TWI559581B - Light emitting unit, manufacturing method thereof and light emitting device - Google Patents

Description

Light emitting unit, manufacturing method thereof and light emitting device

The present invention relates to a method, and more particularly to a light-emitting unit, a method of manufacturing the same, and a light-emitting device.

Referring to FIG. 1 and FIG. 2 , a conventional light-emitting device 9 includes a planar substrate 91 , a circuit board 92 , a module 93 , a plurality of light-emitting diodes 94 , and a package board 95 .

The circuit board 92 is disposed on the circuit board 91. The module 93 is disposed on the circuit board 92, and has a plurality of receiving slots 931 arranged in an array and respectively disposed by the LEDs 94. Each of the receiving slots 931 can be disposed. Four light emitting diodes 94 are accommodated. The light emitting diodes 94 are electrically connected to the circuit board 92, respectively. The package board 95 is disposed above the module 93 and has a plate body 951, a plurality of holes 952 formed on the plate body 951 and corresponding to the light-emitting diodes 94, and a number of corresponding holes 931 disposed on the plate body 951. Separator 953. The holes 952 are respectively provided for the light-emitting diodes 94. The partitions 953 are respectively protruded from the plate body 951 and are respectively located at one side of the receiving groove 931. Therefore, the light-emitting diodes 94 in each of the receiving grooves 931 are provided. Can converge the light emitted by the partitions 953 on both sides In order to increase the concentration of the illumination, and to provide a specific illumination range, the light emitted by the LEDs 94 in the two accommodating slots 931 is prevented from interfering with each other.

However, the general circuit board 92 has a poor heat conduction effect, so that the light-emitting diode 94 does not easily dissipate heat when it operates, and the number of the receiving slots 931 of the module 93 cannot be changed. Therefore, if the number of the light-emitting diodes 94 is to be increased, , the module must be recreated. Moreover, since the general circuit board 92 has a flat shape, the light-emitting diodes 94 can be disposed only on the circuit board 92 along a plane, and cannot provide illumination in different directions and angles. In addition, in the process of assembling the package board 95 in the module 93, the through holes 952 on the package board 95 must be aligned with the LEDs 94, which not only causes cumbersome assembly, but also leads to labor cost and assembly man-hours. This in turn leads to an increase in manufacturing costs.

Accordingly, it is an object of the present invention to provide an illumination unit that achieves different illumination ranges and increases illumination concentration while at the same time improving thermal conductivity and reducing manufacturing costs.

Another object of the present invention is to provide a light-emitting device that can improve the disadvantages of the prior art.

Still another object of the present invention is to provide a method of manufacturing a light-emitting unit that reduces labor costs and assembly man-hours and also reduces manufacturing costs.

Thus, in some embodiments, the illumination unit of the present invention comprises: a pedestal, a conductive line, and at least one illuminating element. The base has a bottom wall, and one extends outward from the periphery of the bottom wall and is formed with the bottom wall The first angle surrounds the wall. The bottom wall has a bottom surface having a surrounding surface. The conductive line is formed at least directly on the bottom surface of the pedestal and the surrounding surface. The light emitting element is disposed on a surface of the conductive line and electrically connected to the conductive line.

In some embodiments, the pedestal includes a metal layer, and an insulating layer formed on the surface of the metal layer, the metal layer and the insulating layer cover the bottom surface and the surrounding surface of the pedestal, and the conductive line is formed on Part of the surface of the insulating layer.

Thus, in some embodiments, the light emitting device of the present invention comprises: a plurality of light emitting units. The light emitting units are arranged in an array on a plane, and each of the light emitting units comprises: a base, a conductive line, and at least one light emitting element. The base has a bottom wall and a surrounding wall extending outwardly from the periphery of the bottom wall and at a first angle to the bottom wall. The bottom wall has a bottom surface having a surrounding surface. The conductive line is formed at least directly on one of a bottom surface and a surrounding surface of the base. The light emitting element is disposed on a surface of the conductive line and electrically connected to the conductive line.

