture wall of encapsulating hole 201 and the clearance between encapsulating head 110, and the leakproofness is good, easy to operate. Optionally, the seal 120 is made of silicone, rubber, or other resilient material.
Further, the sealing element 120 is provided with a through hole, the glue filling head 110 comprises a glue filling end 111, and one end of the glue filling head 110, which is far away from the glue filling end 11, penetrates through the through hole and is tightly attached to the hole wall of the through hole. Because the hole wall of the through-hole on the encapsulating head 110 and the sealing member 120 is tightly attached, no gap exists between the sealing member 120 and the encapsulating head 110, and after the encapsulating head 110 is inserted into the encapsulating hole 201, the sealing effect of the sealing member 120 on the gap between the encapsulating head 110 and the hole wall of the encapsulating hole 201 can be improved. It should be noted that the glue filling end 111 refers to an end of the glue filling head 110 that discharges glue, i.e. a bottom end of the glue filling head 110.
In one embodiment, the number of the glue filling heads 110 is at least two, and at least two glue filling heads 110 are arranged on the mounting frame at intervals. So, can carry out the encapsulating through two at least encapsulating holes 201 on the product simultaneously, raise the efficiency.
An embodiment also relates to a glue-pouring machine, which comprises the glue-pouring head assembly.
In the glue filling machine with the glue filling head assembly 10, the glue filling head 110 is used for filling glue to a product (a display module 20 that needs to be filled with glue) with a glue filling hole, before filling glue, the glue filling head 110 needs to be inserted into the glue filling hole 201, and after the glue filling head 110 is inserted into the glue filling hole 201, the sealing element 120 can seal a gap between the glue filling head 110 and the hole wall of the glue filling hole 201, so that the glue filling hole 201 is sealed. So, when the product that has the encapsulating hole is encapsulating, because encapsulating hole 201 is sealed, the pressure that seals glue that has poured into in the product that has the encapsulating hole receives can be bigger to make its flow velocity obtain improving, thereby reduce the encapsulating time that the product that has the encapsulating hole needs.
It should be noted that the glue filling machine further includes a main body part for realizing the glue filling function, and the main body part is consistent with the structure of the traditional glue filling machine and is not described herein again.
As shown in fig. 1-3, an embodiment of the invention further relates to a display module 20 that needs to be subjected to glue filling, and the display module 20 that needs to be subjected to glue filling includes a bottom chassis 200 and a driving circuit board 210. The bottom shell 200 is provided with a glue filling hole 201 penetrating through two sides of the bottom shell 200 and an exhaust hole 205 penetrating through two sides of the bottom shell 200, the exhaust hole 205 and the glue filling hole 201 are arranged at intervals, the driving circuit board 210 is arranged on one side of the bottom shell 200, a cavity 202 to be filled with glue is formed between the driving circuit board 210 and the bottom shell 200, and the glue filling hole 201 and the exhaust hole 205 are both communicated with the cavity 202; when the potting head 110 is inserted into the potting hole 201, the sealing element 120 in the potting head assembly 10 is used for sealing the potting hole 201.
Specifically, the bottom case 200 is a square structure, the driving circuit board 210 is disposed on the back side of the bottom case 200, the driving circuit board 210 is electrically connected to the electronic component and the LED light emitting lamp, a cavity 202 is formed between the driving circuit board 210 and the bottom case 200, and the cavity 202 is used for glue pouring through the glue pouring head assembly 10, so that the driving circuit board 210 is covered with glue, and functions of dust prevention, water prevention, insulation and the like are achieved, the driving circuit board 210 is prevented from being damaged, and the service life is prolonged.
Before the display module 20 needs to be filled with glue, the glue filling head 110 needs to be inserted into the glue filling hole 201 of the display module 20 needing to be filled with glue, and after the glue filling head 110 is inserted into the glue filling hole 201, the sealing element 120 can seal a gap between the glue filling head 110 and the hole wall of the glue filling hole 201, so that the glue filling hole 201 is sealed. So, when carrying out the display module assembly 20 encapsulating of encapsulating to needs, because encapsulating hole 201 is sealed, seal glue and enter into die cavity 202 back, original gas is discharged by the exhaust hole in the die cavity 202, the pressure that seals glue that has poured into in the die cavity 202 receives can be bigger to make its flow velocity obtain improving, thereby reduce the required encapsulating time of display module assembly 20 that needs carry out the encapsulating.
