CN206164982U - Golden finger, printed circuit board and be used for making printed circuit board's base plate - Google Patents
Golden finger, printed circuit board and be used for making printed circuit board's base plate Download PDFInfo
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- CN206164982U CN206164982U CN201621096496.8U CN201621096496U CN206164982U CN 206164982 U CN206164982 U CN 206164982U CN 201621096496 U CN201621096496 U CN 201621096496U CN 206164982 U CN206164982 U CN 206164982U
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Abstract
The utility model relates to a golden finger, printed circuit board and be used for making printed circuit board's base plate. The golden finger is including electrically conductive basal portion, golden coating and be located the middle conductive layer between electrically conductive basal portion and the golden coating, and this centre conductive layer includes ion implantation layer and/or plasma sedimentary deposit and/or sputtering sedimentation layer. Printed circuit board includes the substrate and at the circuit that forms on the surface and the golden finger of substrate, the golden finger electricity is connected to the circuit. An electrically conductive basal portion, middle conductive layer include to be got rid of as the conducting layer and in finished product printed circuit board when electroplating the formation golden finger in ion implantation layer and/or plasma sedimentary deposit and/or sputtering sedimentation layer for making printed circuit board's base plate includes the substrate, at the circuit that forms on the surface of substrate and middle the conductive layer that forms on both on the surface of the surface of substrate and circuit, partly constitution golden finger of circuit.
Description
Technical field
This utility model is related to art of printed circuit boards, more particularly to golden finger, printed circuit board (PCB) and for manufacturing print
The substrate of printed circuit board.
Background technology
With the fast development of surface mounting technology (SMT), particularly under the promotion of leadless environment-friendly, to printed circuit board (PCB)
(PCB) the requirement more and more higher of surface treatment, various new process of surface treatment also arise at the historic moment.Every kind of process of surface treatment exists
Excellent, the shortcoming of the aspects such as the flatness of coating surface, solderability, wear-resisting and corrosion resistance, non-oxidizability, cost and range of application
It is different.Gold plate has extremely low contact resistance, good corrosion resistance and weldability, be widely used in PCB, half
In the fields such as conductor, IC package technology.It is used to form the surface treatment of gold plate in conventional circuit board or base plate for packaging
Technique generally includes immersion Ni/Au (ENIG), NiPdAu (ENEPIG), electroplates (soft) gold (Electrolytic Gold or
Soft gold) or the hard gold (Hard gold) of plating etc..Wherein, the wire-bonding package (wire that gold is particularly suitable for chip is electroplated
Bonding), have a good application prospect.
The plating gold process of traditional circuit-board includes etching line pattern in advance, by addition lead by the orphan of figure
Vertical block is coupled together carries out plating gold, and on the regional area of isolated block golden finger is formed, and finally removes lead again and obtains electricity
Road plate.That is, the circuit 104 shown in Fig. 1 and the position of golden finger 106 are etched in advance, in the position of golden finger 106 and board substrate
Add lead (not shown) between 102 edge, be then covered by protecting film and only expose golden finger position, with plating grips
Lead simultaneously carries out plating gold, finally removes lead.This technique is applied to circuit board of the space between solder balls more than 800 μm, in gained
Golden finger in easily remain leaded, such as to project from the left side of golden finger 106 shown in Fig. 2 (a) part.Lead can cause
The waste of wiring space, its residual can produce noise etc. and adversely affect to signal.And, lead processing generally requires employing
The methods such as alkaline medicinal liquid etching, cutting or laser ablation, technique is relatively complicated, and the quality for remaining lead is difficult to control to.
In order to realize the design without lead, current people are generally using the technique that full plate is gold-plated, i.e. the electricity on PCB imposite
After copper facing, visuals when forming outer-layer circuit to needing exposes copper face, and unwanted visuals is covered with dry film,
Then whole board electroplating is carried out, plating Jin Houzai carries out taking off film etching, to etch away not gold-plated region, leaves gold-plated pad
(golden finger) and line pattern.This technique is applied to circuit board of the space between solder balls more than 500 μm, but can cause noble metal gold
It is a large amount of to waste, and Gold plated Layer is weaker with the adhesion of welding resistance, falls welding resistance very risky.In the golden finger 106 for so obtaining,
As shown in Fig. 2 (b), golden coating 118 only covers the upper surface of conductive base 108, but does not cover the side of conductive base 108,
Because the part beyond golden coating 118 is etched.In addition to full plate is gold-plated, can be changed with adopting after circuit is formed
It is conductive to realize parcel plating gold to substitute " lead " to learn heavy layers of copper.The technique had not only been capable of achieving without lead but also can avoid golden waste,
And three faces of pad energy plated with gold, lateral erosion can be avoided to project or hang nickel and to fall golden phenomena impair subsequent terminal electronic product
Reliability.But, because, through electroless copper plating, noble metal containing palladium remains and is difficult to remove, thus is susceptible to plating between circuit
Golden problem, brings challenges the insulating properties between dense wire, reliability.
Utility model content
This utility model is made in view of the above problems, be its object is to, there is provided a kind of golden finger, printed circuit board (PCB)
With for manufacturing the substrate of printed circuit board (PCB), this golden finger is not comprising lead and is firmly bonded to the line of printed circuit board (PCB)
Road floor.
First technical scheme of the present utility model is a kind of golden finger being arranged on printed circuit board (PCB), and it includes conductive base
Portion, golden coating and the intermediate conductor layer between conductive base and golden coating, intermediate conductor layer include ion implanted layer and/or
Plasma deposited layers and/or sputtering depositing layer.
