CN104064859A - Manufacturing process of flexible antenna board - Google Patents
Manufacturing process of flexible antenna board Download PDFInfo
- Publication number
- CN104064859A CN104064859A CN201410289594.2A CN201410289594A CN104064859A CN 104064859 A CN104064859 A CN 104064859A CN 201410289594 A CN201410289594 A CN 201410289594A CN 104064859 A CN104064859 A CN 104064859A
- Authority
- CN
- China
- Prior art keywords
- inductive layer
- insulated substrate
- substrate film
- antenna board
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a manufacturing process of a flexible antenna board. The manufacturing process comprises the following steps: 1) selecting an insulation base film; 2) carrying out aluminium/copper etching or aluminium powder/copper powder printing; and 3) carrying out antioxidation processing. An inductive layer is formed by carrying out the aluminium/copper etching or aluminium powder/copper powder printing; the antenna board produced with the manufacturing process in the invention helps to reduce the impedance; the impedance of the antenna board which is not larger than 10. 1 cun is only 7-10 Ohm, and the impedance of the antenna board which is around 120 cun is no more than 200 Ohm; meanwhile, antioxidation processing is carried out cooperatively on the inductive layer, so that the antenna board is not easy to damage and has antioxidation function; the circuit is not easy to scratch by hard objects in the production and assembling process; the antenna board is good in reliability; when used in high/low temperature environment, the antenna board does not have any influence, so that the practicality of the product is improved; the service life of the antenna board in the invention is many times longer than that of the antenna board produced through the silver slurry printing technology; the antenna board is fully superior to the antenna board produced through the silver slurry printing technology in the aspects of cost, reliability and quality; and the antenna board in the invention is simple in process, low in cost, convenient to maintain and can be widely applied to the industry.
Description
Technical field
The present invention relates to antenna plate art, refer in particular to a kind of manufacture craft of flexible antennas plate.
Background technology
At present, former handwriting antenna plate is to adopt the printing of silver slurry in traditional handicraft, and this kind of way exists following technological deficiency in practical application:
First, the impedance comparison of flexible antennas plate silver slurry printing is high, 10.1 cun with interior conventionally 150 ohm of left and right, 10.1～1 size impedance meetings reach more than 150 ohm, what have even can reach more than 1000 ohm, the larger impedance of size meeting is larger.
Secondly, flexible antennas plate silver oar is printed in manufacture process and easily damages, easy oxidation of long duration, in the production assembling process center line appearance of a street easily by hard thing scratch.
Moreover reliability is also bad when flexible antennas plate silver oar is printed on batch production, great majority are to be assemblied in liquid crystal display screen inside, and in use liquid crystal display screen can produce certain temperature, can make the silver slurry of flexible antennas plate silver slurry printing be oxidized ahead of time reduction of service life.
Finally, the cost of silver slurry is very high, a kg silver slurry all more than several thousand RMB, thereby the cost of manufacture of flexible antennas plate is increased, be unfavorable for market competition.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide a kind of manufacture craft of flexible antennas plate, and it can effectively solve existing flexible antennas plate and have high, the easy damage of impedance, reliability is bad, cost is high problem.
For achieving the above object, the present invention adopts following technical scheme:
A manufacture craft for flexible antennas plate, includes following steps:
(1) choose insulated substrate film;
(2) aluminium, copper etching or aluminium powder, copper powder printing: a wherein surperficial pressing aluminum slice or the copper foil at insulated substrate film carries out etching formation array grid, thereby forms inductive layer; Or, on a wherein surface of insulated substrate film, with aluminium powder or copper powder printing, form array grid, thereby form inductive layer;
(3) anti-oxidant treatment: inductive layer is carried out to anti-oxidant treatment and form anti oxidation layer.
Preferably, described insulated substrate film is PE film or PET film.
Preferably, in described step (2), adopt the mode of dry plasma etch to carry out etching.
Preferably, aluminium powder or copper powder adopt steel mesh to print insulated substrate film after by chemical dilution in described step (2).
Preferably, in described step (3), adopt dielectric ink inductive layer is carried out to surface treatment and isolate with outside air, or, adopt the mode of coverlay that inductive layer and outside air are isolated.
