CN106455362A - PCB (printed circuit board) manufacture method and PCB - Google Patents
PCB (printed circuit board) manufacture method and PCB Download PDFInfo
- Publication number
- CN106455362A CN106455362A CN201611050178.2A CN201611050178A CN106455362A CN 106455362 A CN106455362 A CN 106455362A CN 201611050178 A CN201611050178 A CN 201611050178A CN 106455362 A CN106455362 A CN 106455362A
- Authority
- CN
- China
- Prior art keywords
- pcb
- resistance material
- welding resistance
- pad
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a PCB (printed circuit board) manufacture method and a PCB and relates to the field of processing of PCBs (printed circuit boards). The PCB manufacture method comprises the steps of providing a PCB substrate and manufacturing at least two pads on the PCB substrate; filling gaps of the adjacent pads with solder resist. The invention also provides a PCB, comprising a PCB substrate, the surface of the PCB substrate is provided with at least two pads, and gaps of the adjacent pads are filled with solder resist. By filling the gaps of the pads with solder resist, assembly density of the PCB is can be increased, conditions are made for complex wiring of the PCB, PCB size is greatly decreased at the premise of equal circuitry design, circuit shorting due to mutual connection of solder paste on the adjacent pads is also avoided, and hardware basis is provided for light weight and miniaturization of electronic equipment is provided.
Description
Technical field
The present invention relates to PCB processing technique field, more particularly, to a kind of preparation method of PCB and PCB.
Background technology
With the development of electronic equipment small light, as the graphic designs on the PCB of electronic equipment important component part
More and more intensive, the distance between electronic devices and components are less and less, lead to the difficulty of device assembling increasing.
The surface reflow welding component of the pad on PCB is technology commonly used in the trade, but the gap when between pad
When too little, the solder(ing) paste after adjacent pad melt surface easily links together and leads to short circuit.Common solution is done in the industry
Method is design welding resistance bridge between pad, but the restriction due to PCB manufacture craft, generally higher than 63.5 μm of the width of welding resistance bridge,
Under less pad gap, just cannot make welding resistance bridge, thus the circuit after melting solder(ing) paste cannot be avoided to be connected with each other is short
Road.This greatly limits PCB layout, also have impact on the lifting further to packing density for the PCB, have impact on electronic equipment simultaneously
The development of small light.
Content of the invention
It is an object of the invention to provide a kind of preparation method of PCB and PCB, it is achieved that the small light of PCB, protect simultaneously
The components and parts demonstrate,proved on PCB will not be connected with each other because of the melting of solder(ing) paste in the case that gap is very little, protects further
Demonstrate,prove the circuit in the case of small of the gap between components and parts will not be short-circuited.
For reaching this purpose, the present invention employs the following technical solutions：
A kind of preparation method of PCB, comprises the following steps：
PCB substrate is provided, at least two pads are made on described PCB substrate；
Welding resistance material is clogged in the gap of adjacent described pad.
Preferably, after filling welding resistance material in the described gap in adjacent described pad, further comprising the steps of：
Curing process is carried out to described welding resistance material.
Preferably, described curing process is carried out to described welding resistance material after, further comprising the steps of：
Remove the described welding resistance material higher than described bond pad surface.
Preferably, described carry out curing process specifically to described welding resistance material：Described welding resistance material is carried out with light solid
Change and/or heat cure is carried out to described welding resistance material.
Preferably, described remove higher than described bond pad surface described welding resistance material specifically：
Using one of adhesive-bonded fabric nog plate, ceramic nog plate, abrasive belt grinding or arbitrarily two or more combinations to described PCB
Substrate carries out nog plate process.
Preferably, described welding resistance material is solder mask, resin or legend ink.
Preferably, clogging welding resistance material specifically in the described gap in adjacent described pad：Described adjacent described
In the gap of pad, filling welding resistance material includes：By silk-screen, described welding resistance material is packed to the gap of adjacent described pad
Interior；Or by spray printing, described welding resistance material is packed in the gap of adjacent described pad；Or by brushing described welding resistance material
It is packed in the gap of adjacent described pad.
Preferably, the gap of the adjacent described pad of described PCB substrate is [10,63.5] micron.
Specifically, the gap between adjacent pad is set to [10,63.5] micron, improves PCB packing density and achieves PCB
Small light；Welding resistance material is arranged in the gap of adjacent pad, after on pad, the solder(ing) paste of melting touches welding resistance material
Will not continue to the direction diffusion to adjacent pad, it is to avoid in adjacent pad, the solder(ing) paste of melting links together, and realizes weldering
Ensure the safety between components and parts while dish gap miniaturization.
