CN112118676B - Circuit board and method for manufacturing the same - Google Patents
Circuit board and method for manufacturing the same Download PDFInfo
- Publication number
- CN112118676B CN112118676B CN201910611344.9A CN201910611344A CN112118676B CN 112118676 B CN112118676 B CN 112118676B CN 201910611344 A CN201910611344 A CN 201910611344A CN 112118676 B CN112118676 B CN 112118676B
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- Prior art keywords
- insulator
- bottom layer
- extension arm
- top layer
- circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 21
- 239000012212 insulator Substances 0.000 claims abstract description 97
- 238000005476 soldering Methods 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 9
- 230000009286 beneficial effect Effects 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a circuit board and a manufacturing method thereof, wherein the circuit board comprises: the insulator is provided with an insulator top layer and an insulator bottom layer which are opposite in position; the conductive terminal is provided with a top layer extension arm, a bottom layer extension arm and a terminal body which is respectively and electrically communicated with the top layer extension arm and the bottom layer extension arm, and the top layer extension arm and the bottom layer extension arm are respectively provided with a top layer circuit and a bottom layer circuit; the conductive terminal is embedded and molded in the insulator, the insulator is also provided with at least one positioning well, the positioning well extends from the top layer of the insulator or the bottom layer of the insulator to the conductive terminal to expose the top layer extension arm or the bottom layer extension arm, and when the conductive terminal is embedded and molded in the insulator, the positioning well positions the top layer extension arm or the bottom layer extension arm to enable the top layer circuit to be exposed out of the top layer of the insulator or enable the bottom layer circuit to be exposed out of the bottom layer of the insulator. The invention solves the problem that the small-sized through holes on the circuit board can not be effectively plated with conductive materials.
Description
Technical Field
The invention belongs to the field of electronic components, and particularly relates to a circuit board with at least two layers of circuits electrically communicated by conductive terminals and a manufacturing method thereof.
Background
A circuit board (PCB) usually has at least one conductive via formed on a through hole by electroplating a conductive material, which is used to connect a circuit between two or more layers on the circuit board. However, as the number of components on the circuit board increases, the circuits on the circuit board become more dense, the space available for disposing the through holes becomes smaller, and the difficulty of plating the conductive material on the through holes to form the conductive holes increases, because it is difficult to uniformly plate the conductive material on the small-sized through holes.
Therefore, the technical problem to be solved by the skilled person is how to connect the lines between two or more layers on the circuit board in a manner of not penetrating through the conductive hole so as to solve the problem that the small-sized through hole on the circuit board cannot be effectively plated with the conductive material.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a circuit board and a method for manufacturing the same, which is used to solve the problem that the small-sized through holes on the circuit board cannot be plated with conductive materials effectively.
To achieve the above and other related objects, an aspect of the present invention provides a circuit board including: the insulator is provided with an insulator top layer and an insulator bottom layer which are opposite in position; the conductive terminal is provided with a top layer extension arm, a bottom layer extension arm and a terminal body which is respectively and electrically communicated with the top layer extension arm and the bottom layer extension arm, and the top layer extension arm and the bottom layer extension arm are respectively provided with a top layer circuit and a bottom layer circuit; the conductive terminal is embedded and molded in the insulator, the insulator is also provided with at least one positioning well, the positioning well extends from the top layer of the insulator or the bottom layer of the insulator to the conductive terminal to expose the top layer extension arm or the bottom layer extension arm, and when the conductive terminal is embedded and molded in the insulator, the positioning well positions the top layer extension arm or the bottom layer extension arm to expose the top layer circuit or expose the bottom layer circuit to the bottom layer of the insulator.
In an embodiment of the invention, the insulator further has an insulator side surface, the conductive terminal further has a welding arm, the welding arm is connected to the top layer extension arm, the bottom layer extension arm or the terminal body and has a welding circuit, and the welding circuit is exposed out of the insulator side surface.
In an embodiment of the invention, the terminal body and the soldering arm are substantially parallel.
In an embodiment of the invention, a portion of the positioning well exposed out of the top layer extension arm is located below the top layer circuit, or a portion of the positioning well exposed out of the bottom layer extension arm is located above the bottom layer circuit.
