CN219577362U - Novel substrate - Google Patents
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- CN219577362U CN219577362U CN202320389781.2U CN202320389781U CN219577362U CN 219577362 U CN219577362 U CN 219577362U CN 202320389781 U CN202320389781 U CN 202320389781U CN 219577362 U CN219577362 U CN 219577362U
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- aperture
- blind holes
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Abstract
The utility model relates to the technical field of substrates, in particular to a novel substrate, which is provided with at least two different functional areas and at least two different nonfunctional areas; the two different functional areas are at least provided with two functional blind holes, the two different nonfunctional areas are at least provided with two nonfunctional blind holes, and the functional blind holes and the nonfunctional blind holes are respectively formed on the substrate by laser drilling; the utility model has the advantages that the structure is simple, the design is reasonable, the blind holes are conveniently processed step by step through partition arrangement, and the blind holes to be processed are adjusted according to the aperture average value of the processed blind holes, so that the aperture variation of the blind holes is effectively reduced, and the aperture precision of the blind holes is improved.
Description
Technical Field
The utility model relates to the technical field of substrates, in particular to a novel substrate.
Background
As the reliability and alignment requirements of the product are higher, the requirements for the aperture variation of the blind hole formed by laser are also higher. However, different laser machines can generate errors due to errors of energy of the oscillator and degradation of energy of the laser light path passing through each lens group, so that the size of the laser beam during processing can generate errors due to different machines, and the aperture of the blind hole processed under the same processing parameters can have certain variation and errors. In addition, variations in copper thickness during laser pretreatment can also cause aperture variations and errors.
In view of the foregoing, there is a need for a new substrate that better solves the above-mentioned problems.
Disclosure of Invention
In order to solve the problems, the utility model provides a novel substrate which is simple in structure, reasonable in design and convenient for reducing the aperture variation of blind holes and improving the aperture precision of the blind holes.
The technical scheme adopted by the utility model is as follows:
a novel substrate having at least two different functional regions and at least two different nonfunctional regions;
the two different functional areas are at least provided with two functional blind holes, the two different nonfunctional areas are at least provided with two nonfunctional blind holes, and the functional blind holes and the nonfunctional blind holes are respectively formed on the substrate by laser drilling;
the average pore diameter of the plurality of functional blind pores is set to be a first average value, the average pore diameter of the plurality of nonfunctional blind pores is set to be a second average value, and the difference between the first average value and the second average value is not more than 1 micron.
Further, the method comprises the steps of,
the functional blind holes are provided with a plurality of first apertures, and the first average value is the average value of the first apertures of the functional blind holes;
the non-functional blind holes are provided with a plurality of second apertures, and the second average value is the average value of the second apertures of the non-functional blind holes.
Further, the substrate has a first surface and a second surface;
the aperture of the functional blind hole on the first surface is set as a first upper aperture, the aperture of the functional blind hole on the second surface is set as a first lower aperture, and the first aperture at least comprises a first upper aperture and a first lower aperture;
the aperture of the non-functional blind hole on the first surface is set as a second upper aperture, the aperture of the non-functional blind hole on the second surface is set as a second lower aperture, and the second aperture at least comprises a second upper aperture and a second lower aperture.
Further, the substrate comprises a dielectric layer, a first metal layer and a second metal layer, wherein the dielectric layer is positioned between the first metal layer and the second metal layer, and the functional blind holes and the nonfunctional blind holes respectively penetrate through the second metal layer and the dielectric layer.
Further, the thicknesses of the first metal layer and the second metal layer are set to 9 micrometers to 12 micrometers, respectively, and the thickness of the dielectric layer is set to 50 micrometers.
Further, the material of the first metal layer and the second metal layer is copper.
Further, the material of the dielectric layer is any one of prepreg, a taste element build-up film and a photosensitive dielectric material.
Further, the substrate is of a single-layer structure or a multi-layer structure.
Further, the substrate is a printed circuit board.
The beneficial effects of the utility model are as follows:
the substrate provided by the utility model is provided with at least two different functional areas and at least two different nonfunctional areas; the two different functional areas are at least provided with two functional blind holes, the two different nonfunctional areas are at least provided with two nonfunctional blind holes, and the functional blind holes and the nonfunctional blind holes are respectively formed on the substrate by laser drilling; the utility model has the advantages that the structure is simple, the design is reasonable, the blind holes are conveniently processed step by step through partition arrangement, and the blind holes to be processed are adjusted according to the aperture average value of the processed blind holes, so that the aperture variation of the blind holes is effectively reduced, and the aperture precision of the blind holes is improved.
