CN105205483A - Fingerprint sensing device - Google Patents
Fingerprint sensing device Download PDFInfo
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- CN105205483A CN105205483A CN201410264167.9A CN201410264167A CN105205483A CN 105205483 A CN105205483 A CN 105205483A CN 201410264167 A CN201410264167 A CN 201410264167A CN 105205483 A CN105205483 A CN 105205483A
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- substrate
- sensed layer
- control chip
- acquisition apparatus
- fingerprint acquisition
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Abstract
The present invention discloses a fingerprint sensing device which comprises a substrate, a sensing layer, a control chip and a protective layer. The sensing layer is arranged on the substrate and has a first side face and a second side face opposite to the first side face, wherein the first side face is connected to the substrate. The control chip is arranged on the second side face of the sensing layer. The protective layer is arranged on the second side face of the sensing layer and is between the sensing layer and the control chip.
Description
Technical field
The present invention relates to a kind of sensing apparatus, and particularly relate to one and be applied in the technical fingerprint acquisition apparatus of identification of fingerprint.
Background technology
Identification of fingerprint technology uses the fingerprint of fingerprint acquisition apparatus sensing user to identify personal status.Fingerprint acquisition apparatus can according to applied technology category classification, such as optical fingerprint sensing apparatus, Supersonic waves fingerprint acquisition apparatus, pressure type fingerprint sensing apparatus or capacitance type fingerprint sensing apparatus etc.Wherein, capacitance type fingerprint sensing apparatus has the little advantage of volume, and it is applicable to being applied on personal electronic device, such as intelligent mobile phone or panel computer etc.
With regard to capacitance type fingerprint sensing apparatus, existing capacitance type fingerprint sensing apparatus mainly contains two kinds of patterns, and the first is arranged at printed circuit board (PCB) (printedcircuitboard for sensed layer and control chip; PCB) fingerprint acquisition apparatus on, and the second is the fingerprint acquisition apparatus that sensed layer and control circuit are integrated into fingerprint sensing chip.The first fingerprint acquisition apparatus above-mentioned uses manufacturing process for printed circuit board to form sensed layer, and this sensed layer is by printed circuit board (PCB) cabling electrical connection control chip.But be limited to manufacturing process for printed circuit board, the resolution of the first fingerprint acquisition apparatus above-mentioned cannot effectively promote.On the other hand, sensed layer is formed in chip by above-mentioned the second fingerprint acquisition apparatus.By chip fabrication technique, the sensing electrode spacing in sensed layer can be reduced, and then improve the resolution of fingerprint sensing.But the manufacturing cost of above-mentioned the second fingerprint acquisition apparatus is higher.
Summary of the invention
The object of the present invention is to provide a kind of fingerprint acquisition apparatus, its feature is to have the advantages such as high identification of fingerprint resolution, low manufacturing cost and large fingerprint sensing area simultaneously.
According to above-mentioned purpose of the present invention, a kind of fingerprint acquisition apparatus is proposed.This fingerprint acquisition apparatus comprises substrate, sensed layer, control chip and protective seam.Sensed layer is arranged on substrate, and has the first side respect to one another and the second side, and wherein the first side is connected to substrate.Control chip is arranged on the second side of sensed layer.Protective seam is arranged on the second side of sensed layer, and between sensed layer and control chip.
According to one embodiment of the invention, this fingerprint acquisition apparatus also comprises multiple metal routing.This little metal routing is arranged on the second side of above-mentioned sensed layer, and this little metal routing is electrically connected on above-mentioned sensed layer in order to make above-mentioned control chip.
According to another embodiment of the present invention, aforesaid substrate is glass substrate.
According to another embodiment of the present invention, above-mentioned sensed layer is glass type (glasstype) sensed layer or diaphragm type (filmtype) sensed layer.
According to above-mentioned purpose of the present invention, a kind of fingerprint acquisition apparatus is also proposed.This fingerprint acquisition apparatus comprises substrate, sensed layer, control chip and protective seam.Substrate has the first side respect to one another and the second side.Sensed layer is arranged on the first side of substrate.Control chip is arranged on the second side of substrate.Protective seam is arranged on the second side of substrate, and between substrate and control chip.
According to one embodiment of the invention, this fingerprint acquisition apparatus also comprises multiple metal routing.This little metal routing is across substrate on the thickness direction of substrate, and this little metal routing is electrically connected on above-mentioned sensed layer in order to make above-mentioned control chip.