A manufacture craft for flexible antennas plate, includes following steps:
(1) choose insulated substrate film;
(2) aluminium, copper etching or aluminium powder, copper powder printing: a wherein surperficial pressing aluminum slice or the copper foil at insulated substrate film carries out etching formation array grid, thereby forms the first inductive layer; Or, on the wherein surface at insulated substrate film, with aluminium powder or copper powder printing, form array grid, thereby form the first inductive layer;
(3) anti-oxidant treatment: the first inductive layer is carried out to anti-oxidant treatment and form the first anti oxidation layer;
(4) aluminium, copper etching or aluminium powder, copper powder printing: another surperficial pressing aluminum slice or the copper foil at insulated substrate film carries out etching formation array grid, thereby forms the second inductive layer; Or, on another surface at insulated substrate film, with aluminium powder or copper powder printing, form array grid, thereby form the second inductive layer;
(5) anti-oxidant treatment: the second inductive layer is carried out to anti-oxidant treatment and form the second anti oxidation layer.
Preferably, described insulated substrate film is PE film or PET film.
Preferably, in described step (2) and step (4), adopt the mode of dry plasma etch to carry out etching.
Preferably, aluminium powder or copper powder adopt steel mesh to print insulated substrate film after by chemical dilution in described step (2) and step (4).
Preferably, in described step (3) and step (5), adopt dielectric ink inductive layer is carried out to surface treatment and isolate with outside air, or, adopt the mode of coverlay that inductive layer and outside air are isolated.
The present invention compared with prior art has obvious advantage and beneficial effect, particularly, and as shown from the above technical solution:
By adopting aluminium, copper etching or aluminium powder, copper powder mode of printing to form inductive layer, the mode that adopts the printing of silver slurry that has replaced tradition, the antenna plate that the present invention makes has reduced impedance, and 10.1 cun are only had 7～10 ohm with internal impedance, can be over 200 ohm 120 cun of left and right impedances; Coordinate simultaneously inductive layer is carried out to anti-oxidant treatment, be not easy to damage, anti-oxidant, in production assembling process, circuit is difficult for by hard thing scratch, reliability is very good, in high and low temperature environment, use without any impact, improved product practicality, significantly surpass several times of silver slurry printing technology life-span useful life; In addition, the present invention is superior to the printing of silver slurry completely in cost, reliability and quality, and technique is simple, has reduced cost, easy to maintenance, can be extensively universal by industry.
For more clearly setting forth architectural feature of the present invention and effect, below in conjunction with accompanying drawing and specific embodiment, the present invention is described in detail:
Accompanying drawing explanation
Fig. 1 is the making schematic flow sheet of the first preferred embodiment of the present invention;
Fig. 2 is the sectional view of the first preferred embodiment antenna plate of the present invention;
Fig. 3 is the making schematic flow sheet of the second preferred embodiment of the present invention;
Fig. 4 is the sectional view of the second preferred embodiment antenna plate of the present invention.
Accompanying drawing identifier declaration:
10, flexible antennas plate 11, insulated substrate film
12, inductive layer 13, anti oxidation layer
14, insulated substrate film 15, the first inductive layer
16, the first anti oxidation layer 17, the second inductive layer
18, the second anti oxidation layer.
Embodiment
Please refer to shown in Fig. 2, it has demonstrated the concrete structure of the first preferred embodiment of the present invention, this flexible antennas plate 10 includes insulated substrate film 11, inductive layer 12 and anti oxidation layer 13, and this insulated substrate film 11, inductive layer 12 and anti oxidation layer 13 are folded and established successively from lower to upper.
The manufacture craft that the present embodiment flexible antennas plate is described in detail in detail is as follows:
As shown in Figure 1, include following steps:
(1) choose insulated substrate film 11; This insulated substrate film 11 can be PE film or PET film.