Drawings
FIG. 1 is a schematic view of a substrate structure according to some embodiments of the utility model;
FIG. 2 is a schematic cross-sectional view of the substrate of FIG. 1 along section line I-I';
fig. 3 is a schematic view of a substrate structure according to another embodiment of the utility model.
Reference numerals illustrate:
110-a substrate; 110a, 110b, 110c, 110 d-blocks; 111-a first surface; 112-a second surface; 113-a first metal layer; 114-a dielectric layer; 115-a second metal layer; a1-a first region; a2-a second region; d1—a first aperture; d11—a first upper aperture; d12—a first lower aperture; d2—a second aperture; d21—a second upper aperture; d22—a second lower aperture; h1-a first blind hole; h2-a second blind hole; t1, T2-thickness.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be mechanically coupled, directly coupled, or indirectly coupled via an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1, the novel substrate according to this embodiment has at least two different functional areas and at least two different nonfunctional areas;
the two different functional areas are at least provided with two functional blind holes, the two different nonfunctional areas are at least provided with two nonfunctional blind holes, and the functional blind holes and the nonfunctional blind holes are respectively formed on the substrate by laser drilling;
the average pore diameter of the plurality of functional blind pores is set to be a first average value, the average pore diameter of the plurality of nonfunctional blind pores is set to be a second average value, and the difference between the first average value and the second average value is not more than 1 micron.
The blind hole processing device is simple in structure and reasonable in design, blind holes are formed through partition, step-by-step processing of the blind holes is facilitated, and the blind holes to be processed are adjusted according to the average value of the aperture of the processed blind holes, so that the aperture variation of the blind holes is effectively reduced, and the aperture precision of the blind holes is improved.
Referring to fig. 1 specifically, the substrate 110 of the present embodiment is divided into 4 blocks, i.e. a block 110a, a block 110b, a block 110c and a block 110d, then the corners of each block 110a, 110b, 110c and 110d are defined as a first area A1, and the areas other than the corners of each block 110a, 110b, 110c and 110d are defined as a second area A2, but not limited thereto. The first area A1 is a non-functional area, and the second area A2 is a functional area. That is, the first area A1 is not a location where a product is formed, and the second area A2 is a location where a product is formed. In some embodiments, the first area A1 may be removed during the production process. In some embodiments, the periphery of each block may be defined as a first region, and the region outside the periphery of each block may be defined as a second region.
In the present embodiment, the substrate 110 may have a single-layer structure or a multi-layer structure. For example, as shown in fig. 2, in the present embodiment, the substrate 110 has a first surface 111 and a second surface 112 opposite to each other, and the substrate 110 may include a first metal layer 113, a dielectric layer 114, and a second metal layer 115. The dielectric layer 114 is located between the first metal layer 113 and the second metal layer 115, and the first metal layer 113 and the second metal layer 115 are located on opposite sides of the dielectric layer 114, respectively. That is, the substrate 110 may include the first metal layer 113, the dielectric layer 114 and the second metal layer 115 sequentially stacked from bottom to top, but the number of stacked layers of the substrate is not limited by the present utility model. That is, in some embodiments, the substrate may also include other laminates. In some embodiments, the substrate 110 may be, for example, a printed circuit board, but is not limited thereto.
In the present embodiment, the thickness T1 of the first metal layer 113 and the second metal layer 115 is, for example, 9 micrometers (μm) to 12 μm, and the thickness T2 of the dielectric layer 114 is, for example, 50 μm, but not limited thereto. In addition, in the present embodiment, the material of the first metal layer 113 and the second metal layer 115 is copper or other suitable metal material, and the material of the dielectric layer 114 is Prepreg (Prepreg), an Ajinomoto build-up film (ABF), a photosensitive dielectric material (Photoimageable dielectric, PID) or other suitable dielectric material, but not limited thereto.
In the present embodiment, the processing parameters are predetermined in advance according to the thickness, material, etc. of the substrate 110. The parameters in the first process parameter may include, but are not limited to, process energy, process time, and the like. Then, forming a plurality of first blind holes H1 by laser drilling: the laser L1 is irradiated onto the second surface 112 of the substrate 110, so that the laser L1 can sequentially penetrate through the second metal layer 115 and the dielectric layer 114, thereby forming a first blind hole H1. The first surface 111 is a surface of the first metal layer 113 away from the dielectric layer 114, and the second surface 112 is a surface of the second metal layer 115 away from the dielectric layer 114. In the present embodiment, the laser drilling may include, for example, but not limited to, carbon dioxide laser drilling.
