CN110392488B - Method for manufacturing high-frequency circuit board - Google Patents
Method for manufacturing high-frequency circuit board Download PDFInfo
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- CN110392488B CN110392488B CN201910561516.6A CN201910561516A CN110392488B CN 110392488 B CN110392488 B CN 110392488B CN 201910561516 A CN201910561516 A CN 201910561516A CN 110392488 B CN110392488 B CN 110392488B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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Abstract
The invention relates to the technical field of circuit board processing, and provides a method for manufacturing a high-frequency circuit board, which comprises the steps of material preparation, thin copper preparation, thick copper circuit manufacturing and thin copper circuit manufacturing, wherein in the thin copper preparation step, copper films are plated on two opposite board surfaces of a core board to form thin copper plates on the core board, and dry films are attached to the side board surfaces of the thin copper plates, which are deviated from the core board, wherein the thin copper plates are provided with a thin copper plate area, a thick copper plate area and a non-working board area; in the thick copper circuit manufacturing step, the thick copper plate area is exposed firstly, then the thick copper plate area is developed to form a base thick copper circuit, a dry film of an area corresponding to the base thick copper circuit is removed, finally, a copper film is plated on the base thick copper circuit to form a top base thick copper circuit on the base thick copper circuit, and the base thick copper circuit and the top base thick copper circuit form the thick copper circuit together. The manufacturing method of the high-frequency circuit board greatly shortens the manufacturing process and improves the manufacturing efficiency and the processing yield.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a method for manufacturing a high-frequency circuit board.
Background
In order to ensure the signal integrity of the high-frequency circuit board, a thick copper circuit and a thin copper circuit with smaller thickness than the thick copper circuit are arranged on a circuit layer of the high-frequency circuit board in the related industry, so that an area provided with the thin copper circuit has larger etching factors and better line width uniformity, and the high-frequency circuit can meet better electrical performance requirements.
However, the conventional method for manufacturing the high frequency circuit board requires a plurality of pattern transfer processes and a plurality of etching processes to manufacture the thin copper circuit and the thick copper circuit, respectively, which results in a long process, low efficiency and low processing yield, and thus results in high manufacturing cost.
Disclosure of Invention
The invention aims to provide a method for manufacturing a high-frequency circuit board, and aims to solve the problems of long process, low efficiency and low processing yield of the conventional method for manufacturing the high-frequency circuit board.
In order to solve the technical problems, the technical scheme of the invention is as follows: a high-frequency circuit board manufacturing method is used for manufacturing a high-frequency circuit board, the high-frequency circuit board comprises a core board and circuit layers, the circuit layers are arranged on two opposite board surfaces of the core board, each circuit layer comprises a thick copper circuit and a thin copper circuit, the thickness of each thick copper circuit is larger than that of each thin copper circuit, and the method comprises the following steps:
preparing a material, namely preparing a dry film and the core plate;
preparing thin copper, namely plating copper films on two opposite plate surfaces of the core plate to form thin copper plates on the core plate, and attaching the dry film to the side plate surface of each thin copper plate, which is far away from the core plate, wherein each thin copper plate is provided with at least one thin copper plate area, at least one thick copper plate area and a non-work plate area outside each thin copper plate area and each thick copper plate area;
manufacturing a thick copper circuit, namely performing exposure treatment on the thick copper plate area, performing development treatment on the thick copper plate area to form a base thick copper circuit, removing the dry film of an area corresponding to the base thick copper circuit, and finally performing copper plating on the base thick copper circuit to form a top base thick copper circuit on the base thick copper circuit, wherein the base thick copper circuit and the top base thick copper circuit form the thick copper circuit together;
and manufacturing a thin copper circuit, namely performing circuit manufacturing on the thin copper plate area to form the thin copper circuit.
Further, the core board includes an inner substrate and a base copper board, the base copper board is disposed on two opposite surfaces of the inner substrate, and after the thin copper circuit manufacturing step, the high-frequency circuit board manufacturing method further includes the steps of:
and etching the outer layer, and etching the thin copper plate and the base copper plate outside the corresponding areas of the thick copper circuit and the thin copper circuit together.