Second technical scheme of the present utility model is, in above-mentioned first scheme, ion implanted layer is included by the gold for injecting
The flush of the doped structure of the material composition of category material and conductive base, its outer surface and conductive base, and inner surface position
In the depth of lower face 0-500nm of conductive base.
3rd technical scheme of the present utility model is, in above-mentioned first scheme, plasma deposited layers or sputtering sedimentation
Layer is made up of metal material, and positioned at the surface of conductive base.
4th technical scheme of the present utility model is, in above-mentioned second or third program, metal material include Ni, Cr,
One kind in Ti, Cu, Al, Ag, Pd and the alloy between them.
5th technical scheme of the present utility model is, in any one of above-mentioned the first to third program, Jin Fucengbao
Include the one kind in immersion Ni/Au, NiPdAu, electroplating mild alloy, the hard gold of plating.
This golden finger is formed with intermediate conductor layer between conductive base and golden coating, and the intermediate conductor layer includes ion
Implanted layer and/or plasma deposited layers and/or sputtering depositing layer.During ion implanting, conductive material ion is with very high
Speed is forcibly injected into the lower face of circuit, and between the conductive material and the material molecule of circuit of injection doping is defined
Structure, equivalent in the inside of circuit large number of foundation pile is squeezed into.Due to the anchoring effect of foundation pile, ion implanted layer and follow-up
The golden coating of formation is not easy from the line layer of printed circuit board (PCB) to depart from.In plasma-deposited period, conductive material ion exists
In the presence of accelerating field with higher speed fly to circuit and be deposited on above, formed plasma deposited layers.In the sputtering phase
Between, conductive material particle out and with higher speed is flown to circuit and be deposited on above, shape by the Bombardment of ion beam of high-energy
Into sputtering depositing layer.Due to higher incidence rate, also have between plasma deposited layers or sputtering depositing layer and line material
There is larger adhesion so that final obtained golden finger is not easy from the line layer of printed circuit board (PCB) to depart from.Sum it up, by
In the presence of intermediate conductor layer, golden finger of the present utility model is not easy from printed circuit board (PCB) to come off and affect subsequent terminal electronics
The reliability of product.In addition, generally there is nanoscale for ion implanting, plasma-deposited or sputtering conductive material particle
Size, be distributed in injection or deposition process more uniform and little to the incident angle difference of circuit surface.Therefore,
The golden coating for being able to ensure that golden finger has the good uniformity and compactness, it is not easy to the defects such as pin hole or crackle occur.
6th technical scheme of the present utility model is a kind of printed circuit board (PCB), including base material and on the surface of base material
The circuit and golden finger of formation, golden finger is electrically connected to circuit and including the golden handss according to any one in claim 1 to 5
Refer to.
7th technical scheme of the present utility model is, in above-mentioned 6th scheme, on golden finger and the side of printed circuit board (PCB)
There is no lead between edge.
8th technical scheme of the present utility model is that in above-mentioned 7th scheme, the conductive base of golden finger is electrically connected to
A part for circuit or composition circuit, projects laterally from the surface of base material, and is coated by intermediate conductor layer.
In this printed circuit board (PCB), golden finger is not easy de- from printed circuit board (PCB) due to the presence of intermediate conductor layer
Fall.The intermediate conductor layer for being additionally, since golden finger is obtained by methods such as ion implanting, plasma-deposited or sputterings
, thus electroless copper plating technique need not be adopted during manufacture printed circuit board (PCB), so as to noble metal containing palladium will not occur
The problems such as residual or plating gold, the printed circuit board (PCB) without lead can be easily obtained.Additionally, the conductive base of golden finger
Top surface and side are completely coated with by intermediate conductor layer, and intermediate conductor layer is covered by golden coating again, it is thus possible to fully sent out
Wave the excellent process based prediction model such as low contact resistance, high corrosion resistance and the weldability of golden finger.
9th technical scheme of the present utility model is a kind of substrate for manufacturing printed circuit board (PCB), it include base material,
The circuit formed on the surface of base material and the intermediate conductor layer being respectively formed on the surface on the surface of base material and circuit, it is middle
Conductor layer includes ion implanted layer and/or plasma deposited layers and/or sputtering depositing layer, is used as when plating forms golden finger
Conducting medium and it is removed in the printed circuit board (PCB) of finished product, a part for circuit constitutes the conductive base of golden finger.
Tenth technical scheme of the present utility model is that in above-mentioned 9th scheme, ion implanted layer is included by the gold for injecting
The doped structure of the material composition of category material and base material or circuit, surface or the flush of circuit of its outer surface with base material,
And inner surface is located at the depth of lower face 0-500nm on the surface or circuit of base material.
11st technical scheme of the present utility model is, in above-mentioned 9th scheme, plasma deposited layers or sputtering are heavy
Lamination is made up of metal material, and positioned at the surface of base material or the surface of circuit.
12nd technical scheme of the present utility model is, in the above-mentioned tenth or the 11st in scheme, metal material include Ni,
One kind in Cr, Cu, Al, Ag, Pd and the alloy between them.
In this substrate, intermediate conductor layer is formed by methods such as ion implanting, plasma-deposited or sputterings
On the surface of the surface of base material and circuit, thus no longer need using electroless copper plating work during manufacture printed circuit board (PCB)
Skill, will not occur the problems such as residual of noble metal containing palladium or golden plating.Additionally, intermediate conductor layer is used when plating forms golden finger
Make conducting medium and be removed in the printed circuit board (PCB) of finished product, thus no longer need to be separately provided lead etc., can be easily
The printed circuit board (PCB) without lead is obtained, it is to avoid residual lead negatively affects the electric property of circuit board.