Then, the image sensor is used to measure a plurality of first apertures D1 of the plurality of first blind holes H1 to calculate a first average value. The first aperture D1 may include at least a first upper aperture D11 and a first lower aperture D12 opposite to each other, and the first average value may include a first upper aperture average value and a first lower aperture average value. Specifically, in the present embodiment, since the laser light L1 irradiates from above the substrate 110 toward the second surface 112 of the substrate 110, the first aperture D1 of the first blind hole H1 gradually decreases from the second surface 112 toward the first surface 111 of the substrate 110. Thus, the aperture of the first blind hole H1 at the second surface 112 is defined as a first upper aperture D11, and the aperture of the first blind hole H1 at the first surface 111 is defined as a first lower aperture D12. Wherein the first upper aperture D11 may be larger than the first lower aperture D12.
Next, taking the block 110a as an example, after the first apertures D1 of the 4 first blind holes H1 of the block 110a are measured by the image sensor, 4 first upper apertures D11 and 4 first lower apertures D12 are obtained. Next, a first upper aperture average and a standard deviation are calculated according to the 4 first upper apertures D11 in the block 110a, and a first lower aperture average and a standard deviation are calculated according to the 4 first lower apertures D12 in the block 110 a.
Then, the first average value is compared with a preset target value to calculate a first difference value. Wherein the predetermined target value may comprise a predetermined target value of the first upper aperture and a predetermined target value of the first lower aperture, and the first difference value may comprise a first difference value of the first upper aperture and a first difference value of the first lower aperture. Specifically, taking block 110a as an example, after the first upper aperture average value is obtained, the first upper aperture average value may be subtracted from a predetermined target value of the first upper aperture to calculate a first difference value of the first upper aperture. Similarly, after the first lower aperture average value is obtained, the first lower aperture average value may be subtracted from a predetermined target value of the first lower aperture to calculate a first difference value of the first lower aperture.
And then, according to the first difference value and the energy compensation database, adjusting the first processing parameter to obtain a second processing parameter. Specifically, in the present embodiment, the energy compensation database may be, for example, a comparison table of the difference value and the energy compensation value established in advance. The comparison table is a result of performing energy compensation on a series of blind holes with different differences in another substrate (i.e., another substrate with the same thickness as the substrate 110) by testing different energy compensation values before performing the blind hole processing in the present embodiment, so as to obtain according to the result: what energy compensation value should be used for different differences can be used to reduce the variation of the aperture of the blind hole and to improve the aperture accuracy of the blind hole.
In this embodiment, the step of adjusting the first processing parameter to obtain the second processing parameter may include the steps of: according to the comparison table of the difference value and the energy compensation value, obtaining an energy compensation value corresponding to the first difference value of the first upper aperture; then, the processing energy in the first processing parameter is adjusted according to the energy compensation value to obtain a second processing parameter.
Then, a plurality of second blind holes H2 are formed in the second area A2 of the substrate 110 by laser drilling according to the second processing parameters. Specifically, the laser beam L2 after energy compensation is irradiated onto the second area A2 of the substrate 110 to form a second blind hole H2. Then, the image sensor is used to measure a plurality of second apertures D2 of the plurality of second blind holes H2, so as to calculate a second average value and a standard deviation. The plurality of second apertures D2 may at least include a plurality of second upper apertures D21 and a plurality of second lower apertures D22 opposite to each other, and the second average may include a second upper aperture average and a second lower aperture average.
In this embodiment, the second average value of the plurality of second apertures D2 of the plurality of second blind holes H2 may be substantially similar to the predetermined target value. The second difference between the second average value and the predetermined target value may be, for example, 1 μm or less, but is not limited thereto. Thus, the blind hole processing of the embodiment is completed.
In addition, in the present embodiment, the substrate 110 is divided into 4 blocks, and the processing parameters are respectively adjusted for the 4 blocks, so as to reduce the aperture variation of the blind holes in each block and improve the aperture precision of the blind holes in each block. That is, in some embodiments, the substrate may be divided into 2, 3 or 4 or more blocks, and the processing parameters may be adjusted for the 2, 3 or 4 or more blocks, respectively. In some embodiments, as shown in fig. 3, the substrate may not be divided into several blocks, but the processing parameters may be directly adjusted for the entire substrate, so as to reduce the time required for adjusting the processing parameters.
