CN106888345A - PCB, camera module and camera head using the PCB - Google Patents
PCB, camera module and camera head using the PCB Download PDFInfo
- Publication number
- CN106888345A CN106888345A CN201510943624.1A CN201510943624A CN106888345A CN 106888345 A CN106888345 A CN 106888345A CN 201510943624 A CN201510943624 A CN 201510943624A CN 106888345 A CN106888345 A CN 106888345A
- Authority
- CN
- China
- Prior art keywords
- copper
- pcb
- grid
- cover
- covers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 4
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004304 visual acuity Effects 0.000 description 2
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 1
- 235000021168 barbecue Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003938 response to stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
A kind of PCB, including：Substrate, with first surface and the second surface relative with the first surface；First covers copper part, and with reference on the first surface of the substrate, described first covers copper part for conductor layer, including a plurality of extension signal lead；Second copper-clad part, with reference on the second surface of the substrate, the second copper-clad part is ground plane, the second copper-clad part no signal cabling, the second copper-clad part include it is middle cover real copper part and periphery cover grid copper part.It is described that cover grid copper part to cover the mesh shape of grid copper be square or rhombus, it is described cover grid copper part and cover the mesh width of grid copper the distance between two bars cablings in copper part are covered equal to described first.Above-mentioned PCB can be when toasting or carrying lens bracket crosses stove, and deformation is uniform, keeps good flatness.The present invention also provides a kind of camera module and camera head using the PCB.
Description
Technical field
The present invention relates to a kind of PCB technical fields, PCB, use that more particularly to a kind of flatness improves
The camera module and camera head of the PCB.
Background technology
Printed circuit board (PCB), also known as printed circuit board (Printed Circuit Board, hereinafter referred to as PCB),
It is the supplier of electronic component electrical connection, is also the supporter of electronic component.Using the main of PCB
Advantage is the mistake for greatly reducing wiring and assembling, improves the gentle production efficiency of Automated water.Electronic product
Level such as design and the manufacture of the PCB in camera module is the main original for determining the camera module Product Level
Cause, its design and workmanship directly determine the performance and cost of camera module.
PCB in current high-pixel camera module is to use Rigid Flex, run into technique a difficulty
Topic is exactly flatness problem.Fig. 4 is specifically referred to, PCB 200 generally includes substrate in traditional camera module
210, copper part 220 is covered, this covers copper part 220 includes ground plane 221 and conductor layer 222, the substrate 210
With first surface 2101 and the second surface 2102 relative with the first surface 2101, copper part 220 is covered
With reference on the first surface 2101 of the substrate 210, very close, the office that is designed as Local Copper of the ground plane 221
Portion is very thin, also the direct reality copper in part, due to occupying a large amount of areas without trace portions, causes flatness very not
Uniformly.Stove is crossed due to can all have baking in PCB supplied materials or carry lens bracket, and the cabling of ground plane divides
Cloth is uneven to cause PCB to deform inconsistent when lens bracket crosses stove toasting or carry, and cause PCB to occur
Warpage, especially edge are easiest to warpage, have a strong impact on flatness of the whole PCB in barbecue, final shadow
Ring the resolving power of camera module.
The content of the invention
In view of above-mentioned condition, it is necessary to provide PCB and the shooting mould using the PCB that a kind of flatness improves
Group and camera head.
A kind of PCB, including：
Substrate, with first surface and the second surface relative with the first surface；
First covers copper part, and with reference on the first surface of the substrate, described first covers copper part for wire
Layer, including a plurality of extension signal lead；
Second copper-clad part, with reference on the second surface of the substrate, the second copper-clad part is ground connection
Layer, the second copper-clad part no signal cabling, the second copper-clad part is designed as centre and covers real copper, week
While cover grid copper, i.e., described second copper-clad part include it is middle cover real copper part and periphery cover grid copper portion
Point.
Wherein in one embodiment, it is described cover grid copper part cover grid copper mesh shape be it is square or
Rhombus.
Wherein in one embodiment, the described first line width and spacing for covering the signal lead of copper part is all higher than
Equal to 0.1mm.
Wherein in one embodiment, the mesh width of grid copper is covered equal to described in the grid copper part of covering
First covers the distance between two bars cablings in copper part.
Wherein in one embodiment, it is described cover grid copper part and cover the grid spacing of grid copper be more than or equal to
0.1mm。
Wherein in one embodiment, the due signal lead in second copper-clad part is put to described first and is covered
Copper part.
Wherein in one embodiment, the PCB is dual platen or multi-layer sheet.
A kind of camera module, including above-mentioned PCB；And
Support frame, on the PCB, support frame as described above is mutually bonded with the PCB by adhesive glue；
Optical filter, on support frame as described above；
Voice coil motor, on support frame as described above, the voice coil motor is electrically connected with the PCB；
Camera lens, installs on the described voice coil motor.
A kind of camera head, at least including above-mentioned camera module.
The camera head is any one mobile terminal in mobile phone, notebook computer, PDA.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the PCB of embodiment of the present invention；
Fig. 2 is the circuit design diagram of the PCB of embodiment of the present invention；
Fig. 3 is the decomposition texture schematic diagram of the camera module of embodiment of the present invention；
Fig. 4 is the schematic cross-section of traditional PCB.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.
First-selected embodiment of the invention is given in accompanying drawing.But, the present invention can come real in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to this
Disclosure of the invention content is more thorough comprehensive.
It should be noted that when element is referred to as " being fixedly arranged on " another element, it can be directly in another yuan
On part or can also there is element placed in the middle.When an element is considered as " connection " another element, it can
To be directly to another element or may be simultaneously present centering elements.Term as used herein " is hung down
It is straight ", " level ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article with belong to technology of the invention
The implication that the technical staff in field is generally understood that is identical.The art for being used in the description of the invention herein
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in the limitation present invention.It is used herein
Term " and/or " include the arbitrary and all of combination of one or more related Listed Items.
Fig. 1 and Fig. 2, the PCB 100 of embodiment of the present invention, including substrate 110 are referred to, first covers copper
Part 121 and second copper-clad part 122.The substrate 110 have first surface 1101 and with the first surface
1101 relative second surfaces 1102.This first cover copper part 121 combine substrate 110 first surface 1101
On, the second copper-clad part 122 is combined on the second surface 1102 of substrate 110.The PCB 100 can be with
It is dual platen or multi-layer sheet, specifically in the present embodiment, the PCB 100 is multi-layer sheet.
The PCB 100 can apply to different camera modules, for example, two ends focusing cameras module, automatic
Focusing camera module, optical zoom camera module etc., specifically in the present embodiment, with automatic focusing camera mould
Illustrated as a example by group.
The substrate 110 can be the copper-clad plate of organic resin class, metal-based copper-clad plate, ceramic base copper-clad plate etc..
Specifically in the present embodiment, the substrate 110 is organic resin class copper-clad plate.
This first covers copper part 121 for conductor layer, is designed specifically to include uniform signal lead 1211, guarantor
Demonstrate,prove the circuit signal of the PCB 100.The second copper-clad part 122 is ground plane, is designed specifically to centre and covers
Grid copper is covered on real copper, periphery, i.e., including covering real copper part 1221 and covering grid copper part 1222, this covers grid
The mesh shape of copper part 1222 can be square or rhombus, and specifically in the present embodiment, this covers grid copper portion
The mesh shape for dividing 1222 is rhombus.The spacing for covering the grid of grid copper part 1222 is more than or equal to
0.1mm, specifically in the present embodiment, the spacing for covering the grid of grid copper part 1222 is 0.1mm.
In the present embodiment, the no signal cabling of second copper-clad part 122 walks the due signal of ground plane
Line is placed on first and covers copper part 121.
This first cover copper part 121 signal lead 1211 line width and spacing be all higher than be equal to 0.1mm, should
The distance between 1211 liang of bars cablings of signal lead are equal to and cover grid copper part 1222 and cover to obtain grid copper
Mesh width.It is specific in the present embodiment, this first cover copper part 121 signal lead 1211 line width
It is 0.1mm, the distance between two bars cablings are also 0.1mm, and this covers the grid of grid copper part 1222
Width is similarly 0.1mm.
Compared to the traditional PCB used in camera module, above-mentioned PCB at least has advantages below：
(1) because the structure of ground plane is to cover real copper in centre, periphery is covered grid copper, is solved in the prior art
Ground plane Local Copper is very close, the local very thin flatness problem of non-uniform for causing.
(2) the due signal lead of ground plane is placed on conductor layer, further improves PCB flatness not
The problem of foot.
(3) above-mentioned PCB baking or when carrying lens bracket and crossing stove, can improve PCB when expanding with heat and contract with cold
Change the trickle flatness deformation of PCB in response to stress effect, PCB is all kept good smooth before and after processing procedure
Degree, the final resolving power for improving camera module.
Meanwhile, the present invention also provides a kind of camera module, refers to Fig. 3, and the camera module includes PCB 100；
And
Support frame 200, on the PCB 100, the support frame 200 passes through adhesive glue with the PCB 100
Mutually bonding；
Optical filter 300, on the support frame 200；
Voice coil motor 400, on the support frame 200, the voice coil motor 400 is electrically connected with the PCB 100；
Camera lens 500, installs on the voice coil motor 400.
In addition, the present invention also provides a kind of camera head, at least the above camera module of the camera head.
It should be noted that the camera head is any one movement end in mobile phone, notebook computer, PDA
End.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed,
But therefore can not be interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, can also make it is some deformation and
Improve, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is defined.
Claims (10)
1. a kind of PCB, it is characterised in that including：
Substrate, with first surface and the second surface relative with the first surface；
First covers copper part, and with reference on the first surface of the substrate, described first covers copper part for wire
Layer, including a plurality of extension signal lead；
Second copper-clad part, with reference on the second surface of the substrate, the second copper-clad part is ground connection
Layer, the second copper-clad part no signal cabling, the second copper-clad part is designed as centre and covers real copper, week
While cover grid copper, i.e., described second copper-clad part include it is middle cover real copper part and periphery cover grid copper portion
Point.
2. PCB according to claim 1, it is characterised in that cover grid in the grid copper part of covering
The mesh shape of copper is square or rhombus.
3. PCB according to claim 1, it is characterised in that first signal for covering copper part is walked
The line width and spacing of line are all higher than being equal to 0.1mm.
4. PCB according to claim 1, it is characterised in that cover grid in the grid copper part of covering
The mesh width of copper covers the distance between two bars cablings in copper part equal to described first.
5. PCB according to claim 4, it is characterised in that cover grid in the grid copper part of covering
The grid spacing of copper is more than or equal to 0.1mm.
6. PCB according to claim 1, it is characterised in that the due letter in second copper-clad part
Number cabling is put to described first and covers copper part.
7. PCB according to claim 1, it is characterised in that the PCB is dual platen or multilayer
Plate.
8. a kind of camera module, it is characterised in that including the PCB as described in claim 1~7 any one；
And
Support frame, on the PCB, support frame as described above is mutually bonded with the PCB by adhesive glue；
Optical filter, on support frame as described above；
Voice coil motor, on support frame as described above, the voice coil motor is electrically connected with the PCB；
Camera lens, installs on the described voice coil motor.
9. a kind of camera head, it is characterised in that the camera head at least includes as claimed in claim 8
Camera module.
10. according to claim 9 camera head, it is characterised in that the camera head is mobile phone, notes
Any one mobile terminal in this computer, PDA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510943624.1A CN106888345A (en) | 2015-12-16 | 2015-12-16 | PCB, camera module and camera head using the PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510943624.1A CN106888345A (en) | 2015-12-16 | 2015-12-16 | PCB, camera module and camera head using the PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106888345A true CN106888345A (en) | 2017-06-23 |
Family
ID=59175017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510943624.1A Pending CN106888345A (en) | 2015-12-16 | 2015-12-16 | PCB, camera module and camera head using the PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106888345A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862245A (en) * | 2019-02-21 | 2019-06-07 | 信利光电股份有限公司 | A kind of camera module of anti-PCB light leakage |
| CN111133744A (en) * | 2017-09-27 | 2020-05-08 | 京瓷株式会社 | Imaging device, imaging device manufacturing method, and moving body |
-
2015
- 2015-12-16 CN CN201510943624.1A patent/CN106888345A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111133744A (en) * | 2017-09-27 | 2020-05-08 | 京瓷株式会社 | Imaging device, imaging device manufacturing method, and moving body |
| CN109862245A (en) * | 2019-02-21 | 2019-06-07 | 信利光电股份有限公司 | A kind of camera module of anti-PCB light leakage |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170623 |
|
| WD01 | Invention patent application deemed withdrawn after publication |