CN104975276A - Method of forming selective metal circuit on plastic surface and plastic part - Google Patents
Method of forming selective metal circuit on plastic surface and plastic part Download PDFInfo
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- CN104975276A CN104975276A CN201410146680.8A CN201410146680A CN104975276A CN 104975276 A CN104975276 A CN 104975276A CN 201410146680 A CN201410146680 A CN 201410146680A CN 104975276 A CN104975276 A CN 104975276A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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Abstract
The invention relates to conductor structure manufacturing and discloses a method of forming a selective metal circuit on a plastic surface and a plastic part. The method includes the steps of: A. performing laser carving to the circuit on the surface of a moulded plastic base material with laser to achieve laser coarsening; B. cleaning the plastic base material; C. performing chemical coarsening to the plastic base material in a chemical reagent; D. performing reduction and cleaning after chemical coarsening; E. performing activation to the plastic base material in an activation reagent; and F. performing chemical-plating to selectively deposit a plated layer on the surface of the plastic base material, thereby forming the metalized circuit. In the invention, by means of the double-coarsening scheme of the laser coarsening and the chemical coarsening, so that material requirement during selection of the plastic base material is reduced. The method is free of any special materials, is low in cost and is significantly widened in available range of materials. Furthermore, by means of the combination of the laser coarsening and the chemical coarsening, the laser coarsening enables wire distribution to be fine while the chemical coarsening can form a strong adsorption zone on a laser curved surface of the plastic base material, so that it is beneficial to absorption of more active substances.
Description
Technical field
The present invention relates to conductor structure manufacture, particularly form method and the plastic components of selective metal circuit at frosting.
Background technology
Laser direct forming (Laser Direct Structuring, being called for short " LDS ") technology is one of method realizing stereo circuit at present, its technical process is utilize special material to make structural part (this material can be plated to realize selectivity by laser activation), by laser by required figure mark to workpiece surface, then change plate metal level formed circuit.
The patent No. is describe a kind of conductor track structure and manufacture method thereof in the Chinese patent of 02812609.This conductor track structure is made up of metal crystal nuclei and the follow-up metal layer applied on metal crystal nuclei.Conductor track structure is positioned on nonconducting loading material, is mixed with non conducting metallized compound in loading material.The region that loading material will produce conductor track structure is irradiated by electromagnetic radiation, and its non conducting metallized compound mixed isolates heavy metal nucleus, and then this region is chemically reduced metallization again; Non-irradiated region then remains unchanged.Thus achieve and manufacture conductor track structure on nonconducting loading material.But disclosed method cost is higher.First, in order to manufacture conductor track structure, the non conducting metallized compound mixed in non-conductive loading material, be high temperature stable, stablize and the simple d-metal oxide of undissolved, nonconducting higher-order oxide compound based on spinel or similar spinel or its mixture in moisture acidity or basic metal electrolytic solution, it can thus be appreciated that, the performance structure of this non conducting metallized compound requires higher, expensive; Secondly, the loading material cost that can mix above-mentioned non conducting metallized compound is comparatively large, also result in certain restriction.
As can be seen here, LDS technique needs exotic materials, and in this material, with the addition of the necessary metallic compound of LDS technique, due to the large percentage added, this material modified thermostability to metallic compound and plastic basis material, consistency, plasticizing stability, the aspects such as electric performance stablity produce larger impact, also limit the scope of application of material while cost is improved.
Therefore, how to realize a kind ofly forming the simple and reliable of selective metal circuit by common lower cost materials manufacture and the high method of production efficiency is technical problem in the urgent need to address at present.
Summary of the invention
The object of the present invention is to provide a kind of method and the plastic components that form selective metal circuit at frosting, the plastic basis material when selection is made not need exotic materials, with low cost and the scope of application of material obviously expands, while metallized traces is meticulous, the radium carving face on plastic basis material surface can form stronger adsorption zone, is conducive to absorbing more active substance.
