TWI591286B - Method of manufacturing an illumination device - Google Patents

Description

Lighting device manufacturing method

The present invention relates to a method, and more particularly to a method of manufacturing a lighting device.

Referring to FIG. 1 , a conventional lighting device 9 includes a light panel 91 , a plurality of light emitting diode strips 92 , and a plurality of light sheets 93 .

The lamp panel 91 has a plurality of receiving slots 911 which are spaced apart from each other and are respectively provided for the LED strips 92. The bottom of the panel 91 is provided with a circuit board (not shown). The LED strips 92 are electrically connected to the circuit board, respectively. The lamp segments 93 are respectively disposed on the lamp panel 91 to close the accommodating slots 911. Therefore, the light-emitting diode strips 92 in each of the accommodating slots 911 can be designed to converge the light emitted by the recessed structure of the accommodating recesses 911, so as to increase the concentration of the light and pass through the light sheet 93. The light is more uniform.

However, the general circuit board has a poor thermal conductivity, so that the light-emitting diode strip 92 does not easily dissipate heat when it operates, and the recessed structure of the receiving slot 911 can only converge light, and cannot provide other illumination range modes. For example: astigmatism or flat light, so how to develop a good thermal conductivity and Illumination devices capable of achieving a variety of illumination range types have become the subject of research in the present invention.

Accordingly, it is an object of the present invention to provide an illumination device that achieves a variety of illumination range profiles while at the same time improving thermal conductivity.

Accordingly, it is another object of the present invention to provide a method of fabricating a lighting device that can ameliorate the disadvantages of the prior art.

Thus, in some embodiments, the illumination device of the present invention comprises: a pedestal, a plurality of conductive lines, and a plurality of illuminating elements. The base includes a plurality of flat portions and a plurality of bent portions that are staggered and connected to each other. The conductive lines are formed directly on the pedestal. The light-emitting elements are respectively disposed on the surface of the conductive lines and electrically connected to the conductive lines, and the light-emitting elements are disposed at positions corresponding to at least one of the bent portion and the flat portion of the base .

Therefore, in some embodiments, the manufacturing method of the illuminating device of the present invention comprises the steps of: bending a metal plate into a plurality of flat portions and a plurality of bent portions which are staggered and connected to each other to form a base a metal layer; an insulating layer is formed on the surface of the metal layer to jointly form the pedestal; a plurality of conductive lines are directly formed on the surface of the insulating layer; and a plurality of illuminating elements are disposed on the conductive line and electrically connected to the plurality of illuminating elements, The light-emitting elements are disposed at positions corresponding to at least one of the bent portions of the base and the flat portions.

Thus, the method of manufacturing the illumination device of the present invention is implemented in some implementations. In an aspect, the method comprises the steps of: forming an insulating layer on a surface of one of the metal plates; bending the metal plate on which the insulating layer is formed into a pedestal, the pedestal comprising a plurality of slabs staggered and connected to each other And a plurality of bent portions; forming a plurality of conductive lines directly on the surface of the insulating layer; and electrically connecting the plurality of light emitting elements on each of the conductive lines.

Thus, in some embodiments of the present invention, the lamp holder is provided with a plurality of light-emitting elements, the method comprising the steps of: forming an insulating layer on a surface of a metal plate; the insulating layer is formed The metal plate of the layer is bent into a base, the base includes a plurality of flat portions and a plurality of bent portions which are alternately arranged and connected to each other; and a plurality of conductive lines are directly formed on the surface of the insulating layer, and the conductive lines are respectively provided for At least one light emitting element is disposed and electrically connected thereto.

The invention has the effect that the light-emitting elements can be selectively disposed at different positions of the flat plate portion and the bent portion, so that the illumination device can provide various illumination ranges. When the light-emitting elements are respectively disposed on the bent portions, a condensing or astigmatizing effect can be generated; and when the light-emitting elements are respectively disposed on the flat portions, a flat light effect can be produced. Moreover, the susceptor is made of a metal plate having good thermal conductivity, and can accelerate the heat dissipation of the illuminating elements to improve the heat dissipation efficiency of the illuminating device.

