CN106816385B - A kind of wiring method and chip module - Google Patents
A kind of wiring method and chip module Download PDFInfo
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- CN106816385B CN106816385B CN201710053221.9A CN201710053221A CN106816385B CN 106816385 B CN106816385 B CN 106816385B CN 201710053221 A CN201710053221 A CN 201710053221A CN 106816385 B CN106816385 B CN 106816385B
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- plastic cement
- cement pedestal
- chip
- route
- pedestal
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of wiring method and chip modules.Wherein, which includes：Plastic cement pedestal is formed by injection molding；Using laser activation on the plastic cement pedestal preset position, formed activated face；The plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is made to be paved with activated face, forms wiring route.Technical solution provided in an embodiment of the present invention, by being routed on the plastic cement pedestal of chip module using LDS technique, then the route formed on plastic cement pedestal is electrically connected with the route on FPCB again, the area of the line holding FPCB of relatively long distance can be reduced in this way, to reduce the area of FPCB, chip module is saved to the space hold of mobile terminal.
Description
Technical field
The present invention relates to manufacturing process area more particularly to a kind of wiring method and chip modules.
Background technique
Hardware configuration as the function of mobile terminal is more and more, in order to support the realization of function, in mobile terminal
It is more and more.In the prior art, as shown in Figure 1 to Figure 3, segment chip mould group includes：Plastic cement pedestal 101 is arranged in plastic cement base
Chip 102, (the Flexible Printed Circuit of flexible circuit board 103 that is electrically connected with chip 102 on seat 101
Board, abbreviation FPCB) and the connector 104 that is electrically connected with flexible circuit board 103.Wherein, go out to write letters from chip different location
Number line, the cabling on FPCB plate is also different, such as the signal wire come out from chip far from connector position, general cloth line-spacing
From longer, and it may need to avoid other device architectures or route, the route of arrangement can be in irregular shape, the wiring of occupancy
Area can be larger, causes the FPCB for needing larger area to carry a large amount of wiring, and the FPCB of large area makes script anxiety
Mobile terminal space is more nervous.
Summary of the invention
The embodiment of the invention provides a kind of wiring method and chip modules, to solve in chip module in the prior art
The big problem of FCPB area occupied.
In a first aspect, a kind of wiring method is provided, including：
Plastic cement pedestal is formed by injection molding；
Using laser activation on the plastic cement pedestal preset position, formed activated face；
The plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is made to be paved with activated face, forms wiring line
Road.
Second aspect provides a kind of chip module, including：
Plastic cement pedestal, the chip being arranged on plastic cement pedestal, the flexible circuit board being electrically connected with the chip and with it is described
The connector of flexible circuit board electrical connection；
Wherein, a plurality of first line formed using laser direct structuring technique is provided on the plastic cement pedestal, it is described
Be provided with the second route corresponding with the first line on flexible circuit board, the first line respectively with it is right on the chip
The signal pin answered and the electrical connection of corresponding second route.
The beneficial effects of the invention are as follows：
Above-mentioned technical proposal, by utilizing laser direct structuring technique (Laser Direct Structuring, abbreviation
LDS it) is routed on the plastic cement pedestal of chip module, the wiring route then formed on plastic cement pedestal is again and on FPCB
Route electrical connection, can reduce the area of the line holding FPCB of relatively long distance in this way, to reduce the area of FPCB, save core
Space hold of the piece mould group to mobile terminal.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in embodiment or description of the prior art
Required attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the invention
Example is applied, it for those of ordinary skill in the art, without any creative labor, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 shows the main views of chip module in the prior art；
Fig. 2 indicates another main view of chip module in the prior art；
Fig. 3 indicates the side view of chip module in the prior art；
Fig. 4 indicates that the present invention first implements the flow chart of the wiring method provided；
Fig. 5 indicates the main view of chip module provided in an embodiment of the present invention；
Fig. 6 indicates the side view of chip module provided in an embodiment of the present invention；
Fig. 7 indicates another side view of chip module provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
First embodiment
The embodiment of the invention provides a kind of wiring methods, as shown in figure 4, including：
Step 401 forms plastic cement pedestal by injection molding.
In the embodiment of the present invention, the plastic cement pedestal is by a kind of modified plastic rubber for including organometallic compounds using injection molding work
Skill is made.
Wherein, plastic cement pedestal provided in an embodiment of the present invention can be the pedestal for camera chip to be arranged, can also be with
It is the pedestal for fingerprint chip to be arranged, it is of course possible to which understanding can also be that other can implement the pedestal of LDS technique.
Step 402, using laser activation on plastic cement pedestal preset position, formed activated face.