For solving the problems of the technologies described above, embodiments of the present invention disclose a kind of method forming selective metal circuit at frosting, comprise the following steps:
Use the surface of laser to the plastic basis material after shaping to carry out circuit radium carving, realize surface laser alligatoring;
Plastic basis material after laser alligatoring is cleaned;
Plastic basis material after cleaning is placed in chemical agent and carries out chemical roughen;
Plastic basis material after chemical roughen is reduced and cleaned;
Plastic basis material is inserted in activator and activates;
Activated plastic basis material is put into the plating of carrying out of chemical reducing solution, make plastic basis material surface selectivity deposited plating layer, form metal line.
Embodiments of the present invention also disclose the plastic components that a kind of surface has metallic circuit, and this metallic circuit adopts the method forming selective metal circuit at frosting mentioned above to be formed on plastic components surface.
Compared with prior art, the key distinction and effect thereof are embodiment of the present invention:
The two alligatoring schemes in conjunction with laser alligatoring and chemical roughen in the method for selective metal circuit are formed at frosting, make obviously to reduce the material requirements of plastic basis material when selection, do not need exotic materials, the with low cost and scope of application of material obviously expands; In addition, in conjunction with laser alligatoring and chemical roughen, laser alligatoring can make wiring meticulous on the one hand, and chemical roughen can make again the radium on plastic basis material surface face of carving form stronger adsorption zone on the other hand, is conducive to absorbing more active substance.
Further, compared to the exotic materials needed for LDS technique, the plastic basis material in the present invention does not need to the addition of the necessary metallic compound of LDS technique, and the with low cost and scope of application of material obviously expands.
Further, according to different substrate material characteristics in the step of chemical roughen, select suitable alligatoring liquid and alligatoring operating procedure to control chemical roughen intensity, good selective chemical alligatoring can be realized.
Further, the bis-activated base material that contributes to adsorbs abundant active substance, avoids plating leakage or the uneven problem of upper plating, realizes good selectivity is plated.
Further, in conjunction with two alligatoring and bis-activated, can not only realize good selectivity is plated, more effectively can also ensure that its conducting is functional at the structure such as via hole, micro-via hole place;
Further, in conjunction with two alligatoring and bis-activated, be applicable to wider laser radium carving parameter processing, have adaptability widely to laser processing;
Further, in conjunction with two alligatoring and bis-activated, have laser processing extensive adaptive while, also assures that good coating adsorptive power.
Further, by adding coating, metallic circuit can be enable to carry larger electric current, to meet the needs of more application scenarios.
Accompanying drawing explanation
Fig. 1 is a kind of schematic flow sheet forming the method for selective metal circuit at frosting in first embodiment of the invention;
Fig. 2 is that differing materials is merely through the change plating design sketch after laser alligatoring;
Fig. 3 is the upper plating design sketch of different coarsening rate in first embodiment of the invention;
Fig. 4 is bis-activated in second embodiment of the invention and single activation plates effect contrast figure;
Fig. 5 is bis-activated in second embodiment of the invention and effect contrast figure is plated in single change activated on via hole and micro-via hole;
Fig. 6 changes plating effect contrast figure under 6 groups of larger laser parameters of difference in second embodiment of the invention;
Fig. 7 is that in second embodiment of the invention, hundred lattice test result comparison diagrams after plating changed by PC base material under four kinds of dissimilar alligatoring and activation method;
Fig. 8 is the sticking power descriptive grade figure of hundred lattice tests in second embodiment of the invention;
Fig. 9 is a kind of schematic flow sheet forming the method for selective metal circuit at frosting in second embodiment of the invention.
Embodiment
In the following description, many ins and outs are proposed in order to make reader understand the application better.But, persons of ordinary skill in the art may appreciate that even without these ins and outs with based on the many variations of following embodiment and amendment, also can realize each claim of the application technical scheme required for protection.
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.
First embodiment of the invention relates to a kind of method forming selective metal circuit at frosting, and Fig. 1 is that this forms the schematic flow sheet of the method for selective metal circuit at frosting.
Specifically, as shown in Figure 1, should comprise the following steps in the method for frosting formation selective metal circuit:
In a step 101, use the surface of laser to the plastic basis material after shaping to carry out circuit radium carving, realize surface laser alligatoring.