In an embodiment of the invention, the top layer extension arm has a top layer positioning hole, and the top layer positioning hole positions the top layer circuit when the conductive terminal is embedded and molded in the insulator, so that the top layer circuit is exposed at a predetermined position on the top layer of the insulator; the bottom layer extension arm is provided with a bottom layer positioning hole, and the bottom layer positioning hole is used for positioning the bottom layer circuit when the conductive terminal is embedded and molded in the insulator, so that the bottom layer circuit is exposed at a preset position on the bottom layer of the insulator.
In an embodiment of the present invention, the at least one conductive terminal is a plurality of conductive terminals electrically isolated from each other.
Another aspect of the present invention provides a method of manufacturing a circuit board, the method comprising: providing a glue injection mold; providing at least one conductive terminal, wherein the conductive terminal is provided with a top layer extension arm, a bottom layer extension arm and a terminal body which is respectively and electrically communicated with the top layer extension arm and the bottom layer extension arm, and the top layer extension arm and the bottom layer extension arm are respectively provided with a top layer circuit and a bottom layer circuit; placing the conductive terminals into the glue injection mold and arranging and positioning the conductive terminals; injecting glue into the glue injection mold to form an insulator, so that the conductive terminal is embedded and molded in the insulator, the insulator is provided with an insulator top layer, an insulator bottom layer and at least one positioning well which are opposite in position, the positioning well extends from the insulator top layer or the insulator bottom layer to the conductive terminal to expose the top layer extension arm or the bottom layer extension arm, and when the conductive terminal is embedded and molded in the insulator, the positioning well is favorable for positioning the top layer extension arm or the bottom layer extension arm, so that the top layer circuit is exposed out of the insulator top layer, or the bottom layer circuit is exposed out of the insulator bottom layer to form a circuit board.
In an embodiment of the invention, the insulator further has an insulator side surface, and the conductive terminal further has a soldering arm, the soldering arm is connected to the bottom layer extension arm and has a soldering circuit, and the soldering circuit is exposed out of the insulator side surface.
In an embodiment of the invention, the terminal body and the soldering arm are substantially parallel.
In an embodiment of the invention, a portion of the positioning well exposed out of the top layer extension arm is located below the top layer circuit, or a portion of the positioning well exposed out of the bottom layer extension arm is located above the bottom layer circuit.
In an embodiment of the invention, the top layer extension arm further has a top layer positioning hole, and the top layer positioning hole is favorable for positioning the top layer circuit when the conductive terminal is embedded and molded in the insulator, so that the top layer circuit can be exposed at a predetermined position on the top layer of the insulator; the bottom layer extension arm is further provided with a bottom layer positioning hole, and the bottom layer positioning hole is beneficial to positioning the bottom layer circuit when the conductive terminal is embedded and molded in the insulator, so that the bottom layer circuit is exposed at a preset position on the bottom layer of the insulator.
In an embodiment of the present invention, the at least one conductive terminal is a plurality of conductive terminals electrically isolated from each other.
As described above, the circuit board and the manufacturing method thereof of the present invention have the following beneficial effects:
the circuit board and the manufacturing method thereof solve the problem that small-sized through holes on the circuit board cannot effectively electroplate conductive materials by embedding the conductive terminals in the insulator of the circuit board and electrically communicating at least two layers of circuits on the circuit board through the conductive terminals, and realize the technology of communicating the circuits between two layers or more layers on the circuit board in a mode of not passing through the conductive holes.
Drawings
FIG. 1 is a flow chart illustrating the steps of the method for manufacturing a circuit board according to the present invention.
Fig. 2 is a schematic perspective view of a conductive terminal of a circuit board according to the present invention.
FIG. 3 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
Fig. 3-1 is a schematic view showing the steps of the circuit board manufacturing method of the present invention.
FIG. 4 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
Fig. 4-1 is a schematic view showing the steps of the circuit board manufacturing method of the present invention.
FIG. 5 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
Fig. 5-1 is a schematic view showing the steps of the circuit board manufacturing method of the present invention.
FIG. 6 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
FIG. 6-1 is a schematic view showing the steps of the method for manufacturing a circuit board according to the present invention
FIG. 7 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
FIG. 7-1 is a schematic view showing the steps of the method for manufacturing a circuit board according to the present invention
FIG. 8 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
Fig. 8-1 is a schematic view showing a step of the circuit board manufacturing method of the present invention.
FIG. 9 is a schematic diagram illustrating a method for manufacturing a circuit board according to the present invention.
Fig. 9-1 is a schematic view showing the steps of the circuit board manufacturing method of the present invention.
Fig. 10 is a perspective view of the first layer of the circuit board of the present invention.
