CN216600230U

CN216600230U - Ceramic circuit board

Info

Publication number: CN216600230U
Application number: CN202122881355.4U
Authority: CN
Inventors: 黄嘉铧; 罗素扑; 袁广
Original assignee: Huizhou Xinci Semiconductor Co ltd
Current assignee: Huizhou Xinci Semiconductor Co ltd
Priority date: 2021-11-23
Filing date: 2021-11-23
Publication date: 2022-05-24
Anticipated expiration: 2031-11-23

Abstract

The utility model discloses a ceramic circuit board, which comprises a ceramic substrate, wherein an electroplated copper layer is arranged on the upper surface of the ceramic substrate, the electroplated copper layer comprises a copper-plated circuit and a lead, the copper-plated circuit comprises a plurality of single peripheral circuit base layers, and the lead is connected between the adjacent single peripheral circuit base layers; the thickened metal circuit is formed on the upper surface of the single peripheral circuit substrate in an electroplating mode so as to form a corresponding single peripheral circuit. This ceramic circuit board obtains copper-plated circuit and wire through setting up the copper-plated layer earlier, has the thickening metal circuit in the upper surface electroplating of copper-plated circuit again, need not do the electroplating earlier with traditional technique and use the wire, electroplate when having solved the cutting with the wire problem that produces metal burr easily, simultaneously, the thickness of single peripheral circuit is not restricted, can thicken the design as required, has solved the problem that circuit easily appears opening circuit among the traditional technique.

Description

Ceramic circuit board

Technical Field

The utility model relates to the technical field of ceramic circuit boards, in particular to a ceramic circuit board.

Background

With the development of electronic products toward precision and light weight, miniaturization of electronic components has made higher demands on the precision of circuit fabrication of ceramic substrates. In the existing ceramic circuit board with electroplating connecting lines, the electroplating connecting lines mostly adopt thick metal layers.

In the prior art, a thin metal layer may be formed by electroless plating, which cannot realize a thick metal layer. Thus, most of the prior art can only form a thick metal layer on a ceramic circuit board by using an electroplating process: firstly, a conducting wire for electroplating is needed, and the conducting wire for electroplating is used for realizing communication so as to electroplate a thick metal layer. The prior art ceramic circuit boards suffer from the following drawbacks: because electroplating needs to be done on the ceramic substrate firstly, and in actual production and processing, the thickness of the electroplated thick metal layer needs to be less than 20 micrometers (because the thicker the burrs are larger during cutting), the electroplated thick metal layer is limited by the thickness of the electroplated thick metal layer, and the circuit breaking phenomenon is easy to occur in the subsequent production process; in addition, when the wire for electroplating is cut after being manufactured, the wire for electroplating is easy to generate metal burrs and other phenomena, so that electric sparks are possibly generated when a single-particle product is used, and the product is invalid.

Therefore, a new technical solution is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a ceramic circuit board, which is mainly characterized in that a copper-plated circuit and a conductive wire are obtained by first disposing a copper-plated layer, and then a thickened metal circuit is plated on the upper surface of the copper-plated circuit, so that the problem that the conductive wire for plating is prone to generate metal burrs during cutting is solved without first making a conductive wire for plating as in the conventional technology.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a ceramic circuit board comprises a ceramic substrate, wherein an electroplated copper layer is arranged on the upper surface of the ceramic substrate and comprises a copper-plated circuit and a lead, the copper-plated circuit comprises a plurality of single peripheral circuit base layers, and the lead is connected between the adjacent single peripheral circuit base layers; the thickened metal lines are formed on the upper surface of the single peripheral line base layer in an electroplating mode so as to form corresponding single peripheral lines.

Preferably, the electroplated copper layer further comprises a substrate peripheral circuit, and the lead is connected between the substrate peripheral circuit and the single peripheral circuit.

As a preferable scheme, after the thickened metal circuit is electroplated, the wire is removed by dry etching or chemical corrosion.

Preferably, the thickened metal circuit is a nickel-gold layer or a nickel-palladium-gold layer or a nickel-silver layer.

Preferably, the ceramic substrate is an aluminum nitride ceramic or an aluminum oxide ceramic.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, and particularly, according to the technical scheme, the copper-plated circuit and the lead are obtained by arranging the copper-plated layer firstly, and then the thickened metal circuit is electroplated on the upper surface of the copper-plated circuit, so that the problem that the electroplating lead is easy to generate metal burrs during cutting is solved without using the traditional technology as the thickening lead for electroplating firstly, meanwhile, the thickness of a single peripheral circuit is not limited, the thickening design can be carried out according to the requirement, and the problem that the circuit is easy to generate open circuit in the traditional technology is solved.

To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a first top view of an embodiment of the present invention;

FIG. 2 is a first bottom view of an embodiment of the present invention;

FIG. 3 is a second plan view of the embodiment of the present invention (the ceramic substrate with the lead lines removed);

FIG. 4 is a second bottom view of the embodiment of the present invention (with the ceramic substrate removed from the lead wires);

FIG. 5 is a third plan view of the embodiment of the present invention (after the ceramic substrate is cut);

fig. 6 is a third bottom view (after cutting the ceramic substrate) of the embodiment of the present invention.