In addition, be appreciated that laser alligatoring is, with laser, plastic surface etch is formed fine and closely woven microscopic pits, so that the absorption of active substance and filling, form the catalytic center of electroless plating.Laser alligatoring can be understood as physics alligatoring, finds that the area of laser alligatoring is also more easily by chemical roughen in an experiment, thus facilitates selective chemical alligatoring.But if only implement laser alligatoring, no matter, processing procedure is single activation or bis-activated, is all difficult to the absorption of guarantee active substance, time particularly for multiple plastics.Be illustrated in figure 2 differing materials merely through the change plating design sketch after laser alligatoring, as shown in Figure 2, even if PC material adopts and bis-activatedly also cannot go up plating, and PP material can partly upper plating, and PC/ABS material exists equally and lacks plating phenomenon.
Carry out circuit radium carving on the surface using laser to the plastic basis material after shaping, realize in the step 101 of surface laser alligatoring, plastic basis material comprises one of following or its arbitrary combination:
Polycarbonate, acrylonitrile-butadiene-styrene copolymer, the mixture of polycarbonate and acrylonitrile-butadiene-styrene copolymer, polymeric amide or nylon, polypropylene, polymeric liquid crystal copolymer, polyformaldehyde resin, polyimide, polyethylene terephthalate.Wherein,
Polycarbonate (polycarbonate is called for short " PC ") can be synthesized by dihydroxyphenyl propane and oxychlorination carbon (COCl2);
Acrylonitrile-butadiene-styrene copolymer (acrylonitrile butadiene styrene, be called for short " ABS "), ABS material is the graft copolymer of vinyl cyanide (Acrylonitrile), 1,3-butadiene (Butadiene), vinylbenzene (Styrene) three kinds of monomers;
Polycarbonate and acrylonitrile-butadiene-styrene copolymer and mixture (PC/ABS) are the thermoplastic plastic rubbers by polycarbonate and polyacrylonitrile alloy;
Polymeric amide or nylon (polyamides is called for short " PA "), its essentially consist material is the fatty polyamide by amido linkage-[NHCO]-couple together;
Polypropylene (polypropylene is called for short " PP "), be a kind of superpolymer, monomer is propylene CH2=CH-CH3;
Polymeric liquid crystal copolymer (liquid crystal polymer is called for short " LCP ") or title liquid crystalline polymers, industrialization liquid crystalline polymers etc. are a kind of novel high-performance special engineering plastics
Polyformaldehyde resin (polyoxymethylene is called for short " POM "), or claim POM plastic, match steel material etc., oyster white opaque crystallinity linear thermoplastic resin;
Polyimide (polyimide, be called for short " PI "), be the aromatic heterocycle polymer compound that molecular structure contains imide chain link, equal benzene-type PI can be divided into, solubility PI, polyamide-imide (PAI) and polyimide (PEI) four class
Polyethylene terephthalate (polythylene terephthalate is called for short " PET ") (being commonly called as polyester resin) is the polymkeric substance of oyster white or front yellow highly crystalline
The formulation of common plastics is compared to the exotic materials needed for LDS technique, the necessary metallic compound of this technique is with the addition of in this material, doping ratio is 3% ~ 10%, due to the large percentage added, this material modified thermostability to metallic compound and plastic basis material, consistency, plasticizing stability, the aspects such as electric performance stablity produce larger impact, also limit the scope of application of material while cost is improved.
Compared to the exotic materials needed for LDS technique, the plastic basis material in the present invention does not need to the addition of the necessary metallic compound of LDS technique, and the with low cost and scope of application of material obviously expands.According to different substrate material characteristics in the step of chemical roughen, select suitable alligatoring liquid and alligatoring operating procedure to control chemical roughen intensity, good selective chemical alligatoring can be realized.
In addition, be appreciated that plastic basis material comprises above-mentioned materials but is not limited thereto in other embodiments of the present invention.
After this enter step 102, the plastic basis material after laser alligatoring is cleaned.
After this enter step 103, the plastic basis material after cleaning is placed in chemical agent and carries out chemical roughen.
Chemical roughen is to plastic basis material surface etch by chemical action, produce chemical scission of link, on the one hand make plastic basis material surface become polarity, form good wetting ability effect, simultaneously also because chemical milling forms fine and close uniform lacklustre microscopic pits.Chemical roughen is owing to producing surface polarity, adsorption activity material easier in laser.But only implement chemical roughen and cannot realize selectivityization plating, the method generally adopted at present is: all plate metal at substrate surface after activation, and then the method for gold-tinted radiography realizes local etching formation circuit, cause its selective metallization process comparatively complicated and expensive.