Fig. 10-1 is a schematic cross-sectional view taken along line AA in fig. 10.
Fig. 11 is a perspective view of a second layer of the circuit board of the present invention.
Description of the element reference numerals
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, ratio changes, or size adjustments can still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle", and "a" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative changes or modifications thereof may be regarded as the scope of the present invention without substantial technical changes.
The application provides a circuit board and a manufacturing method thereof, which mainly solves the problem that small-sized through holes on the circuit board cannot be effectively plated with conductive materials by embedding and molding conductive terminals in an insulator of the circuit board and electrically communicating at least two layers of circuits on the circuit board through the conductive terminals. For the technical idea of the present application, please refer to fig. 1 to 11 and the following embodiments.
In order to make the disclosure more concise and clearer, components having the same or similar functions in the following embodiments will be denoted by the same reference numerals, and descriptions of the same or equivalent features will be omitted.
Referring to fig. 1, a flow chart of steps of a method for manufacturing a circuit board is shown. As shown in fig. 1, in the method for manufacturing a circuit board of the present embodiment, first, step S11 is performed to provide the injection mold 2, and as shown in fig. 4, the injection mold 2 has an upper mold 21 and a lower mold 22. Then, step S12 is performed to provide at least one conductive terminal 12, wherein, as shown in fig. 2, the conductive terminal 12 has a top layer extension arm 121, a bottom layer extension arm 122 and a terminal body 123 respectively communicating the top layer extension arm 121 and the bottom layer extension arm 122, and the top layer extension arm 121 and the bottom layer extension arm 122 respectively have a top layer circuit 1211 and a bottom layer circuit 1221, so that the terminal body 123 can respectively electrically communicate the top layer circuit 1211 and the bottom layer circuit 1221. The at least one conductive terminal 12 is a plurality of conductive terminals 12 electrically isolated from each other and capable of transmitting electrical signals respectively, but not limited to one.
In step S13, as shown in fig. 3 to 3-1, the conductive terminals 12 are placed in the lower mold 22 of the molding compound 2 and set in place. Next, step S14 is performed, as shown in fig. 4 to 7-1, the upper mold 21 of the injection mold 2 is overlapped on the lower mold 22, and as shown in fig. 8 to 9-1, glue is injected between the upper mold 21 and the lower mold 22 of the injection mold 2 to form the insulator 11, so that the conductive terminals 12 are insert-molded in the insulator 11. In the present application, as shown in fig. 10 to 11, the insulator 11 has an insulator top layer 111 and an insulator bottom layer 112 opposite to each other, and further has at least one positioning well 113, wherein the positioning well 113 extends from the insulator top layer 111 or the insulator bottom layer 112 to the conductive terminal 12 to expose the top layer extension arm 121 or the bottom layer extension arm 122, so as to facilitate the conductive terminal 12 to be embedded and formed in the insulator 11, when the conductive terminal 12 is embedded and formed in the upper mold 21 or the lower mold 22, for example, to provide supporting and positioning for the top layer extension arm 121 or the bottom layer extension arm 122 by the pillar-shaped supporting structures 221 and 211 shown in fig. 6-1, thereby preventing the top layer extension arm 121 or the bottom layer extension arm 122 from being deformed during the process of forming the insulator 11, so that the top layer circuit 1211 is exposed out of the insulator top layer 111, or so that the bottom layer circuit 1221 is exposed out of the insulator bottom layer 112 to form the circuit board 1.
Specifically, as shown in fig. 10-1, the portion of the positioning well 113 exposing the top layer extension arm 121 is located below the top layer line 1211 to ensure the positioning of the top layer line 1211. The exposed portion of the positioning well 113 of the bottom extension arm 122 is located above the bottom line 1221 to ensure the positioning of the bottom line 1221.
In addition, in the present application, the insulator 11 further has an insulator side surface 114, and correspondingly, the conductive terminal 12 further has a welding arm 124 substantially parallel to the terminal body 123. As shown in fig. 2, the soldering arm 124 is connected to the top layer extension arm 121 and has a soldering circuit 1241, as shown in fig. 10 to 11, the soldering circuit 1241 is exposed out of the insulator side 114 to provide soldering of the circuit board 1. However, the solder arm 124 can be selectively connected to the bottom extension arm 122 or the terminal body 123, and is not limited thereto.