Further, before the step of collectively etching the thin copper plate and the base copper plate outside the region corresponding to the thick copper wiring and the thin copper wiring, the outer layer etching step may further include performing tin plating on the thick copper wiring and the thin copper wiring to make the thick copper wiring and the thin copper wiring resistant to etching.
Further, after the step of collectively etching the thin copper plate and the base copper plate outside the region corresponding to the thick copper wiring and the thin copper wiring, the outer layer etching step may further include removing tin plating films on the thick copper wiring and the thin copper wiring.
Further, before the step of plating the tin film on the thick copper wire and the thin copper wire, the outer layer etching step further includes a step of chemically pretreating the thin copper plate to remove impurities on the surface of the thin copper plate.
Further, the outer layer etching step may further include removing the dry film remaining on the surface of the thin copper plate after the step of plating the tin film on the thick copper wiring and the thin copper wiring and before the step of collectively etching the thin copper plate and the base copper plate outside the region corresponding to the thick copper wiring and the thin copper wiring.
Further, in the thin copper preparing step, the step of plating copper films on the two opposite surfaces of the core board to form the thin copper plates on the core board includes plating copper films on the two opposite surfaces of the core board to form copper plated plates on the core board, and performing copper reduction processing on the copper plated plates to form the thin copper plates, wherein the thickness of the copper plated plates is greater than that of the thin copper plates.
Further, in the thin copper line manufacturing step, the thin copper plate region is subjected to line manufacturing by ablation to form the thin copper line, and the dry film in a region corresponding to the thin copper line is removed.
Further, in the thin copper line fabrication step, CO is passed2And ablating the dry film in the area corresponding to the thin copper circuit by a laser process to manufacture the circuit.
Furthermore, the thickness of the thin copper plate is 17-23 μm.
The invention has the beneficial effects that:
the manufacturing method of the high-frequency circuit board comprises the steps of firstly forming a thin copper plate with the thickness same as that of a preset thin copper circuit on the surface of a core plate, attaching a dry film on the thin copper plate, then exposing and developing a thick copper plate area of the thin copper plate to form a base thick copper circuit, carrying out copper plating thickening on the base thick copper circuit to finally form the thick copper circuit with the preset thickness, and then carrying out circuit manufacturing on the thin copper plate area of the thin copper plate to obtain the thin copper circuit with the preset thickness. The manufacturing method of the high-frequency circuit board provided by the invention does not need to respectively manufacture the thin copper circuit and the thick copper circuit through a plurality of pattern transfer processes and etching processes, greatly shortens the manufacturing process, thereby improving the manufacturing efficiency and the processing yield to a certain extent and reducing the manufacturing cost to a certain extent.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a high-frequency circuit board according to an embodiment of the present invention;
fig. 2 is a schematic sectional view of a high-frequency wiring board when a thin copper plate is formed on a core board;
FIG. 3 is a schematic sectional view of a high-frequency circuit board in which a dry film is attached to a thin copper plate;
FIG. 4 is a schematic sectional view of a high-frequency wiring board when a base thick copper wiring is formed in a thick copper board region;
FIG. 5 is a schematic cross-sectional view of a high-frequency circuit board when a thick copper circuit is formed in a thick copper plate region;
FIG. 6 is a schematic sectional view of a high-frequency wiring board when a thin copper wiring is formed in a thin copper plate region;
FIG. 7 is a schematic sectional view of a high-frequency wiring board when tin plating is performed on a thin copper wiring and a thick copper wiring;
FIG. 8 is a schematic sectional view of the high-frequency wiring board after the outer layer etching step.