Description of the drawings
After the following detailed description is read referring to the drawings, those skilled in the art will be better understood of the present utility model
These and other feature, aspect and advantage.For the sake of clarity, accompanying drawing is not drawn necessarily to scale, but some of which portion
Dividing may be exaggerated to show detail.In all of the figs, identical reference number represents same or analogous part, its
In：
Fig. 1 illustrates the schematic top plan view without lead printed circuit board (PCB)；
Fig. 2 (a) illustrates the generalized section by golden finger obtained in prior art to 2 (b)；
Fig. 3 illustrates a kind of process chart of the method for manufacturing golden finger of the present utility model；
Fig. 4 (a), (b), (c), (d) and (e) are shown respectively five steps of method shown in Fig. 3；
Fig. 5 (a) illustrates that the section of the printed circuit board (PCB) corresponding with each step of method shown in Fig. 3 is illustrated to 5 (e)
Figure；
Fig. 6 illustrates the generalized section according to golden finger of the present utility model；
Fig. 7 illustrates the operation principle schematic diagram of ion implanting；
Fig. 8 (a) illustrates the generalized section of the various golden fingers with intermediate conductor layer to 8 (c)；
Fig. 9 illustrates the process chart of another kind of method for manufacturing golden finger of the present utility model；
Figure 10 (a), (b), (c), (d), (e), (f) are shown respectively six steps of method shown in Fig. 9；
Figure 11 (a) illustrates that the section of the printed circuit board (PCB) corresponding with each step of method shown in Fig. 9 is illustrated to 11 (f)
Figure；And
Figure 12 (a) to 12 (c) is illustrated according to the section for manufacturing the various substrates of printed circuit board (PCB) of the present utility model
Schematic diagram.
Reference number：
10 printed circuit board (PCB)s
102 base materials
104 circuits
106 golden fingers
108 conductive bases
The surface of 110 conductive bases
112 intermediate conductor layers
114 ion implanted layers
116 plasma deposited layers
118 gold medal coating
120 coverlays
The surface of 122 base materials
20 substrates.
Specific embodiment
Hereinafter, with reference to the accompanying drawings, embodiment of the present utility model is described in detail.Those skilled in the art should be easy
Understand, these descriptions only list exemplary embodiment of the present utility model, and are in no way intended to limit guarantor of the present utility model
Shield scope.For example, the element or feature described in some accompanying drawing of the present utility model or embodiment can be with one or more
Other elements or feature illustrated in many other accompanying drawings or embodiment combine.Additionally, for the ease of describing between each material layer
Position relationship, used herein space relative terms, such as " top " and " lower section " and " interior " and " outward " etc., this
A little terms are for the surface of base material or circuit.If A layer materials relative to B layer materials be located towards base material or
On the direction on the surface of circuit, then it is assumed that A layer materials are located at the top or outside of B layer materials, and vice versa.
Turning now to Fig. 3, this illustrates a kind of process chart of the method for manufacturing golden finger of the present utility model.Specifically
For, the method typically comprises following steps：Outer-layer circuit is formed on the base material of printed circuit board (PCB), the outer-layer circuit includes
For forming the conductive base (step S1) of golden finger；Ion implanting, sputtering or plasma-deposited process are carried out to base material,
Intermediate conductor layer (step S2) is respectively formed on the surface on the surface of base material and circuit；Stick coverlay and be exposed, show
Shadow, expose will carry out electroplate gold region (that is, conductive base region) and base material both sides for connecting plating gripping head
Region (step S3)；Region to opening a window carries out plating gold, to form the golden coating (step S4) for covering conductive base；And
Film, etching are taken off, to get rid of intermediate conductor layer, the golden finger (step S5) of outer-layer circuit and gained is only left.Fig. 4 (a),
B (), (c), (d) and (e) correspond respectively to this five step S1 to S5, and represented using the block diagram of different colours base material,
Circuit, intermediate conductor layer, coverlay and golden coating.In the electroplating process shown in Fig. 4 (d), the base material of circuit board is placed into electricity
In coating bath and it is plated chuck and clamps and be used as an electrode, so as to electroplates on the conductive base region that uncovered film is covered
Form one layer of golden coating.
Fig. 5 (a) illustrates that the section of the printed circuit board (PCB) corresponding with each step of method shown in Fig. 3 is illustrated to 5 (e)
Figure, corresponds respectively to (a) to (e) in Fig. 4.First, as shown in Fig. 5 (a), the line of outer layer is formed on the surface of base material 102
Road 104 a, part for the circuit constitutes the conductive base 108 of golden finger.Then, as shown in Fig. 5 (b), using ion implanting, splash
Penetrate or plasma-deposited processing method, intermediate conductor layer is all defined on both surfaces of the surface of base material and circuit
112.Then, as shown in Fig. 5 (c), pasted last layer coverlay 120 on the surface of base material 102, and partly opened a window with
Expose the conductive base 108 of golden finger.Next, with plating gripping head clamp board substrate uncovered membrane cover live two
Lateral edges, are electroplated and are formed the golden coating 118 of coated with conductive base portion 108, as shown in Fig. 5 (d).Finally, coverlay is taken off
120, and the intermediate conductor layer 112 of the lower section of coverlay 120 is etched away, so as to obtaining golden finger 106 and possessing this golden finger
106 printed circuit board (PCB) 10, such as shown in Fig. 5 (e).Golden coating 118 has highly stable chemical property, will not be in last erosion
It is etched during quarter.