1‧‧‧Base

11‧‧‧ Flat section

12‧‧‧Bend

121‧‧‧ first base

122‧‧‧second base

123‧‧‧First bevel

124‧‧‧second bevel

111‧‧‧ first plane

112‧‧‧ second plane

13‧‧‧ vents

14‧‧‧metal layer

15‧‧‧Insulation

2‧‧‧Electrical circuit

20‧‧‧Active layer

21‧‧‧First conductive layer

22‧‧‧Second conductive layer

23‧‧‧Line pattern area

24‧‧‧Non-line pattern area

25‧‧‧Isolated area

3‧‧‧Lighting elements

4‧‧‧ mask

D1‧‧‧ first direction

P‧‧‧ plane

101‧‧‧Steps

102‧‧‧Steps

103‧‧‧Steps

104‧‧‧Steps

Other features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the accompanying drawings in which: FIG. 1 is a perspective view illustrating a conventional lighting device; FIG. 2 is a block diagram illustrating the illumination of the present invention. The main method of manufacturing the device FIG. 3 is a perspective view showing a pedestal of the illuminating device of the present invention, the pedestal includes a plurality of flat portions and a plurality of bent portions which are staggered and connected to each other; FIG. 4 is a perspective view illustrating the pedestal FIG. 5 is a cross-sectional view illustrating a first embodiment of a method of manufacturing a lighting device, the step of bending a metal plate into a base; FIG. 6 is a cross-sectional view illustrating the first embodiment a step of forming an insulating layer on the pedestal; FIG. 7 is a cross-sectional view showing the step of forming an active layer containing an active metal on the surface of the insulating layer in the first embodiment; FIG. 8 is a cross-sectional view showing the first embodiment The step of forming a first conductive layer on the surface of the active layer by the electroless plating process; FIG. 9 is a cross-sectional view showing the first conductive layer and the corresponding active layer removed from the first embodiment to form a line pattern isolated from each other. And a non-line pattern area step; FIG. 10 is a cross-sectional view showing the step of forming a second conductive layer in the circuit pattern region by the electroplating process to form a conductive line; FIG. 11 is a FIG. 12 is a cross-sectional view showing the steps of the first embodiment for disposing and electrically connecting the light-emitting elements on the conductive line; FIG. 13 is a cross-sectional view showing a second embodiment of a method of manufacturing a lighting device, the step of forming an insulating layer on one surface of a metal plate; and FIG. 14 is a cross-sectional view showing the second embodiment having an insulating layer. a step of bending a metal plate into a base, the base comprising a plurality of flat portions and a plurality of bent portions which are alternately arranged and connected to each other; FIG. 15 is a cross-sectional view showing that the second embodiment forms a first layer before the insulating layer a step of forming a layer of patterned regions to form an active layer; FIG. 16 is a cross-sectional view showing the step of forming a first conductive layer on the surface of the active layer by an electroless plating process in the second embodiment; FIG. 17 is a cross-sectional view The second embodiment is characterized in that a second conductive layer is formed on the surface of the first conductive layer by an electroplating process to form a conductive line; FIG. 18 is a cross-sectional view showing that the second embodiment is disposed on the conductive line. And a step of electrically connecting the light-emitting elements; FIG. 19 is a cross-sectional view showing a third embodiment of the manufacturing method of the illumination device, the step of forming a patterned activation layer on the surface of the insulating layer by a printing technique; FIG. 20 is a cross-sectional view illustrating The third embodiment is a step of forming a first conductive layer on the surface of the active layer by an electroless plating process; FIG. 21 is a cross-sectional view showing the third embodiment of the surface of the first conductive layer by an electroplating process Step of forming a second conductive layer to form a conductive line; FIG. 22 is a cross-sectional view showing the step of bending the metal plate having the insulating layer into a pedestal according to the third embodiment, the pedestal including staggered and phased a plurality of connected flat portions and a plurality of bent portions; FIG. 23 is a cross-sectional view showing the step of disposing and electrically connecting the light emitting elements on the conductive lines in the third embodiment; Figure 24 is a perspective view showing an embodiment of the lighting device of the present invention; Figure 25 is a cross-sectional view showing the position of each of the light-emitting elements of the embodiment corresponding to a bend of a base A base surface in which a conductive line is not shown; FIG. 26 is a perspective view showing another embodiment of the lighting device of the present invention; and FIG. 27 is a cross-sectional view showing three light-emitting portions of the other embodiment. The arrangement positions of the components respectively correspond to a second base surface and a second second slope of one of the bent portions of the base, wherein the conductive lines are not shown; FIG. 28 is a perspective view showing still another embodiment of the lighting device of the present invention. FIG. 29 is a cross-sectional view showing the arrangement position of each of the light-emitting elements of the further embodiment corresponding to a flat portion of a base, wherein the conductive lines are not shown.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

The following description of the embodiments is intended to be illustrative of the specific embodiments The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", etc., are merely directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

Referring to FIG. 2, it is one of the manufacturing methods of the lighting device of the present invention. The main steps of the first embodiment are shown in the following steps, and the implementation steps are further explained below with other drawings.

