CN107025427A - Identification of fingerprint module - Google Patents

Identification of fingerprint module Download PDF

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Publication number
CN107025427A
CN107025427A CN201611039790.XA CN201611039790A CN107025427A CN 107025427 A CN107025427 A CN 107025427A CN 201611039790 A CN201611039790 A CN 201611039790A CN 107025427 A CN107025427 A CN 107025427A
Authority
CN
China
Prior art keywords
identification
fingerprint
substrate
fingerprint module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611039790.XA
Other languages
Chinese (zh)
Inventor
林韦丞
萧建仁
曾士修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keycore Technology Corp
Original Assignee
Keycore Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keycore Technology Corp filed Critical Keycore Technology Corp
Priority to CN201611039790.XA priority Critical patent/CN107025427A/en
Publication of CN107025427A publication Critical patent/CN107025427A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor

Abstract

The invention discloses a kind of identification of fingerprint module, it is included:One substrate, multiple fingerprint sensing units;The substrate has one first side and one second side;The plurality of fingerprint sensing unit is divided into the second side of the substrate and with a basic unit, the basic unit has a first surface, a second surface, an inductive layer and a control IC, the inductive layer is arranged at the first surface, and the control IC selections are arranged at the first surface or second surface;The identification of fingerprint module that the present invention is provided can solve the problem of large area palmmprint identification module is difficult manufacture and too high manufacturing cost.