For reaching above-mentioned purpose, the present invention also provides a kind of PCB, and including PCB substrate, described PCB substrate is provided with least
Two pads, are provided with welding resistance material in the gap of adjacent described pad.
Preferably, described welding resistance material is solder mask, resin or legend ink.
Specifically, described welding resistance material is not higher than the surface of described pad.
Beneficial effects of the present invention：A kind of preparation method of PCB is provided, the gap between adjacent pad be set to [10,
63.5] micron, clogs welding resistance material in the gap of adjacent described pad simultaneously, is conducive to improving the packing density of PCB, is
The complicated wiring of PCB provides condition.
There is provided a kind of PCB, the gap between adjacent pad is set to [10,63.5] micron, in the gap of adjacent described pad
Interior filling welding resistance material, significantly reduces the size of PCB under same circuits design, also avoid the weldering in adjacent pad simultaneously
Tin cream is connected with each other the situation leading to short circuit, is that the small light of electronic equipment provides hardware foundation.
Brief description
Fig. 1 is a kind of FB(flow block) of the preparation method of PCB of the present invention；
Fig. 2 is a kind of structural representation of PCB of the present invention；
Fig. 3 is the enlarged drawing at A in Fig. 2；
Fig. 4 is a kind of profile of PCB of the present invention；
In figure：
1st, PCB substrate；
2nd, pad；
3rd, welding resistance material.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment one
As Figure 1-3, a kind of preparation method of PCB, comprises the following steps：
S10, offer PCB substrate 1, make at least two pads 2 in PCB substrate 1.
In the present embodiment, the gap of the adjacent pad 2 in PCB substrate 1 is [10,63.5] micron.Certainly, real in other
Apply in example, depending on real needs, the gap of adjacent pad 2 can be [2,100] micron, [5,80] micron, [15,50] micron, 30
Micron, 20 microns or 55 microns.
Specifically, the gap between the pad 2 in PCB substrate 1 diminishes, the chi of PCB substrate 1 needed for same circuit setting
Very little just diminish, be also that the complicated wiring in PCB substrate 1 provides the foundation simultaneously.Sky shared by PCB substrate 1 in the electronic device
Between also just corresponding reduce, be that the small light of electronic equipment provides hardware foundation, effectively promoted the development of electronic product.
S20, in the gap of adjacent pad 2 clog welding resistance material 3.
Specifically, welding resistance material 3 is solder mask.The most frequently used technology of welding component is on circuit boards now
Reflow Soldering.The one way in which of Reflow Soldering is：Air or nitrogen are heated to sufficiently high temperature after-blow to having posted unit
The PCB substrate 1 of device, allows the solder(ing) paste of components and parts both sides to bond with pad 2 after melting.This technological temperature is easily controllable, weldering
Also it is avoided that oxidation, low cost of manufacture in termination process.But, when the gap between the pad 2 in PCB substrate 1 is very little, phase
The solder(ing) paste of adjacent pad 2 melt surface easily links together and leads to short circuit.Clog in the gap of adjacent pad 2 for this
Solder mask as welding resistance material 3, when the solder(ing) paste on pad 2 is under molten condition and once touches during random diffusion
Solder mask would not continue to move to the direction of adjacent pad 2, it is to avoid the solder(ing) paste in adjacent pad 2 connects and leads to circuit
Short circuit.Certainly, in other embodiments, welding resistance material 3 can be the material of resin, legend ink or other like attribute.
Specifically, the mode clogging welding resistance material 3 in the gap of adjacent pad 2 is silk-screen.Silk-screen is circuit board making
One of technique of Shi Changyong, provides a forme, and forme, in printing, makes welding resistance material 3 such as this enforcement by certain pressure
Solder mask in example is transferred in PCB substrate 1 by the eyelet of hole version.By the extruding of scraper plate during printing, make solder mask
Transferred in PCB substrate 1 by mesh, form default shape.
Certainly, in other embodiments, the mode clogging welding resistance material 3 in the gap of adjacent pad 2 can be spray printing, thoroughly
Cross print face welding resistance material 3 is sprayed to PCB substrate 1 and form default shape, or by way of brushing, welding resistance material 3 is clogged
Enter in the gap of the adjacent pad 2 in PCB substrate 1.
S30, curing process is carried out to welding resistance material 3.