In some embodiments, the pedestal of each of the illuminating units includes a metal layer, and an insulating layer formed on the surface of the metal layer, the metal layer and the insulating layer covering the bottom surface and the surrounding surface of the pedestal, and the A conductive line is formed on a portion of the surface of the insulating layer.

Therefore, in some embodiments, the method for manufacturing the light-emitting unit of the present invention comprises the steps of: bending a metal substrate into a metal layer including a bottom wall and a surrounding wall, the surrounding wall being outwardly from the periphery of the bottom wall Extending and forming a first angle with the bottom wall, and the bottom wall has a bottom surface The surrounding wall has a surrounding surface; the bottom surface of the metal layer and the surrounding surface form an insulating layer, and the metal layer and the insulating layer are matched to form a pedestal; a conductive line is directly formed on the surface of the insulating layer of the pedestal And arranging and electrically connecting at least one light emitting element on the conductive line.

Therefore, in some embodiments, the method for manufacturing the light-emitting unit of the present invention comprises the steps of: forming an insulating layer on one surface of a metal substrate; forming an active layer containing an active metal on the surface of the insulating layer; The substrate, the insulating layer and the active layer are bent into a base including a bottom wall and a surrounding wall, the surrounding wall extending outward from the peripheral edge of the bottom wall and at a first angle with the bottom wall; Forming a conductive line on the surface of the active layer; and disposing and electrically connecting at least one light emitting element on the conductive line.

The effect of the present invention is that the light-emitting unit is designed to have a first angle between the surrounding wall and the bottom wall of the base, and the conductive line can be formed on the bottom surface or the surrounding surface to enable the light-emitting element to The bottom surface or the surrounding surface is provided to provide illumination ranges of different angles and directions, and the light-emitting unit cooperates with the surrounding surface to form the structure of the susceptor like a concentrator. The illumination concentration of the light-emitting element is increased, and the conventional package board can be omitted, and the assembly cost can be reduced at the same time. Furthermore, the pedestal includes a metal layer to improve thermal conductivity and accelerate heat dissipation of the illuminating element.