Referring to Figures 3, 4 and 5, step 101 is a stamping and bending of a metal sheet into a metal layer 14 of a susceptor 1. The susceptor 1 has a wave plate shape and includes a plurality of flat plate portions 11 and a plurality of bent portions 12 which are alternately arranged and connected to each other. Each of the bent portions 12 is bent toward a first direction D1, and each of the flat plate portions 11 is formed with a plurality of heat dissipation holes 13 which are spaced apart from each other. Here, FIG. 5 only schematically depicts a single bent portion 12 and an adjacent flat portion 11. However, in this step, the heat dissipation holes 13 are also formed by punching (see FIG. 3).

Referring to FIG. 6, step 102 forms an insulating layer 15 on the surface of the metal layer 14 by Electro-Deposition Coating, and the metal layer 14 and the insulating layer 15 together form the susceptor 1. In the present embodiment, the insulating layer 15 is located only inside the bent portion 12 and has a thickness of 15 μm to 25 μm. However, in other embodiments, the insulating layer 15 may be integrally formed on the inner side of the bent portion 12 and the surface of the flat portion 11 on the same side, instead of being selectively located only inside the bent portion 12 as in the present embodiment.

Referring to FIG. 7 to FIG. 11, the step 103 is described to directly form the conductive line 2 on the surface of the insulating layer 15. The detailed sub-steps of this embodiment are as follows: Referring to FIG. 7, an active layer 20 containing an active metal is formed on the surface of the insulating layer 15 by a spray coating technique, and the thickness of the active layer 20 is between 15 μm and 30 μm. It should be noted that the insulating layer 15 and the active layer 20 can also be formed by digital printing, screen printing, pad printing, transfer, immersion plating, coating technology, or powder coating, etc., without the disclosed electricity. Painting technology and spraying technology are limited.

Referring to FIG. 8, the surface of the active layer 20 is formed by an electroless plating process. The first conductive layer 21 is formed. The electroless plating process described in this embodiment is, for example, an electroless plating process, in which the susceptor 1 is placed in a plating solution for a predetermined time and then taken out from the plating solution, and the active layer 20 of the susceptor 1 is removed. The surface forms the first conductive layer 21. In the present embodiment, the first conductive layer 21 has a thickness of about 0.1 μm to 0.25 μm. Moreover, the first conductive layer 21 suitable for the present embodiment can also be processed by sputtering, immersion plating or vapor deposition, which can also achieve the purpose of forming the first conductive layer 21 without forming the active layer 20, and It is not limited to the electroless plating process disclosed in this embodiment.

Referring to FIG. 9 and FIG. 10, a portion of the first conductive layer 21 and the corresponding active layer 20 are removed by laser to form a line pattern region 23 and a non-line pattern region 24, a line pattern region 23 and a non-line which are isolated from each other. The pattern regions 24 each include a first conductive layer 21 and a corresponding active layer 20. In this step, the first conductive layer 21 and the corresponding active layer 20 are ablated by the laser beam along the periphery of the line pattern area 23, so that the ablated position forms a groove-shaped isolation region 25, by the isolation region 25 The line pattern area 23 and the non-line pattern area 24 are defined and isolated. In addition, as shown in FIG. 9 and FIG. 10, when the isolation region 25 is formed by ablation of the first conductive layer 21 and the active layer 20 by the laser beam by controlling the appropriate power of the laser, the laser light ablation depth can be only It is limited to the first conductive layer 21 and the active layer 20 without destroying the insulating layer 15 below, that is, in the overall process of forming the conductive line 2 in this embodiment, the integrity of the insulating layer 15 is not damaged or affected, in other words, The insulating layer 15 does not need to be specially modified to match the pattern or configuration design of the different conductive lines 2, so that the processing time of the conductive lines 2 can be shortened.