Preferably, the top extension arm 121 and the bottom extension arm 122 further have a top positioning hole 1212 and a bottom positioning hole 1222, respectively. The top positioning holes 1212 facilitate the conductive terminals 12 to be inserted into the insulator 11, and position the top circuits 1211 (as shown in fig. 5-1) through the lower mold 22, for example, the pillar-shaped supporting structure 221 shown in fig. 6-1, so as to ensure the positioning of the top circuits 1211, such that the top circuits 1211 are exposed to a predetermined position on the top layer 111 of the insulator, and the positions of the electrical contacts of the circuit board 1 are in accordance with the expectation. The bottom positioning hole 1222 facilitates positioning the bottom circuit 1221 through the upper mold 21, for example, the pillar-shaped supporting structure 211 shown in fig. 6-1, when the conductive terminal 12 is insert-molded in the insulator 11 (as shown in fig. 5-1), so as to ensure positioning of the bottom circuit 1221, such that the bottom circuit 1221 is exposed at a predetermined position on the bottom layer 112 of the insulator, and the position of the electrical contact of the circuit board 1 is in accordance with an expected position.
In summary, the circuit board and the manufacturing method thereof according to the present invention mainly solve the problem that the small-sized through hole on the circuit board cannot effectively plate the conductive material by embedding the conductive terminal in the insulator of the circuit board and electrically connecting the conductive terminal with the circuit between at least two layers on the circuit board, thereby realizing the technology of connecting the circuit between two or more layers on the circuit board without passing through the conductive hole. The invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (12)
1. A circuit board, comprising:
the insulator is provided with an insulator top layer and an insulator bottom layer which are opposite in position; and
the conductive terminal is provided with a top layer extension arm, a bottom layer extension arm and a terminal body which is respectively and electrically communicated with the top layer extension arm and the bottom layer extension arm, and the top layer extension arm and the bottom layer extension arm are respectively provided with a top layer circuit and a bottom layer circuit;
the conductive terminal is embedded and molded in the insulator, the insulator is also provided with at least one positioning well, the positioning well extends from the top layer of the insulator or the bottom layer of the insulator to the conductive terminal to expose the top layer extension arm or the bottom layer extension arm, and when the conductive terminal is embedded and molded in the insulator, the positioning well positions the top layer extension arm or the bottom layer extension arm to expose the top layer circuit or expose the bottom layer circuit to the bottom layer of the insulator.
2. The circuit board of claim 1, wherein the insulator further has an insulator side surface, and the conductive terminal further has a soldering arm connecting the top layer extension arm, the bottom layer extension arm or the terminal body and having a soldering circuit exposed on the insulator side surface.
3. The circuit board of claim 2, wherein the terminal body is substantially parallel to the solder arm.
4. The circuit board of claim 2, wherein the positioning well exposes the top layer extension arms below the top layer trace or exposes the bottom layer extension arms above the bottom layer trace.
5. The circuit board of claim 1, wherein: the top layer extension arm is provided with a top layer positioning hole which is used for positioning the top layer circuit when the conductive terminal is embedded and molded in the insulator, so that the top layer circuit is exposed at a preset position on the top layer of the insulator; the bottom layer extension arm is provided with a bottom layer positioning hole, and the bottom layer positioning hole is used for positioning the bottom layer circuit when the conductive terminal is embedded and molded in the insulator, so that the bottom layer circuit is exposed at a preset position on the bottom layer of the insulator.
6. The circuit board of claim 1, wherein the at least one conductive terminal is a plurality of conductive terminals electrically isolated from each other.
7. A circuit board manufacturing method, characterized by comprising:
providing a glue injection mold;
providing at least one conductive terminal, wherein the conductive terminal is provided with a top layer extension arm, a bottom layer extension arm and a terminal body which is respectively and electrically communicated with the top layer extension arm and the bottom layer extension arm, and the top layer extension arm and the bottom layer extension arm are respectively provided with a top layer circuit and a bottom layer circuit;
placing the conductive terminals into the glue injection mold and arranging and positioning the conductive terminals;
injecting glue into the glue injection mold to form an insulator, so that the conductive terminal is embedded and molded in the insulator, the insulator is provided with an insulator top layer, an insulator bottom layer and at least one positioning well which are opposite in position, the positioning well extends from the insulator top layer or the insulator bottom layer to the conductive terminal to expose the top layer extension arm or the bottom layer extension arm, and when the conductive terminal is embedded and molded in the insulator, the positioning well is favorable for positioning the top layer extension arm or the bottom layer extension arm, so that the top layer circuit is exposed out of the insulator top layer, or the bottom layer circuit is exposed out of the insulator bottom layer to form a circuit board.