1‧‧‧Lighting unit

11‧‧‧Base

111‧‧‧ bottom wall

112‧‧‧ Around the wall

113‧‧‧Connecting wall

114‧‧‧ bottom

115‧‧‧ Around the surface

116‧‧‧ Around the face

117‧‧‧metal layer, metal substrate

118‧‧‧Insulation

12‧‧‧Electrical circuit

120‧‧‧Active layer

121‧‧‧First conductive layer

122‧‧‧Second conductive layer

123‧‧‧Line pattern area

124‧‧‧Non-line pattern area

125‧‧‧Isolated area

13‧‧‧Lighting elements

2‧‧‧Frame

3‧‧‧Diffusion layer

Θ‧‧‧first angle

‧‧‧second angle

The other features and advantages of the present invention will be apparent from the detailed description of the embodiments of the invention, wherein: FIG. 2 is a side view showing an assembled state of a conventional light-emitting device; FIG. 3 is a perspective view showing an embodiment of the light-emitting device of the present invention, and a conductive line is omitted in FIG. 3; FIG. 4 is a perspective view. FIG. 5 is a cross-sectional view of FIG. 4 illustrating the structure of the light emitting units of the embodiment; FIG. 6 is a side view showing the light emitting units of the embodiment. Illumination concentration, and the conductive line is omitted in FIG. 6; FIG. 7 is a side view showing the dispensing mode of the embodiment, and the conductive line is omitted in FIG. 7; FIG. 8 is a cross-sectional view showing the light-emitting unit of the present invention. A first embodiment of the manufacturing method, the metal substrate is bent into a metal layer including a bottom wall and a surrounding wall; FIG. 9 is a cross-sectional view showing the first embodiment of the bottom surface of the metal layer and the An insulating layer is formed around the surface; FIG. 10 is a cross-sectional view showing the first embodiment forming an active layer containing an active metal on the surface of the insulating layer; FIG. 11 is a cross-sectional view showing the first embodiment in an electroless plating process. Activation The surface of the layer forms a first conductive layer; FIG. 12 is a cross-sectional view illustrating the first conductive layer and the corresponding active layer removed from the first embodiment to form a line pattern region and a non-line isolated from each other. Figure 13 is a cross-sectional view showing the first embodiment forming a second conductive layer in the circuit pattern region by an electroplating process to form a conductive line; Figure 14 is a cross-sectional view showing the first conductive layer and the active layer except the line pattern region in the first embodiment; Figure 15 is a cross-sectional view taken along the line XV-XV in Figure 4, illustrating the first embodiment An example is provided on the conductive line and electrically connected to the light-emitting element; FIG. 16 is a cross-sectional view showing a second embodiment of the method for manufacturing the light-emitting unit of the present invention, providing a metal substrate; FIG. 17 is a cross-sectional view illustrating the second embodiment For example, an insulating layer is formed on one surface of the metal substrate; FIG. 18 is a cross-sectional view showing that the second embodiment forms an active layer containing an active metal on the surface of the insulating layer; FIG. 19 is a cross-sectional view showing the second embodiment. For example, the metal substrate, the insulating layer and the active layer are bent into a base including a bottom wall and a surrounding wall; FIG. 20 is a cross-sectional view showing the second embodiment of the surface of the active layer by an electroless plating process. A first conductive layer is formed; FIG. 21 is a cross-sectional view showing the first conductive layer and the corresponding active layer removed from the second embodiment to form a line pattern region and a non-line pattern separated from each other. FIG. 22 is a cross-sectional view showing the second embodiment forming a second conductive layer in the circuit pattern region by electroplating to form a conductive line; FIG. 23 is a cross-sectional view showing the second embodiment removing the line a first conductive layer and an active layer other than the pattern region; FIG. 24 is a cross-sectional view showing the second embodiment of the conductive line disposed on the conductive line and electrically connecting the light emitting element; Figure 25 is a cross-sectional view taken along line XXV-XXV of Figure 4, illustrating that the conductive traces and the light-emitting elements are connected in series to form a conductive path.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 3, FIG. 4 and FIG. 5, an embodiment of a light-emitting device of the present invention comprises: a plurality of light-emitting units 1, and a frame 2.

The light emitting units 1 are arranged in an array on a plane, and each of the light emitting units 1 includes a base 11, a conductive line 12, and at least one light emitting element 13. The base 11 has a bottom wall 111, a surrounding wall 112, and a connecting wall 113. The bottom wall 111 has a bottom surface 114 that extends outwardly from the periphery of the bottom wall 111 and forms a first angle θ with the bottom wall 111, and has a surrounding surface 115 around the wall 112. The connecting wall 113 extends outward from the circumference of the surrounding wall 112 and forms a second angle with the surrounding wall 112. . The conductive line 12 is formed at least directly on one of the bottom surface 114 and the surrounding surface 115 of the susceptor 11. In particular, FIG. 3 is a schematic view, and the conductive line 12 is omitted. The light emitting element 13 is disposed on the surface of the conductive line 12 and electrically connected to the conductive line 12. In this embodiment, the light-emitting element 13 is a light-emitting diode, and may of course be other types of light-emitting elements, and is not limited by the disclosure of the embodiment.

Specifically, the frame 2 has the light-emitting unit 1 framed therein, so that the connecting walls 113 of the light-emitting unit 1 are closely abutted and connected to each other, and at least one end of each conductive line 12 extends to the connecting wall 113 to make the light-emitting element 13 is electrically connected by corresponding conductive lines 12.

In detail, the bottom surface 114 of the base 11 of each of the light-emitting units 1 has a rectangular shape, and the surrounding surface 115 has four surrounding faces 116 extending from four sides of the bottom surface 114 and connected to each other, each of which has a trapezoidal shape around the face portion 116. . Through the two-dimensional lattice design, the structural force direction of each of the susceptors 11 can be increased.