(2) aluminium, copper etching or aluminium powder, copper powder printing: a wherein surperficial pressing aluminum slice or the copper foil at insulated substrate film 11 carries out etching formation array grid, and each antenna grid belongs to an induction region, thereby forms inductive layer 12; Or, on a wherein surface of insulated substrate film 11, with aluminium powder or copper powder printing, forming array grid, each antenna grid belongs to an induction region, thereby forms inductive layer 12.
Particularly, while adopting engraving method, to adopt the mode of dry plasma etch to carry out etching, active group and etched presentation materials generation chemical reaction in one side plasma, generation can be brought into play product, and the ion in plasma is directed and accelerate to realize and to treat etched surfaces and carry out directed corrosion and accelerated corrosion under the effect of bias voltage on the other hand.
While adopting printing process, aluminium powder or copper powder adopt steel mesh to print insulated substrate film 11 after by chemical dilution.
Above two kinds of methods can normally be used radiationless to human body in all kinds of high and low temperature environments.
(3) anti-oxidant treatment: inductive layer 12 is carried out to anti-oxidant treatment and form anti oxidation layer 13, particularly, can adopt dielectric ink inductive layer 12 is carried out to surface treatment and isolate with outside air, or, adopt the mode of coverlay that inductive layer 12 and outside air are isolated.By carrying out having improved after oxidation processes the practicality of product, be also multiplied several times useful life.
During use, the control mainboard that flexible antennas plate 10 inserts connector after by the pressing of FPC soft board (not shown) forms former person's handwriting control subject structure, and being located at liquid crystal display screen intermediate layer or electronic whiteboard intermediate layer, while writing on liquid crystal display screen or on electronic whiteboard by electromagnetic pen, built-in flexible antennas plate 10 is transferred to control mainboard the induced signal of receiving and reads the former person's handwriting content of writing.
Please refer to shown in Fig. 4, it has demonstrated the concrete structure of the second preferred embodiment of the present invention, this flexible antennas plate 10 includes insulated substrate film 14, the first inductive layer 15 and the first anti oxidation layer 16, the second inductive layer 17 and the second anti oxidation layer 18, this first inductive layer 15 and the first anti oxidation layer 16 are stacked at a surface of insulated substrate film 14 successively, and this second inductive layer 17 and the second anti oxidation layer 18 are stacked at another surface of insulated substrate film 14 successively.
The manufacture craft that the present embodiment flexible antennas plate is described in detail in detail is as follows:
As shown in Figure 3, include following steps:
(1) choose insulated substrate film 14, the insulated substrate film 14 in the present embodiment is identical with the insulated substrate film 11 in the first preferred embodiment.
(2) aluminium, copper etching or aluminium powder, copper powder printing: a wherein surperficial pressing aluminum slice or the copper foil at insulated substrate film 14 carries out etching formation array grid, thereby forms the first inductive layer 15; Or, on the wherein surface at insulated substrate film 14, with aluminium powder or copper powder printing, form array grid, thereby form the first inductive layer 15.
(3) anti-oxidant treatment: the first inductive layer 15 is carried out to anti-oxidant treatment and form the first anti oxidation layer 16.
(4) aluminium, copper etching or aluminium powder, copper powder printing: another surperficial pressing aluminum slice or the copper foil at insulated substrate film 14 carries out etching formation array grid, thereby forms the second inductive layer 17; Or, on another surface at insulated substrate film 14, with aluminium powder or copper powder printing, form array grid, thereby form the second inductive layer 17.
(5) anti-oxidant treatment: the second inductive layer 17 is carried out to anti-oxidant treatment and form the second anti oxidation layer 18.
The using method of the present embodiment is identical with the using method of aforementioned the first preferred embodiment, and the using method at this to the present embodiment does not describe in detail.
Design focal point of the present invention is: by adopting aluminium, copper etching or aluminium powder, copper powder mode of printing to form inductive layer, the mode that adopts the printing of silver slurry that has replaced tradition, the antenna plate that the present invention makes has reduced impedance, 10.1 cun are only had 7～10 ohm with internal impedance, can be over 200 ohm 120 cun of left and right impedances; Coordinate simultaneously inductive layer is carried out to anti-oxidant treatment, be not easy to damage, anti-oxidant, in production assembling process, circuit is difficult for by hard thing scratch, reliability is very good, in high and low temperature environment, use without any impact, improved product practicality, significantly surpass several times of silver slurry printing technology life-span useful life; In addition, the present invention is superior to the printing of silver slurry completely in cost, reliability and quality, and technique is simple, has reduced cost, easy to maintenance, can be extensively universal by industry.