Fig. 6 illustrate by obtained in said method according to the generalized section of golden finger of the present utility model.As illustrated,
Golden finger 106 is located on the surface of the base material 102 of printed circuit board (PCB), and including conductive base 108, golden coating 118, Yi Jiwei
Intermediate conductor layer 112 between conductive base 108 and golden coating 118.Conductive base 108 is shown in Fig. 4 (a) and Fig. 5 (a)
The step of in formed, the outer-layer circuit for being electrically connected to printed circuit board (PCB) or the part for constituting the circuit.Conductive base 108
Project laterally from the surface of base material 102, its upper surface and side are coated by intermediate conductor layer 112.Intermediate conductor layer 112 is
Formed in the step shown in Fig. 4 (b) and Fig. 5 (b), its preparation method will be illustrated more specifically below.Golden coating 118 is
Formed by plating gold process in the step shown in Fig. 4 (d) and Fig. 5 (d), coat the dew upward of intermediate conductor layer 112
The surface for going out.Due to having carried out taking off film and etching in S5 the step of being described above, intermediate conductor layer 112 not by golden coating
118 parts for covering are etched, thus the peripheral side of intermediate conductor layer 112 does not have fully to be covered by golden coating 118, and
It is to direct out side to expose.That is, golden coating 118 not with base material 102 and the directly contact of conductive base 108, but via
Intermediate conductor layer 112 is electrically connected to conductive base 108.
In by printed circuit board (PCB) obtained in said method, such as shown in Fig. 1 and Fig. 5 (e), printed circuit board (PCB) 10 includes base
Material 102 and the circuit 104 formed on the surface of base material 102 and golden finger 106.Golden finger 106 is electrically connected to circuit 104,
And with the cross-section structure shown in Fig. 6.There is no any lead between the edge of golden finger 106 and printed circuit board (PCB) 10, i.e.
Define the printed circuit board (PCB) without lead.
As the base material of printed circuit board (PCB), rigid insulation base material (also known as hardboard), such as organic polymer can be adopted
Rigid plate, ceramic wafer (such as silica plate), glass plate.Organic polymer rigid plate may include again LCP, PTFE, CTFE,
FEP, PPE, synthetic rubber plate, glass-fiber-fabric/ceramic packing strengthens one or more in plate, and wherein glass-fiber-fabric/ceramic packing increases
Strong plate be based on high-molecular organic material such as epoxy resin, modified epoxy, PTFE, PPO, CE, BT material, with
Glass-fiber-fabric/ceramic packing is used as the sheet material for strengthening phase.Further, it is also possible to using flex plate (also known as soft board) as printed circuit
The base material of plate, such as PI, PTO, PC, PSU, PES, PPS, PS, PE, PP, PEI, PTFE, PEEK, PA, PET, PEN, LCP or PPA
Deng organic polymer thin film.
When forming the outer-layer circuit of printed circuit board (PCB) in step sl, subtraction can be carried out using Copper Foil is first pressed and subsequently
The method of etching, it would however also be possible to employ the electric plating of whole board or graphic plating method of routine.The centre of golden finger is formed in step s 2
During conductive layer, one or more method in ion implanting, plasma-deposited, sputtering can be adopted, so as to correspondingly form
One or more in ion implanted layer, plasma deposited layers, sputtering depositing layer.
Ion implanting can be carried out by the following method：Using conductive material as target, under vacuum conditions, pass through
Arcing (for example with vacuum cathode vacuum arc plasma source) makes the conductive material in target ionize and produce a large amount of ions, so
Make the acceleration of ions under the electric field afterwards and obtain the energy of 1keV-1000keV, such as 5,10,50,100,200,300,400,
500th, 600,700,800,900keV etc..The conductive material ion of high energy then directly impinges base material or line with higher speed
On the surface on road, and it is injected at the certain depth of the lower face of base material or circuit.In the conductive material ion for being injected
Relatively stable chemical bond (such as ionic bond or covalent bond), the two common structure are formed between base material or the material molecule of circuit
Into doped structure.The outer surface of the doped structure (that is, ion implanted layer) is flushed with the surface of base material or circuit, and its interior table
Face is then deep into the inside of base material or circuit, i.e. positioned at base material or the lower face of circuit.
In ion implantation process, it is preferred to use the larger metal of adhesion between line material or gold plate or
Alloy is carrying out ion implanting so that ion implanted layer or even gold plate not readily disengage from printed circuit board (PCB), so that it is guaranteed that golden handss
Refer to and play good conducting function.The line material of printed circuit board (PCB) generally using Ag, Cu, Au, Al etc., thus for carry out from
The metal material of son injection correspondingly adopts Ni, Cr, Ti, Cu, Al, Ag, Pd and the one kind in the alloy between them, for example
Ni-Cr alloy, Ni-Cu alloys, Cr-Cu alloys, Ni-Cr-Cu alloys etc..By the various parameters for controlling ion implantation process
(such as voltage, electric current, vacuum, ion implantation dosage etc.), can comparatively easy adjust depth, the Yi Jijin of ion implanting
Adhesion between coating and circuit.For example, the injection depth of ion can be adjusted to 0-500nm (such as 10,50,100,
200th, 300,400nm etc.), and the adhesion between gold plate and circuit can be adjusted to more than 0.5N/mm (such as 0.8,
1.0th, 1.5N/mm etc.).