As shown in FIG. 4, in the present embodiment, the number of the light-emitting elements 13 of each of the light-emitting units 1 may be 1 to 5, and only three aspects are exemplified herein, and are not limited thereto. When the light emitting unit 1 has three light emitting elements 13, the conductive line 12 is directly formed on the bottom surface 114 of the base 11 and the opposite two surrounding surface portions 116, and the light emitting elements 13 are disposed at positions corresponding to the bottom surface 114 and on opposite sides, respectively. The two surround the face 116.

Further, when the light-emitting unit 1 has four light-emitting elements 13, the conductive lines 12 are directly formed on the four surrounding faces 116, and the positions of the respective light-emitting elements 13 correspond to the respective surrounding faces 116, respectively. When the light-emitting unit 1 has five light-emitting elements 13, the conductive lines 12 are directly formed on the bottom surface 114 and the four surrounding portions 116, and the light-emitting elements 13 are disposed at positions corresponding to the bottom surface 114 and the four surrounding portions 116, respectively.

In this way, the light-emitting unit 1 is designed to pass through the wall 11 of the susceptor 11 at a first angle θ with the bottom wall 111, so that the position of the light-emitting element 13 can correspond to the bottom surface 114 or around the surface portion 116 to provide different angles and directions. Lighting range. Referring to FIG. 6 , the illuminating unit 1 is configured by the bottom surface 114 and the surrounding surface 115 to form a structure similar to a concentrating hood, which can increase the illumination concentration of the illuminating element 13 and can also Omit the components such as the conventional package board (see Figure 1) to reduce the assembly this.

Referring to FIG. 7, the light emitting device further includes a plurality of diffusion layers 3. Each diffusion layer 3 is formed on the corresponding susceptor 11 to enclose the light-emitting element 13 such that the light-emitting element 13 emits uniform light. The material of the diffusion layer 3 is a liquid ruthenium rubber containing 1% to 3% of calcium carbonate, but it may be other materials having good light diffusibility, and is not limited thereto.

Referring to FIG. 14, further, the susceptor 11 includes a metal layer 117 and an insulating layer 118 formed on the surface of the metal layer 117. The metal layer 117 and the insulating layer 118 cover the bottom surface 114 and the surrounding surface 115 of the susceptor 11. In the embodiment, the metal layer 117 is made of aluminum alloy or stainless steel, but other materials with good thermal conductivity may not be used. This limit. Therefore, the susceptor 11 accelerates the heat dissipation of the illuminating element 13 by the metal layer 117 to improve the heat conduction efficiency; the material of the insulating layer 118 may be selected from an insulating material such as an epoxy resin or an acryl resin, but may also be other insulation. The material is not limited to the disclosure of the embodiment. In other embodiments, the susceptor 11 may be made of an insulating material as a whole instead of being divided into a metal layer 117 and an insulating layer 118 as in the embodiment.

As shown in FIG. 14, the conductive line 12 has an active layer 120, a first conductive layer 121, and a second conductive layer 122. The active layer 120 is formed on a portion of the surface of the insulating layer 118 of the susceptor 11, and the active layer 120 comprises an active metal selected from the group consisting of palladium, rhodium, ruthenium, iridium, platinum, gold, silver, copper, nickel, iron, or One of these combinations of catalytic metals. The first conductive layer 121 is formed on the active layer 120 and is made of nickel or copper, and is not limited by the disclosure of the embodiment. The second conductive layer 122 is disposed on the first conductive layer 121, and its material is copper to provide good electrical conductivity. The light-emitting elements 13 are disposed on the second conductive layer 122 and electrically connected to the second conductive layer 122.

A first embodiment of the manufacturing method of the light-emitting unit of the present invention is described below. The method includes the following steps: Referring to FIG. 8, a metal substrate is bent into a metal layer 117 including a bottom wall 111, a surrounding wall 112 and a connecting wall 113. . The bottom wall 111 has a bottom surface 114 extending outward from the periphery of the bottom wall 111 and forming a first angle θ with the bottom wall 111, and the surrounding wall 112 has a surrounding surface 115, and the connecting wall 113 is formed by the circumference of the surrounding wall 112. Extending outwardly and at a second angle to surrounding wall 112 .

