CN103491716A - Pattern electrically conductive circuit structure and forming method thereof - Google Patents
Pattern electrically conductive circuit structure and forming method thereof Download PDFInfo
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- CN103491716A CN103491716A CN201310363733.7A CN201310363733A CN103491716A CN 103491716 A CN103491716 A CN 103491716A CN 201310363733 A CN201310363733 A CN 201310363733A CN 103491716 A CN103491716 A CN 103491716A
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Abstract
The invention mainly relates to the field of electrically conductive circuit manufacturing, in particular to the field of pattern electrically conductive circuit manufacturing. A forming method of a pattern electrically conductive circuit includes the steps that mica particulates and macromolecule plastic particles are mixed and formed to be an insulating substrate, the insulating substrate is subjected to laser engraving to form an electrically conductive circuit pattern, the electrically conductive circuit pattern at least undergoes coarsening and wetting steps to promote the water content of the insulating substrate and show hydrophilcity, then, a copper metal layer is at least formed on the electrically conductive circuit pattern in a chemically film plating mode, and a palladium metal layer, a nickel metal layer and a gold metal layer can be sequentially formed on the copper metal layer. The method effectively simplifies processing procedures, reduces production cost and promotes processing efficiency. The pattern electrically conductive circuit structure manufactured through the method at least comprises the insulating substrate, the electrically conductive circuit pattern and the copper metal layer, and the palladium metal layer, the nickel metal layer and the gold metal layer can be additionally arranged on the copper metal layer. The structure is not prone to generating organic catalytic agent interference in an insulating carrier, and the insulating carrier after forming is good in structural strength.
Description
Technical field
The present invention relates generally to making field, conducting wire, relates in particular to making field, pattern conducting wire.
Background technology
The manufacture method of pattern conducting wire is simply that electric conducting material directly is fitted in to the polymer base material surface traditionally, but adopt electric conducting material on the pattern conducting wire that this mode makes easily to have, peels off the disappearance that breaks away from the polymer base material surface; The manufacture method of another kind of pattern conducting wire is that macromolecular material is penetrated to the coated with conductive material, and make aforementioned electric conducting material part to exposing outside the type of forming, yet utilize this mode to make wire line on polymer base material, not only can increase the thickness of finished product (polymer base material), nor easily carry out the Change In Design of wire line.
For this reason, No. US7060421 open case of the U.S. arranged, it discloses a kind of conducting wire formation method, mainly comprises following steps: (a) non-conductive metal oxide and the dielectric material with spinel structure (spinel-based) is mixed to get to a base material; (b) destroy the bond of non-conductive metal oxide with the electromagnetic wave irradiation aforementioned substrates, and obtain the metal discharged by non-conductive metal oxide; (c) again in described formed layer of metal film by the zone after electromagnetic wave irradiation in the plated film mode after, make aforementioned conducting wire.
The hierarchy of skill needed due to above-mentioned processing method is higher, and comparatively difficult in operation, is not therefore seeing and is being widely used on the market at present.
U.S. US6319564 Patent Case is separately arranged, it has disclosed circuit structure and manufacture method thereof on a kind of non-conductive substrate, mainly by the base material containing heavy metal, and the metallization be arranged on aforementioned substrates forms, contain the heavy metal nucleus at this base material, this heavy metal nucleus is that a kind of non-conductive organic heavy metal complex compound of ultraviolet ray destruction of launching by excimer laser generates, this heavy metal complex is coated in the micropore of substrate surface, and in the scope of circuit structure, and forming circuit surface.
Yet because the heavy metal composition is contained in above-mentioned base material inside, therefore in application, have following disappearance: 1. described heavy metal composition can affect the impact strength of monolith substrate and extend rupture strength.2. not only itself is with high costs for the base material raw material (plastic pellet) that generally contains the heavy metal composition, and it can't be useful in the application scenario of general raw material (plastic pellet), easily causes substantial contribution to overstock, and does not meet economic benefit.3. the described base material that contains the heavy metal composition can make the splash of heavy metal nucleus to predeterminable area in the process of radium-shine processing, increases degree of difficulty and the fraction defective of volume production.
Summary of the invention
Main purpose of the present invention is to provide the formation method of a kind of pattern conducting wire, and it can effectively be reduced at the procedure that forms tool conductive pattern circuit on insulating carrier, to reduce production costs, to promote working (machining) efficiency; And it can utilize the radium-shine processing machine of extensive use on market to be processed, and can effectively reduce equipment investment cost, can the organic catalyst of splash in the radium-shine course of processing and causing is coated with the yield of journey and reduces yet.