Description

Identification of fingerprint module
Technical field
The present invention relates to a kind of identification of fingerprint module, espespecially one kind can reduce large scale fingerprint or palmmprint recognizes module system Cause this identification of fingerprint module.
Background technology
Existing running gear (such as mobile phone, tablet PC) is all collocated with identification of fingerprint module, and identification of fingerprint module is removed There can be mobile phone enable outside safety identification function, it may also be used in Third-party payment, to ensure the safety of Third-party payment Property, existing identification of fingerprint module is mainly arranged at the region of running gear non-touch-control, i.e., by identification of fingerprint region and Touch Zone Domain is distinguished, and identification of fingerprint mainly once carries out identification of fingerprint only for a local cell domain, when more than 1 piece of fingerprint needs to distinguish It then can not simultaneously carry out, but need to sequentially carry out during knowledge, at present, because identification regional extent is generally large, then need to recognize Working region also expands, and can recognize the manufacturing cost of fingerprint or palmmprint the identification module in a wide range of fingerprint or palmmprint region very It is high and qualification rate is poor, therefore how reducing manufacturing cost and improving manufacture qualification rate is the present invention subject matter to be solved.
The content of the invention
To solve the above problems, it is a primary object of the present invention to provide a kind of to reduce the identification of fingerprint of manufacturing cost Module.
The secondary objective of the present invention can improve the identification of fingerprint module of manufacture qualification rate for offer is a kind of.
In order to achieve the above object, the invention provides a kind of identification of fingerprint module, it is included:One substrate and multiple fingerprints Sensing unit;
The substrate has one first side and one second side, and first side, the second side are correspondingly arranged in the glass substrate The upper side and lower side.
The plurality of fingerprint sensing unit is divided into the second side of the substrate, and the plurality of fingerprint sensing unit has a basic unit, The basic unit has a first surface, a second surface, an inductive layer and a control IC, and the inductive layer is arranged at first table Face, the control IC selections are arranged at the first surface or the second surface.
In one embodiment of this invention, the basic unit is a silicon substrate or a silica membrane.
In one embodiment of this invention, the plurality of fingerprint sensing unit horizontal is spaced.
In one embodiment of this invention, the inductive layer has multiple induction electrodes and multiple cablings, the plurality of sensing Electrode is electrically connected with the plurality of cabling with control IC.
In one embodiment of this invention, the material of the substrate is glass or polymethyl methacrylate.
In one embodiment of this invention, there is a gap between the plurality of fingerprint sensing unit.
The identification of fingerprint module that the present invention is provided can solve large area palmmprint identification module be difficult manufacture, qualification rate it is low and The problem of manufacturing cost is too high.
Brief description of the drawings
The identification of fingerprint module first embodiment three-dimensional exploded view that Fig. 1 provides for the present invention;
The identification of fingerprint module first embodiment combination of side view that Fig. 2 provides for the present invention;
The identification of fingerprint module second embodiment combination of side view that Fig. 3 provides for the present invention;
The identification of fingerprint module 3rd embodiment combination of side view that Fig. 4 provides for the present invention;
The identification of fingerprint module fourth embodiment combination of side view that Fig. 5 provides for the present invention;
The schematic diagram for the identification of fingerprint module work that Fig. 6 provides for the present invention.
Description of reference numerals:1- identification of fingerprint modules;11- substrates;The sides of 111- first;The sides of 112- second;12- fingerprint sensings Unit;121- basic units;1211- first surfaces;1212- second surfaces;1213- inductive layers;1214- controls IC;13- gaps;2- Palmmprint recognizes area.
Embodiment
The above-mentioned purpose and its structure of the present invention and characteristic functionally, the preferred embodiment according to institute's accompanying drawings is given Explanation.
As shown in Figure 1 and Figure 2, it is respectively the identification of fingerprint module first embodiment three-dimensional exploded view of the invention provided and group Side view is closed, as illustrated, the identification of fingerprint module 1 that the present invention is provided is included:One substrate 11 and multiple fingerprint sensing units 12;
The substrate 11 has one first side 111 and one second side 112, and first side 111, the second side 112 are correspondingly arranged In the upper side and lower side of the substrate 11, the material of the substrate 11 is glass or polymethyl methacrylate (Polymethylmethacrylate), the present embodiment is using glass material as explanation embodiment, but is not limited thereto.
The plurality of fingerprint sensing unit 12 is closely adjacent to each other is divided into the second side 112 of the substrate 11, the plurality of fingerprint side by side Sensing unit 12 has a basic unit 121, and the basic unit 121 is a silicon substrate.
The basic unit 121 has a first surface 1211, a second surface 1212, an inductive layer 1213 and a control IC1214, the inductive layer 1213 is arranged at the first surface 1211, and the control IC1214 is arranged at the first surface 1211 And it is adjacent with the inductive layer 1213, the inductive layer 1213 has multiple induction electrodes and multiple cabling (not shown), and this is more Individual induction electrode is electrically connected with the plurality of cabling with control IC1214, and the layer structure in foregoing inductive layer 1213 can refer to The wire structures of existing fingeprint distinguisher, will not be described in great detail herein.
The identification of fingerprint module second embodiment combination of side view that the present invention is provided is illustrated in figure 3, as illustrated, this reality Apply a part-structure identical with aforementioned first embodiment, therefore will not be described in great detail herein, the present embodiment and aforementioned first embodiment It is a silica membrane that difference, which is in the basic unit 121, when with silica membrane as basic unit 121, then must be led to Mode after successively coating in the second side 112 of the substrate 11 is molded the structure sheaf of the plurality of fingerprint sensing unit 12, first in The leading coating aforementioned silicas film in the second side 112 of the substrate 11, to increase attachment degree, afterwards again by fingerprint sensing unit The silica that 12 inductive layer 1213 and control IC1214 is arranged at foregoing the second side 112 for being coated in the substrate 11 in advance is thin On film, the coating layer of silicon dioxide film on foregoing inductive layer 1213 and control IC1214 is used as fingerprint sensing unit 12 Basic unit 121 and used as insulation.
The identification of fingerprint module 3rd embodiment combination of side view that the present invention is provided is illustrated in figure 4, as illustrated, this reality Apply a part-structure identical with aforementioned first embodiment, therefore will not be described in great detail herein, the present embodiment and aforementioned first embodiment Difference is in is arranged at the second surface 1212 in the control IC1214, is to be correspondingly arranged in the base with the inductive layer 1213 The upper side and lower side of layer 121.
The identification of fingerprint module fourth embodiment combination of side view that the present invention is provided is illustrated in figure 5, as illustrated, this reality Apply a part-structure identical with aforementioned first embodiment, therefore will not be described in great detail herein, the present embodiment and aforementioned first embodiment Difference, which is in be spaced in the plurality of fingerprint sensing unit 12, is arranged at the second side 112 of the substrate 11, the plurality of fingerprint sense Surveying between unit 12 has a gap 13, and the plurality of gap 13 can be by an algorithm by the identification nothing caused by between the plurality of gap 13 Imitate region to eliminate, the algorithm is an existing margin of error correction algorithm, therefore be will not be described in great detail herein.
The identification of fingerprint module operating diagram that the present invention is provided is illustrated in figure 6, as shown in Fig. 1~Fig. 5, the fingerprint Identification module mainly sets multiple fingerprint sensing units 12 in the second side 112 of the substrate 11, and by the plurality of fingerprint sensing list First 12 arrays rearrange palmmprint identification area 2, when user needs identification of fingerprint then by the plurality of fingerprint sensing unit 12 are individually recognized, and need to such as carry out a wide range of palmmprint identification or the work of multiple identification of fingerprint need to be while when carrying out, then by preceding State palmmprint identification area to be recognized, the plurality of fingerprint sensing unit 12 in the present invention is mainly arranged at the second side of the substrate 11 112, and when actually user operates to should the first side 111 of substrate 11 operate.
During present invention is primarily aimed at solving to carry out large scale fingerprint or palmmprint identification at present, the fingerprint or the palm provided The problem of line identification module can not reach identification purpose, by big combined by the arrangement of multiple fingerprint sensing packing forms Region fingerprint or palmmprint identification module can reduce manufacturing cost, because needed for the production of existing large scale identification of fingerprint module Large scale silicon substrate material cost costly simultaneously easily produces defective work, and then raising disqualification rate in the manufacturing, Identification of fingerprint module 1 disclosed by the invention, which can solve the problem that, is currently manufactured as the problem of this is too high and reduction disqualification rate.