Then, a second guide is formed in the line pattern region 23 by an electroplating process. The electric layer 22 is formed to form the conductive line 2. In the present embodiment, the thickness of the second conductive layer 22 is between 0.2 μm and 0.5 μm. Since the first conductive layer 21 and the active layer 20 of both the line pattern region 23 and the non-line pattern region 24 are not continuous, the second conductive layer 22 may be plated only on the surface of the first conductive layer 21 of the line pattern region 23. And the thickness of the second conductive layer 22 after plating is higher than the thickness of the first conductive layer 21 of the non-line pattern region 24, so that the line pattern region 23 is significantly protruded from the non-line pattern region 24. In particular, the electroplated positive electrode member (not shown) is made of copper, and the first conductive layer 21 of the line pattern region 23 is electrically connected to the negative electrode member (not shown), and the positive electrode member and the susceptor 1 are immersed. After being placed in an electrolyte solution containing copper ions and being supplied with a direct current power source, the copper of the positive electrode member releases electrons and becomes copper ions, and the copper ions in the solution are in the first conductive layer of the line pattern region 23 electrically connected to the negative electrode member. 21 is reduced to copper atoms and deposited on the surface thereof to form a second conductive layer 22.

Referring to FIG. 11, the first conductive layer 21 and the active layer 20 other than the line pattern region 23 are removed. That is, the conductive layer 2 is formed on the surface of the insulating layer 15 of the susceptor 1 by removing the active layer 20 and the first conductive layer 21 of the non-line pattern region 24, for example, by chemical cleaning.

Finally, referring to FIG. 12, step 104 is provided on the conductive line 2 and electrically connected to the light-emitting element 3. Specifically, the light-emitting element 3 is fixed on the surface of the conductive line 2 with red glue, and is electrically connected to the conductive line 2 by solder paste, so that the conductive line 2 and the light-emitting element 3 form a complete electrical connection path.

It should also be noted that the first conductive layer 21 is formed through the active layer 20 and, for example, a plating process to form conductive lines on the surface of the insulating layer 15 of the susceptor 1. The road 2 is only one of the ways in which the conductive line is directly formed on the surface of the insulating layer 15 of the susceptor 1 for the light-emitting element 3 to be mounted and guided. Other processes for forming a conductive line directly on an insulating surface, such as the conventional mine Laser Direct Structuring (LDS) technology or other Molded Interconnect Device (MID) technology can also be applied to the present invention to form conductive lines. Specifically, the process of forming a conductive line directly on the insulating surface in the present invention means that it does not need to pass through an electronic circuit such as a printed circuit board (PCB) or a flexible circuit board (FPC), or an intermediary carrier of the component, that is, The conductive traces can be attached directly to the insulating surface.

Referring to FIGS. 13 to 18, in a second embodiment of the manufacturing method of the illumination device, the insulating layer 15 may be formed on one surface of one of the metal plates 14, and then the metal plate 14 having the insulating layer 15 on the surface may be stamped and bent. The pedestal 1 is formed into a wave plate shape. Then, the conductive line 2 is formed directly on the surface of the insulating layer 15. Next, the light-emitting element 3 is placed and electrically connected to the conductive line 2. The step of forming the conductive line 2 may also have another embodiment, which is described in detail below. Referring to FIG. 15, a mask 4 is formed on the surface of the insulating layer 15 to expose a line pattern region 23, and then sprayed to the line. The pattern area 23 forms the active layer 20, and then the mask 4 is removed. It can also be implemented in such a manner that a patterned activation layer 20 is directly formed on the surface of the insulating layer 15 by a printing technique. Referring to FIG. 16 and FIG. 17, then, a subsequent electroless plating process is performed to form the first conductive layer 21 and an electroplating process to form the second conductive layer 22 in the same manner as described above, and will not be further described herein. This embodiment can eliminate the step of removing the first conductive layer 21 and the active layer 20 other than the line pattern region 23.

In addition, referring to FIG. 19 to FIG. 23, a third embodiment of the manufacturing method of the illuminating device is a metal plate 14 having the insulating layer 15 and the conductive line 2 on the surface after the conductive line 2 is directly formed on the surface of the insulating layer 15. The base 1 is stamped and bent into a wave-like shape, and then the light-emitting element 3 is placed. In particular, since the conductive line 2 has been formed on the surface of the insulating layer 15, the bending angle of the susceptor 1 has its limitation, and in order to ensure that the conductive line 2 is not damaged during the bending process, it is usually conductive. A protective layer (not shown) is added to the surface of the line 2 to prevent the conductive line 2 from being broken or shorted.