Another purpose of the present invention is to provide the structure of a kind of pattern conducting wire, and it be difficult for to produce organic catalyst and disturbs in insulating carrier, also can not reduce the structural strength after the moulding of aforementioned dielectric carrier.
For achieving the above object, the present invention by the following technical solutions:
The formation method of a kind of pattern conducting wire at least comprises:
One batch mixing forming step, mix cracked mica particulate with the high molecule plastic grain, to obtain an insulating substrate;
One laser engraving step, utilize radium-shine processing at the aforementioned dielectric substrate surface, to destroy the bond of aforementioned mica, and then forms the conducting wire pattern;
One pre-treatment program, sequentially by an alligatoring step and a moistening step, formed, described alligatoring step is to make described insulating substrate energy fast lifting water content, and to reach the effect of surface active, moistening step is to utilize wetting agent to make the aforementioned dielectric substrate surface represent better hydrophily;
One plated film program, at least there is an electroless copper step, to produce the layer of copper ion on the pattern of the conducting wire of aforementioned dielectric base material, and this copper ion can be deposited in the gap between each cracked mica particulate and form a copper metal layer, makes aforementioned conducting wire pattern have preferably conductivity.
According to said method, described plated film program is after the electroless copper step, separately sequentially comprise the following steps: palladium activation, chemical nickel plating and chemical gilding, described palladium activation step is to analyse and be attached to copper metallic face with palladium ion, forming one can increase described copper metal layer and be combined active palladium metal layer with other metal, described electroless nickel step is to make the nickel ion reduction on palladium metal layer surface, formation one can increase the nickel metal layer of surface oxidation-resistant characteristic, described chemical gilding step is to produce a gold metal layer on the nickel metal layer surface, to increase whole conductivity.
According to said method, the alligatoring step is to be a non-chromium roughening treatment.
According to said method, described pre-treatment program separately was provided with a defatting step before the alligatoring step, and defatting step is, with the interface activating agent, remover oil removing reaction is carried out in the insulating substrate surface, to promote the adhesive force on metal pair insulating substrate surface.
According to said method, described batch mixing forming step with after the high molecule plastic grain mixes, after separately via one, taking out the material process, then is shaped to insulating substrate through a mode that is selected from ejaculation, extrude wherein at the mica particulate.
The structure of a kind of pattern conducting wire, it at least comprises:
One insulating substrate, at least formed by mica particulate and the abundant mixed-forming of high molecule plastic grain;
One conducting wire pattern, it is formed on the local default position of aforementioned dielectric substrate surface;
One copper metal layer, it is formed on pattern position in conducting wire on the aforementioned dielectric base material, makes described conducting wire pattern have conductivity.
According to said structure, separately be provided with a palladium metal layer on described copper metal layer surface, this palladium metal layer can increase the activity that this copper metal layer is combined with other metal.
According to said structure, described palladium metal layer separately is provided with a nickel metal layer on surface, and this nickel metal layer can increase surperficial anti-oxidation characteristics.
According to said structure, described nickel metal layer separately is provided with a gold metal layer on surface, and this gold metal layer can increase whole conductivity.
Compare with conventional art, the invention has the advantages that:
The formation method of pattern of the present invention conducting wire can effectively be reduced at the procedure that forms tool conductive pattern circuit on insulating carrier, to reduce production costs, to promote working (machining) efficiency, and it can utilize the radium-shine processing machine of extensive use on market to be processed, can effectively reduce equipment investment cost, can the organic catalyst of splash in the radium-shine course of processing and causing is coated with the yield of journey and reduces yet.Utilize pattern conductive line structure that said method makes to be difficult for producing organic catalyst in insulating carrier and disturb, also can not reduce the structural strength after the moulding of aforementioned dielectric carrier.
the accompanying drawing explanation:
Below in conjunction with the drawings and the specific embodiments, the present invention is further illustrated:
Fig. 1 is the complete method flow chart of preferred embodiment of the formation method of pattern conducting wire in the present invention.
Fig. 2 is the section of structure of the preferred embodiment of the structure of pattern conducting wire in the present invention.
embodiment:
As shown in Figure 1, the present invention relates to the formation method of a kind of pattern conducting wire, its method at least comprises: batch mixing moulding S11 step, laser engraving S12 step, pre-treatment A program and plated film B program; Wherein said pre-treatment A program, sequentially a degreasing S13 step, an alligatoring S14 step and a moistening S15 step, consisted of, aforementioned plated film B program sequentially is comprised of an electroless copper S16 step, a palladium activation S17 step, a chemical nickel plating S18 step and a chemical gilding S19 step.