As shown in fig. 2, in one embodiment, an anti-overflow protrusion 203 is disposed on a side of the bottom case 200 away from the driving circuit board 210, and the anti-overflow protrusion 203 surrounds the glue filling hole 201. Thus, in the process of pouring the glue into the display module 20 needing glue pouring by the glue pouring head assembly 10, even if the glue overflows from the cavity 202 carelessly, the anti-overflow protrusion 203 can prevent the glue from continuously diffusing, and the glue is prevented from polluting other areas. Specifically, the spill prevention protrusion 203 has a closed ring shape.
As shown in fig. 2, in one embodiment, the display module 20 that needs to be glue-filled includes at least two glue-filling hole sets 204 formed by at least two glue-filling holes 201, the number of the glue-filling hole sets 204 is at least two, the at least two glue-filling hole sets 204 are arranged on the bottom chassis 200 at intervals, and an air vent 205 is disposed between two adjacent glue-filling hole sets 204. The single glue filling hole group 204 comprises at least two glue filling holes 201, so that the glue filling speed can be further improved, the glue filling time required by the display module 20 needing glue filling is reduced, and the display module 20 needing glue filling comprises at least two glue filling hole groups 204, so that the glue filling speed can be further improved; and the vent hole 205 is arranged between two adjacent glue pouring hole groups 204, when the glue pouring head assembly 10 pours glue into the cavity 202 through two adjacent glue pouring hole groups 204 at the same time, the glue can flow from the position of the two groups of glue pouring hole groups 204 to the position of the vent hole 205 in the cavity 202, so that the gas in the cavity 202 is discharged through the vent hole 205, and the vent hole 205 is arranged between two adjacent groups of glue pouring hole groups 204, so that the path of the gas moving in the cavity 202 can be reduced, and the gas discharging speed is accelerated.
Specifically, the display module assembly 20 that needs to carry out the encapsulating includes two sets of encapsulating punch combination 204, and one of them encapsulating punch combination 204 sets up the left side at the display module assembly 20 that needs carry out the encapsulating, and another encapsulating punch combination 204 sets up the right side at the display module assembly 20 that needs carry out the encapsulating, and exhaust hole 205 sets up the middle zone at the display module assembly 20 that needs carry out the encapsulating.
As shown in fig. 2, in one embodiment, the display module 20 that needs to be filled with glue further includes a power source disposed on the bottom case 200, a power line connected to the power source, and a wire pressing plate 230 disposed on the bottom case 200, wherein a wire passage for passing the power line is formed between the wire pressing plate 230 and the bottom case 200, and two sides of the power line are respectively abutted to the wire pressing plate 230 and the bottom case 200. The power is used for providing the electric energy to drive circuit board 210, electronic components and LED luminescent lamp, pushes down the power cord of being connected the power through using line ball board 230, can avoid personnel when dragging the power cord carelessly, causes the power cord and the interface of power to take place not hard up phenomenon.
Specifically, the power supply is disposed at the back of the bottom case 200, the display module 20 to be subjected to glue filling further includes a power supply cover 220, and the power supply cover 220 is covered on the power supply and fixed on the back of the bottom case 200 through a bolt; the display module assembly 20 that needs to carry out the encapsulating still includes adjusting bolt, and line ball board 230 is equipped with first pilot hole, and drain pan 200 is equipped with the second pilot hole relative with first pilot hole, and adjusting bolt movably wears to locate first pilot hole and second pilot hole. The wire pressing plate 230 is fixed on the back of the bottom case 200 through an adjusting bolt, and the adjusting bolt can adjust the distance between the wire pressing plate 230 and the bottom case 200, so that power wires with different diameters are pressed. Optionally, the first assembling hole is a through hole, the second assembling hole is a threaded hole, and the adjusting bolt sequentially penetrates through the first assembling hole and the second assembling hole.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a glue filling head subassembly for carry out the encapsulating to the product that has the encapsulating hole, its characterized in that, glue filling head subassembly includes:
a mounting frame;
the glue filling head is arranged on the mounting frame; and
the sealing piece is arranged on the mounting frame or the glue filling head, and the glue filling head is operatively inserted into the glue filling hole until the sealing piece abuts against the edge of the glue filling hole and seals the glue filling hole.