Fig. 7 schematically shows the fundamental diagram of ion implanting.As illustrated, the equipment for performing ion implanting
Mainly it is made up of plasma formation region (triggering system) and ion beam forms district (extraction system) this two parts.The plasma bodily form
Include negative electrode, anode and trigger electrode into area, ion beam forms district is typically made up of one group of electrode of porous three.In trigger voltage
Under effect, highdensity plasma is formed between negative electrode and anode and to draw-out area diffusion.In the acceleration for drawing electric field
Under, the charged ion in plasma is brought out and accelerates to form ion beam, and the species and purity of the ion beam is by cathode targets
Material is determined.Typically, negative electrode trigger electrode and anode are coaxial configuration.Negative electrode is cylindrical and by the conductive material of desired ion
Make.Anode is cylinder barrel shaped and is enclosed within negative electrode outside, and center drilling is plasma channel.Using high voltage pulse triggering side
Formula, for example, be enclosed within trigger electrode outside negative electrode, between insulated with boron nitride, trigger voltage is 10kV or so, and triggering pulsewidth is
10ms or so.When trigger voltage is applied on negative electrode and trigger electrode, by spark discharge produce plasma make negative electrode and
Anode circuit is connected and forms vacuum arc discharge, forms only micron order size in cathode surface but electric current density is up to 106A/
cm2Negative electrode speckle, cause cathode target material evaporation and highly ionized into plasma.Plasma is with about 104The speed of m/s
Injection a, part is diffused into extraction electrode by anodes centre hole.Then, plasma is drawn in the presence of electric field is drawn
Go out, form the ion beam of high speed.The arc voltage being applied between yin, yang electrode is higher, and arc current is bigger, produced plasma
Body density is also higher, it is possible to drawing bigger line.Educt beaming flow size also with ionogenic running parameter, extraction
Voltage, deriving structure and cathode material etc. are relevant.For example, the extraction voltage of ion beam forms district (extraction system) is higher, powered
The ion beam of particle is just accelerated to higher speed, the deeper position in the inside such that it is able to be injected into base material.In addition, vacuum
Arc discharge also produces not charged microgranule of many sizes at 0.1 to 10 micron while plasma is produced.These microgranules
Exist and the performance of institute's deposition film had significant effect, cause film surface coarse, compactness is poor, glossiness and with base material
Adhesion decline etc..In order to remove or reducing the bulky grain of cathode vacuum arc generation, magnetic filter can be adopted, i.e. set up one
The magnetic field of individual bending, is filled into uncharged bulky grain, is only directed to the current-carrying plasma of needs along the magnetic field of bending
The surface of base material.
It is plasma-deposited carrying out, only to apply relatively low in the course of the work using with ion implanting similar mode
Accelerating potential.That is, equally use conductive material as target, under vacuum conditions, leading in target is made by arcing
Electric material is ionized and produces ion, is then ordered about the acceleration of ions under electric field action and is obtained certain energy, deposits to base
Plasma deposited layers are constituted on the surface of material and circuit.In plasma-deposited period, can pass through to adjust adding for electric field
Fast voltage and make conductive material ion obtain 1-1000eV (such as 5,10,50,100,200,300,400,500,600,700,
800th, 900eV etc.) energy, and can by controlling the ion deposition time, thickness is obtained by electric current etc. for 10-
1000nm (such as 50,100,200,300,400,500,600,700,800,900nm etc.) plasma deposited layers.
Further, it is also possible to form intermediate conductor layer using sputtering method：Indifferent gas is filled with the sputtering chamber of condition of high vacuum degree
Body, ionized inert gas are made under the electric field of high-frequency and high-voltage and glow discharge is produced, and the ion stream of high-energy are formed, using this
Ion stream is bombarding target electrode, so that the material of target electrode is deposited on the surface of base material and circuit and forms conductive film,
That is, intermediate conductor layer.
In step s 2, one or more technique in ion implanting, plasma-deposited, sputtering can be adopted, so as to
Correspondingly form the intermediate conductor layer including one or more in ion implanted layer, plasma deposited layers, sputtering depositing layer.
Fig. 8 (a) shows the generalized section of the various golden fingers with intermediate conductor layer to 8 (c).As shown in Fig. 8 (a), golden finger
106 are located on the surface of the base material 102 of printed circuit board (PCB), and including conductive base 108, golden coating 118 and positioned at conduction
Ion implanted layer 114 between base portion 108 and golden coating 118, wherein ion implanted layer 114 constitute the middle conductor being described above
Layer 112.Ion implanted layer 114 includes the doped structure being made up of the material of the metal material and conductive base that inject, its appearance
Face is concordant with the surface 110 of conductive base 108, and inner surface is located at the lower section of surface 110 of conductive base 108.In Fig. 8 (b) institutes
In the example shown, golden finger 106 includes conductive base 108, golden coating 118 and positioned at conductive base 108 and golden coating 118
Between ion implanted layer 114 and plasma deposited layers 116, wherein ion implanted layer 114 and the structure of plasma deposited layers 116
Into the intermediate conductor layer 112 being described above.Ion implanted layer 114 is located at the inside of conductive base 108, its outer surface and conductive base
The surface 110 in portion 108 is concordant, and inner surface is located at the lower section of surface 110 of conductive base 108.Plasma deposited layers 116 are by sinking
Long-pending metal material composition, is attached directly to the surface of ion implanted layer 114, i.e. positioned at the surface of conductive base 108
110 tops, in other words positioned at the outside of conductive base 108.In the example shown in Fig. 8 (c), golden finger 106 includes conductive base
Portion 108, golden coating 118 and the plasma deposited layers 116 between conductive base 108 and golden coating 118, its is medium
Plasma deposition layer 116 constitutes the intermediate conductor layer 112 being described above.Plasma deposited layers 116 are by the metal material for depositing
Composition, positioned at the top of surface 110 of conductive base 108.