Reference numerals:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
110 | |
| 120 | |
101 | |
| 200 | |
300 | |
| 301 | Thin |
302 | Thick |
| 400 | |
410 | Substrate |
| 420 | Top-base |
500 | |
| 600 | Tin-plated film |
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the embodiments of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
with the high-frequency and high-speed development of the electronic information industry, the circuit board is gradually changed from a traditional circuit to a high-frequency circuit. In order to ensure the signal integrity of the high-frequency circuit board, in the related industry, a thick copper circuit and a thin copper circuit with smaller thickness than the thick copper circuit are arranged on a circuit layer of the high-frequency circuit board, for example, a thin copper circuit is arranged in a surface antenna radio frequency area of the high-frequency circuit board, so that the area provided with the thin copper circuit has a larger etching factor and better line width uniformity, and the area can meet better electrical performance requirements. On the one hand, however, in the conventional method for manufacturing the high-frequency circuit board, the thin copper circuit and the thick copper circuit are respectively manufactured through a plurality of pattern transfer processes and a plurality of etching processes, so that the problems of long process, low efficiency and low processing yield exist, and the manufacturing cost of the high-frequency circuit board is high; on the other hand, when the traditional high-frequency circuit board manufacturing method is used for attaching the dry film, the problem that the dry film is not firmly pressed is easily caused because a certain thickness difference exists between a circuit layer area for preparing the thick copper circuit and a circuit layer area for preparing the thin copper circuit, so that the dry film cannot completely play a role in blocking electroplating and etching, the phenomenon of seepage and corrosion of the thick copper circuit and the thin copper circuit in the etching process is easily caused, and the processing yield of the high-frequency circuit board is greatly influenced to a certain extent.
Referring to fig. 1, to solve the above problems, an embodiment of the present invention provides a method for manufacturing a high frequency circuit board, which is used to manufacture the high frequency circuit board, the high frequency circuit board includes a core board 100 and circuit layers, the core board 100 is provided with circuit layers on two opposite surfaces thereof, the circuit layers include a thick copper circuit 400 and a thin copper circuit 500, the thickness of the thick copper circuit 400 is greater than that of the thin copper circuit 500, and the method for manufacturing the high frequency circuit board includes the steps of material preparation, thin copper preparation, thick copper circuit manufacturing and thin copper circuit manufacturing. It should be noted that, preferably, the core board 100 is provided with circuit layers on two opposite board surfaces thereof.
In the material preparation step, the dry film 200 and the core board 100 are prepared. It should be noted that the dry film 200 is a polymer compound having a certain viscosity and good photosensitivity, and can generate a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the adhered plate surface, thereby playing a certain role in blocking plating and etching. It should be noted that the core board 100 is a core board 100 formed by a multilayer substrate after processes of inner layer circuit fabrication, lamination, outer layer drilling and the like, and specifically, the core board 100 includes an inner substrate 110 formed by laminating a plurality of layers of substrates, a base copper board 120 laminated on two opposite sides of the inner substrate 110, and an interconnection hole 101 provided through the inner substrate 110 and the base copper board 120 and used for filling a conductive material to realize conductive connection between the inner substrate 110 and the base copper board 120.
In the thin copper preparation step, copper films are plated on two opposite surfaces of the core board 100 to form thin copper plates 300 on the core board 100, and then the dry film 200 is attached on the side surfaces of the thin copper plates 300 away from the core board 100, wherein the thin copper plates 300 have at least one thin copper plate area 301, at least one thick copper plate area 302, and a non-work plate area outside each thin copper plate area 301 and each thick copper plate area 302. It should be noted that, referring to fig. 1 and 2, a thin copper plate 300 with a certain thickness can be formed on the surface of the core board 100 by performing a copper plating operation (i.e., an electroplating copper operation), and the thickness of the thin copper plate 300 is set to be equal to the thickness of the predetermined thin copper line 500. The surface of the thin copper plate 300 can be correspondingly divided into a thin copper plate area 301, a thick copper plate area 302 and a non-work plate area according to the distribution of the preset thin copper circuit 500 and the preset thick copper circuit 400. Referring to fig. 1 and 3, the prepared dry film 200 is then attached to the surface of the thin copper plate 300. Based on the thin copper preparation steps, on one hand, the thin copper plate area 301 with the preset thickness of the thin copper line 500 can be directly obtained, so that the subsequent thin copper line 500 is favorably manufactured, and the thickness precision of the thin copper line 500 is favorably ensured; on the other hand, the surface of the thin copper plate 300 can be ensured to be flush, and the adhesion tightness between the dry film 200 and the surface of the thin copper plate 300 can be ensured, so that the problem of poor pressing of the dry film 200 in the prior art is solved, and the dry film 200 can completely exert the functions of blocking electroplating and etching. It should be added that, in order to further ensure that the dry film 200 is effectively adsorbed on the surface of the thin copper plate 300, the surface of the thin copper plate 300 may be roughened to improve the surface roughness of the thin copper plate 300.