Referring to FIG. 9, an insulating layer 118 is formed on the bottom surface 114 of the metal layer 117, the surrounding surface 115, and the surface of the connecting wall 113 by Electro-Deposition Coating, and the thickness of the insulating layer 118 is between 15 μm and 25 μm. The metal layer 117 and the insulating layer 118 are matched to form a pedestal 11.

Referring to FIG. 10, an active metal-containing active layer 120 is formed on the surface of the insulating layer 118 by coating, and the thickness of the active layer 120 is between 15 μm and 30 μm. It should be noted that the insulating layer 118 and the active layer 120 can also be formed by digital printing, spraying technology, pad printing, transfer, immersion plating, screen printing technology, or powder coating, etc., without the disclosed electricity. Coating technology and coating methods are limited.

Referring to FIG. 11, a first conductive layer 121 is formed on the surface of the active layer 120 by an electroless plating process. The electroless plating process described in this embodiment is, for example For the electroless plating process, the step of placing the susceptor 11 in a plating solution for a predetermined time is taken out from the plating solution, and a first conductive layer 121 is formed on the surface of the active layer 120 of the susceptor 11, in this embodiment. In the example, the first conductive layer 121 has a thickness of about 0.1 μm to 0.25 μm. Moreover, the first conductive layer 121 suitable for the present embodiment can also be processed by sputtering, immersion plating or vapor deposition, which can also achieve the purpose of forming the first conductive layer 121 without forming the active layer 120. It is not limited to the electroless plating processing method disclosed in the embodiment.

Referring to FIG. 12, a portion of the first conductive layer 121 and the corresponding active layer 120 are removed by laser to form a line pattern region 123 and a non-line pattern region 124, a line pattern region 123 and a non-line pattern region 124 which are isolated from each other. Each includes a first conductive layer 121 and a corresponding active layer 120. In this step, the first conductive layer 121 and the corresponding active layer 120 are ablated by the laser beam along the periphery of the line pattern region 123, so that the ablated position forms a trench-shaped isolation region 125, by the isolation region 125. The line pattern area 123 and the non-line pattern area 124 are defined and isolated.

Referring to FIG. 13, a second conductive layer 122 is formed in the wiring pattern region 123 by an electroplating process to form the conductive traces 12. In the embodiment, the thickness of the second conductive layer 122 is between 0.2 μm and 0.5 μm. Since the first conductive layer 121 and the active layer 120 of both the line pattern region 123 and the non-line pattern region 124 are not continuous, the second conductive layer may be selectively plated only on the surface of the first conductive layer 121 of the line pattern region 123. The layer 122, and the thickness of the second conductive layer 122 after plating is higher than the thickness of the first conductive layer 121 of the non-line pattern region 124, so that the line pattern region 123 is significantly protruded from the non-line pattern region 124. In particular, the material of the electroplated positive electrode (not shown) is composed of The first conductive layer 121 of the circuit pattern region 123 is electrically connected to the negative electrode member (not shown), and the positive electrode member and the susceptor 11 are immersed in an electrolyte solution composed of copper ions, and the power supply of the direct current is applied. The copper of the positive electrode member releases electrons and becomes copper ions, and the copper ions in the solution are reduced to copper atoms at the first conductive layer 121 of the line pattern region 123 electrically connected to the negative electrode member and accumulate on the surface thereof to form a second. Conductive layer 122. It should also be noted that the second conductive layer 122 can also be formed by, for example, electroless plating, and is not limited to the electroplating process in this example. Furthermore, in other embodiments, the second conductive layer 122 may also be omitted, and after the first conductive layer 121 is formed on the surface of the active layer 120 by an electroless plating process, the conductive traces 12 are formed.

Referring to FIG. 14, the first conductive layer 121 and the active layer 120 other than the line pattern region 123 are removed. That is, the conductive layer 12 is formed on the surface of the insulating layer 118 of the susceptor 11 by removing the active layer 120 and the first conductive layer 121 of the non-line pattern region 124, for example, by chemical cleaning, and at least one end of the conductive trace 12 extends to Connect the wall 113 (as shown in Figure 4).