It is easy to understand, can be replaced using the sputtering depositing layer formed by sputtering method shown in Fig. 8 (b) and Fig. 8 (c)
Plasma deposited layers 116.Now, the intermediate conductor layer 112 of golden finger 106 is by including outer surface and conductive base 108
The concordant ion implanted layer in surface 110 and the sputtering depositing layer above the ion implanted layer, or only include be located at lead
The sputtering depositing layer of the top of surface 110 of electric base portion 108.Further, it is also possible to note to the ion shown in Fig. 8 (c) in Fig. 8 (a)
Enter layer 114 and/or the top of plasma deposited layers 116, one layer of sputtering depositing layer is additionally formed by sputtering method.Now,
The sputtering depositing layer being additionally formed between the ion implanted layer 114 shown in Fig. 8 (a) and golden coating 118, or will be located at
Between plasma deposited layers 116 and golden coating 118 shown in Fig. 8 (b) and 8 (c).Certainly, this sputtering depositing layer with wait from
The position of daughter sedimentary 116 can also exchange.
It is also appreciated that, ion implanting, plasma-deposited or sputtering can be carried out using multiple targets simultaneously.This
When, will simultaneously there are various target components in same ion implanted layer, plasma deposited layers or sputtering depositing layer.This
Outward, can be with during ion implanting, plasma-deposited or sputtering, one after the other using multiple identical or different targets
Material, so as to form the multiple ion implanted layers, the plasma deposited layers that are made up of identical material component or different materials component
Or sputtering depositing layer.
After intermediate conductor layer is formed, need to stick coverlay in step s3 and be exposed, develop, to expose
Will carry out electroplating the region (that is, conductive base region) of gold and the region for connecting plating gripping head of base material both sides.So
Afterwards, the both sides of the base material for being formed with intermediate conductor layer are clamped with plating gripping head in step s 4, in exposed conductive base region
Middle plating last layer gold, as the golden coating of golden finger.Although electroplating mild alloy is described herein as golden coating, hold
It is readily understood, conventional immersion Ni/Au, NiPdAu can also be adopted, hard gold etc. is electroplated as golden coating.
As described above, being formed with middle conductor between conductive base and golden coating according to golden finger of the present utility model
Layer, the intermediate conductor layer includes ion implanted layer and/or plasma deposited layers and/or sputtering depositing layer.In the ion implanting phase
Between, conductive material ion is forcibly injected into the lower face of circuit with very high speed, in the conductive material and circuit of injection
Material molecule between define doped structure, squeeze into large number of foundation pile equivalent in the inside of circuit.Due to foundation pile
Anchoring effect, ion implanted layer and the golden coating being subsequently formed are not easy from the line layer of printed circuit board (PCB) to depart from.In plasma
During body is deposited, conductive material ion flies to circuit and is deposited on above, shape in the presence of accelerating field with higher speed
Into plasma deposited layers.During sputtering, conductive material particle is by the Bombardment of ion beam of high-energy out and with higher speed
Degree flies to circuit and is deposited on above, forms sputtering depositing layer.Due to higher incidence rate, plasma deposited layers or sputtering
Also there is larger adhesion so that final obtained golden finger is not easy from printed circuit board (PCB) between sedimentary and line material
Line layer depart from.Sum it up, due to the presence of intermediate conductor layer, golden finger of the present utility model is not easy from printed circuit
Plate comes off and affects the reliability of subsequent terminal electronic product.In addition, for ion implanting, it is plasma-deposited or sputtering lead
Electric material particle generally has nano level size, is distributed in injection or deposition process more uniformly, and to circuit surface
Incident angle difference it is little.It is accordingly possible to ensure the golden coating of golden finger has the good uniformity and compactness, it is not easy to
There is the defect such as pin hole or crackle.
The circuit formed including base material and on the surface of base material according to printed circuit board (PCB) of the present utility model and electricity
The golden finger of the circuit is connected to, there is no lead between golden finger and the edge of printed circuit board (PCB), and golden finger is led
Electric base portion is coated by intermediate conductor layer.Similarly, golden finger is not easy from printed circuit board (PCB) due to the presence of intermediate conductor layer
Come off.The intermediate conductor layer for being additionally, since golden finger is obtained by methods such as ion implanting, plasma-deposited or sputterings
, thus electroless copper plating technique need not be adopted during manufacture printed circuit board (PCB), so as to noble metal containing palladium will not occur
The problems such as residual or plating gold, the printed circuit board (PCB) without lead can be easily obtained.Additionally, the conductive base of golden finger
Top surface and side are completely coated with by intermediate conductor layer, and intermediate conductor layer is covered by golden coating again, it is thus possible to fully sent out
Wave the excellent process based prediction model such as low contact resistance, high corrosion resistance and the weldability of golden finger.
Fig. 9 illustrates the process chart of another kind of method for manufacturing golden finger of the present utility model. specifically, the method
Comprise the following steps：Outer-layer circuit is formed on the base material of printed circuit board (PCB), the outer-layer circuit is included for forming golden finger
Conductive base (step S01)；Ion implanting, sputtering or plasma-deposited process are carried out to base material, with the surface of base material
Intermediate conductor layer (step S02) is respectively formed on the surface of circuit；Stick coverlay and be exposed, develop, expose etch window
Mouth (conductive base of golden finger is located in the window) and the region (step for connecting plating gripping head of base material both sides
S03)；Windowed regions are etched, intermediate conductor layer therein (step S04) is got rid of；Electroplate in region to opening a window
Gold, to form the golden coating (step S05) for covering conductive base；And film, etching are taken off, to get rid of the centre below coverlay
Conductor layer, only leaves outer-layer circuit and golden finger (step S06).This six step S01 to S06 correspond respectively to Figure 10 (a),
(b), (c), (d), (e) and (f).Step S01, S02, S03, S05 compared with the former approach shown in Fig. 3, in this method
The step of corresponding respectively to former approach with S06 S1, S2, S3, S4 and S5, only increased step S04 between S3 and S4,
That is, windowed regions are etched, get rid of intermediate conductor layer therein.