Know-why of the present invention has below been described in conjunction with specific embodiments.These are described is in order to explain principle of the present invention, and can not be interpreted as by any way limiting the scope of the invention.Explanation based on herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, within these modes all will fall into protection scope of the present invention.
Claims (10)
1. a manufacture craft for flexible antennas plate, is characterized in that: include following steps:
(1) choose insulated substrate film;
(2) aluminium, copper etching or aluminium powder, copper powder printing: a wherein surperficial pressing aluminum slice or the copper foil at insulated substrate film carries out etching formation array grid, thereby forms inductive layer; Or, on the surface of insulated substrate film, with aluminium powder or copper powder printing, form array grid, thereby form inductive layer;
(3) anti-oxidant treatment: inductive layer is carried out to anti-oxidant treatment and form anti oxidation layer.
2. the manufacture craft of flexible antennas plate as claimed in claim 1, is characterized in that: described insulated substrate film is PE film or PET film.
3. the manufacture craft of flexible antennas plate as claimed in claim 1, is characterized in that: in described step (2), adopt the mode of dry plasma etch to carry out etching.
4. the manufacture craft of flexible antennas plate as claimed in claim 1, is characterized in that: in described step (2), aluminium powder or copper powder adopt steel mesh to print insulated substrate film after by chemical dilution.
5. the manufacture craft of flexible antennas plate as claimed in claim 1, it is characterized in that: in described step (3), adopt dielectric ink inductive layer is carried out to surface treatment and isolate with outside air, or, adopt the mode of coverlay that inductive layer and outside air are isolated.
6. a manufacture craft for flexible antennas plate, is characterized in that: include following steps:
(1) choose insulated substrate film;
(2) aluminium, copper etching or aluminium powder, copper powder printing: a wherein surperficial pressing aluminum slice or the copper foil at insulated substrate film carries out etching formation array grid, thereby forms the first inductive layer; Or, on the wherein surface at insulated substrate film, with aluminium powder or copper powder printing, form array grid, thereby form the first inductive layer;
(3) anti-oxidant treatment: the first inductive layer is carried out to anti-oxidant treatment and form the first anti oxidation layer;
(4) aluminium, copper etching or aluminium powder, copper powder printing: another surperficial pressing aluminum slice or the copper foil at insulated substrate film carries out etching formation array grid, thereby forms the second inductive layer; Or, on another surface at insulated substrate film, with aluminium powder or copper powder printing, form array grid, thereby form the second inductive layer;
(5) anti-oxidant treatment: the second inductive layer is carried out to anti-oxidant treatment and form the second anti oxidation layer.
7. the manufacture craft of flexible antennas plate as claimed in claim 6, is characterized in that: described insulated substrate film is PE film or PET film.
8. the manufacture craft of flexible antennas plate as claimed in claim 6, is characterized in that: in described step (2) and step (4), adopt the mode of dry plasma etch to carry out etching.
9. the manufacture craft of flexible antennas plate as claimed in claim 6, is characterized in that: in described step (2) and step (4), aluminium powder or copper powder adopt steel mesh to print insulated substrate film after by chemical dilution.