Referring to FIG. 15, a light-emitting element 13 is disposed on the conductive line 12 and electrically connected. 15 is a cross-sectional view taken along the line XV-XV in FIG. 4, specifically, the light-emitting element 13 is fixed on the surface of the conductive line 12 by red glue, and is electrically conductive by solder paste. The line 12 forms an electrical connection such that the conductive line 12 forms a complete electrical connection path with the light-emitting element 13.

Finally, with reference to FIG. 7 , after the light-emitting elements 13 are disposed on the conductive line 12 and electrically connected to the light-emitting elements 13 , a diffusion layer 3 covering the light-emitting elements 13 is formed on the susceptor 11 in a dispensing manner, so that the light-emitting elements are 13 Uniform light is emitted, and thus the light-emitting unit 1 of the present invention is prepared.

It should be noted that in other embodiments, an active metal-containing active layer 120 may be formed on the surface of the insulating layer 118 by screen printing, pad printing, transfer printing or digital printing, and the active layer 120 has conductive lines. 12 identical patterns. In other words, the patterned activation layer 120 can be directly formed by the above-described manner. Therefore, in the subsequent step of the manufacturing method of the light-emitting unit, it is not necessary to remove the portion of the first conductive layer 121 and the corresponding activation layer 120 by laser. The step of removing the first conductive layer 121 and the active layer 120 other than the line pattern region 123 is also unnecessary.

It should be noted that, through the activation layer 120, the first conductive layer 121 formed by the plating process, and the second conductive layer 122 formed by the electroplating process, only the conductive line 12 is formed on the surface of the insulating layer 118 of the susceptor 11 for the present invention. One of the ways in which the light-emitting element 13 is mounted, and other processes that can directly form a conductive line on an insulating surface, such as the conventional Laser Direct Structuring (LDS) technology or other molded interconnect device (Molded Interconnect Device, The MID) technique can also be applied to the present invention to form conductive lines as well. Specifically, the process of forming a conductive line directly on the insulating surface in the present invention means that it does not need to pass through an electronic circuit such as a printed circuit board (PCB) or a flexible circuit board (FPC), or an intermediary carrier of the component, that is, The conductive traces can be attached directly to the insulating surface.

Referring to FIG. 16, FIG. 17, and FIG. 18, the second embodiment of the manufacturing method of the light-emitting unit of the present invention is substantially the same as that of the first embodiment. However, in the second embodiment, a metal substrate 117 having a flat shape is provided first. And forming an insulating layer 118 on one surface of the metal substrate 117, and then on the insulating layer The surface of 118 forms an active layer 120 comprising an active metal.

Referring to FIG. 19, the metal substrate 117, the insulating layer 118, and the active layer 120 are then bent into a pedestal 11 including a bottom wall 111, a surrounding wall 112, and a connecting wall 113. The surrounding wall 112 extends outwardly from the periphery of the bottom wall 111 and forms a first angle θ with the bottom wall 111, and the connecting wall 113 extends outwardly from the periphery of the surrounding wall 112 and forms a second angle with the surrounding wall 112. .

Referring to FIG. 20 to FIG. 24, the remaining detailed steps are the same as those of the first embodiment, and will not be further described herein.

Referring to FIG. 3, a plurality of light-emitting units 1 are manufactured by the manufacturing method of the above embodiment, and the light-emitting units 1 are connected to each other and closely arranged in an array, and then the light-emitting units 1 are framed by the frame 2 And further modularized to make a backlight for a display screen.

Referring to FIG. 25, which is a cross-sectional view taken along the line XXV-XXV in FIG. 4, one end of each conductive line 12 is electrically connected to the positive electrode, and the other end is electrically connected to the negative electrode, and is electrically conductive. The line 12 and the three light-emitting elements 3 are connected in series to each other to form a conductive path. However, the conductive paths may be formed in parallel or in series and in parallel with each other, and are not limited to the disclosed conductive paths formed in series with each other.