In the thick copper circuit manufacturing step, the thick copper plate area 302 is exposed, the thick copper plate area 302 is developed to form the base thick copper circuit 410, the dry film 200 in the area corresponding to the base thick copper circuit 410 is removed, and finally, the copper film is plated on the base thick copper circuit 410 to form the top base thick copper circuit 420 on the base thick copper circuit 410, wherein the base thick copper circuit 410 and the top base thick copper circuit 420 form the thick copper circuit 400 together. It should be noted that in the thin copper preparation step, the thick copper plate region 302 has attached the dry film 200 with good photosensitivity. Based on this, referring to fig. 1 and 4, a film negative with circuit patterns is placed on the thick copper plate area 302, and then is exposed by ultraviolet rays, wherein the dry film 200 corresponding to the transparent and light-transmitting portion (i.e. the non-circuit pattern portion) of the negative is irradiated by ultraviolet rays and undergoes a polymerization reaction to be hardened. The dry film 200 that has not undergone the polymerization reaction, i.e., the dry film 200 corresponding to the circuit pattern portion, is then washed away by a developing process, thereby removing the dry film 200 at a region corresponding to the underlying thick copper circuit 410 and exposing the underlying thick copper circuit 410. Referring to fig. 1 and 5, after the base thick copper circuit 410 is exposed, a copper plating operation (i.e., an electroplating copper operation) is performed on the base thick copper circuit 410, so as to form a top base thick copper circuit 420 by electroplating and thickening on the base thick copper circuit 410, the top base thick copper circuit 420 and the base thick copper circuit 410 jointly form a thick copper circuit 400 with a certain thickness, and the thickness of the thick copper circuit 400 is set according to the thickness of the preset thick copper circuit 400. Based on the thick copper circuit manufacturing steps, the thick copper circuit 400 with the preset thickness can be accurately formed in a short process, the efficiency is high, and the processing yield is high.
It should be noted that, in the process of performing the developing process on the thick copper plate area 302, the dry film 200 protects the thin copper plate area 301 from being washed and flushed by the developing process liquid.
It should be noted that the time interval between the step of attaching the dry film 200 to the side plate surface of the thin copper plate 300 away from the core board 100 and the step of exposing the thick copper plate area 302 should be within 15 minutes to 24 hours, because when the interval time is less than 15 minutes, the adhesion tightness between the dry film 200 and the surface of the thin copper plate 300 is not good, which is not good for the exposure step; when the interval time is longer than 24 hours, the close contact between the dry film 200 and the thin copper plate 300 is too tight, which is not favorable for the development process, especially for removing the dry film 200 in the region corresponding to the base thick copper circuit 410.
It should be noted that the step of exposing the thick copper plate region 302 and the step of developing the thick copper plate region 302 should be separated by a certain time to provide the time required for the polymerization reaction of the dry film 200 to be sufficiently polymerized.
Referring to fig. 1 and 6, in the thin copper line fabricating step, a thin copper plate area 301 is subjected to line fabrication to form a thin copper line 500. It should be noted that after the thick copper lines 400 are formed, the corresponding thin copper lines 500 can be formed in the thin copper plate area 301, so as to finally form the thick copper lines 400 and the thin copper lines 500 with a certain thickness difference.
The method for manufacturing the high-frequency circuit board provided by the embodiment of the invention comprises the steps of firstly forming the thin copper plate 300 with the thickness same as that of the preset thin copper circuit 500 on the board surface of the core board 100, attaching the dry film 200 on the thin copper plate 300, then exposing and developing the thick copper plate area 302 of the thin copper plate 300 to form the base thick copper circuit 410, carrying out copper plating thickening on the base thick copper circuit 410 to finally form the thick copper circuit 400 with the preset thickness, and then carrying out circuit manufacturing on the thin copper plate area 301 of the thin copper plate 300 to obtain the thin copper circuit 500 with the preset thickness. The method for manufacturing the high-frequency circuit board provided by the embodiment of the invention does not need to respectively manufacture the thin copper circuit 500 and the thick copper circuit 400 through a plurality of image transfer processes and etching processes, greatly shortens the manufacturing process, thereby improving the manufacturing efficiency and the processing yield to a certain extent and reducing the manufacturing cost to a certain extent.