Claims (6)

1. a kind of identification of fingerprint module, it is characterised in that include:
One substrate, with one first side and one second side, first side, the second side be correspondingly arranged in the upside of the substrate and under Side;
Multiple fingerprint sensing units, are divided into the second side of the substrate, and the plurality of fingerprint sensing unit has a basic unit, the basic unit With a first surface, a second surface, an inductive layer and a control IC, the inductive layer is arranged at the first surface, described Control IC selections are arranged at the first surface or the second surface.
2. identification of fingerprint module according to claim 1, it is characterised in that the basic unit is a silicon substrate or a titanium dioxide Silicon thin film.
3. identification of fingerprint module according to claim 1, it is characterised in that the plurality of fingerprint sensing unit horizontal interval row Row.
4. identification of fingerprint module according to claim 1, it is characterised in that the inductive layer have multiple induction electrodes and Multiple cablings, the plurality of induction electrode is electrically connected with the plurality of cabling with control IC.
5. identification of fingerprint module according to claim 1, it is characterised in that the material of the substrate is glass or poly- methyl Methyl acrylate.
6. identification of fingerprint module according to claim 1, it is characterised in that have between the plurality of fingerprint sensing unit between one Gap.
CN201611039790.XA 2016-11-10 2016-11-10 Identification of fingerprint module Pending CN107025427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611039790.XA CN107025427A (en) 2016-11-10 2016-11-10 Identification of fingerprint module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611039790.XA CN107025427A (en) 2016-11-10 2016-11-10 Identification of fingerprint module

Publications (1)

Publication Number Publication Date
CN107025427A true CN107025427A (en) 2017-08-08

Family

ID=59525869

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611039790.XA Pending CN107025427A (en) 2016-11-10 2016-11-10 Identification of fingerprint module

Country Status (1)

Country Link
CN (1) CN107025427A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110147751A (en) * 2019-05-16 2019-08-20 Oppo广东移动通信有限公司 A kind of method and device of fingerprint detection