In the embodiment of the present invention, the plastic cement pedestal of injection molding, under the action of laser exciting, the chemical combination key of modified plastic rubber
It can be opened, the metallic in modified plastic rubber is exposed, therefore in wiring process, uses laser irradiation plastic cement pedestal
Upper preset position (position for needing to be routed), it will be able to form required activated face, lay the foundation for further wiring.
Plastic cement pedestal is placed in copper facing liquid medicine by step 403, and the copper in copper facing liquid medicine is made to be paved with activated face, forms cloth
Line route.
The metallic being exposed in step 402, the introducing a fine variety as metal deposit in the very high copper facing liquid medicine of activity,
Promote the copper in liquid medicine to be paved with entire activated face, i.e., route that can be conductive is formed on the plastic cement pedestal of insulation, such as Fig. 5 and figure
In 6 505 shown in, and be not routed on plastic cement pedestal in the prior art, as shown in Figures 2 and 3.
The embodiment of the present invention is routed on plastic cement pedestal using LDS technique, the wiring then formed on plastic cement pedestal
Route is electrically connected with the route on FPCB again, is not limited to wiring on FPCB, can be reduced the route of relatively long distance in this way
The area of FPCB is occupied, to reduce the area of FPCB, saves chip module to the space hold of mobile terminal.Wherein, LDS work
Skill maturation is steady, flexible design, can be realized three-dimensional Butut, is conducive to the inner space for saving mobile terminal.
Further, the embodiment of the present invention is in order to enable the wiring route formed on plastic cement pedestal and chip and FPCB
It is electrically connected, upper solder joint 506 is welded at the both ends of the every wiring route formed on plastic cement pedestal, as shown in figure 5 and figure 7.
Further, in the embodiment of the present invention, activated face is located at the top surface of plastic cement pedestal (i.e. away from flexible circuit board
Surface) on and/or the side in plastic cement base thickness direction on, it can on plastic cement pedestal deviate from flexible circuit board surface
It is routed on the upper and/or side in plastic cement base thickness direction, concrete condition can design according to actual needs, can increase in this way
Add wiring space, makes to be routed more flexible.
In conclusion the embodiment of the present invention is using LDS technique on the plastic cement pedestal of chip module by being routed, so
The route formed on plastic cement pedestal afterwards is electrically connected with the route on FPCB again, is not limited to wiring on FPCB, such energy
Enough reduce the area of the line holding FPCB of relatively long distance, to reduce the area of FPCB, saves chip module to mobile terminal
Space hold.
Second embodiment
The embodiment of the invention provides a kind of chip modules, as shown in Figure 5 and Figure 6, including：Plastic cement pedestal 501, setting exist
Chip 502 on plastic cement pedestal 501, the flexible circuit board (i.e. FPCB) 503 and and flexible circuit board being electrically connected with chip 502
The connector 504 of 503 electrical connections.
Wherein, a plurality of first line formed using laser direct structuring technique i.e. (LDS) is provided on plastic cement pedestal 501
505, be provided with second route corresponding with first line 505 on flexible circuit board 503, first line 505 respectively with chip 502
Upper corresponding signal pin and the electrical connection of corresponding second route.
The embodiment of the present invention is routed on plastic cement pedestal 501 using LDS technique, then the shape on plastic cement pedestal 501
At route be electrically connected again with the route on FPCB, make wiring be not limited on FPCB, relatively long distance can be reduced in this way
The area of line holding FPCB saves 502 mould group of chip to the space hold of mobile terminal to reduce the area of FPCB.Its
In, LDS technical maturity is steady, flexible design, can be realized three-dimensional Butut, is conducive to the inner space for saving mobile terminal.
Wherein, chip 502 is 502 mould of chip that camera or fingerprint recognition etc. meet above structure in the embodiment of the present invention
Chip 502 in group.
Further, first line 505 is arranged in plastic cement pedestal 501 on the surface of flexible circuit board 503 and/or moulds
On the side of 501 thickness direction of matrix seat, it can on plastic cement pedestal 501 away from flexible circuit board 503 surface on and/or
It is routed on the side of 501 thickness direction of plastic cement pedestal, concrete condition can design according to actual needs, can increase cloth in this way
Space of lines makes to be routed more flexible.
For example, first line 505 includes：Along the first sub-line road away from flexible circuit board 503 of plastic cement pedestal 501, with
And along plastic cement pedestal 501 thickness direction lay the second sub-line road and third sub-line road, the second sub-line road, the first sub-line road and
Third sub-line road is sequentially connected, and the end on the first sub-line road is formed with and the weldering of the corresponding signal pin connection on chip 502
Point, the end on third sub-line road are formed with and the solder joint of corresponding second connection.