Referring to fig. 1 and 8, in the present embodiment, the core board 100 includes an inner substrate 110 and a base copper board 120, the inner substrate 110 is provided with the base copper board 120 on two opposite surfaces thereof, and after the thin copper circuit manufacturing step, the high frequency circuit board manufacturing method further includes an outer layer etching step.
In the outer layer etching step, the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper wiring 400 and the thin copper wiring 500 are etched together. Here, referring to fig. 8, based on this step, the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper wiring 400 and the thin copper wiring 500 are etched together, and only the thin copper plate 300 and the base copper plate 120 corresponding to the region corresponding to the thick copper wiring 400 and the thin copper wiring 500 remain, thereby forming the wiring layer of the high-frequency wiring board. Based on this step, the thin copper plate 300 and the base copper plate 120 of the non-wiring portion can be etched and finally formed into the wiring layer only by one etching process, which not only greatly shortens the manufacturing process, but also improves the manufacturing efficiency and the processing yield to a certain extent and reduces the manufacturing cost to a certain extent.
Referring to fig. 1 and 7-8, in the present embodiment, before the step of etching the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper wire 400 and the thin copper wire 500 together, the outer layer etching step further includes performing a tin plating film 600 on the thick copper wire 400 and the thin copper wire 500 to make the thick copper wire 400 and the thin copper wire 500 resistant to etching. It should be noted that, in the present embodiment, tin is used as a resist, and the tin plating film 600 is performed on the thick copper wire 400 and the thin copper wire 500 (i.e., performing tin electroplating operation), so that a tin plating film 600 having blocking and protecting functions can be formed on the outer layer of the thick copper wire 400 and the thin copper wire 500, thereby preventing the thick copper wire 400 and the thin copper wire 500 from being corroded by the etching solution during etching, and ensuring the signal integrity of the thick copper wire 400 and the thin copper wire 500 to a certain extent.
Referring to fig. 1 and 7-8, in the present embodiment, after the step of etching the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper wire 400 and the thin copper wire 500, the outer layer etching step further includes removing the tin-plated film 600 on the thick copper wire 400 and the thin copper wire 500. It should be noted here that after the process of collectively etching the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper wiring 400 and the thin copper wiring 500, i.e., after only the thin copper plate 300 and the base copper plate 120 corresponding to the region corresponding to the thick copper wiring 400 and the thin copper wiring 500 are left, the tin plating film 600 for blocking the etching solution and protecting the thick copper wiring 400 and the thin copper wiring 500 at the time of etching should be removed to further secure the signal integrity of the thick copper wiring 400 and the thin copper wiring 500. Preferably, the tin plating film 600 is removed by, but not limited to, a tin stripping solution.
Referring to fig. 1, 7-8, in the present embodiment, before the step of performing the tin plating film 600 on the thick copper lines 400 and the thin copper lines 500, the outer layer etching step further includes performing a chemical pretreatment on the thin copper plate 300 to remove impurities on the surface of the thin copper plate 300. It should be noted that, by removing the impurities on the thin copper plate 300 through chemical pretreatment, the adhesion and uniformity between the tin-plated film 600 and the thin copper plate 300 can be improved to some extent, thereby further ensuring the etching resistance of the tin-plated film 600 on the thick copper lines 400 and the thin copper lines 500.
Referring to fig. 1 and 7-8, in the present embodiment, after the step of performing the tin plating film 600 on the thick copper wire 400 and the thin copper wire 500, and before the step of collectively etching the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper wire 400 and the thin copper wire 500, the outer layer etching step further includes removing the dry film 200 remaining on the surface of the thin copper plate 300. It should be noted that, by removing the dry film 200 remaining on the surface of the thin copper plate 300, the protective effect of the dry film 200 on the base copper plate 120 can be removed, thereby ensuring the integrity of the subsequent process of collectively etching the thin copper plate 300 and the base copper plate 120 outside the region corresponding to the thick copper line 400 and the thin copper line 500, further improving the yield and reducing the manufacturing cost.