Figure 11 (a) illustrates that the section of the printed circuit board (PCB) corresponding with each step of method shown in Fig. 9 is illustrated to 11 (f)
Figure, corresponds respectively to (a) to (f) in Figure 10.First, as shown in Figure 11 (a), outer layer is formed on the surface of base material 102
Circuit 104 a, part for the circuit constitutes the conductive base 108 of golden finger.Then, as shown in Figure 11 (b), noted using ion
Enter, sputter or plasma-deposited processing method, centre is all defined on both surfaces of the surface of base material and circuit and is led
Body layer 112.Then, as shown in Figure 11 (c), last layer coverlay 120 is pasted on the surface of base material 102, and is partly carried out
Open a window to expose the conductive base 108 of golden finger.Next, as shown in Figure 11 (d), being etched to windowed regions, remove
Fall the intermediate conductor layer 112 on the substrate surface and conductive base surface in windowed regions.Then, circuit is clamped with plating gripping head
The both sides of the edge that the uncovered membrane cover of plate base material is lived, are electroplated and are formed the golden coating 118 of coated with conductive base portion 108, such as
Shown in Figure 11 (e).Finally, coverlay 120 is taken off, and etches away the intermediate conductor layer 112 below coverlay 120, so as to
To golden finger 106 and the printed circuit board (PCB) 10 for possessing this golden finger 106, such as shown in Figure 11 (f).
In this approach, windowed regions are etched in step S04, get rid of intermediate conductor layer therein, and
The conductive base of golden finger is located in the windowed regions again, thus the middle conductor being formed in step S02 in conductive base
Layer is not present in the golden finger for ultimately forming.As shown in Figure 11 (f), golden finger 106 only includes conductive base and covering
The golden coating of conductive base, but do not include the intermediate conductor layer being located between conductive base and golden coating.And, with Fig. 5 (c) phases
Than this method can open up larger window in step S03 to coverlay, as long as the window is not fully insulated karat gold finger
Conductive base.That is, during the conductive base of golden finger exists via the lower section of the coverlay in window-external
Between conductor layer and be electrically connected to the edge of base material, make intermediate conductor layer serve as conducting medium and conductive base during plating gold
Top plating forms golden coating.
It should be readily apparent to one skilled in the art that the product formed in step S02 can individually be taken out, as making
Making printed circuit board, the especially substrate 20 without lead printed circuit board (PCB).This substrate includes base material, the shape on the surface of base material
Into circuit and the intermediate conductor layer that is respectively formed on the surface on the surface of base material and circuit, the intermediate conductor layer include from
Sub- implanted layer and/or plasma deposited layers and/or sputtering depositing layer.
Figure 12 (a) shows the generalized section of this substrate to 12 (c), similar to Fig. 8 (a) to 8 (c).Such as Figure 12 (a)
Shown, substrate 20 is including base material 102, the circuit 114 formed on the surface of base material 102 and in the surface of base material and circuit
The ion implanted layer 114 that is respectively formed on of surface, wherein ion implanted layer 114 constitutes the intermediate conductor layer 112 being described above.From
The outer surface of sub- implanted layer 114 and the surface 122 of base material or the flush of circuit, and inner surface is located at the surface 122 of base material
Or the lower face of circuit.In the example shown in Figure 12 (b), substrate 20 includes base material 102, the shape on the surface of base material 102
Into circuit 114 and the ion implanted layer 114 that is respectively formed on the surface on the surface of base material and circuit and plasma-deposited
Layer 116, wherein ion implanted layer 114 and plasma deposited layers 116 constitute the intermediate conductor layer 112 being described above.Ion is noted
Enter layer 114 positioned at base material 102 or the inside of circuit 104, plasma deposited layers 116 are attached directly to ion implanted layer 114
Surface, i.e. positioned at the surface 122 or the surface of circuit of base material, in other words positioned at the outer of base material 102 or circuit 104
Portion.In the example shown in Figure 12 (c), substrate 20 include base material 102, on the surface of base material 102 formed circuit 114, with
And the plasma deposited layers 116 being respectively formed on the surface on the surface of base material and circuit, the wherein structure of plasma deposited layers 116
Into the intermediate conductor layer 112 being described above, positioned at the top of surface 110 of conductive base 108.
As it was noted above, can be replaced using the sputtering depositing layer formed by sputtering method in Figure 12 (b) and Figure 12 (c)
Shown plasma deposited layers 116, can be with Figure 12 (a) be to the ion implanted layer 114 shown in Figure 12 (c) and/or waits
The top of plasma deposition layer 116 is additionally formed one layer of sputtering depositing layer by sputtering method, this sputtering depositing layer with wait from
The position of daughter sedimentary 116 can exchange.Further, it is also possible to adopt multiple targets in step S02, formed by identical material
Component multiple ion implanted layers, plasma deposited layers or sputtering depositing layer that either different materials component is constituted.
In this substrate, intermediate conductor layer is formed by methods such as ion implanting, plasma-deposited or sputterings
On the surface of the surface of base material and circuit, thus no longer need using electroless copper plating work during manufacture printed circuit board (PCB)
Skill, will not occur the problems such as residual of noble metal containing palladium or golden plating.Additionally, intermediate conductor layer is used when plating forms golden finger
Make conducting medium and be removed in the printed circuit board (PCB) of finished product, thus no longer need to be separately provided lead etc., can be easily
The printed circuit board (PCB) without lead is obtained, it is to avoid residual lead negatively affects the electric property of circuit board.