Referring to FIG. 12, FIG. 24 and FIG. 25, one embodiment of the illumination device obtained by the above manufacturing method comprises: a susceptor 1, a plurality of conductive lines 2, and a plurality of light-emitting elements 3.

The susceptor 1 has a wave plate shape and includes a plurality of flat plate portions 11 and a plurality of bent portions 12 which are alternately arranged and connected to each other. Each of the bent portions 12 is bent toward a first direction D1 and has a first base surface 121 facing the plane P where the flat plate portion 11 is located, and a pair of opposite sides from the first base surface 121 are respectively bent toward the flat plate portion 11 The first inclined surface 123 is extended and the first inclined surface 123 is disposed opposite to each other. In this embodiment, as shown in FIG. 25, the first base surface 121 and the two first inclined surfaces 123 of each bent portion 12 collectively define a trapezoidal cross section. Each of the flat plate portions 11 is formed with a plurality of heat dissipation holes 13 arranged at intervals along the longitudinal direction thereof, and the heat dissipation holes 13 facilitate ventilation to facilitate heat dissipation.

The conductive lines 2 are formed directly on the susceptor 1 and are respectively disposed on the first base surface 121 of the bent portion 12 and extend along the longitudinal direction of the first base surface 121. The light-emitting elements 3 are respectively disposed on the surface of the conductive line 2 and electrically connected to the conductive line 2, and each of the conductive lines 2 is provided with a plurality of spaced apart from each other. Arranged light-emitting elements 3. Since the light-emitting elements 3 are respectively located inside the curved shape of the bent portion 12, the light emitted from the light-emitting element 3 can be reflected and concentrated by the first base surface 121 and the two first inclined surfaces 123 facing each other to form a concentrating type illumination device.

It is to be noted that the conductive lines 2 may be respectively disposed on the first base surface 121 of the bent portion 12 and the two first inclined surfaces 123 facing each other and extending along the length direction of the first base surface 121, and the light-emitting elements 3 respectively It is disposed on the surface of the conductive line 2 and forms an electrical connection with the conductive line 2. In this way, the light in three directions emitted by the light-emitting element 3 can be just placed at a focus.

Furthermore, as shown in FIG. 12, the susceptor 1 includes a metal layer 14, and an insulating layer 15 on a portion of the surface of the metal layer 14. The metal layer 14 covers the flat portion 11 and the bent portion 12 of the base 1, and the insulating layer 15 covers only the first base surface 121 and the first inclined surface 123 of the bent portion 12, in other words, the flat portion 11 of the base 1 is not Covering the insulating layer 15 can provide a good heat dissipation effect by directly exposing the metal layer 14 to the air. In the present embodiment, the material of the metal layer 14 is aluminum alloy or stainless steel, but other materials having good thermal conductivity may be used, and are not limited thereto. Therefore, the susceptor 1 accelerates the heat dissipation of the illuminating element 3 by the metal layer 14 to improve the heat conduction efficiency; the material of the insulating layer 15 may be selected from an insulating material such as an epoxy resin or an acryl resin, but may also be other insulation. The material is not limited to the scope of this embodiment. In addition, if the material of the metal layer 14 is a glossy metal, the insulating layer 15 may be made of a transparent material; and if the material of the metal layer 14 is a non-gloss metal, the material of the insulating layer 15 must be white or bright. The color of the face is good for reflecting light. of course If the metal layer 14 and the insulating layer 15 are both non-white or glossy, the white or glossy ink may be applied to the surface of the insulating layer 15 to achieve the effect of reflecting light. In addition, in other embodiments, the susceptor 1 may be entirely made of an insulating material, and is not limited to form an insulating layer 15 on the surface of the metal layer 14 as in this example to provide an insulating surface.