According to another embodiment of the present invention, aforesaid substrate is glass substrate.
According to another embodiment of the present invention, the first side of aforesaid substrate has surface of contact and noncontact face.Wherein, this surface of contact directly contacts for finger, and above-mentioned control chip is arranged on this noncontact face.
According to another embodiment of the present invention, this fingerprint acquisition apparatus also comprises shielding layer.This shielding layer is arranged on above-mentioned control chip, and covers above-mentioned control chip.
According to another embodiment of the present invention, above-mentioned sensed layer is glass type sensed layer or diaphragm type sensed layer.
Accompanying drawing explanation
Figure 1A is the vertical view of one embodiment of the invention fingerprint acquisition apparatus;
Figure 1B is the side view of Figure 1A fingerprint acquisition apparatus;
Fig. 2 is the side view of further embodiment of this invention fingerprint acquisition apparatus.
Symbol description
100,200: fingerprint acquisition apparatus
110,210: substrate
120,220: sensed layer
120A, 210A: the first side
120B, 210B: the second side
130,230: control chip
140,240: metal routing
150,250: protective seam
212: surface of contact
214: noncontact face
Embodiment
Below hash out embodiments of the invention.But be understandable that, embodiment provides many applicable inventive concepts, and it may be implemented in certain content miscellaneous.The specific embodiment discussed only for illustrating, and is not used to limit scope of the present invention.
Please refer to Figure 1A, it illustrates the vertical view of one embodiment of the invention fingerprint acquisition apparatus 100.Fingerprint acquisition apparatus 100 is in order to obtain the fingerprint signal of user, and it can be applicable to electronic installation or the systems such as such as notebook computer, panel computer, intelligent mobile phone, digital camera, gate control system or antitheft system for vehicle, but is not limited thereto.
In figure ia, fingerprint acquisition apparatus 100 comprises substrate 110, sensed layer 120, control chip 130 and metal routing 140.The finger of substrate 110 for user directly contacts.In the present invention, substrate 110 can be glass substrate or resin substrate etc.Sensed layer 120 is arranged on substrate 110, and has the first side 120A respect to one another and the second side 120B, and wherein the first side 120A is connected to substrate 110.Sensed layer 120 is in order to sense the finger print lines of user, and sensed layer 120 carries out corresponding method for sensing according to its structure type.For example, if sensed layer 120 is capacitance type sensing layer, then this sensed layer 120 can have and is arranged as rectangular multiple electrode structures, this a little electrode structure acts on from the convex ridge (ringe) pointed and chase (valley) and assembles the different quantity of electric charge respectively, this a little different quantity of electric charge produces sensing signal, then again by back-end processing processing of circuit sensing signal, to obtain fingerprint image signal.Sensed layer 120 as capacitance type sensing layer can be glass type (glasstype) sensed layer or diaphragm type (filmtype) sensed layer, and its related embodiment known by those skilled in the art, therefore does not illustrate in detail at this.In addition, in the present invention, sensed layer 120 also can be such as pressure type sensed layer or heat seeking sensed layer etc.
Control chip 130 is arranged on the second side 120B of sensed layer 120, and by being arranged at the metal routing 140 on the second side 120B of sensed layer 120 equally and being electrically connected with sensed layer 120.Control chip 130 can have multiple pin position (pin), and in order to connection metal cabling 140, to receive the sensing signal of sensed layer 120, and the control circuit of control chip 130 inside can process sensing signal, to obtain fingerprint image signal.
In addition, referring to Figure 1B, the second side 120B of sensed layer 120 is also provided with protective seam 150.As shown in Figure 2, protective seam 150 is arranged between sensed layer 120 and control chip 130, and it causes the damage of control chip 130 in order to prevent the direct contact sensing layer 120 of control chip 130.Protective seam 150 can comprise such as non-conductive adhesive (non-conductivepolymer, NCP) or other have the insulating material etc. of stickiness.In certain embodiments, protective seam 150 can comprise anisotropy conductiving glue (anisotropicconductivefilm; ACF), in order to make the pin position electrical connection metal routing 140 of control chip 130, and the body of control chip 130 and sensed layer 120 are electrically insulated.