The attached drawings indicate the following:

10. ceramic substrate 20, single peripheral circuit

30. Substrate peripheral circuit 40 and lead wire

50. Single line A on the back and a via hole.

Detailed Description

Referring to fig. 1 to 6, specific structures of the embodiments of the present invention are shown.

A ceramic wiring board includes a ceramic substrate 10. Fig. 1 and 2 show a top view and a bottom view of a ceramic substrate 10, respectively. The electroplated copper layer on the upper surface of the ceramic substrate 10 comprises a copper-plated circuit and a lead 40, wherein the copper-plated circuit comprises a plurality of single peripheral circuit base layers, and the lead 40 is connected between the adjacent single peripheral circuit base layers. The thickened metal traces are electroplated onto the upper surface of the single peripheral trace base to form a corresponding single peripheral trace 20. After the thickened metal circuit is electroplated, the lead 40 is removed by dry etching or chemical corrosion. The electroplated copper layer also comprises a substrate peripheral circuit 30, and the lead 40 is connected between the substrate peripheral circuit 30 and the single peripheral circuit 20.

In the present embodiment, 12 single peripheral circuits 20 are disposed on the upper surface of the ceramic substrate 10, wherein the 12 single peripheral circuits 20 are disposed on the upper surface of the ceramic substrate 10 in a matrix structure of three rows and four columns. In the present embodiment, the wires 40 have a strip structure, the wires 40 are connected between adjacent single peripheral circuit substrates, and the wires 40 are connected between the substrate peripheral circuit 30 and the single peripheral circuit 20. Preferably, the outer surface of the copper-plated wire is disposed flush with the outer surface of the wire 40.

In this embodiment, the ceramic substrate 10 is further provided with a via hole a penetrating vertically, and the lower end of the single peripheral circuit 20 is provided with a single back circuit 50. Wherein, an opening of one end of the via hole a is disposed on the single peripheral circuit 20, and an opening of the other end of the via hole a is disposed on the single circuit 50 on the back surface, so that: the individual peripheral wires 20 in the ceramic substrate 10 communicate with the underlying backside individual wires 50 through vias a.

Preferably, the ceramic substrate 10 is an aluminum nitride ceramic or an aluminum oxide ceramic.

Next, the manufacturing process flow of the present invention is detailed as follows:

the method comprises the following steps: performing copper electroplating layer fabrication on the ceramic substrate 10, as shown in fig. 1 and 2, fabricating a conductive wire 40 when fabricating a copper-plated circuit on the upper surface of the ceramic substrate 10 and a substrate peripheral circuit 30, wherein the thickness of the copper-plated circuit, the thickness of the substrate peripheral circuit 30 and the thickness of the conductive wire 40 are consistent;

step two: after the copper electroplating layer is finished, thickening metal circuit processing is carried out on the outer surface of the ceramic substrate 10, and a surface electroplating process is carried out by using electroplating nickel gold or nickel palladium gold or nickel silver, so as to integrally manufacture and form;

step three: as shown in fig. 3 and 4, the conductive wire 40 is etched, and the conductive wire 40 is removed by dry etching or chemical etching; after the etching is completed, the ceramic substrate 10 is packaged and cut, as shown in fig. 5 and 6, the side wall of the single peripheral circuit 20 obtained after cutting has no metal or burr.

In the actual implementation of the manufacturing process, laser equipment such as ultraviolet and infrared can be adopted for dry etching, and in addition, the laser equipment can be picosecond equipment and nanosecond equipment.

The design of the utility model is characterized in that the copper-plated circuit and the lead are obtained by arranging the copper-plated layer firstly, and then the thickened metal circuit is plated on the upper surface of the copper-plated circuit, so that the traditional technology does not need to be used as a lead for plating firstly, the problem that the metal burrs are easily generated on the lead for plating during cutting is solved, meanwhile, the thickness of a single peripheral circuit is not limited, the design can be thickened according to the requirement, and the problem that the circuit is easily broken in the traditional technology is solved. The structure is simple and the production is easy.

Claims

1. A ceramic wiring board characterized in that: the copper-plated circuit comprises a ceramic substrate and a copper-plated layer on the upper surface of the ceramic substrate, wherein the copper-plated layer comprises a copper-plated circuit and a lead, the copper-plated circuit comprises a plurality of single peripheral circuit base layers, and the lead is connected between the adjacent single peripheral circuit base layers; the thickened metal lines are electroplated on the upper surfaces of the single peripheral line base layers to form corresponding single peripheral lines.

2. A ceramic wiring board according to claim 1, wherein: the electroplated copper layer also comprises a substrate peripheral circuit, and the lead is connected between the substrate peripheral circuit and the single peripheral circuit.

3. A ceramic wiring board according to claim 1, wherein: and after the thickened metal circuit is electroplated, the lead is etched by a dry method or corroded by a liquid medicine.

4. A ceramic wiring board according to claim 1, wherein: the thickened metal circuit is a nickel-gold layer or a nickel-palladium-gold layer or a nickel-silver layer.

5. A ceramic wiring board according to any one of claims 1 to 4, wherein: the ceramic substrate is aluminum nitride ceramic or aluminum oxide ceramic.