Each of the conductive lines 2 is directly formed on the surface of the insulating layer 15 and includes an active layer 20, a first conductive layer 21, and a second conductive layer 22. The active layer 20 is located on the surface of the susceptor 1 and contains an active metal selected from the group consisting of palladium, rhodium, platinum, silver, or a combination of such catalytic metal sources for forming the first conductive layer 21. Catalytic metal deposition. . The first conductive layer 21 is formed on the active layer 20 and is made of nickel or copper, and is not limited by the embodiment. The second conductive layer 22 is disposed on the first conductive layer 21 and is made of copper to provide good electrical conductivity. The light-emitting elements 3 are disposed on the second conductive layer 22 and electrically connected to the second conductive layer 22. In this embodiment, the light-emitting element 3 is a light-emitting diode, and of course, other types of light-emitting diodes. The components are not limited to the embodiment. As shown in FIG. 23, it should be noted that one end of each conductive line 2 is electrically connected to the positive electrode, and the other end is electrically connected to the negative electrode, and the conductive line 2 and the light-emitting elements 3 are connected in series to each other to form a conductive path, but The conductive paths may also be formed in parallel or in series and in parallel with each other, and are not limited to the disclosed conductive paths formed in series with each other. Moreover, in the embodiment, the conductive line 2 is directly formed on the insulating layer 15 of the susceptor 1, so that the heat generated by the illuminating element 3 can be quickly transmitted to the susceptor 1 to dissipate heat, and the illuminating element is disposed on the circuit board as compared with the general illuminating element. The (PCB) is then mounted on a pedestal to speed up the heat dissipation rate.

Referring to FIG. 26 and FIG. 27, another embodiment of the illuminating device of the present invention is substantially the same as the foregoing embodiment. However, in the embodiment, each bent portion 12 of the susceptor 1 has a back flat portion. The second base surface 122 of the plane P where 11 is located, and a pair of second slopes 124 bent from the opposite sides of the second base surface 122 toward the flat plate portion 11 are disposed opposite to each other. That is, the second base surface 122 of each bent portion 12 is opposite to the first base surface 121, and the second inclined surface 124 is opposite to the corresponding first inclined surface 123.

The conductive lines 2 are respectively disposed on the second base surface 122 and the second inclined surface 124 of the bent portion 12 and extend along the second base surface 122. The light-emitting elements 3 are respectively disposed on the surface of the conductive line 2 and electrically connected to the conductive lines 2, and each of the conductive lines 2 is provided with a plurality of light-emitting elements 3 arranged at intervals. Since the light-emitting elements 3 are respectively located outside the curved shape of the bent portion 12 and the second base surface 122 and the second inclined surface 124 opposite to each other are respectively oriented in different directions, the light emitted by the light-emitting element 3 can be diverged in a plurality of directions to form astigmatism. Type of lighting device.

Referring to FIG. 28 and FIG. 29, still another embodiment of the illuminating device of the present invention is substantially the same as the foregoing embodiment. However, in the embodiment, each flat portion 11 of the susceptor 1 has a first side on the opposite side. A flat surface 111 and a second flat surface 112, and the bent portion 12 protrudes toward the second flat surface 112 side and is formed with a plurality of heat dissipation holes 13 which are spaced apart from each other. The conductive lines 2 are respectively disposed on the first plane 111 of the flat plate portion 11 and extend longitudinally along the first plane 111. The light-emitting elements 3 are respectively disposed on the surface of the conductive line 2 and electrically connected to the conductive lines 2, and each of the conductive lines 2 is provided with a plurality of light-emitting elements 3 arranged at intervals. Since the light-emitting elements 3 are respectively located on the flat plate portion The first plane 111 of the first light 111 causes the light emitted from the light-emitting element 3 to be directly emitted without being reflected by the bent portion 12, thereby forming a flat-light type illumination device.

In summary, the light-emitting elements 3 are disposed at different positions of the flat plate portion 11 or the bent portion 12, so that the illumination device generates different illumination ranges, and the base 1 has a wave-like design, which can increase the bilateral sides of the two-way structure. Force direction to facilitate the production of larger lighting fixtures. In addition, by the good thermal conductivity of the metal layer 14 of the susceptor 1 and the ventilation assistance of the vent holes 13, the illuminating device can accelerate the heat dissipation of the illuminating element 3 to achieve a better heat dissipation effect, thereby increasing the load wattage of the illuminating device. limit. More importantly, the manufacturing method of directly forming the susceptor 1 through the conductive line 2 can omit the structure of the conventional circuit board, and contribute to the realization of a lighter and more structurally illuminating device, so that the present invention can be achieved. The purpose.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