In summary, the surrounding wall 112 and the bottom wall 111 of the base 11 of the light-emitting unit 1 can be designed to have different bending angles according to environmental requirements, that is, the degree of the first angle θ can be appropriately adjusted according to the required illumination range. Adjustment, and further through the conductive line 12 can be formed on at least one of the bottom surface 114 or the surrounding surface 115, so that the light-emitting element 13 can be located on the bottom surface 114 or the surrounding surface 115 to provide illumination ranges of different angles and directions. In addition, 1 can be installed in each light-emitting unit 1 Up to 5 light-emitting elements 13 and without the need to replace different pedestals 11 to achieve different illumination brightness effects. Moreover, the light-emitting unit 1 cooperates with the surrounding surface 115 by the bottom surface 114 to form the susceptor 11 into a structure similar to a concentrating mask, so that the illumination concentration of the illuminating element 13 can be increased, and the conventional packaging can be omitted. Components such as boards, while reducing assembly costs. Furthermore, the susceptor 11 includes a metal layer 117 having excellent thermal conductivity to improve heat conduction efficiency and accelerate heat dissipation of the illuminating element 13 to increase the load wattage limit, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

1‧‧‧Lighting unit

11‧‧‧Base

13‧‧‧Lighting elements

2‧‧‧Frame

Claims (22)