It should be noted, in figure ia, control chip 130 is arranged at the centre of fingerprint acquisition apparatus 100.In practical application, control chip 130 can be not limited to the centre being positioned at fingerprint acquisition apparatus 100.For example, according to the layout of the electrode in sensed layer 120 and metal routing 140, control chip 130 can be arranged at side or the corner of fingerprint acquisition apparatus 100.
The feature of fingerprint acquisition apparatus of the present invention is that it has the advantages such as high identification of fingerprint resolution, low manufacturing cost and large fingerprint sensing area simultaneously.In other words, compared to existing film flip chip type (chiponfilm; Or chip direct package type (chiponboard COF); COB) fingerprint acquisition apparatus, sensed layer and control chip overlap by fingerprint acquisition apparatus of the present invention on the thickness direction of substrate, more effectively can utilize the plane space on substrate, and by suitable manufacture craft, sensed layer is arranged on glass substrate, the resolution of fingerprint sensing can be promoted.On the other hand, compared to existing fingerprint sensing chip, fingerprint acquisition apparatus of the present invention can reduce manufacturing cost and increase fingerprint sensing area.
Please refer to Fig. 2, it illustrates the side view of further embodiment of this invention fingerprint acquisition apparatus 200.In fig. 2, fingerprint acquisition apparatus 200 comprises substrate 210, sensed layer 220, control chip 230, metal routing 240 and protective seam 250.Substrate 210 can be glass substrate, resin substrate or other similar substrates etc.Substrate 210 has the first side 210A respect to one another and the second side 210B, wherein, first side 210A of substrate 210 is provided with sensed layer 220, and this sensed layer 220 in order to sense the finger print lines of user, and carries out corresponding method for sensing according to its structure type.The structure type that sensed layer 220 can have is identical with sensed layer 120, therefore please refer to the explanation about sensed layer 120 in previous paragraph about the explanation of sensed layer 220, does not repeat them here.
Control chip 230 is arranged on the second side 210B of substrate 210, and by the thickness direction of substrate 210 across the metal routing 240 of substrate 210 with and sensed layer 220 is electrically connected.In the present embodiment, the second side 210B of substrate 210 can be divided into surface of contact 212 and noncontact face 214, and wherein surface of contact 212 directly contacts for the finger of user, and noncontact face 214 is arranged thereon for control chip 230.Noncontact face 214 is preferably placed at the side of fingerprint acquisition apparatus 200, thus, can make that the second side 210B of substrate 210 has larger surface of contact 212, point direct contact for user.Control chip 230 can have multiple pin position, and in order to connection metal cabling 240, to receive the sensing signal of sensed layer 220, and the control circuit of control chip 230 inside can process sensing signal, to obtain fingerprint image signal.
Protective seam 250 is arranged between substrate 210 and control chip 230, and it causes the damage of control chip 230 in order to prevent the direct contact substrate 210 of control chip 230.Protective seam 250 can comprise such as non-conductive adhesive or other have the insulating material etc. of stickiness.In certain embodiments, protective seam 250 can comprise anisotropy conductiving glue, in order to make the pin position electrical connection metal routing 240 of control chip 230, and the body of control chip 230 and substrate 210 is electrically insulated.
In addition, in certain embodiments, also can on the control chip 230 of fingerprint acquisition apparatus 200 and/or the side edge of control chip 230 shielding layer (figure do not illustrate) is set, to be used for coverage control chip 230, and then prevent the direct touch controls chip 230 of the finger of user.
In sum, sensed layer and control chip overlap by fingerprint acquisition apparatus of the present invention on the thickness direction of substrate, and sensed layer are arranged in glass substrate or sensed layer by suitable manufacture craft.According to the fingerprint acquisition apparatus that the embodiment of the present invention completes, the advantages such as high identification of fingerprint resolution, low manufacturing cost and large fingerprint sensing area can be had simultaneously.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention, be anyly familiar with this operator, without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, what therefore protection scope of the present invention should define with the claim of enclosing is as the criterion.
Claims (10)
1. a fingerprint acquisition apparatus, comprises:
Substrate;
Sensed layer, is arranged on this substrate, and this sensed layer has the first side respect to one another and the second side, and wherein this first side of this sensed layer is connected to this substrate;
Control chip, is arranged on this second side of this sensed layer; And
Protective seam, is arranged on this second side of this sensed layer, and between this sensed layer and this control chip.
2. fingerprint acquisition apparatus as claimed in claim 1, also comprise multiple metal routing, those metal routings are arranged on this second side of this sensed layer, and those metal routings are electrically connected on this sensed layer in order to make this control chip.