Below please refer to Fig. 2 described, the formation method of above-mentioned pattern conducting wire is described simultaneously, the formation method of pattern conducting wire comprises the following steps:
(1) batch mixing moulding S11, mix trickle mica (aluminosilicate aluminosilicate) particulate with the high molecule plastic grain, after one takes out material processing, then be shaped to an insulating substrate 1 via ejaculation or extrusion type;
(2) laser engraving S12, utilize radium-shine processing to destroy the bond of the mica on aforementioned dielectric base material 1 surface, to form a required conducting wire pattern 2;
(3) pre-treatment A program, comprise degreasing S13 step, alligatoring S14 step and moistening S15 step, degreasing S13 step is to utilize the interface activating agent aforementioned dielectric base material 1 surface to be carried out the remover oil removing reaction of 1 ~ 10 minute under 25 ~ 60 ℃ of environment, to promote the adhesive force on various metal pair insulating substrates 1 surface; Alligatoring S14 step is to make insulating substrate 1 utilize non-chromium roughening treatment processing 1 ~ 10 minute under 25 ~ 50 ℃ of environment, makes insulating substrate 1 energy fast lifting water content, to reach the effect of surface active; Moistening S15 step is to utilize wetting agent, under 25 ~ 50 ℃ of environment, insulating substrate 1 is acted on to 1 ~ 5 minute, makes aforementioned dielectric base material 1 surface represent preferably hydrophilic (not draining) property; Through above three steps, described insulating substrate 1 energy fast lifting water content also represents hydrophily;
(4) plated film B program, produce multiple layer metal on the conducting wire of aforementioned dielectric base material 1 pattern 2, so that conducting wire has preferably conductivity, comprising an electroless copper S16 step, a palladium activation S17 step, a chemical nickel plating S18 step and a chemical gilding S19 step; Electroless copper S16 step is to produce the layer of copper ion on the conducting wire of insulating substrate 1 pattern 2 on the gap between each cracked mica particulate, with the copper metal layer 3 that forms a tool conductivity; Palladium activation S17 step is to analyse and be attached to copper metal layer 3 surfaces with palladium ion, to form, can increase aforementioned copper metal layer 3 and is combined active palladium metal layer 4 with other metal; Chemical nickel plating S18 step is to make nickel ion reduction on palladium metal layer 4 surface, to form a nickel metal layer 5 that can increase the surface oxidation-resistant characteristic; Chemical gilding S19 step is to be formed the gold metal layer 6 of a tool excellent electric conductivity on nickel metal layer 5 surfaces by gold ion.
With conventional art, compare, said method can effectively be reduced at the procedure that forms tool conductive pattern circuit on insulating carrier, to reduce production costs, to promote working (machining) efficiency, and it can utilize the radium-shine processing machine of extensive use on market to be processed, can effectively reduce equipment investment cost, can the organic catalyst of splash in the radium-shine course of processing and causing is coated with the yield of journey and reduces yet.
Can make pattern conductive line structure as shown in Figure 2 by said method, mainly comprise an insulating substrate 1, one conducting wire pattern 2 and a copper metal layer, insulating substrate 1 is at least by mica particulate and high molecule plastic mixed-forming, be formed with a conducting wire pattern 2 by laser engraving on insulating substrate 1, be laid with copper metal layer 3 on conducting wire pattern 2, so that described conducting wire has conductivity, separately be provided with a palladium metal layer 4 that can increase the activity that copper metal layer is combined with other metal level on copper metal layer 3 surfaces, separately be provided with a nickel metal layer 5 that can increase the surface oxidation-resistant characteristic on palladium metal layer surface, separately be provided with a gold metal layer 6 that can increase monolithic conductive on nickel metal layer 5 surfaces.
With conventional art, compare, this pattern conductive line structure be difficult for to produce organic catalyst and disturbs in insulating carrier, also can not reduce the structural strength after the moulding of aforementioned dielectric carrier.
Claims (9)
1. the formation method of a pattern conducting wire is characterized in that: at least comprise:
One batch mixing forming step, mix cracked mica particulate with the high molecule plastic grain, to obtain an insulating substrate;
One laser engraving step, utilize radium-shine processing at the aforementioned dielectric substrate surface, to destroy the bond of aforementioned mica, and then forms the conducting wire pattern;
One pre-treatment program, sequentially by an alligatoring step and a moistening step, formed, described alligatoring step is to make described insulating substrate energy fast lifting water content, and to reach the effect of surface active, moistening step is to utilize wetting agent to make the aforementioned dielectric substrate surface represent better hydrophily;
(4) one plated film programs, at least there is an electroless copper step, to produce the layer of copper ion on the pattern of the conducting wire of aforementioned dielectric base material, and this copper ion can be deposited in the gap between each cracked mica particulate and form a copper metal layer, makes aforementioned conducting wire pattern have preferably conductivity.