8. The method as claimed in claim 7, wherein the insulator further has an insulator side surface, and the conductive terminal further has a soldering arm connected to the extension arm of the bottom layer and having a soldering circuit exposed from the insulator side surface.
9. The method of manufacturing a circuit board according to claim 8, wherein the terminal body is substantially parallel to the soldering arm.
10. The method of claim 8, wherein the portion of the positioning well exposed by the top layer extension arm is located below the top layer circuit or the portion of the positioning well exposed by the bottom layer extension arm is located above the bottom layer circuit.
11. The method of claim 8, wherein the top extension arm further has a top positioning hole for positioning the top circuit when the conductive terminal is embedded in the insulator, such that the top circuit is exposed at a predetermined position on the top layer of the insulator; the bottom layer extension arm is further provided with a bottom layer positioning hole, and the bottom layer positioning hole is beneficial to positioning the bottom layer circuit when the conductive terminal is embedded and molded in the insulator, so that the bottom layer circuit is exposed at a preset position on the bottom layer of the insulator.
12. The method of claim 7, wherein the at least one conductive terminal is a plurality of conductive terminals electrically isolated from each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108121833 | 2019-06-21 | ||
| TW108121833A TWI706705B (en) | 2019-06-21 | 2019-06-21 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112118676A CN112118676A (en) | 2020-12-22 |
| CN112118676B true CN112118676B (en) | 2022-02-01 |
Family
ID=73795487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910611344.9A Active CN112118676B (en) | 2019-06-21 | 2019-07-08 | Circuit board and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112118676B (en) |
| TW (1) | TWI706705B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585593A (en) * | 1998-02-26 | 2005-02-23 | 揖斐电株式会社 | Multilayer printed wiring board having filled-via structure |
| WO2005104635A1 (en) * | 2004-04-27 | 2005-11-03 | Imbera Electronics Oy | Heat conduction from an embedded component |
| CN101277590A (en) * | 2007-03-26 | 2008-10-01 | 相互股份有限公司 | Inner connection line structure and method for forming the same |
| CN102843876A (en) * | 2011-06-24 | 2012-12-26 | 富士通株式会社 | A method of manufacturing a multilayer circuit board and the multilayer circuit board |
| CN104938040A (en) * | 2013-01-18 | 2015-09-23 | 名幸电子有限公司 | Component-embedded substrate and method for manufacturing same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5603847A (en) * | 1993-04-07 | 1997-02-18 | Zycon Corporation | Annular circuit components coupled with printed circuit board through-hole |
| JP2006339365A (en) * | 2005-06-01 | 2006-12-14 | Mitsui Mining & Smelting Co Ltd | Wiring board, its manufacturing method, manufacturing method of multilayer laminated wiring board and forming method of via hole |
| TW200714162A (en) * | 2005-09-13 | 2007-04-01 | You Shi Rong | Manufacturing process of circuit board |
| CN102149255B (en) * | 2010-02-04 | 2013-07-24 | 日月光半导体制造股份有限公司 | Forming method of multiple-lead through hole |
| JP2019057697A (en) * | 2017-09-22 | 2019-04-11 | 住友電気工業株式会社 | Printed wiring board and method for manufacturing the same |
-
2019
- 2019-06-21 TW TW108121833A patent/TWI706705B/en active
- 2019-07-08 CN CN201910611344.9A patent/CN112118676B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585593A (en) * | 1998-02-26 | 2005-02-23 | 揖斐电株式会社 | Multilayer printed wiring board having filled-via structure |
| WO2005104635A1 (en) * | 2004-04-27 | 2005-11-03 | Imbera Electronics Oy | Heat conduction from an embedded component |
| CN101277590A (en) * | 2007-03-26 | 2008-10-01 | 相互股份有限公司 | Inner connection line structure and method for forming the same |
| CN102843876A (en) * | 2011-06-24 | 2012-12-26 | 富士通株式会社 | A method of manufacturing a multilayer circuit board and the multilayer circuit board |
| CN104938040A (en) * | 2013-01-18 | 2015-09-23 | 名幸电子有限公司 | Component-embedded substrate and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202102083A (en) | 2021-01-01 |
| CN112118676A (en) | 2020-12-22 |
| TWI706705B (en) | 2020-10-01 |
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