Specifically, the mode of curing process is the dual curing technology of photocuring and heat cure, guarantees the speed solidifying simultaneously
Degree and solidification effect, and reached the requirement of environmental protection.The solder mask of welding resistance material 3 such as the present embodiment is packed to adjacent pad
Can not need to carry out curing process to solder mask, to realize solder mask with PCB substrate 1 good combination after in 2 gap
The steady in a long-term surface being solidificated in PCB substrate 1.Photocuring technology is the ultraviolet light by certain wavelength, makes welding resistance thing
Matter 3 high speed of polymerization solidifies, and welding resistance material 3 passes through photocuring and is not easy to volatilize it is achieved that the purpose of energy-conserving and environment-protective.Heat is provided simultaneously
Curing process, strengthens curing rate and the solidification effect of welding resistance material 3.
Certainly, in other embodiments, depending on the difference of welding resistance material 3 species and characteristic, in order to cost-effective or have it
The technical scheme that he requires, the mode of curing process can be the independent curing mode of photocuring or heat cure.
S40, removing are higher than the welding resistance material 3 on pad 2 surface.
Specifically, after carrying out curing process to welding resistance material 3, the welding resistance material 3 in PCB substrate 1 is with respect to pad 2
There is 0 micron -25 microns of height on surface, and welding resistance material 3 can affect fitting between components and parts and pad 2 and consolidate in this case
Fixed, and then affect the quality of electronic equipment.Followed by remove higher than pad 2 table curing process is carried out to welding resistance material 3 for this
The welding resistance material 3 in face, to eliminate above-mentioned impact.Specifically, remove and higher than welding resistance material 3 mode on pad 2 surface be：First to resistance
Weldering material 3 carries out abrasive belt grinding；Again ceramic nog plate is carried out to welding resistance material 3；Finally adhesive-bonded fabric nog plate is carried out to welding resistance material 3.
Certainly, in other embodiments, removing higher than welding resistance material 3 mode on pad 2 surface can be that welding resistance material 3 is entered
Row abrasive belt grinding, welding resistance material 3 is carried out ceramic nog plate or welding resistance material 3 is carried out these three modes of adhesive-bonded fabric nog plate order
With select on any combination, to reach optimal effect.
After carrying out above-mentioned process, carry out welding resistance in other relevant positions of PCB substrate 1 by arranging the modes such as welding resistance bridge
Setting, further carries out following surface treatment step：Finished product cleaning, test, organic guarantor weldering film (Organic
Solderability Preservatives, OSP) process, finished goods inspection checking (Finish Quality Control,
FQC) process, Plant quality assurance (Factory Quality Assurance, FQA) processes last packaging and storage.
Embodiment two
A kind of PCB as shown in Figure 2, Figure 3 and Figure 4, including PCB substrate 1, the surface of PCB substrate 1 is provided with two pads 2,
Gap between adjacent pad 2 is [10,63.5] micron, is provided with welding resistance material 3 in gap.
Specifically, on PCB substrate 1 surface, the gap of adjacent pad 2 is set to [10,63.5] micron it is achieved that circuit board
The small light making, the complicated wiring for circuit board provides basis.Space shared by PCB substrate 1 is also in the electronic device
Corresponding minimizing, is that the small light of electronic equipment provides hardware foundation, has effectively promoted the development of electronic product.Certainly,
In other embodiment, depending on real needs, the gap of adjacent pad 2 can be [2,100] micron, [5,80] micron, [15,50]
Micron, 30 microns, 20 microns or 55 microns.
In other embodiments, depending on the difference of circuit setting, the setting of pad 2 quantity can be with more than two.
Specifically, welding resistance material 3 is solder mask.The most frequently used technology of welding component is on circuit boards now
Reflow Soldering.The one of which technique of Reflow Soldering is：Air or nitrogen are heated to sufficiently high temperature after-blow to having posted unit
The PCB substrate 1 of device, allows the solder(ing) paste of components and parts both sides to bond with pad 2 after melting.This technological temperature is easily controllable, weldering
Also it is avoided that oxidation, low cost of manufacture in termination process.But, when the gap between the pad 2 in PCB substrate 1 is very little, phase
The solder(ing) paste of adjacent pad 2 melt surface easily links together and leads to short circuit.Clog in the gap of adjacent pad 2 for this
Solder mask as welding resistance material 3, when the solder(ing) paste on pad 2 is under molten condition and once touches during random diffusion
Solder mask would not continue to move to the direction of adjacent pad 2, it is to avoid the solder(ing) paste in adjacent pad 2 connects and leads to circuit
Short circuit.