Further, as shown in figure 5 and figure 7, the embodiment of the present invention is in order to enable the route formed on plastic cement pedestal 501
Enough to be electrically connected with chip 502 and FPCB, the both ends of every first line 505 are respectively arranged with a solder joint 506, first line
505 are electrically connected by solder joint 506 with the second route.
In conclusion the embodiment of the present invention using LDS technique on the plastic cement pedestal 501 of 502 mould group of chip by being carried out
Wiring, the route then formed on plastic cement pedestal 501 are electrically connected with the route on FPCB again, are not limited to wiring in FPCB
On, the area of the line holding FPCB of relatively long distance can be reduced in this way, to reduce the area of FPCB, save 502 mould of chip
Space hold of the group to mobile terminal.
Above-described is the preferred embodiment of the present invention, it should be pointed out that the ordinary person of the art is come
It says, can also make several improvements and retouch under the premise of not departing from principle of the present invention, these improvements and modifications also exist
In protection scope of the present invention.
Claims (5)
1. a kind of wiring method, which is characterized in that including：
The plastic cement pedestal of chip module is formed by injection molding, wherein the plastic cement pedestal is to include organometallic compounds
Modified plastic rubber；
Using laser activation on the plastic cement pedestal preset position, formed activated face；Wherein, the activated face is located at described
On on the plastic cement pedestal top surface and side in plastic cement base thickness direction；
The plastic cement pedestal is placed in copper facing liquid medicine, the copper in copper facing liquid medicine is made to be paved with activated face, forms wiring route,
In, the wiring route for respectively with the corresponding signal pin and flexible circuit board on the chip in the chip module
Corresponding route electrical connection.
2. wiring method according to claim 1, which is characterized in that described that the plastic cement pedestal is placed on copper facing liquid medicine
In, after the step of making the copper in copper facing liquid medicine be paved with activated face, forming wiring route, the wiring method further includes：
Weld upper solder joint in the both ends of the every wiring route formed on the plastic cement pedestal.
3. a kind of chip module, which is characterized in that including：
Plastic cement pedestal, the chip being arranged on plastic cement pedestal, the flexible circuit board being electrically connected with the chip and with the flexibility
The connector of circuit board electrical connection；Wherein, the plastic cement pedestal is the modified plastic rubber for including organometallic compounds；
Wherein, a plurality of first line formed using laser direct structuring technique, the flexibility are provided on the plastic cement pedestal
The second route corresponding with the first line is provided on circuit board, the first line is corresponding on the chip respectively
Signal pin and the electrical connection of corresponding second route；Wherein, the first line setting is in the plastic cement pedestal away from described
On on the surface of the flexible circuit board and side in plastic cement base thickness direction.
4. chip module according to claim 3, which is characterized in that the both ends of every first line are respectively arranged with
One solder joint, the first line are electrically connected by the solder joint with second route.
5. chip module according to claim 3, which is characterized in that the chip is camera chip or fingerprint recognition core
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710053221.9A CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710053221.9A CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106816385A CN106816385A (en) | 2017-06-09 |
| CN106816385B true CN106816385B (en) | 2018-11-30 |
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ID=59111347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710053221.9A Active CN106816385B (en) | 2017-01-24 | 2017-01-24 | A kind of wiring method and chip module |
Country Status (1)
| Country | Link |
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| CN (1) | CN106816385B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633430A (en) * | 2013-11-29 | 2014-03-12 | 重庆国虹科技发展有限公司 | LDS technology-based novel antenna wiring method |
| CN104955278B (en) * | 2014-03-26 | 2018-04-13 | 华南理工大学 | A kind of method that three-dimensional circuit is manufactured on moulding surface |
| CN104975276B (en) * | 2014-04-11 | 2019-07-12 | 深圳市泛友科技有限公司 | The method and plastic components of selective metal route are formed in frosting |
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
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| Publication number | Publication date |
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| CN106816385A (en) | 2017-06-09 |
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Effective date of registration: 20171107 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant after: VIVO MOBILE COMMUNICATION CO., LTD. Applicant after: Wewo Mobile Communication Co. Ltd. Beijing branch Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant before: VIVO MOBILE COMMUNICATION CO., LTD. |
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Effective date of registration: 20200526 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Patentee after: VIVO MOBILE COMMUNICATION Co.,Ltd. Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Co-patentee before: Wewo Mobile Communication Co. Ltd. Beijing branch Patentee before: VIVO MOBILE COMMUNICATION Co.,Ltd. |