Referring to fig. 1 and 2, in the present embodiment, in the thin copper preparing step, the steps of plating copper films on the two opposite surfaces of the core board 100 to form the thin copper plate 300 on the core board 100 include plating copper films on the two opposite surfaces of the core board 100 to form a copper plated plate on the core board 100, and performing a copper reduction process on the copper plated plate to form the thin copper plate 300, wherein the thickness of the copper plated plate is greater than the thickness of the thin copper plate 300. It should be noted that, when the copper plating operation is performed on the board surface of the core board 100 (i.e., when the copper electroplating operation is performed), the copper plating operation time may be correspondingly prolonged to form a copper plated board with a thickness greater than the thickness of the predetermined thin copper line 500, and then the copper reduction process is performed on the copper plated board to obtain the thin copper board 300 with the thickness equal to the thickness of the predetermined thin copper line 500. By doing so, on one hand, the situation that the copper plating operation needs to be performed repeatedly due to the situation that the thickness of the formed thin copper plate 300 is insufficient after the copper plating operation can be avoided, that is, the repeated manufacturing process is shortened to a certain extent, and the manufacturing efficiency of the thin copper plate 300 is improved; on the other hand, the flatness of the thin copper plate 300 can be ensured by the copper reduction process, so that the processing yield of the thin copper lines 500 and the thick copper lines 400 can be improved to a certain extent.
Referring to fig. 1 and 6, in the present embodiment, in the thin copper line fabrication step, a thin copper plate area 301 is patterned by ablation to form a thin copper line 500, and the dry film 200 in the area corresponding to the thin copper line 500 is removed. It should be noted that, according to the predetermined layout of the thin copper circuit 500, the thin copper circuit 500 can be exposed by ablating the dry film 200 in the corresponding region. The manufacturing method of the thin copper circuit 500 is simple and convenient to operate, and the formed thin copper circuit 500 has high accuracy, i.e. has high processing yield.
Referring to FIGS. 1 and 6, in the present embodiment, in the step of forming the thin copper lines, CO is introduced2The laser process ablates the dry film 200 in the area corresponding to the thin copper line 500 to make the line. It should be noted that, preferably, in the present embodiment, theWith CO2The laser process ablates the dry film 200 in the area corresponding to the thin copper circuit 500 according to the preset circuit plan of the thin copper circuit 500 to expose the thin copper circuit 500, which not only can ensure the contact ratio of the thin copper circuit 500 and the preset circuit, i.e. the processing yield, but also can avoid generating internal stress on the thin copper plate area 301 and damage of the thin copper plate area 301, thereby improving the quality and service life of the finally formed high-frequency circuit board to a certain extent.
Referring to fig. 1 and 2, in the present embodiment, the thin copper plate 300 has a thickness of 17 to 23 μm. It should be noted that, based on the above arrangement, on one hand, the finally formed thin copper circuit 500 can be ensured to have a larger etching factor and a better line width uniformity, so that the finally formed thin copper circuit 500 can meet better electrical performance requirements, and on the other hand, the processing yield of the thin copper circuit 500 and the thick copper circuit 400, that is, the processing yield of the high-frequency circuit board, can be ensured.
The method for manufacturing the high-frequency circuit board provided by the embodiment of the invention comprises the steps of firstly forming the thin copper plate 300 with the thickness same as that of the preset thin copper circuit 500 on the board surface of the core board 100, attaching the dry film 200 on the thin copper plate 300, then exposing and developing the thick copper plate area 302 of the thin copper plate 300 to form the base thick copper circuit 410, carrying out copper plating thickening on the base thick copper circuit 410 to finally form the thick copper circuit 400 with the preset thickness, and then carrying out circuit manufacturing on the thin copper plate area 301 of the thin copper plate 300 to obtain the thin copper circuit 500 with the preset thickness. The method for manufacturing the high-frequency circuit board provided by the embodiment of the invention does not need to respectively manufacture the thin copper circuit 500 and the thick copper circuit 400 through a plurality of image transfer processes and etching processes, greatly shortens the manufacturing process, thereby improving the manufacturing efficiency and the processing yield to a certain extent and reducing the manufacturing cost to a certain extent.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A high-frequency circuit board manufacturing method is used for manufacturing a high-frequency circuit board, the high-frequency circuit board comprises a core board and circuit layers, the circuit layers are arranged on two opposite board surfaces of the core board, each circuit layer comprises a thick copper circuit and a thin copper circuit, the thickness of each thick copper circuit is larger than that of each thin copper circuit, and the high-frequency circuit board manufacturing method is characterized by comprising the following steps:
preparing a material, namely preparing a dry film and the core plate, wherein the dry film has viscosity and photosensitivity;
preparing thin copper, namely plating copper films on two opposite plate surfaces of the core plate to form thin copper plates on the core plate, and attaching the dry film to the side plate surface of each thin copper plate, which is far away from the core plate, wherein each thin copper plate is provided with at least one thin copper plate area, at least one thick copper plate area and a non-work plate area outside each thin copper plate area and each thick copper plate area;
manufacturing a thick copper circuit, namely performing exposure treatment on the thick copper plate area, performing development treatment on the thick copper plate area to form a base thick copper circuit, removing the dry film of an area corresponding to the base thick copper circuit, and finally performing copper plating on the base thick copper circuit to form a top base thick copper circuit on the base thick copper circuit, wherein the base thick copper circuit and the top base thick copper circuit form the thick copper circuit together;
and in the thin copper circuit manufacturing step, performing circuit manufacturing on the thin copper plate area through ablation to form the thin copper circuit, and removing the dry film in an area corresponding to the thin copper circuit.