10. the manufacture craft of flexible antennas plate as claimed in claim 6, it is characterized in that: in described step (3) and step (5), adopt dielectric ink inductive layer is carried out to surface treatment and isolate with outside air, or, adopt the mode of coverlay that inductive layer and outside air are isolated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410289594.2A CN104064859A (en) | 2014-06-25 | 2014-06-25 | Manufacturing process of flexible antenna board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410289594.2A CN104064859A (en) | 2014-06-25 | 2014-06-25 | Manufacturing process of flexible antenna board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104064859A true CN104064859A (en) | 2014-09-24 |
Family
ID=51552458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410289594.2A Pending CN104064859A (en) | 2014-06-25 | 2014-06-25 | Manufacturing process of flexible antenna board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104064859A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582258A (en) * | 2015-01-06 | 2015-04-29 | 广东小天才科技有限公司 | Thin film circuit board and production method of thin film circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1739323A (en) * | 2003-01-20 | 2006-02-22 | 株式会社藤仓 | Multilayer wiring board and its manufacturing method |
| CN101036199A (en) * | 2004-10-08 | 2007-09-12 | 三井金属矿业株式会社 | Conductive ink |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
| US20090031561A1 (en) * | 2007-08-03 | 2009-02-05 | Foxconn Advanced Technology Inc. | Method for manufacturing printed circuit board |
| CN102368389A (en) * | 2011-08-31 | 2012-03-07 | 安徽祈艾特电子科技有限公司 | Conductive organic slurry and preparation method thereof |
| CN103612464A (en) * | 2013-11-11 | 2014-03-05 | 莱芜金鼎电子材料有限公司 | Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces |
-
2014
- 2014-06-25 CN CN201410289594.2A patent/CN104064859A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1739323A (en) * | 2003-01-20 | 2006-02-22 | 株式会社藤仓 | Multilayer wiring board and its manufacturing method |
| CN101036199A (en) * | 2004-10-08 | 2007-09-12 | 三井金属矿业株式会社 | Conductive ink |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
| US20090031561A1 (en) * | 2007-08-03 | 2009-02-05 | Foxconn Advanced Technology Inc. | Method for manufacturing printed circuit board |
| CN102368389A (en) * | 2011-08-31 | 2012-03-07 | 安徽祈艾特电子科技有限公司 | Conductive organic slurry and preparation method thereof |
| CN103612464A (en) * | 2013-11-11 | 2014-03-05 | 莱芜金鼎电子材料有限公司 | Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582258A (en) * | 2015-01-06 | 2015-04-29 | 广东小天才科技有限公司 | Thin film circuit board and production method of thin film circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102238809B (en) | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof | |
| KR101931895B1 (en) | Surface-treated copper foil for forming high frequency signal transmission circuit, copper clad laminate board and printed wiring board | |
| US20090294152A1 (en) | Printed circuit board | |
| CN104093278B (en) | The manufacture method of one side and two-sided aluminium etching FPC | |
| CN102627856B (en) | Polyimide film of high-peel-strength flexible printed circuit board, preparation method thereof and printed circuit board made of polyimide film | |
| JP2007194174A (en) | Ink for conductor pattern, conductor pattern, wiring board, electro-optical device and electronic equipment | |
| CN104064859A (en) | Manufacturing process of flexible antenna board | |
| CN203339301U (en) | Capacitive coupling antenna and Bluetooth apparatus employing antenna | |
| CN108712817A (en) | A kind of wireless charging FPC multi-layer boards and its manufacture craft | |
| CN204795828U (en) | Use flexible printed wiring board structure of ferrite as substrate | |
| CN208623980U (en) | A kind of wireless charging FPC multi-layer board | |
| JP4089902B2 (en) | Low temperature fired ceramic substrate manufacturing method | |
| CN203407070U (en) | Thin core plate laminating structure | |
| CN207460615U (en) | A kind of polytetrafluoroethylene (PTFE) ladder printed circuit board lamination design device | |
| TWM399374U (en) | Narrow side of a touch panel | |
| CN206524420U (en) | A kind of RF transmitting structures for being used to penetrate pcb board | |
| CN207589275U (en) | A kind of remaining pcb board structure of no lead | |
| CN106612591A (en) | Method for making flexible printed circuit board | |
| CN210469851U (en) | FPC structure | |
| CN111128702A (en) | Preparation method of metal electrode | |
| CN203537664U (en) | Multilayer circuit board based on insulating base paper | |
| CN203287882U (en) | Etching-free resistance touch screen | |
| CN204463783U (en) | Flat display apparatus | |
| CN106304698A (en) | A kind of method for manufacturing circuit board | |
| CN204155231U (en) | A kind of touch-screen of monofilm multi-point touch |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140924 |
|
| RJ01 | Rejection of invention patent application after publication |