Above-described content is only referred to desired embodiment of the present utility model.However, this utility model is not received
The specific embodiment being limited to described in text.Those skilled in the art will readily occur to, without departing from main idea of the present utility model
In the range of, these embodiments can be carried out with various obvious modifications, adjustment and replaced, with make it suitable for specific feelings
Shape.In fact, protection domain of the present utility model is defined by the claims, and may include that those skilled in the art can be pre-
The other examples expected.If such other examples have the structural element with the literal language zero difference of claim, or
If person they include the equivalent structural elements that there are non-limiting difference with the literal language of claim, then they will fall
In scope of the claims.
Claims (12)
1. a kind of golden finger being arranged on printed circuit board (PCB), including conductive base, golden coating and positioned at the conductive base with
Intermediate conductor layer between the golden coating, the intermediate conductor layer include ion implanted layer and/or plasma deposited layers and/
Or sputtering depositing layer.
2. golden finger according to claim 1, it is characterised in that the ion implanted layer is included by the metal material for injecting
The doped structure constituted with the material of the conductive base, the flush of its outer surface and the conductive base, and inner surface
Positioned at the depth of lower face 0-500nm of the conductive base.
3. golden finger according to claim 1, it is characterised in that the plasma deposited layers or the sputtering depositing layer
It is made up of metal material, and positioned at the surface of the conductive base.
4. the golden finger according to Claims 2 or 3, it is characterised in that the metal material include Ni, Cr, Ti, Cu, Al,
One kind in Ag, Pd and the alloy between them.
5. the golden finger described in any one in claims 1 to 3, it is characterised in that the golden coating includes chemistry
One kind in heavy nickel gold, NiPdAu, electroplating mild alloy, the hard gold of plating.
6. a kind of printed circuit board (PCB), including base material and the circuit formed on the surface of the base material and golden finger, the gold
Finger is electrically connected to the circuit and including the golden finger described in any one in claim 1 to 5.
7. printed circuit board (PCB) according to claim 6, it is characterised in that in the golden finger and the printed circuit board (PCB)
There is no lead between edge.
8. printed circuit board (PCB) according to claim 7, it is characterised in that the conductive base of the golden finger is electrically connected to institute
State circuit or constitute a part for the circuit, project laterally from the surface of the base material, and by the middle conductor
Layer cladding.
9. a kind of substrate for manufacturing printed circuit board (PCB), including base material, on the surface of the base material formed circuit and
In the intermediate conductor layer that the surface on the surface of the base material and the circuit is respectively formed on, the intermediate conductor layer is noted including ion
Enter layer and/or plasma deposited layers and/or sputtering depositing layer, conducting medium is used as when plating forms golden finger and in finished product
Printed circuit board (PCB) in be removed, the part of the circuit constitutes the conductive base of the golden finger.
10. substrate according to claim 9, it is characterised in that the ion implanted layer is included by the metal material for injecting
The doped structure constituted with the material of the base material or the circuit, the surface of its outer surface and the base material or the circuit
Flush, and inner surface is located at the depth of lower face 0-500nm on the surface or the circuit of the base material.
11. substrates according to claim 9, it is characterised in that the plasma deposited layers or the sputtering depositing layer
It is made up of metal material, and positioned at the surface of the base material or the surface of the circuit.
12. substrates according to claim 10 or 11, it is characterised in that the metal material include Ni, Cr, Cu, Al,
One kind in Ag, Pd and the alloy between them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621096496.8U CN206164982U (en) | 2016-09-30 | 2016-09-30 | Golden finger, printed circuit board and be used for making printed circuit board's base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621096496.8U CN206164982U (en) | 2016-09-30 | 2016-09-30 | Golden finger, printed circuit board and be used for making printed circuit board's base plate |
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| Publication Number | Publication Date |
|---|---|
| CN206164982U true CN206164982U (en) | 2017-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318224A (en) * | 2017-07-31 | 2017-11-03 | 瑞声声学科技(苏州)有限公司 | The preparation method of circuit board and circuit board |
| CN107517541A (en) * | 2017-07-31 | 2017-12-26 | 瑞声精密电子沭阳有限公司 | The preparation method of circuit board and circuit board |
| CN108207085A (en) * | 2017-12-29 | 2018-06-26 | 深圳欣强智创电路板有限公司 | A kind of grading connecting finger optic module PCB plate surface treatment method |
| CN113038725A (en) * | 2021-03-08 | 2021-06-25 | 深圳市迅捷兴科技股份有限公司 | Method for forming conductive layer circuit side wall and surface gold plating by high-frequency circuit board chemical copper deposition |
-
2016
- 2016-09-30 CN CN201621096496.8U patent/CN206164982U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318224A (en) * | 2017-07-31 | 2017-11-03 | 瑞声声学科技(苏州)有限公司 | The preparation method of circuit board and circuit board |
| CN107517541A (en) * | 2017-07-31 | 2017-12-26 | 瑞声精密电子沭阳有限公司 | The preparation method of circuit board and circuit board |
| CN108207085A (en) * | 2017-12-29 | 2018-06-26 | 深圳欣强智创电路板有限公司 | A kind of grading connecting finger optic module PCB plate surface treatment method |
| CN113038725A (en) * | 2021-03-08 | 2021-06-25 | 深圳市迅捷兴科技股份有限公司 | Method for forming conductive layer circuit side wall and surface gold plating by high-frequency circuit board chemical copper deposition |
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Effective date of registration: 20230920 Address after: No. 501, 5th Floor, Gaoke Building, No. 2 Jiayuan Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430073 Patentee after: Wuhan Xinchuangyuan Semiconductor Co.,Ltd. Address before: 430070 10th floor, Gaoke building, 18 guandongyuan Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee before: RICHVIEW ELECTRONICS Co.,Ltd. |