In order to do selective chemical alligatoring for laser coarse surface, according to different material behaviors, certain chemical roughen intensity need be controlled by suitable alligatoring liquid and alligatoring operating procedure.Preferably, in this step 103:
When the material of plastic basis material is polycarbonate, the preferred potassium permanganate of chemical agent, the concentration preferably 20 ~ 120g/L of medicament, the coarsening time preferably 5 ~ 50min of chemical roughen, Coarsening Temperature preferably 25 ~ 80 DEG C.
Alligatoring undercapacity, will not cause plating or upper plating uneven; Alligatoring excessively then can cause full plating.Be illustrated in figure 3 the upper plating design sketch of different coarsening rate.As shown in Fig. 3 (a), when alligatoring is excessive (such as, the coarsening time of PC materials chemistry alligatoring is greater than 50min, and Coarsening Temperature is greater than 80 DEG C) full plating can be caused; As shown in Fig. 3 (b), when alligatoring is not enough (such as, the coarsening time of PC materials chemistry alligatoring is less than 5min, and Coarsening Temperature is less than 25 DEG C) can not cause plating or upper plating uneven; As shown in Fig. 3 (c), when alligatoring intensity is suitable, (such as, the coarsening time of PC materials chemistry alligatoring is 5 ~ 50min, and Coarsening Temperature is 25 ~ 80 DEG C) then can go up plating evenly.
After this enter step 104, the plastic basis material after chemical roughen is reduced and cleaned.
Preferably, in this step, the liquid that reduction and cleaning use is hydrogen peroxide.
In addition, be appreciated that in other embodiments of the present invention, the liquid that reduction and cleaning use is not limited to hydrogen peroxide, also can be other liquids, such as sodium hypophosphite solution or dilute sulphuric acid etc.
After this enter step 105, plastic basis material is inserted in activator and activates.
Plastic basis material is immersed in activator and carries out chemical activation process, make subregion adsorb atoms metal in this activator.
After this enter step 106, activated plastic basis material is put into the plating of carrying out of chemical reducing solution, make plastic basis material surface selectivity deposited plating layer, form metal line.
Preferably, activated plastic basis material is being put into the plating of carrying out of chemical reducing solution, is making plastic basis material surface selectivity deposited plating layer, after forming the step 106 of metal line, also comprise step:
By chemical reduction method or electrolytic process, the coating on plastic basis material surface is thickened as required.
Preferably, in this step, the coating thickened is chemical plating copper layer, and it is 1 ~ 50um that electroless copper thickens thickness, and deposition rate is 2.0 ~ 3.5u/h preferably, electroless copper temperature preferably 30 ~ 70 DEG C.
In addition, be appreciated that in other embodiments of the present invention, follow-uply also can select other metal plating such as silver-plated, golden.
In the present embodiment, the two alligatoring schemes in conjunction with laser alligatoring and chemical roughen in the method for selective metal circuit are formed at frosting, make obviously to reduce the material requirements of plastic basis material when selection, do not need exotic materials, the with low cost and scope of application of material obviously expands.In addition, in conjunction with laser alligatoring and chemical roughen, laser alligatoring can make wiring meticulous on the one hand, and chemical roughen can make again the radium on plastic basis material surface face of carving form stronger adsorption zone on the other hand, is conducive to absorbing more active substance.
Second embodiment of the invention relates to a kind of method forming selective metal circuit at frosting, second embodiment improves on the basis of the first embodiment, main improvements are, plastic basis material is being inserted in activator in the step carrying out activating, activation, for bis-activated, comprises following sub-step:
Plastic basis material is inserted in the first activator and carry out first time activation;
Plastic basis material is cleaned;
Plastic basis material is inserted in the second activator and carry out second time activation.
First activator and the second activator are two kinds of different activated solutions.
First activator and the second activator can be colloidal palladium solution or ionic palladium etc. containing the activation solution of palladium ion, can be the activation solutions of silver-colored ammonia or other silver ion, can be or the activation solution of electrocuprol or other copper ions.First activator and the second activator are one wherein respectively.