2. The glue head assembly of claim 1 wherein the seal is a resilient member.
3. The glue pouring head assembly as claimed in claim 1, wherein the sealing member is provided with a through hole, the glue pouring head comprises a glue pouring end, and one end of the glue pouring head, which is far away from the glue pouring end, penetrates through the through hole and is tightly attached to the hole wall of the through hole.
4. The glue pouring head assembly according to any one of claims 1 to 3, wherein the number of the glue pouring heads is at least two, and at least two glue pouring heads are arranged on the mounting frame at intervals.
5. A glue-pouring machine comprising a glue-pouring head assembly as claimed in any one of claims 1 to 4.
6. The utility model provides a display module assembly who need carry out the encapsulating which characterized in that includes:
the bottom shell is provided with glue filling holes penetrating through two sides of the bottom shell and exhaust holes penetrating through two sides of the bottom shell, and the exhaust holes and the glue filling holes are arranged at intervals; and
the driving circuit board is arranged on one side of the bottom shell, a cavity to be filled with glue is formed between the driving circuit board and the bottom shell, and the glue filling hole and the exhaust hole are communicated with the cavity.
7. The display module assembly requiring glue filling as claimed in claim 6, wherein an anti-overflow protrusion is disposed on a side of the bottom case away from the driving circuit board, and the anti-overflow protrusion is surrounded on the glue filling hole.
8. The display module assembly of claim 6, comprising at least two glue filling hole sets formed by matching at least two glue filling holes, wherein the at least two glue filling hole sets are arranged on the bottom case at intervals, and the exhaust hole is arranged between two adjacent glue filling hole sets.
9. The display module assembly as claimed in claim 6, further comprising a power source disposed on the bottom case, a power line connected to the power source, and a wire pressing plate disposed on the bottom case, wherein a wire passage for the power line to pass through is formed between the wire pressing plate and the bottom case, and two sides of the power line are respectively abutted against the wire pressing plate and the bottom case.
10. The display module assembly as claimed in claim 9, further comprising an adjusting bolt, wherein the pressure plate has a first assembling hole, the bottom shell has a second assembling hole opposite to the first assembling hole, and the adjusting bolt is movably disposed through the first assembling hole and the second assembling hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920929003.1U CN210411366U (en) | 2019-06-19 | 2019-06-19 | Glue filling head assembly, glue filling machine and display module needing glue filling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920929003.1U CN210411366U (en) | 2019-06-19 | 2019-06-19 | Glue filling head assembly, glue filling machine and display module needing glue filling |
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| Publication Number | Publication Date |
|---|---|
| CN210411366U true CN210411366U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920929003.1U Active CN210411366U (en) | 2019-06-19 | 2019-06-19 | Glue filling head assembly, glue filling machine and display module needing glue filling |
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| CN (1) | CN210411366U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066397A (en) * | 2021-04-15 | 2021-07-02 | 深圳市金翰半导体技术有限公司 | LED display module with stable structure and good flatness |
| CN114074056A (en) * | 2020-08-20 | 2022-02-22 | 深圳市裕展精密科技有限公司 | Lead-in device, lead-in method and product |
| CN115445858A (en) * | 2022-09-02 | 2022-12-09 | 无锡车联天下信息技术有限公司 | One-time extrusion dispenser |
-
2019
- 2019-06-19 CN CN201920929003.1U patent/CN210411366U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074056A (en) * | 2020-08-20 | 2022-02-22 | 深圳市裕展精密科技有限公司 | Lead-in device, lead-in method and product |
| CN113066397A (en) * | 2021-04-15 | 2021-07-02 | 深圳市金翰半导体技术有限公司 | LED display module with stable structure and good flatness |
| CN113066397B (en) * | 2021-04-15 | 2024-03-15 | 深圳市金翰半导体技术有限公司 | LED display module assembly stable in structure, roughness are good |
| CN115445858A (en) * | 2022-09-02 | 2022-12-09 | 无锡车联天下信息技术有限公司 | One-time extrusion dispenser |
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