101‧‧‧Steps

102‧‧‧Steps

103‧‧‧Steps

104‧‧‧Steps

Claims (21)

A manufacturing method of a lighting device, comprising the steps of: bending a metal plate into a plurality of flat portions and a plurality of bent portions including staggered and connected to each other to form a metal layer of a base; An insulating layer is formed on the surface of the layer to jointly form the pedestal; a plurality of conductive lines are directly formed on the surface of the insulating layer; and a plurality of illuminating elements are disposed and electrically connected to each of the conductive lines, and the positions of the illuminating elements are respectively corresponding to At least one of the bent portions and the flat portions of the pedestal, wherein the step of forming the conductive lines directly on the surface of the insulating layer comprises: forming an active metal on the surface of the insulating layer An activation layer; forming a first conductive layer on the surface of the active layer by an electroless plating process; removing a portion of the first conductive layer and the corresponding active layer to form a line pattern region and a non-line pattern region which are isolated from each other The circuit pattern region and the non-line pattern region both include the first conductive layer and the corresponding activation layer; and forming a second conductive layer in the circuit pattern region by an electroplating process To form the conductive line. The method of manufacturing the lighting device of claim 1, wherein each of the bent portions of the base has a first base surface that is closer to the flat portions, and the In the step of disposing and electrically connecting the plurality of light-emitting elements on each of the conductive lines, the light-emitting elements are respectively disposed on the first base surface of the bent portion. The method of manufacturing the illuminating device of claim 1, wherein each of the bent portions of the pedestal has a second base surface that is farther away from the flat portion, and the electrical connection is provided on each conductive line. In the step of illuminating elements, the illuminating elements are respectively disposed on the second base surface of the bent portion. The method of manufacturing the illumination device of claim 1, further comprising forming at least one of the plurality of spaced apart heat dissipation holes in the flat portion of the base. A manufacturing method of a lighting device, comprising the steps of: bending a metal plate into a plurality of flat portions and a plurality of bent portions including staggered and connected to each other to form a metal layer of a base; An insulating layer is formed on the surface of the layer to jointly form the pedestal; a plurality of conductive lines are directly formed on the surface of the insulating layer; and a plurality of illuminating elements are disposed and electrically connected to each of the conductive lines, and the positions of the illuminating elements are respectively corresponding to At least one of the bent portion and the flat portion of the pedestal, wherein the step of forming the conductive lines directly on the surface of the insulating layer comprises: forming a mask on the surface of the insulating layer a line pattern area is exposed; forming an active layer containing an active metal in the line pattern area Forming a first conductive layer on the surface of the active layer by an electroless plating process; and forming a second conductive layer on the surface of the first conductive layer by an electroplating process. The method of manufacturing the illuminating device of claim 5, wherein each of the bent portions of the pedestal has a first base surface that is closer to the flat plate portions, and the plurality of conductive lines are disposed on each of the conductive lines and electrically connected In the step of illuminating elements, the illuminating elements are respectively disposed on the first base surface of the bent portion. The manufacturing method of the illuminating device of claim 5, wherein each of the bent portions of the pedestal has a second base surface farther away from the flat plate portions, and the electrical connection is provided on each of the conductive lines. In the step of illuminating elements, the illuminating elements are respectively disposed on the second base surface of the bent portion. The method of manufacturing the illumination device of claim 5, wherein at least one of the flat portions of the pedestal further comprises a plurality of spaced apart heat dissipation holes. A manufacturing method of a lighting device, comprising the steps of: bending a metal plate into a plurality of flat portions and a plurality of bent portions including staggered and connected to each other to form a metal layer of a base; Forming an insulating layer on the surface of the layer to jointly form the pedestal; forming a plurality of conductive lines directly on the surface of the insulating layer; and disposing and electrically connecting the plurality of illuminating elements on each of the conductive lines, The arrangement positions of the light-emitting elements respectively correspond to at least one of the bent portions of the pedestal and the flat portions, wherein the step of directly forming the conductive lines on the surface of the insulating layer comprises: printing technology Forming a patterned activation layer on the surface of the insulating layer, the active layer comprises an active metal; forming a first conductive layer on the surface of the active layer by an electroless plating process; and forming an electroplating process on the surface of the first conductive layer a second conductive layer. The method of manufacturing the lighting device of claim 9, wherein each of the bent portions of the base has a first base surface that is closer to the flat plate portions, and