3. fingerprint acquisition apparatus as claimed in claim 1, wherein this substrate is a glass substrate.
4. fingerprint acquisition apparatus as claimed in claim 1, wherein this sensed layer is a glass type (glasstype) sensed layer or a diaphragm type (filmtype) sensed layer.
5. a fingerprint acquisition apparatus, comprises:
Substrate, has the first side respect to one another and the second side;
Sensed layer, is arranged on this first side of this substrate;
Control chip, is arranged on this second side of this substrate; And
Protective seam, is arranged on this second side of this substrate, and between this substrate and this control chip.
6. fingerprint acquisition apparatus as claimed in claim 5, also comprises multiple metal routing, and those metal routings are across this substrate on the thickness direction of this substrate, and those metal routings are electrically connected on this sensed layer in order to make this control chip.
7. fingerprint acquisition apparatus as claimed in claim 5, wherein this substrate is a glass substrate.
8. fingerprint acquisition apparatus as claimed in claim 5, wherein this first side of this substrate has surface of contact and noncontact face, and this surface of contact directly contacts for finger, and this control chip is arranged on this noncontact face.
9. fingerprint acquisition apparatus as claimed in claim 8, also comprise shielding layer, this shielding layer is arranged on this control chip, and this shielding layer covers this control chip.
10. fingerprint acquisition apparatus as claimed in claim 5, wherein this sensed layer is glass type (glasstype) sensed layer or diaphragm type (filmtype) sensed layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410264167.9A CN105205483B (en) | 2014-06-13 | 2014-06-13 | Fingerprint sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410264167.9A CN105205483B (en) | 2014-06-13 | 2014-06-13 | Fingerprint sensing device |
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| Publication Number | Publication Date |
|---|---|
| CN105205483A true CN105205483A (en) | 2015-12-30 |
| CN105205483B CN105205483B (en) | 2020-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410264167.9A Active CN105205483B (en) | 2014-06-13 | 2014-06-13 | Fingerprint sensing device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107025427A (en) * | 2016-11-10 | 2017-08-08 | 关键禾芯科技股份有限公司 | Identification of fingerprint module |
| CN107766779A (en) * | 2016-08-19 | 2018-03-06 | 上海箩箕技术有限公司 | Electronic equipment |
| CN108090398A (en) * | 2016-11-22 | 2018-05-29 | 致伸科技股份有限公司 | Identification of fingerprint module |
| US11747675B2 (en) | 2019-12-13 | 2023-09-05 | Hisense Visual Technology Co., Ltd. | Display apparatus |
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| CN203102316U (en) * | 2012-10-12 | 2013-07-31 | 周正三 | Biosensor module, biosensor assembly, and electronic device using the same |
| CN103365508A (en) * | 2012-04-10 | 2013-10-23 | 奇景光电股份有限公司 | Touch panel |
| TW201416991A (en) * | 2012-10-16 | 2014-05-01 | Wei-Ting Lin | Capacitive fingerprint sensor and method of manufacturing the same |
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| CN1629876A (en) * | 2003-12-19 | 2005-06-22 | 升达科技股份有限公司 | Separated touch control board module and electronic product having the same |
| TW201011660A (en) * | 2008-08-15 | 2010-03-16 | Standard Microsyst Smc | Low cost fingerprint sensor system |
| US20100220900A1 (en) * | 2009-03-02 | 2010-09-02 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Fingerprint sensing device |
| CN103365508A (en) * | 2012-04-10 | 2013-10-23 | 奇景光电股份有限公司 | Touch panel |
| CN203102316U (en) * | 2012-10-12 | 2013-07-31 | 周正三 | Biosensor module, biosensor assembly, and electronic device using the same |
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| CN107766779A (en) * | 2016-08-19 | 2018-03-06 | 上海箩箕技术有限公司 | Electronic equipment |
| CN107025427A (en) * | 2016-11-10 | 2017-08-08 | 关键禾芯科技股份有限公司 | Identification of fingerprint module |
| CN108090398A (en) * | 2016-11-22 | 2018-05-29 | 致伸科技股份有限公司 | Identification of fingerprint module |
| US11747675B2 (en) | 2019-12-13 | 2023-09-05 | Hisense Visual Technology Co., Ltd. | Display apparatus |
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| CN105205483B (en) | 2020-09-01 |
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