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Publication number Priority date Publication date Assignee Title
CN2826476Y (en) * 2006-01-17 2006-10-11 深圳市瑞福达液晶显示技术有限公司 Color filter for LCD
CN101727571A (en) * 2008-10-24 2010-06-09 宏碁股份有限公司 Fingerprint sensing device and fingerprint sensing touch device
CN103870817A (en) * 2014-03-27 2014-06-18 成都费恩格尔微电子技术有限公司 Radio-frequency micro-capacitance fingerprint acquisition chip and method
CN104680126A (en) * 2014-11-24 2015-06-03 麦克思智慧资本股份有限公司 Fingerprint identifying device and manufacturing method thereof
CN105095872A (en) * 2015-07-29 2015-11-25 京东方科技集团股份有限公司 Substrate and preparation method thereof, fingerprint identification sensor, and fingerprint identification apparatus
TWM513411U (en) * 2015-06-10 2015-12-01 Tpk Touch Solutions Xiamen Inc Touch device with fingerprint identification function
CN105205483A (en) * 2014-06-13 2015-12-30 奇景光电股份有限公司 Fingerprint sensing device
TW201608442A (en) * 2014-08-20 2016-03-01 友達光電股份有限公司 Optoelectronic sensor array, method of fabricating optoelectronic sensor array and display device
CN105373772A (en) * 2015-10-09 2016-03-02 京东方科技集团股份有限公司 Optical fingerprint/palm print identification device, touch control display panel and display device
KR20160033328A (en) * 2014-09-17 2016-03-28 엘지디스플레이 주식회사 Apparatus for sensing touch/fingerprint
US20160132713A1 (en) * 2014-11-12 2016-05-12 Crucialtec Co., Ltd. Display Apparatus Capable of Image Scanning and Driving Method Thereof
CN205427875U (en) * 2016-01-25 2016-08-03 茂丞科技股份有限公司 Sensor is discerned to fingerprint
CN106033270A (en) * 2015-03-16 2016-10-19 林志忠 Touch device with fingerprint identification

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2826476Y (en) * 2006-01-17 2006-10-11 深圳市瑞福达液晶显示技术有限公司 Color filter for LCD
CN101727571A (en) * 2008-10-24 2010-06-09 宏碁股份有限公司 Fingerprint sensing device and fingerprint sensing touch device
CN103870817A (en) * 2014-03-27 2014-06-18 成都费恩格尔微电子技术有限公司 Radio-frequency micro-capacitance fingerprint acquisition chip and method
CN105205483A (en) * 2014-06-13 2015-12-30 奇景光电股份有限公司 Fingerprint sensing device
TW201608442A (en) * 2014-08-20 2016-03-01 友達光電股份有限公司 Optoelectronic sensor array, method of fabricating optoelectronic sensor array and display device
KR20160033328A (en) * 2014-09-17 2016-03-28 엘지디스플레이 주식회사 Apparatus for sensing touch/fingerprint
US20160132713A1 (en) * 2014-11-12 2016-05-12 Crucialtec Co., Ltd. Display Apparatus Capable of Image Scanning and Driving Method Thereof
CN104680126A (en) * 2014-11-24 2015-06-03 麦克思智慧资本股份有限公司 Fingerprint identifying device and manufacturing method thereof
CN106033270A (en) * 2015-03-16 2016-10-19 林志忠 Touch device with fingerprint identification
TWM513411U (en) * 2015-06-10 2015-12-01 Tpk Touch Solutions Xiamen Inc Touch device with fingerprint identification function
CN105095872A (en) * 2015-07-29 2015-11-25 京东方科技集团股份有限公司 Substrate and preparation method thereof, fingerprint identification sensor, and fingerprint identification apparatus
CN105373772A (en) * 2015-10-09 2016-03-02 京东方科技集团股份有限公司 Optical fingerprint/palm print identification device, touch control display panel and display device
CN205427875U (en) * 2016-01-25 2016-08-03 茂丞科技股份有限公司 Sensor is discerned to fingerprint

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110147751A (en) * 2019-05-16 2019-08-20 Oppo广东移动通信有限公司 A kind of method and device of fingerprint detection

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Application publication date: 20170808

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