the plurality of conductive lines are disposed on each of the conductive lines and electrically connected In the step of illuminating elements, the illuminating elements are respectively disposed on the first base surface of the bent portion. The method of manufacturing the illuminating device of claim 9, wherein each of the bent portions of the pedestal has a second base surface that is farther away from the flat portion, and the electrical connection is provided on each conductive line. In the step of illuminating elements, the illuminating elements are respectively disposed on the second base surface of the bent portion. The method of manufacturing the illumination device of claim 9, further comprising forming at least one of the plurality of spaced apart heat dissipation holes in the flat portion of the base. A method of manufacturing a lighting device, comprising the steps of: forming an insulating layer on a surface of a metal plate; The metal plate on which the insulating layer is formed is bent into a pedestal, and the pedestal includes a plurality of flat portions and a plurality of bent portions which are alternately arranged and connected to each other; and a plurality of conductive lines are directly formed on the surface of the insulating layer; Providing a plurality of light-emitting elements on each of the conductive lines, wherein the step of forming the conductive lines directly on the surface of the insulating layer comprises: forming an active layer containing an active metal on the surface of the insulating layer; Forming a first conductive layer on the surface of the active layer; removing a portion of the first conductive layer and the corresponding active layer to form a line pattern region and a non-line pattern region which are isolated from each other, the circuit pattern region and The non-line pattern region includes the first conductive layer and the corresponding activation layer; and a second conductive layer is formed in the circuit pattern region by an electroplating process to form the conductive line. The method of manufacturing the lighting device of claim 13, wherein each of the bent portions of the base has a first base surface that is closer to the flat plate portions, and the plurality of conductive lines are disposed on each of the conductive lines and electrically connected In the step of illuminating elements, the illuminating elements are respectively disposed on the first base surface of the bent portion. The method of manufacturing the illumination device of claim 13, further comprising forming at least one of the spaced apart heat dissipation holes in at least one of the flat portions of the base. A manufacturing method of a lighting device, comprising the steps of: forming an insulating layer on one surface of a metal plate; bending the metal plate on which the insulating layer is formed into a base, the bases being staggered and connected to each other a plurality of flat portions and a plurality of bent portions; forming a plurality of conductive lines directly on the surface of the insulating layer; and disposing and electrically connecting the plurality of light emitting elements on each of the conductive lines, wherein the conductive layers are directly formed on the surface of the insulating layer The step of the circuit includes: forming a mask on the surface of the insulating layer to expose a line pattern region; forming an active layer containing an active metal in the line pattern region; and forming a surface on the surface of the active layer by an electroless plating process a conductive layer; and forming a second conductive layer on the surface of the first conductive layer by an electroplating process. The method of manufacturing the lighting device of claim 16, wherein each of the bent portions of the base has a first base surface that is closer to the flat plate portions, and the plurality of conductive lines are disposed on each of the conductive lines and electrically connected In the step of illuminating elements, the illuminating elements are respectively disposed on the first base surface of the bent portion. The method of manufacturing the illumination device of claim 16, further comprising forming at least one of the spaced apart heat dissipation holes in at least one of the flat portions of the base. A manufacturing method of a lighting device, comprising the steps of: forming an insulating layer on one surface of a metal plate; bending the metal plate on which the insulating layer is formed into a base, the bases being staggered and connected to each other a plurality of flat portions and a plurality of bent portions; forming a plurality of conductive lines directly on the surface of the insulating layer; and disposing and electrically connecting the plurality of light emitting elements on each of the conductive lines, wherein the conductive layers are directly formed on the surface of the insulating layer The step of routing includes: forming a patterned activation layer on the surface of the insulating layer by a printing technique, the activation layer comprising an active metal; forming a first conductive layer on the surface of the active layer by an electroless plating process; and performing an electroplating process Forming a second conductive layer on the surface of the first conductive layer. The manufacturing method of the illuminating device of claim 19, wherein each of the bent portions of the pedestal has a first base surface closer to the flat plate portions, and the plurality of conductive lines are disposed on each of the conductive lines and electrically connected In the step of illuminating elements, the illuminating elements are respectively disposed on the first base surface of the bent portion. The method of manufacturing the illumination device of claim 19, further comprising forming at least one of the spaced apart heat dissipation holes in at least one of the flat portions of the base.