CN201256486Y - Bond pad construction for hardware piece - Google Patents
Bond pad construction for hardware piece Download PDFInfo
- Publication number
- CN201256486Y CN201256486Y CNU2008201884635U CN200820188463U CN201256486Y CN 201256486 Y CN201256486 Y CN 201256486Y CN U2008201884635 U CNU2008201884635 U CN U2008201884635U CN 200820188463 U CN200820188463 U CN 200820188463U CN 201256486 Y CN201256486 Y CN 201256486Y
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- CN
- China
- Prior art keywords
- pad
- parts
- welding
- hardware
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A pad structure of hardware part comprises a pad plat which is connected with the same circuit and is divided into 2 to 6 small pads by welding-resistance oil. When parts or hardware sheets stick, floating phenomenon caused by excess tin paste or unbalanced force can be avoided by employing the small pad structures. Good contact between parts and the pad after welding greatly reduces bad contact phenomenon such as tilting, displacing and fault welding, and increases percent of pass.
Description
Technical field
The utility model relates to a kind of wiring board pad structure.
Background technology
The increase of present various electronic products, various undersized circuit boards are more and more, and five metals sheet and SMD electronic devices and components also replace the bigger traditional components and parts of volume gradually.Before the welding, at first need components and parts or five metals sheet are affixed on the pad that is coated with tin cream, components and parts or five metals sheet are fixed on the pad thereby by Reflow Soldering tin cream is melted again.When being attached to components and parts or five metals sheet on the pad; because the tin cream on the pad has the certain thickness and the error of stickup; components and parts or five metals sheet rising phenomenon appear easily; after by reflow soldering; components and parts occur or the perk of five metals sheet, off normal etc. are bad through regular meeting, cause percent defective high.
The utility model content
The technical problems to be solved in the utility model provides a kind of hardware pad structure.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of hardware pad structure comprises the pad plane that is connected with same circuit, it is characterized in that: described pad plane is divided into 2～6 little pads.
And, separate by welding resistance oil between each little pad.
When components and parts or the stickup of five metals sheet, owing to adopted little pad structure, pulling force unanimity to four direction, stress point is placed in the middle, do not exist because tin cream too much causes components and parts or five metals sheet rising phenomenon, welding back components and parts contact well with pad, greatly reduce the failure welding phenomenon of components and parts perk, off normal and rosin joint, have improved product percent of pass.
Description of drawings
Accompanying drawing 1 is the utility model embodiment one structural representation;
Accompanying drawing 2 is the utility model embodiment two structural representations.
Embodiment
For the ease of those skilled in the art's understanding, the utility model structural principle is further described in detail below in conjunction with specific embodiment and accompanying drawing:
Embodiment one: as shown in Figure 1, this programme is a kind of improved form at existing pad.In this programme, pad plane 1 length and width size is all less than 2.0mm, because whole pad plane 1 size is less, so pad plane 1 is divided between 2 little pad 11, two little pads 11 by 2 isolation of welding resistance oil.When pasting hardware or components and parts, form pulling force to both direction when the bond site tin cream melts tin, stressed placed in the middle, hardware that welds out at last or components and parts offset are less, and welding is good.
Embodiment two: as shown in Figure 2, this programme is a kind of improvement at existing larger-size pad, this pad plane 1 length and width size is all greater than 2.0mm, so in this scheme, whole pad plane 1 is divided into 4 little pads 11, separates by welding resistance oil 2 equally between 11 between each little pad 11.The same with embodiment one effect, the better effects if after the existing relatively pad structure welding.
In addition, according to concrete pad plane 1 size, little pad 11 quantity can not given unnecessary details at this one by one for 4 or 6 yet.
The foregoing description is the preferable implementation of the utility model; in addition; all right other implementations of the utility model need to prove that any conspicuous replacement is all within the utility model protection range under the prerequisite that does not break away from the present utility model design.
Claims (2)
1. a hardware pad structure comprises the pad plane (1) that is connected with same circuit, and it is characterized in that: described pad plane is divided into 2～6 little pads (11).
2. hardware pad structure according to claim 1 is characterized in that: separate by welding resistance oil (2) between each little pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201884635U CN201256486Y (en) | 2008-08-08 | 2008-08-08 | Bond pad construction for hardware piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201884635U CN201256486Y (en) | 2008-08-08 | 2008-08-08 | Bond pad construction for hardware piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201256486Y true CN201256486Y (en) | 2009-06-10 |
Family
ID=40739813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201884635U Expired - Fee Related CN201256486Y (en) | 2008-08-08 | 2008-08-08 | Bond pad construction for hardware piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201256486Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455362A (en) * | 2016-11-24 | 2017-02-22 | 生益电子股份有限公司 | PCB (printed circuit board) manufacture method and PCB |
| CN110958768A (en) * | 2019-12-25 | 2020-04-03 | 浪潮商用机器有限公司 | PCB (printed circuit board) bonding pad and manufacturing method thereof |
-
2008
- 2008-08-08 CN CNU2008201884635U patent/CN201256486Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455362A (en) * | 2016-11-24 | 2017-02-22 | 生益电子股份有限公司 | PCB (printed circuit board) manufacture method and PCB |
| CN110958768A (en) * | 2019-12-25 | 2020-04-03 | 浪潮商用机器有限公司 | PCB (printed circuit board) bonding pad and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090610 Termination date: 20160808 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |