CN105117714A - Fingerprint sensor module and electronic device - Google Patents
Fingerprint sensor module and electronic device Download PDFInfo
- Publication number
- CN105117714A CN105117714A CN201510597050.7A CN201510597050A CN105117714A CN 105117714 A CN105117714 A CN 105117714A CN 201510597050 A CN201510597050 A CN 201510597050A CN 105117714 A CN105117714 A CN 105117714A
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- cover plate
- sensor module
- fingerprint sensor
- frame
- sensor chip
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a fingerprint sensor module and an electronic device. The fingerprint sensor module comprises a FPC, a frame, a sensor chip, and a cover plate. The frame is a hollow annular structure. The bottom of the frame and the FPC are bonded by a bonding agent. A receiving space is formed in the frame. The cover plate is located at the upper part inside the receiving space. The sensor chip is located at the lower part inside the receiving space. The bottom surface of the sensor chip is bonded with the FPC through a conductive bonding agent. The top surface of the sensor chip is bonded with the cover plate through a nonconductive bonding agent. The cover plate is arranged on the top of the sensor chip so that the fingerprint sensor module can be used for a long time, is prevented from wearing, is high in surface hardness and identification accuracy and reliability, and good in appearance effect.
Description
Technical field
The present invention relates to sensor technical field, particularly relate to a kind of fingerprint sensor module and electronic equipment.
Background technology
Along with the development of fingerprint identification technology, fingerprint recognition system is applied in daily life more and more, as gate inhibition, attendance checking system, notebook computer, mobile phone, automobile, bank paying etc. all can the technology of employing fingerprint identification.
Fingerprint recognition system comprises fingerprint sensor module and drive circuit unit, wherein: fingerprint sensor module is for detecting fingerprint active user fingerprint pattern, and described active user's fingerprint pattern is converted to the finger print information of electric signal, drive circuit unit, for driving described fingerprint sensor module, and process the finger print information that fingerprint sensor module detects.
And fingerprint sensor module of the prior art, as shown in Figure 1, it comprises the FPC1 being positioned at the bottom, the top of FPC1 is bonded with frame 2 by bonding agent 6, the inner hollow of this frame 2, and the inside of frame 2 is provided with sensor chip 3, the bottom of sensor chip 3 is bonding with FPC1 by electrically conducting adhesive 5, the top of sensor chip 3 is provided with ink printed layer 4 ', when user's finger is by when getting on, inner sensor chip 3 just starts the fingerprint of sensitive scanning finger and signal is connected by FPC1 the main control chip feeding back to drive circuit unit to compare judgement, thus realize fingerprint identification function.This fingerprint sensor module formed with ink printing form; because the skin hardness of ink printed layer 4 ' is relatively low; wearing and tearing will be formed when long-time touch; and then damage outward appearance, also will affect the accuracy rate of identification, and this ink printed layer; more responsive in order to touch; the thickness of ink printed layer is less, and is unfavorable for protecting sensor chip, and thus reliability is low.
Summary of the invention
The object of the invention is to propose a kind of fingerprint sensor module and electronic equipment, its skin hardness is high, and avoid wearing and tearing, recognition accuracy is high, can increase the service life.
For reaching this object, the present invention by the following technical solutions:
On the one hand, the invention provides a kind of fingerprint sensor module, comprise FPC, frame, sensor chip, cover plate, wherein,
Described frame is the loop configuration of inner hollow;
The bottom of described frame is bonding with described FPC by bonding agent, and forms the receiving space being positioned at the inside of described frame;
Described cover plate is positioned at the top of described receiving space, and described sensor chip is positioned at the bottom of described receiving space;
The underrun electrically conducting adhesive of described sensor chip is bonding with described FPC, and the end face of described sensor chip is by the bonding described cover plate of non-conductive adhesive.
Preferably, the top of described frame and bottom all can be conducted electricity.
Wherein, the sidepiece of described cover plate, described sensor chip all with the inner side interference fit of described receiving space.
Preferably, the thickness of described non-conductive adhesive is 0.003 ~ 0.1mm; The thickness of described cover plate is 0.05 ~ 0.5mm.
Preferred further, the thickness of described non-conductive adhesive is 0.005 ~ 0.05mm; The thickness of described cover plate is 0.08 ~ 0.2mm.
Further preferred, the thickness of described non-conductive adhesive is 0.01 ~ 0.02mm; The thickness of described cover plate is 0.1mm.
Wherein, described cover plate is the cover plate of sapphire, pottery, quartz, glass, PC, PMMA, PET, PI or PA material.
Wherein, the bottom surface of described cover plate is provided with non-conductive and is with coloured ink coating, and the thickness of described oil film coating is 0.005 ~ 0.05mm.
Preferably, the top of described frame is provided with the position-limited edge extended internally, and described position-limited edge is installed with the top in described cover plate.
Preferred further, the width of described position-limited edge is 0.3 ~ 3mm.
Wherein, the xsect of the side of described frame is step L-type structure outwardly, and described position-limited edge is arranged at the top of the vertical edge of described L-type structure;
When the shell of described fingerprint sensor module and electronic equipment assembles, the vertical edge of described L-type structure coordinates with the shell aperture of described shell, and the horizontal sides of described L-type structure coordinates with the inner bottom surface of described shell.
On the other hand, the present invention also provides a kind of electronic equipment with described fingerprint sensor module.
Beneficial effect of the present invention is:
Fingerprint sensor module of the present invention and electronic equipment, in the receiving space formed by the FPC that the frame of the loop configuration in inner hollow is bonding with bottom, sensor chip and cover plate are set, and cover plate is bonded in the end face of sensor chip by non-conductive adhesive, and the bottom of sensor chip is bonding with FPC by electrically conducting adhesive, thus when operating, user's finger presses cover plate, and the fingerprint that sensitive scanning is pointed by sensor chip, and sweep signal is fed back to main control chip by FPC to compare judgement, thus realize fingerprint identification function, therefore, support when realizing fingerprint recognition by cover plate, and provide far away higher than the skin hardness of ink printed layer by cover plate, and then avoid wearing and tearing, the reliability identified can not only be ensured for a long time, improve recognition accuracy, and increase the service life, appearance is good.
Accompanying drawing explanation
Fig. 1 is the structural representation of fingerprint sensor module of the prior art.
Fig. 2 is the structural representation of a kind of embodiment of fingerprint sensor module of the present invention.
Fig. 3 is the structural representation of the another kind of embodiment of fingerprint sensor module of the present invention.
In figure: 100-fingerprint sensor module; 1-FPC; 2-frame; 3-sensor chip; 4 '-ink printed layer; 4-cover plate; 5-electrically conducting adhesive; 6-bonding agent; 7-non-conductive adhesive; 201-receiving space; 202-vertical edge; 203-horizontal sides; 204-position-limited edge; 301-bottom surface; 302-end face.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.
Embodiment one
As shown in Figure 2, the invention provides a kind of fingerprint sensor module 100, comprise FPC1, frame 2, sensor chip 3, cover plate 4.
Particularly, frame 2 is the loop configuration of inner hollow; The bottom of frame 2 is bonding with FPC1 by bonding agent 6, and forms the receiving space 201 being positioned at the inside of frame 2.
Further, cover plate 4 is positioned at the top of receiving space 201, and sensor chip 3 is positioned at the bottom of receiving space 201; The bottom surface 301 of sensor chip 3 is bonding with FPC1 by electrically conducting adhesive 5, and the end face 302 of sensor chip 3 is by the bonding cover plate 4 of non-conductive adhesive 7.
Fingerprint sensor module of the present invention, in the receiving space 201 formed by the FPC1 that the frame 2 of the loop configuration in inner hollow is bonding with bottom, sensor chip 3 and cover plate 4 are set, and cover plate 4 is bonded in the end face 302 of sensor chip 3 by non-conductive adhesive 7, and the bottom of sensor chip 3 is bonding with FPC1 by electrically conducting adhesive 5, thus when operating, user's finger presses cover plate 4, and the fingerprint that sensitive scanning is pointed by sensor chip 3, and sweep signal is fed back to main control chip by FPC1 to compare judgement, thus realize fingerprint identification function, therefore, support when realizing fingerprint recognition by cover plate 4, and provide far away higher than the skin hardness of ink printed layer by cover plate 4, and then avoid wearing and tearing, the reliability identified can not only be ensured for a long time, and increase the service life, appearance is good, this also just can be avoided finger touching sensor chip 3, thus protection sensor chip 3 is impaired.
In the present embodiment, cover plate 4 is bonding by non-conductive adhesive 7 with sensor chip 3, the connection of both realizations, but does not need conduction.
Electrically conducting adhesive 5 can be anisotropic conductive (ACF), also can be tin cream; Upon connection, conduction can be realized in the vertical direction, and realize insulation in the horizontal direction, just can realize the signal transmission between sensor 3 and FPC1 well.
Bonding agent 6 between frame 2 and FPC1 can be the bonding agent that conduct electricity, or the mixing of the bonding agent conducted electricity and non-conductive bonding agent, or nonconducting bonding agent.
Because sensor chip 3 is divided into passive type and active two kinds, different sensor chips 3 is by frames 2 different for correspondence, specific as follows:
When sensor chip 3 is passive type, user's finger is pressed on the surface of cover plate 4, sensor chip 3 just can finger sensing carry out fingerprint recognition, thus the top of frame 2 now and bottom are just without the need to conduction, at this moment, bonding agent 6 between frame 2 and FPC1 also can be just nonconducting, and therefore, this bonding agent 6 can be non-conductive bonding agent;
When sensor chip 3 is active, user's finger is pressed on the surface of cover plate 4, need the top of frame 2 and bottom all can conduct electricity, finger is utilized to realize with the top of frame 2 and the conductive characteristic of bottom the transmission pressing signal, then sensor chip 3 just carries out fingerprint recognition according to this signal, at this moment, the top of frame 2 and bottom need conduction, and the bonding agent 6 between frame 2 and FPC1 also needs the ability of conduction, at this moment, this bonding agent 6 is the bonding agent of conduction, the bonding agent of this conduction can be conductive glue (as elargol), ACF or tin cream, the electrical connection of FPC and frame is realized by the bonding agent of conduction, the bonding connection of frame and FPC is realized by non-conductive bonding agent.
But, when the application of reality, due to bonding agent 6 be conduction bonding agent time, its cost is higher, now, just can frame 2 with coordinate with non-conductive bonding agent between FPC1, jointly to arrange in pairs or groups use to make the bonding agent of conduction and non-conductive bonding agent, when can realize above-mentioned conduction and bonding, this just can effectively reduce costs.
Preferably, in the present embodiment, cover plate 4 is the cover plate of sapphire, pottery, quartz, glass, PC, PMMA, PET, PI or PA material.Utilize cover plate of the present invention, ink printed layer of the prior art can be substituted, high surfaces hardness can be provided, skin hardness can >=6H, and this be the scheme of ink printing of the prior art is very inaccessible.Preferred further, in the present embodiment, the bottom surface of cover plate 4 is provided with non-conductive and is with coloured ink coating, and the thickness of this oil film coating is 0.005 ~ 0.05mm.Herein, due to cover plate 4 be above-mentioned material time, being generally transparent, thus by being provided with the oil film coating of color, decoration screening effect can being played, play protection sensor chip 3 effect.
Particularly, the sidepiece of cover plate 4, sensor chip 3 all with the inner side interference fit of receiving space 201.That is, the size of the size of all sides of cover plate 4, all sides of sensor chip 3 is all slightly larger than the size of the inner side of receiving space 201.Illustrate further, the profile of cover plate 4, sensor chip 3 is consistent with the inner shape of receiving space 201, such as, when cover plate 4, sensor chip 3 are rectangle or square, the rectangle that receiving space 201 is namely corresponding with it or square, and when cover plate 4, sensor chip 3 are circle, the circle that receiving space is namely corresponding with it; Therefore, when assembling, sensor chip 3 and cover plate 4 are just placed in receiving space 201, interference fit is formed with receiving space 201, thus make sensor chip 3 and cover plate 4 can both stably be placed in receiving space 201, further, when assembling, cover plate 4 just can prevent the electrically conducting adhesive 5 between cover plate 4 and sensor chip 3 from overflowing the outside of cover plate well, and then the appearance in the outside of guarantee cover plate 4.
Wherein, interference fit can be, cover plate and receiving space interference fit, sensor chip and receiving space interference fit, now, the size of the size of all sides of cover plate 4, all sides of sensor chip 3 can be consistent, also can be inconsistent, if the size of all sides of cover plate is relative to the extending out or inside contract 0.05mm of all sides of sensor chip 3, no matter be which kind of form, can realize interference fit, therefore, this design just can reduce the difficulty of processing and fabricating.
Certainly, it should be noted that herein, the outer shape of receiving space 201 does not limit, it is not necessarily consistent with the shape inside it, inner side as receiving space 201 is circular, and outside is square, this just makes the outside of receiving space 201 can carry out adaptive design according to the parts be specifically mated, and dirigibility is stronger.
Preferably, the thickness of non-conductive adhesive 7 is 0.003 ~ 0.1mm; The thickness of cover plate 4 is 0.05 ~ 0.5mm.
Preferred further, the thickness of non-conductive adhesive 7 is 0.005 ~ 0.05mm; The thickness of cover plate 4 is 0.08 ~ 0.2mm.
Further preferred, the thickness of non-conductive adhesive 7 is 0.01 ~ 0.02mm; The thickness of cover plate 4 is 0.1mm.
In the present embodiment, during by the bonding cover plate of non-conductive adhesive 7 and sensor chip, when the thickness of cover plate and non-conductive adhesive 7 is set in above-mentioned scope, just can while the thickness controlling fingerprint sensor module as far as possible, reach good recognition capability, improve higher recognition accuracy.
In the present embodiment, the xsect of the side of frame 2 is step L-type structure outwardly, when fingerprint sensor module 100 assembles at the shell with electronic equipment, the vertical edge 202 of L-type structure coordinates with the shell aperture of shell, and the horizontal sides 203 of L-type structure coordinates with the inner bottom surface of shell.Utilize the structure of this stepped ramp type, frame can be coordinated with the shell of electronic equipment well, fingerprint sensor module is easily located, assembling is firm, and usability is good.
Embodiment two
As shown in Figure 3, in the present embodiment, be with embodiment one difference, the top of frame 2 is provided with the position-limited edge 204 extended internally, and position-limited edge 204 is installed with the top in cover plate 4.Preferably, the width of position-limited edge 204 is 0.3 ~ 3mm.
Be pressed on the end face of cover plate 4 by position-limited edge 204, the spacing of cover plate 4 and sensor chip 3 can be realized at the top open part of receiving space 201, avoiding cover plate 4 to drop when colliding, improving reliability.Wherein, the forward position of position-limited edge 204 can be set to hypotenuse, to provide good feel, avoids scraping.
More specifically, the xsect of the side of frame 2 is step L-type structure outwardly, and position-limited edge 204 is arranged at the top of the vertical edge 202 of L-type structure;
When fingerprint sensor module 100 assembles with the shell of electronic equipment, the vertical edge 202 of L-type structure coordinates with the shell aperture of shell, and the horizontal sides 203 of L-type structure coordinates with the inner bottom surface of shell.
In sum, have employed the electronic equipment of fingerprint sensor module 100 of the present invention, its fingerprint recognition accuracy rate is high, and reliability is high, and the skin hardness of its fingerprint sensor module is high, wear-resisting, long service life.
Below know-why of the present invention is described in conjunction with specific embodiments.These describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (12)
1. a fingerprint sensor module (100), is characterized in that, comprises FPC (1), frame (2), sensor chip (3), cover plate (4), wherein,
The loop configuration that described frame (2) is inner hollow;
The bottom of described frame (2) is bonding with described FPC (1) by bonding agent (6), and forms the receiving space (201) being positioned at the inside of described frame (2);
Described cover plate (4) is positioned at the top of described receiving space (201), and described sensor chip (3) is positioned at the bottom of described receiving space (201);
The bottom surface (301) of described sensor chip (3) is bonding with described FPC (1) by electrically conducting adhesive (5), and the end face (302) of described sensor chip (3) is by the bonding described cover plate (4) of non-conductive adhesive (7).
2. fingerprint sensor module (100) according to claim 1, is characterized in that, top and the bottom of described frame (2) all can be conducted electricity.
3. fingerprint sensor module (100) according to claim 1, it is characterized in that, the sidepiece of described cover plate (4), described sensor chip (3) all with the inner side interference fit of described receiving space (201).
4. fingerprint sensor module (100) according to claim 1, is characterized in that, the thickness of described non-conductive adhesive (7) is 0.003 ~ 0.1mm; The thickness of described cover plate (4) is 0.05 ~ 0.5mm.
5. fingerprint sensor module (100) according to claim 4, is characterized in that, the thickness of described non-conductive adhesive (7) is 0.005 ~ 0.05mm; The thickness of described cover plate (4) is 0.08 ~ 0.2mm.
6. fingerprint sensor module (100) according to claim 5, is characterized in that, the thickness of described non-conductive adhesive (7) is 0.01 ~ 0.02mm; The thickness of described cover plate (4) is 0.1mm.
7. fingerprint sensor module (100) according to claim 1, is characterized in that, described cover plate (4) is sapphire, pottery, quartz, glass, PC, PMMA, PET, PI or PA material cover plate.
8. fingerprint sensor module (100) according to claim 1, is characterized in that, the bottom surface of described cover plate (4) is provided with non-conductive and is with coloured ink coating, and the thickness of described oil film coating is 0.005 ~ 0.05mm.
9. the fingerprint sensor module (100) according to any one of claim 1 to 8, it is characterized in that, the top of described frame (2) is provided with the position-limited edge (204) extended internally, and described position-limited edge (204) is installed with the top in described cover plate (4).
10. fingerprint sensor module (100) according to claim 9, is characterized in that, the width of described position-limited edge (204) is 0.3 ~ 3mm.
11. fingerprint sensor modules (100) according to claim 9, it is characterized in that, the xsect of the side of described frame (2) is step L-type structure outwardly, and described position-limited edge (204) is arranged at the top of the vertical edge (202) of described L-type structure;
When described fingerprint sensor module (100) is assembled with the shell of electronic equipment, the vertical edge (202) of described L-type structure coordinates with the shell aperture of described shell, and the horizontal sides (203) of described L-type structure coordinates with the inner bottom surface of described shell.
12. 1 kinds of electronic equipments with fingerprint sensor module (100) described in any one of claim 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510597050.7A CN105117714A (en) | 2015-09-17 | 2015-09-17 | Fingerprint sensor module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510597050.7A CN105117714A (en) | 2015-09-17 | 2015-09-17 | Fingerprint sensor module and electronic device |
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| CN105117714A true CN105117714A (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510597050.7A Withdrawn CN105117714A (en) | 2015-09-17 | 2015-09-17 | Fingerprint sensor module and electronic device |
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| CN (1) | CN105117714A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105763681A (en) * | 2016-03-22 | 2016-07-13 | 广东欧珀移动通信有限公司 | Fingerprint-sensing assembly for terminal and terminal equipped with same |
| CN105844219A (en) * | 2016-03-17 | 2016-08-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and terminal thereof, and fingerprint identification chip packaging method |
| CN106203337A (en) * | 2016-07-11 | 2016-12-07 | 深圳天珑无线科技有限公司 | Fingerprint recognition module and mobile terminal |
| CN106384104A (en) * | 2016-10-21 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and electronic device |
| CN106534433A (en) * | 2016-11-01 | 2017-03-22 | 惠州Tcl移动通信有限公司 | Fingerprint identification key, mobile terminal and mobile phone |
| CN106855938A (en) * | 2015-12-08 | 2017-06-16 | 安徽昌硕光电子科技有限公司 | A kind of structure of fingerprint identification module |
| WO2018133059A1 (en) * | 2017-01-22 | 2018-07-26 | 深圳市汇顶科技股份有限公司 | Fingerprint module |
| WO2018177387A1 (en) * | 2017-03-31 | 2018-10-04 | 华为技术有限公司 | Fingerprint identification device and terminal device |
| CN108986673A (en) * | 2017-05-31 | 2018-12-11 | 群创光电股份有限公司 | Show equipment |
-
2015
- 2015-09-17 CN CN201510597050.7A patent/CN105117714A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106855938A (en) * | 2015-12-08 | 2017-06-16 | 安徽昌硕光电子科技有限公司 | A kind of structure of fingerprint identification module |
| CN105844219A (en) * | 2016-03-17 | 2016-08-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and terminal thereof, and fingerprint identification chip packaging method |
| CN105763681A (en) * | 2016-03-22 | 2016-07-13 | 广东欧珀移动通信有限公司 | Fingerprint-sensing assembly for terminal and terminal equipped with same |
| CN106203337A (en) * | 2016-07-11 | 2016-12-07 | 深圳天珑无线科技有限公司 | Fingerprint recognition module and mobile terminal |
| CN106384104A (en) * | 2016-10-21 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and electronic device |
| CN106534433A (en) * | 2016-11-01 | 2017-03-22 | 惠州Tcl移动通信有限公司 | Fingerprint identification key, mobile terminal and mobile phone |
| WO2018133059A1 (en) * | 2017-01-22 | 2018-07-26 | 深圳市汇顶科技股份有限公司 | Fingerprint module |
| CN108475332A (en) * | 2017-01-22 | 2018-08-31 | 深圳市汇顶科技股份有限公司 | A kind of fingerprint module |
| WO2018177387A1 (en) * | 2017-03-31 | 2018-10-04 | 华为技术有限公司 | Fingerprint identification device and terminal device |
| CN108986673A (en) * | 2017-05-31 | 2018-12-11 | 群创光电股份有限公司 | Show equipment |
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