In addition, when immersing activator and carrying out activation act, for differing materials, suitable operating procedure will be selected, such as soak at room temperature mode, or warming-in-water immersion etc.
Preferably, when the material of plastic basis material is polycarbonate, the preferred colloidal palladium solution of the first activator, soak time is 1 ~ 10min preferably, activation temperature preferably 25 ~ 50 DEG C, the preferred silver-colored ammonia activation solution of the second activator, soak time is 1 ~ 10min preferably, activation temperature preferably 25 ~ 50 DEG C.
Although the ability of base material radium carving patterned surface adsorption activity is better after being appreciated that two alligatoring, only implements single activation, be still difficult to ensure that base material adsorbs abundant active substance, plating leakage or the uneven problem of upper plating can not be avoided completely.Be illustrated in figure 4 bis-activated and single activation and plate effect contrast figure, as shown in the figure, provide and test contriver and find that the bis-activated base material that contributes to adsorbs abundant active substance, avoid plating leakage or the uneven problem of upper plating, realize good selectivity is plated.
In processing procedure, contriver also finds that two alligatoring is in conjunction with bis-activated, can not only realize good selectivity is plated, can also:
1, more effectively ensure that its conducting is functional at the structure such as via hole, micro-via hole place.Be illustrated in figure 5 bis-activated and single change activate on via hole and micro-via hole and plate effect contrast figure, wherein Fig. 5 (A), 5 (C) plate effect for bis-activated change on via hole and micro-via hole, and its via hole is evenly gone up and plated, micro-via hole conducting; Fig. 5 (B), 5 (D) are that effect is plated in the change of single activation on via hole and micro-via hole, and via holeization plating is bad, and the plating of micro-via holeization is bad.Fig. 5 A, 5C, 5B, 5D are the enlarged view of Fig. 5 (A), 5 (C) 5 (B), 5 (D) respectively.
2, combine two alligatoring and bis-activated, be applicable to wider laser radium carving parameter processing, have adaptability widely to laser processing.Fig. 6 changes plating effect contrast figure under 6 groups of larger laser parameters of difference, and Fig. 6 (a), 6 (b) are after radium carving and effect after changing plating respectively, and wherein 6 groups of laser parameters are as shown in table 1 below.As shown in Figure 6,6 groups of larger laser parameters of difference can obtain good selectivityization plating result.
| Numbering | Power | Frequency/kHz | Speed/mm/s |
| 1 | 90％ | 25 | 2500 |
| 2 | 70％ | 25 | 2500 |
| 3 | 65％ | 65 | 3000 |
| 4 | 65％ | 28 | 1500 |
| 5 | 80％ | 65 | 3500 |
| 6 | 65％ | 65 | 3500 |
Table 1
3, combine two alligatoring and bis-activated, have laser processing extensive adaptive while, also assures that good coating adsorptive power.The hundred lattice test result comparison diagrams of Fig. 7 after to be PC base material change plating under four kinds of dissimilar alligatoring and activation method.Hundred lattice tests are a kind of methods of general test material surface adhesion force, and its test procedure comprises:
First with ethanol (95%) wiping coating surface, (specification of each grid is 1mm then to cut 100 grids with cross-cut tester/cutter
*1mm), surface metal-layer must be cut off; Then after using 3M#610 adhesive tape sticking hundred lattice district, swab flat rear placement 90 seconds with cotton or eraser, capture the vertical pull-up of adhesive tape one end moment, so repeat 3 above-mentioned actions at same position, then check the dropping situations of metal level.
Being the sticking power descriptive grade figure of hundred lattice tests shown in Fig. 8, is 0B ~ 5B according to the dropping situations of metal level by the grade classification of sticking power.In present embodiment, the judging criterion of hundred lattice test passes is: more than class 4 B (see Fig. 8), namely the scope of coming off is less than 5% of test zone.
Two alligatoring is in conjunction with bis-activated, extraordinary coating adsorptive power effect can be obtained, see Fig. 7, as shown in Figure 7, contrast the modes such as single alligatoring+mono-activation, single alligatoring+bis-activated, two alligatoring+mono-activation, two alligatoring+bis-activated mode not only achieves well in selectivity and plates, and the test of hundred lattice does not come off substantially, illustrate that its sticking power is very good, ensure that good coating adsorptive power.
As the preference of present embodiment, form the schematic flow sheet of the method for selective metal circuit at frosting as shown in Figure 9, the concrete implementation step of preferred embodiment is as follows:
In step s1, common substrate is shaping by modes such as injection mouldings;
After this enter step s2, use certain wavelength laser to carry out local line radium carving at substrate surface, form surface laser alligatoring; Line pattern radium is carved on structural part by the three-dimensional marking machine (model is: QM3D1H) using Shenzhen Fanyou Technologies Co., Ltd. to produce, above-mentioned technique laser equipment used can also be gas laser or liquid laser, or other solid statelaser; Plant capacity is 3 ~ 50W, preferably 10 ~ 25W; Optical maser wavelength can be 200 ~ 1064nm, preferably 1064nm; The parameter of radium carving parameter preferably in table 1;
After this enter step s3, cleaning being immersed in degreaser by the base material of laser alligatoring, removing the dirt settling produced in laser coarsening process;
After this enter step s4, this isolator is immersed in chemical roughen liquid and carries out chemical roughen, select different chemical roughens according to properties of materials, and control certain chemical roughen intensity; The preferred potassium permanganate alligatoring of such as PC base material, liquor strength 20 ~ 120g/L, coarsening time 5 ~ 50min, Coarsening Temperature 25 ~ 80 DEG C;
After this enter step s5, after alligatoring, base material need reduce and clean; Reduction and cleaning liquid are such as hydrogen peroxide, or sodium hypophosphite solution, or dilute sulphuric acid etc.
After this enter step s6, above-mentioned base material is immersed in activator 1 and carry out first time activation; Such as, PC base material after alligatoring, preferably immerses colloidal palladium solution mode and completes first time activation, soak time 1 ~ 10min, activation temperature 25 ~ 50 DEG C;
After this enter step s7, above-mentioned base material is immersed in activator 2 and do second time activation; Such as, PC base material after first time activation, preferably immerses in silver-colored ammonia activation solution and completes second time activation, soak time 1 ~ 10min, activation temperature 25 ~ 50 DEG C;
After this enter step s8, be immersed in by activated base material and have in certain active chemical bronze plating liquid or chemical nickel-plating liquid, the deposition rate of such as electroless copper is 2.5 ~ 4.0u/h; Through chemical reaction, form one deck layers of copper at substrate surface;
After this enter step s9, above-mentioned base material can continue electroless plating thickening or plating adds thickness coating.It is 1 ~ 50um that such as electroless copper thickens thickness, deposition rate 2.0 ~ 3.5u/h, and electroless copper temperature is 30 ~ 70 DEG C; Follow-uply also other metal plating such as silver-plated, golden can be selected.
Third embodiment of the invention relates to the plastic components that a kind of surface has metallic circuit, and the metallic circuit of this plastic components adopts the method any one of first and second embodiment to be formed on plastic components surface.
Comprehensively above-mentioned, the invention provides that a kind of technique is simple, plastic components that the method forming selective metal circuit on common plastics surface that cost is low and surface have metallic circuit, possess following technical superiority:
1, being applicable to common plastics, carrying out modification without the need to adding organometallic compound, save and make and tooling cost;
2, PC, PC+ABS, PA, PP, LCP, POM, PI, PET etc. common plastic substrates is included but not limited to, applied widely;
3, two alligatoring and bis-activated combination, while realizing plating smoothly, also possesses outstanding pattern precision;
4, two alligatoring and bis-activated combination, efficiently solve " sticking power ", optionally problem;
5, two alligatoring and bis-activated combination, the conducting efficiently solving the structure such as via hole, micro-via hole place is functional;
6, two alligatoring and bis-activated combination, goes for the circuit surface that different laser radium carving parameter is processed to form, has adaptability widely to laser processing.
It should be noted that, in the claim and specification sheets of this patent, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operational zone, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element " being comprised " limited by statement, and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
Although by referring to some of the preferred embodiment of the invention, to invention has been diagram and describing, but those of ordinary skill in the art should be understood that and can do various change to it in the form and details, and without departing from the spirit and scope of the present invention.