2. The method for manufacturing a high-frequency wiring board according to claim 1, wherein the core board comprises an inner substrate and a base copper board, the inner substrate is provided with the base copper board on both of its opposing surfaces, and after the thin copper wiring step, the method for manufacturing a high-frequency wiring board further comprises the steps of:
and etching the outer layer, and etching the thin copper plate and the base copper plate outside the corresponding areas of the thick copper circuit and the thin copper circuit together.
3. The method for manufacturing a high-frequency circuit board according to claim 2, wherein, prior to the step of collectively etching the thin copper plate and the base copper plate outside the regions corresponding to the thick copper wiring and the thin copper wiring, the outer layer etching step further includes performing tin plating on the thick copper wiring and the thin copper wiring to make the thick copper wiring and the thin copper wiring resist etching.
4. The method for manufacturing a high-frequency circuit board according to claim 3, wherein the outer layer etching step further includes removing tin-plated films on the thick copper wiring and the thin copper wiring after the step of collectively etching the thin copper plate and the base copper plate outside the regions corresponding to the thick copper wiring and the thin copper wiring.
5. The method for manufacturing a high-frequency circuit board according to claim 3, wherein the outer layer etching step further comprises a chemical pretreatment of the thin copper plate to remove impurities on a plate surface of the thin copper plate before the step of performing tin plating on the thick copper wiring and the thin copper wiring.
6. The method for manufacturing a high-frequency circuit board according to claim 3, wherein the outer layer etching step further comprises removing the dry film remaining on the surface of the thin copper plate after the step of performing tin plating on the thick copper wiring and the thin copper wiring and before the step of collectively etching the thin copper plate and the base copper plate outside the region corresponding to the thick copper wiring and the thin copper wiring.
7. The method for manufacturing a high-frequency circuit board according to claim 1, wherein the step of preparing the thin copper includes plating copper films on the opposite surfaces of the core substrate to form thin copper plates on the core substrate, and includes plating copper films on the opposite surfaces of the core substrate to form copper plated plates on the core substrate, and performing a copper reduction process on the copper plated plates to form the thin copper plates, wherein the thickness of the copper plated plates is greater than the thickness of the thin copper plates.
8. The method for manufacturing a high-frequency wiring board according to claim 1, wherein in said thin copper wiring forming step, CO is supplied2And ablating the dry film in the area corresponding to the thin copper circuit by a laser process to manufacture the circuit.
9. The manufacturing method of a high-frequency circuit board according to any one of claims 1 to 8, wherein the thickness of the thin copper plate is 17 to 23 μm.
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| CN103874339A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| CN107493658A (en) * | 2017-06-29 | 2017-12-19 | 珠海杰赛科技有限公司 | A kind of preparation method and equipment of copper thickness printed circuit board |
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| CN101616549B (en) * | 2009-07-21 | 2011-01-05 | 东莞康源电子有限公司 | Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
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| CN103338595B (en) * | 2013-07-09 | 2016-03-02 | 皆利士多层线路版(中山)有限公司 | Thick copper ladder wiring board and preparation method thereof |
| CN103731997A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
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| CN103002660A (en) * | 2011-09-13 | 2013-03-27 | 深南电路有限公司 | Circuit board and processing method thereof |
| CN103874339A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
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