2. the formation method of a kind of pattern according to claim 1 conducting wire, it is characterized in that: described plated film program is after the electroless copper step, separately sequentially comprise the following steps: the palladium activation, chemical nickel plating and chemical gilding, described palladium activation step is to analyse and be attached to copper metallic face with palladium ion, forming one can increase described copper metal layer and be combined active palladium metal layer with other metal, described electroless nickel step is to make the nickel ion reduction on palladium metal layer surface, formation one can increase the nickel metal layer of surface oxidation-resistant characteristic, described chemical gilding step is to produce a gold metal layer on the nickel metal layer surface, to increase whole conductivity.
3. the formation method of a kind of pattern according to claim 1 conducting wire, it is characterized in that: described alligatoring step is to be a non-chromium roughening treatment.
4. the formation method of a kind of pattern according to claim 1 conducting wire, it is characterized in that: described pre-treatment program separately was provided with a defatting step before the alligatoring step, defatting step is, with the interface activating agent, remover oil removing reaction is carried out in the insulating substrate surface, to promote the adhesive force on metal pair insulating substrate surface.
5. the formation method of a kind of pattern according to claim 1 conducting wire; it is characterized in that: described batch mixing forming step at the mica particulate with after the high molecule plastic grain mixes; after separately via one, taking out the material process, then be shaped to insulating substrate through a mode that is selected from ejaculation, extrude wherein.
6. the structure of a pattern conducting wire, it is characterized in that: it at least comprises:
One insulating substrate, at least formed by mica particulate and the abundant mixed-forming of high molecule plastic grain;
One conducting wire pattern, it is formed on the local default position of aforementioned dielectric substrate surface;
One copper metal layer, it is formed on pattern position in conducting wire on the aforementioned dielectric base material, makes described conducting wire pattern have conductivity.
7. the structure of a kind of pattern according to claim 6 conducting wire, it is characterized in that: separately be provided with a palladium metal layer on described copper metal layer surface, this palladium metal layer can increase the activity that this copper metal layer is combined with other metal.
8. the structure of a kind of pattern according to claim 7 conducting wire, it is characterized in that: described palladium metal layer separately is provided with a nickel metal layer on surface, and this nickel metal layer can increase surperficial anti-oxidation characteristics.
9. the structure of a kind of pattern according to claim 8 conducting wire, it is characterized in that: described nickel metal layer separately is provided with a gold metal layer on surface, and this gold metal layer can increase whole conductivity.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310363733.7A CN103491716A (en) | 2013-08-20 | 2013-08-20 | Pattern electrically conductive circuit structure and forming method thereof |
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| CN201310363733.7A CN103491716A (en) | 2013-08-20 | 2013-08-20 | Pattern electrically conductive circuit structure and forming method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2015154502A1 (en) * | 2014-04-11 | 2015-10-15 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface, and plastic component |
| CN105723469A (en) * | 2014-04-16 | 2016-06-29 | Lg化学株式会社 | Composition for forming conductive pattern, method for forming conductive pattern by using same, and resin structure having conductive pattern |
| CN105848422A (en) * | 2016-06-08 | 2016-08-10 | 上海安费诺永亿通讯电子有限公司 | Circuit fabrication method |
| CN108866548A (en) * | 2018-07-12 | 2018-11-23 | 深圳市化讯半导体材料有限公司 | A kind of coat of metal and its preparation method and application |
| CN109638435A (en) * | 2018-11-27 | 2019-04-16 | 深圳市臻鼎盛通讯有限公司 | The manufacturing process and 5G antenna of a kind of non-metallic substrate antenna or route |
| CN110230046A (en) * | 2019-06-26 | 2019-09-13 | 捷奈斯科技（深圳）有限公司 | A kind of chemical palladium-plating/gold plating method |
| CN115087760A (en) * | 2020-02-18 | 2022-09-20 | 日本高纯度化学株式会社 | Plated laminate |
| WO2023048645A3 (en) * | 2021-09-22 | 2023-05-25 | Nanyang Technological University | Hybrid manufacturing and electronic devices made thereby |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109638435A (en) * | 2018-11-27 | 2019-04-16 | 深圳市臻鼎盛通讯有限公司 | The manufacturing process and 5G antenna of a kind of non-metallic substrate antenna or route |
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| CN115087760A (en) * | 2020-02-18 | 2022-09-20 | 日本高纯度化学株式会社 | Plated laminate |
| WO2023048645A3 (en) * | 2021-09-22 | 2023-05-25 | Nanyang Technological University | Hybrid manufacturing and electronic devices made thereby |
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