Claims (9)
1. form a method for selective metal circuit at frosting, it is characterized in that, comprise the following steps:
Use the surface of laser to the plastic basis material after shaping to carry out circuit radium carving, realize surface laser alligatoring;
Plastic basis material after laser alligatoring is cleaned;
Plastic basis material after cleaning is placed in chemical agent and carries out chemical roughen;
Plastic basis material after described chemical roughen is reduced and cleaned;
Described plastic basis material is inserted in activator and activates;
Activated plastic basis material is put into the plating of carrying out of chemical reducing solution, make described plastic basis material surface selectivity deposited plating layer, form metal line.
2. the method forming selective metal circuit at frosting according to claim 1, it is characterized in that, circuit radium carving is carried out on the surface of described use laser to the plastic basis material after shaping, realize in the step of surface laser alligatoring, described plastic basis material comprises one of following or its arbitrary combination:
Polycarbonate, acrylonitrile-butadiene-styrene copolymer, the mixture of polycarbonate and acrylonitrile-butadiene-styrene copolymer, polymeric amide or nylon, polypropylene, polymeric liquid crystal copolymer, polyformaldehyde resin, polyimide, polyethylene terephthalate.
3. the method forming selective metal circuit at frosting according to claim 1, is characterized in that, described, plastic basis material after cleaning is placed in the step that chemical agent carries out chemical roughen:
When the material of described plastic basis material is polycarbonate, the preferred potassium permanganate of described chemical agent, the concentration preferably 20 ~ 120g/L of medicament, the coarsening time preferably 5 ~ 50min of described chemical roughen, Coarsening Temperature preferably 25 ~ 80 DEG C.
4. the method forming selective metal circuit at frosting according to claim 1, is characterized in that, to be inserted in activator by plastic basis material in the step carrying out activating described, described activation is bis-activated, comprises following sub-step:
Described plastic basis material is inserted in the first activator and carry out first time activation;
Described plastic basis material is cleaned;
Described plastic basis material is inserted in the second activator and carry out second time activation;
Described first activator and described second activator are two kinds of different activated solutions.
5. the method forming selective metal circuit at frosting according to claim 4, is characterized in that, in described bis-activated step:
When the material of described plastic basis material is polycarbonate, the preferred colloidal palladium solution of described first activator, soak time is 1 ~ 10min preferably, activation temperature preferably 25 ~ 50 DEG C;
The preferred silver-colored ammonia activation solution of described second activator, soak time is 1 ~ 10min preferably, activation temperature preferably 25 ~ 50 DEG C.
6. the method forming selective metal circuit at frosting according to claim 1, it is characterized in that, in the described step of reducing to the plastic basis material after chemical roughen and cleaning, the liquid that described reduction and cleaning use is hydrogen peroxide.
7. the method forming selective metal circuit at frosting according to claim 1, it is characterized in that, described, activated plastic basis material is put into the plating of carrying out of chemical reducing solution, make described plastic basis material surface selectivity deposited plating layer, after forming the step of metal line, also comprise step:
By chemical reduction method or electrolytic process, the coating on described plastic basis material surface is thickened as required.
8. the method forming selective metal circuit at frosting according to claim 7, it is characterized in that, in the described step by chemical reduction method or electrolytic process, the coating on described plastic basis material surface thickened as required, the described coating thickened is chemical plating copper layer, it is 1 ~ 50um that electroless copper thickens thickness, deposition rate is 2.0 ~ 3.5u/h preferably, electroless copper temperature preferably 30 ~ 70 DEG C.
9. surface has a plastic components for metallic circuit, it is characterized in that, this metallic circuit adopts the method according to any one of claim 1 to 8 to be formed on plastic components surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410146680.8A CN104975276B (en) | 2014-04-11 | 2014-04-11 | The method and plastic components of selective metal route are formed in frosting |
| PCT/CN2014/093499 WO2015154502A1 (en) | 2014-04-11 | 2014-12-10 | Method of forming selective metal circuit on plastic surface, and plastic component |
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| CN201410146680.8A CN104975276B (en) | 2014-04-11 | 2014-04-11 | The method and plastic components of selective metal route are formed in frosting |
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| Publication number | Publication date |
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| CN104975276B (en) | 2019-07-12 |
| WO2015154502A1 (en) | 2015-10-15 |
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