The solder(ing) paste that welding resistance material 3 solves adjacent pad 2 melt surface well easily links together and leads to circuit
The problem of short circuit, solves safety problem for circuit board it is ensured that small light while making small-sized circuit board
Circuit board actually used.
Certainly, in other embodiments, depending on the situation of use environment and cost, welding resistance material 3 can be resin or character oil
Ink.
Specifically, fit with pad 2 and fixing effect, welding resistance material 3 and pad to ensure the components and parts on pad 2
2 flush.Pad 2 is used for welding component, if components and parts and pad 2 can be caused in the surface that welding resistance material 3 is higher than pad 2
Cannot completely fit, and then affect the quality of circuit board.
In other embodiments, welding resistance material 3 can also be less than the surface of pad 2.
Obviously, the above embodiment of the present invention is used for the purpose of clearly example of the present invention being described, and is not right
The restriction of embodiments of the present invention.For those of ordinary skill in the field, also may be used on the basis of the above description
To make other changes in different forms.There is no need to be exhaustive to all of embodiment.All this
Any modification, equivalent and improvement made within the spirit of invention and principle etc., should be included in the claims in the present invention
Protection domain within.
Claims (10)
1. a kind of preparation method of PCB is it is characterised in that comprise the following steps：
PCB substrate is provided, at least two pads are made on described PCB substrate；
Welding resistance material is clogged in the gap of adjacent described pad.
2. a kind of PCB according to claim 1 preparation method it is characterised in that described between adjacent described pad
After filling welding resistance material in gap, further comprising the steps of：
Curing process is carried out to described welding resistance material.
3. a kind of preparation method of PCB according to claim 2 is it is characterised in that described carried out to described welding resistance material
After curing process, further comprising the steps of：
Remove the described welding resistance material higher than described bond pad surface.
4. a kind of preparation method of PCB according to claim 2 is it is characterised in that described carried out to described welding resistance material
Curing process is specifically：
Described welding resistance material is carried out with photocuring and/or heat cure is carried out to described welding resistance material.
5. a kind of preparation method of PCB according to claim 3 is it is characterised in that described removing is higher than described pad table
The described welding resistance material in face is specifically：
Using one of adhesive-bonded fabric nog plate, ceramic nog plate, abrasive belt grinding or arbitrarily two or more combinations to described PCB substrate
Carry out nog plate process.
6. a kind of PCB according to claim 1 preparation method it is characterised in that described welding resistance material be solder mask,
Resin or legend ink.
7. a kind of PCB according to claim 1 preparation method it is characterised in that described between adjacent described pad
Welding resistance material is clogged specifically in gap：By silk-screen, described welding resistance material is packed in the gap of adjacent described pad；Or it is logical
Cross spray printing described welding resistance material is packed in the gap of adjacent described pad；Or it is packed to phase by brushing described welding resistance material
In the gap of adjacent described pad.
8. a kind of preparation method of PCB according to claim 1 is it is characterised in that the adjacent described weldering of described PCB substrate
The gap of disk is [10,63.5] micron.
9. it is characterised in that including PCB substrate, described PCB substrate is provided with least two pads, adjacent described weldering to a kind of PCB
It is provided with welding resistance material in the gap of disk.
10. a kind of PCB according to claim 9 is it is characterised in that described welding resistance material is solder mask, resin or word
Symbol ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611050178.2A CN106455362A (en) | 2016-11-24 | 2016-11-24 | PCB (printed circuit board) manufacture method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611050178.2A CN106455362A (en) | 2016-11-24 | 2016-11-24 | PCB (printed circuit board) manufacture method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455362A true CN106455362A (en) | 2017-02-22 |
Family
ID=58218523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611050178.2A Pending CN106455362A (en) | 2016-11-24 | 2016-11-24 | PCB (printed circuit board) manufacture method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455362A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108098092A (en) * | 2017-12-21 | 2018-06-01 | 成都川美新技术股份有限公司 | A kind of method being sintered using solder(ing) paste to radio frequency substrate and housing |