A lighting unit includes: a base having a bottom wall; and a surrounding wall extending outward from the peripheral edge of the bottom wall and at a first angle to the bottom wall, the bottom wall having a bottom surface, the surrounding wall having a a conductive line, at least one of the bottom surface and the surrounding surface of the pedestal; and at least one illuminating element disposed on the surface of the conductive line and electrically connected to the conductive line, wherein The conductive line has an active layer and a first conductive layer. The active layer is formed on a portion of the surface of the susceptor, and the first conductive layer is formed on the active layer. The light-emitting unit of claim 1, wherein the bottom surface of the base has a rectangular shape, and the surrounding surface has four surrounding faces respectively extending from four sides of the bottom surface and connected to each other. The light-emitting unit of claim 2, wherein each of the surrounding faces of the pedestal has a trapezoidal shape. The illuminating unit of claim 2, comprising at least three illuminating elements, the conductive line is formed on the bottom surface of the pedestal and the two opposite surrounding portions of the pedestal, and the positions of the illuminating elements respectively correspond to the bottom surface And the two surround the face. The illuminating unit of claim 2, comprising at least four illuminating elements, the conductive lines are formed on the surrounding faces, and the positions of the illuminating elements respectively correspond to the surrounding faces. The illuminating unit of claim 2, comprising at least five illuminating elements, the conductive lines are formed on the bottom surface and the surrounding surfaces, and the illuminating elements are disposed at positions corresponding to the bottom surface and the surrounding surfaces, respectively. The illuminating unit of claim 1, wherein the pedestal comprises a metal layer, and an insulating layer formed on a surface of the metal layer, the metal layer and the insulating layer covering the bottom surface and the surrounding surface of the pedestal, and An active layer of the conductive line is formed on a portion of the surface of the insulating layer. The lighting unit of claim 1, wherein the base has a connecting wall extending outwardly from the circumference of the surrounding wall and at a second angle to the surrounding wall. The light emitting unit of claim 1, further comprising a diffusion layer formed in the base and covering the light emitting element. A light-emitting device comprising: a plurality of light-emitting units arranged in an array on a plane, each light-emitting unit comprising: a base having a bottom wall, and an outer wall extending outward from the bottom wall and forming a line with the bottom wall a surrounding wall having a first angle, the bottom wall having a bottom surface, the surrounding wall having a surrounding surface; a conductive line formed at least directly on one of a bottom surface and a surrounding surface of the base; and at least one light emitting element disposed On the surface of the conductive line, and electrically connected to the conductive line, wherein the conductive line has an active layer and a first conductive layer, the active layer is formed on a part of the surface of the base, the first guide An electrical layer is formed on the active layer. The light-emitting device of claim 10, wherein the bottom surface of the base has a rectangular shape, and the surrounding surface has four surrounding faces extending from four sides of the bottom surface and connected to each other. The illuminating device of claim 10, wherein the pedestal comprises a metal layer, and an insulating layer formed on a surface of the metal layer, the metal layer and the insulating layer covering the bottom surface and the surrounding surface of the pedestal, and An active layer of the conductive line is formed on a portion of the surface of the insulating layer. The illuminating device of claim 10, wherein the base of each of the illuminating units has a connecting wall extending outward from the peripheral edge of the surrounding wall and at a second angle to the surrounding wall, the light emitting units being connected to each other The walls are connected, and at least one end of each of the conductive lines extends to the connecting wall, so that the light emitting elements are electrically connected by the corresponding conductive lines. The illuminating device of claim 13, further comprising a frame on which the illuminating unit is framed, such that the connecting walls of the illuminating units are closely abutted to each other, so as to extend to the One end of the conductive lines connecting the walls is electrically connected. A manufacturing method of a light emitting unit, comprising the steps of: bending a metal substrate into a metal layer including a bottom wall and a surrounding wall, the surrounding wall extending outward from the peripheral edge of the bottom wall and forming a first angle with the bottom wall And the bottom wall has a bottom surface, the surrounding wall has a surrounding surface; the bottom surface of the metal layer and the surrounding surface form an insulating layer, and the metal layer and the insulating layer are matched to form a pedestal; Forming a conductive line directly on the surface of the insulating layer of the pedestal; and disposing and electrically connecting at least one light emitting element on the conductive line, wherein the step of forming a conductive line on the surface of the insulating layer of the pedestal comprises: An active layer comprising an active metal is formed on the surface of the insulating layer; and a first conductive layer is formed on the surface of the active layer by an electroless plating process. The method of manufacturing the light-emitting unit of claim 15, wherein the step of forming a conductive line on the surface of the insulating layer of the pedestal further comprises: removing a portion of the first conductive layer and the corresponding active layer to form a mutual isolation And a non-line pattern area, the line pattern area and the non-line pattern area comprise the first conductive layer and the corresponding activation layer. The method for manufacturing a light-emitting unit according to claim 15, further comprising forming a diffusion layer covering the light-emitting element on the conductive line after the conductive line is disposed and electrically connected to the at least one light-emitting element. The method of manufacturing the light emitting unit of claim 15, wherein the metal layer further comprises a connecting wall extending outward from the peripheral edge of the surrounding wall and at a second angle to the surrounding wall, and the insulating layer extends to the connecting wall And at least one end of the conductive line extends to the connecting wall. A method for manufacturing a light emitting unit, comprising the steps of: forming an insulating layer on a surface of a metal substrate; forming an active layer containing an active metal on the surface of the insulating layer; The metal substrate, the insulating layer and the active layer are bent into a base including a bottom wall and a surrounding wall, the surrounding wall extending outward from the peripheral edge of the bottom wall and at a first angle with the bottom wall; Forming a conductive line on the surface of the active layer of the pedestal; and disposing and electrically connecting at least one light emitting element on the conductive line, wherein the step of forming a conductive line on the surface of the active layer of the pedestal comprises: performing an electroless plating process The surface of the active layer forms a first conductive layer. The method of manufacturing a light emitting unit according to claim 19, wherein the step of forming a conductive line on the surface of the active layer of the pedestal further comprises: removing a portion of the first conductive layer and the corresponding active layer to form a mutual isolation And a non-line pattern area, the line pattern area and the non-line pattern area comprise the first conductive layer and the corresponding activation layer. The method for manufacturing a light-emitting unit according to claim 19, further comprising forming a diffusion layer covering the light-emitting element on the conductive line after the conductive line is disposed and electrically connected to the at least one light-emitting element. The method of manufacturing the light-emitting unit of claim 19, wherein the base further comprises a connecting wall extending outward from the peripheral edge of the surrounding wall and at a second angle to the surrounding wall, and at least one end of the conductive line extends to The connecting wall.