Furthermore, although each first region A1 in the present embodiment may be formed with 1 first blind hole H1, for example, the present utility model is not limited to the number of first blind holes in each first region. That is, in some embodiments, as shown in fig. 3, more than 1 first blind hole may be formed in each first region.
Fig. 3 is a schematic top view of a substrate in blind hole processing according to another embodiment of the present utility model. Referring to fig. 1 and 3, a substrate 110' in blind hole processing according to the present embodiment is similar to the substrate 110 in blind hole processing in fig. 2, except that: in the blind hole processing of the present embodiment, the substrate is not divided into a plurality of blocks, but the processing parameters are directly adjusted for the entire substrate.
Referring to fig. 3, the corners of the entire substrate 110 'are defined as a first area A1, and the areas other than the corners of the entire substrate 110' are defined as a second area A2. The first blind hole H1 is located in the first area A1, and the second blind hole H2 is located in the second area A2. In addition, in the present embodiment, each first area A1 may have, for example, 3 first blind holes H1, but not limited thereto. In some embodiments, the periphery of the entire substrate may also be defined as a first region, and a region outside the periphery of the entire substrate may be defined as a second region.
After dividing the substrate into blocks, the processing parameters are respectively adjusted for each block.
In some specific examples, the first metal layer and the second metal layer in the substrate have a thickness of 9 microns and the dielectric layer has a thickness of 50 microns. The material of the first metal layer and the second metal layer is copper, and the material of the dielectric layer is PP1037.
Specifically, in this embodiment, the substrate 110 is first divided into 4 blocks, and the processing parameters are respectively adjusted for the 4 blocks, so as to reduce the aperture variation of the blind holes in each block, and improve the aperture precision of the blind holes in each block.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (9)
1. A novel substrate, characterized in that the substrate has at least two different functional areas and at least two different nonfunctional areas;
the two different functional areas are at least provided with two functional blind holes, the two different nonfunctional areas are at least provided with two nonfunctional blind holes, and the functional blind holes and the nonfunctional blind holes are respectively formed on the substrate by laser drilling;
the average pore diameter of the plurality of functional blind pores is set to be a first average value, the average pore diameter of the plurality of nonfunctional blind pores is set to be a second average value, and the difference between the first average value and the second average value is not more than 1 micron.
2. The novel substrate according to claim 1, wherein,
the functional blind holes are provided with a plurality of first apertures, and the first average value is the average value of the first apertures of the functional blind holes;
the non-functional blind holes are provided with a plurality of second apertures, and the second average value is the average value of the second apertures of the non-functional blind holes.
3. The novel substrate of claim 2, wherein the substrate has a first surface and a second surface;
the aperture of the functional blind hole on the first surface is set as a first upper aperture, the aperture of the functional blind hole on the second surface is set as a first lower aperture, and the first aperture at least comprises a first upper aperture and a first lower aperture;
the aperture of the non-functional blind hole on the first surface is set as a second upper aperture, the aperture of the non-functional blind hole on the second surface is set as a second lower aperture, and the second aperture at least comprises a second upper aperture and a second lower aperture.
4. The novel substrate of claim 1, wherein the substrate comprises a dielectric layer, a first metal layer and a second metal layer, the dielectric layer is located between the first metal layer and the second metal layer, and the functional blind holes and the non-functional blind holes penetrate through the second metal layer and the dielectric layer, respectively.
5. The novel substrate of claim 4, wherein the first metal layer and the second metal layer each have a thickness of 9 microns to 12 microns and the dielectric layer has a thickness of 50 microns.
6. The novel substrate of claim 4, wherein the material of the first metal layer and the second metal layer is copper.
7. The novel substrate of claim 4, wherein the dielectric layer is any one of a prepreg, a taste-enhancing film, and a photosensitive dielectric material.
8. The novel substrate according to claim 1, wherein the substrate has a single-layer structure or a multi-layer structure.
9. The novel substrate of claim 1, wherein the substrate is a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320389781.2U CN219577362U (en) | 2023-03-06 | 2023-03-06 | Novel substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320389781.2U CN219577362U (en) | 2023-03-06 | 2023-03-06 | Novel substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219577362U true CN219577362U (en) | 2023-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320389781.2U Active CN219577362U (en) | 2023-03-06 | 2023-03-06 | Novel substrate |
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| CN (1) | CN219577362U (en) |
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- 2023-03-06 CN CN202320389781.2U patent/CN219577362U/en active Active
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