| CN108235579A (en) * | 2018-01-08 | 2018-06-29 | 昆山首源电子科技有限公司 | 5G communication high frequency signal plate slide-changing resistor performance boost techniques |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
| CN113163615A (en) * | 2021-02-05 | 2021-07-23 | 东莞市春瑞电子科技有限公司 | Non-photopolymerization PCB solder resist ink windowing and solder resist oil bridge process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006344664A (en) * | 2005-06-07 | 2006-12-21 | Kyocer Slc Technologies Corp | Wiring board and its manufacturing method |
| CN201256486Y (en) * | 2008-08-08 | 2009-06-10 | 惠州市蓝微电子有限公司 | Bond pad construction for hardware piece |
| CN101588678A (en) * | 2008-05-20 | 2009-11-25 | 欣兴电子股份有限公司 | Method for forming welding resisting layer |
| WO2012043201A1 (en) * | 2010-09-28 | 2012-04-05 | 三菱製紙株式会社 | Method for forming solder resist pattern |
| US20150132865A1 (en) * | 2002-12-27 | 2015-05-14 | Fujitsu Limited | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus |
| JP2016051747A (en) * | 2014-08-29 | 2016-04-11 | 京セラサーキットソリューションズ株式会社 | Wiring board |
-
2016
- 2016-11-24 CN CN201611050178.2A patent/CN106455362A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150132865A1 (en) * | 2002-12-27 | 2015-05-14 | Fujitsu Limited | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus |
| JP2006344664A (en) * | 2005-06-07 | 2006-12-21 | Kyocer Slc Technologies Corp | Wiring board and its manufacturing method |
| CN101588678A (en) * | 2008-05-20 | 2009-11-25 | 欣兴电子股份有限公司 | Method for forming welding resisting layer |
| CN201256486Y (en) * | 2008-08-08 | 2009-06-10 | 惠州市蓝微电子有限公司 | Bond pad construction for hardware piece |
| WO2012043201A1 (en) * | 2010-09-28 | 2012-04-05 | 三菱製紙株式会社 | Method for forming solder resist pattern |
| JP2016051747A (en) * | 2014-08-29 | 2016-04-11 | 京セラサーキットソリューションズ株式会社 | Wiring board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108098092A (en) * | 2017-12-21 | 2018-06-01 | 成都川美新技术股份有限公司 | A kind of method being sintered using solder(ing) paste to radio frequency substrate and housing |
| CN108235579A (en) * | 2018-01-08 | 2018-06-29 | 昆山首源电子科技有限公司 | 5G communication high frequency signal plate slide-changing resistor performance boost techniques |
| WO2019134207A1 (en) * | 2018-01-08 | 2019-07-11 | 昆山首源电子科技有限公司 | Process for improving slip resistance performance of 5g communication high-frequency signal board |
| CN108235579B (en) * | 2018-01-08 | 2020-04-24 | 昆山首源电子科技有限公司 | 5G communication high-frequency signal board sliding resistance performance improving process |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
| CN113163615A (en) * | 2021-02-05 | 2021-07-23 | 东莞市春瑞电子科技有限公司 | Non-photopolymerization PCB solder resist ink windowing and solder resist oil bridge process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106455362A (en) | PCB (printed circuit board) manufacture method and PCB | |
| DE19632200C2 (en) | Multichip module | |
| CN102802357A (en) | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage | |
| JP5899517B2 (en) | Manufacturing method and manufacturing system of component mounting board | |
| US4767892A (en) | Printed-wiring board | |
| CN108055780A (en) | A kind of multilayer circuit board solder mask structure technique | |
| KR100905568B1 (en) | Printed circuit board and method of manufacturing the same | |
| CN107087351B (en) | Printed circuit board, method for manufacturing printed circuit board, and electronic product | |
| US7199304B2 (en) | Configurable microelectronic package using electrically conductive material | |
| US7410093B2 (en) | Solder wave process for solder shunts for printed circuit board | |
| CN108990266A (en) | A kind of pcb board | |
| JPH03241802A (en) | Chip type electronic parts | |
| JP2010171125A (en) | Semiconductor device and method of manufacturing the same | |
| CN110351962A (en) | A kind of secondary via hole reflow method | |
| TWI333819B (en) | Printing template of legend and method of manufacturing printed circuit board using the same | |
| CN114434963B (en) | Printing method, device and equipment for PCB oil plugging hole and storage medium | |
| JP2868989B2 (en) | Component mounting method | |
| JP2724933B2 (en) | Reflow type printed wiring board | |
| DE102004030588A1 (en) | Connecting material template and method of use | |
| JPH03241813A (en) | Method of covering chip type electronic part | |
| JP2007258654A (en) | Circuit board land connection method and the circuit board | |
| US20220238401A1 (en) | Seamless Interconnect Thresholds using Dielectric Fluid Channels | |
| CN113423183A (en) | Manufacturing process of 5G communication high-frequency signal plate | |
| KR200176365Y1 (en) | Printed circuit board | |
| JP2023136661A (en) | Method for forming conductive layer, conductive layer, electronic module, and electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |
|
| RJ01 | Rejection of invention patent application after publication |