CN105205483B - Fingerprint sensing device - Google Patents
Fingerprint sensing device Download PDFInfo
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- CN105205483B CN105205483B CN201410264167.9A CN201410264167A CN105205483B CN 105205483 B CN105205483 B CN 105205483B CN 201410264167 A CN201410264167 A CN 201410264167A CN 105205483 B CN105205483 B CN 105205483B
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Abstract
The invention discloses a fingerprint sensing device which comprises a substrate, a sensing layer, a control chip and a protective layer. The sensing layer is disposed on the substrate and has a first side and a second side opposite to each other, wherein the first side is connected to the substrate. The control chip is arranged on the second side surface of the sensing layer. The protective layer is arranged on the second side surface of the sensing layer and is positioned between the sensing layer and the control chip.
Description
Technical Field
The present invention relates to a sensing device, and more particularly, to a fingerprint sensing device applied in fingerprint identification technology.
Background
Fingerprint identification technology is to use a fingerprint sensing device to sense the fingerprint of a user to identify the personal identity. Fingerprint sensing devices can be classified according to the applied technology, such as optical fingerprint sensing devices, ultrasonic fingerprint sensing devices, pressure fingerprint sensing devices, or capacitive fingerprint sensing devices. Among them, the capacitive fingerprint sensing device has the advantage of small volume, and is suitable for being applied to personal electronic devices, such as smart phones or tablet computers.
As for the capacitive fingerprint sensing device, the conventional capacitive fingerprint sensing device mainly has two types, the first type is a fingerprint sensing device in which a sensing layer and a control chip are disposed on a Printed Circuit Board (PCB), and the second type is a fingerprint sensing device in which a sensing layer and a control circuit are integrated into a fingerprint sensing chip. The first fingerprint sensing device forms a sensing layer by using a printed circuit board manufacturing process, and the sensing layer is electrically connected with the control chip through the printed circuit board wiring. However, the resolution of the first fingerprint sensing device cannot be effectively improved due to the manufacturing process of the printed circuit board. On the other hand, the second fingerprint sensing device forms the sensing layer in the chip. By the chip manufacturing process, the sensing electrode distance in the sensing layer can be reduced, and the resolution of fingerprint sensing is further improved. However, the second fingerprint sensing device is expensive to manufacture.
Disclosure of Invention
The present invention is directed to a fingerprint sensing device, which has the advantages of high fingerprint recognition resolution, low manufacturing cost, large fingerprint sensing area, etc.
In accordance with the above object of the present invention, a fingerprint sensing device is provided. The fingerprint sensing device comprises a substrate, a sensing layer, a control chip and a protective layer. The sensing layer is disposed on the substrate and has a first side and a second side opposite to each other, wherein the first side is connected to the substrate. The control chip is arranged on the second side surface of the sensing layer. The protective layer is arranged on the second side surface of the sensing layer and is positioned between the sensing layer and the control chip.
According to an embodiment of the present invention, the fingerprint sensing device further includes a plurality of metal traces. The metal wires are arranged on the second side surface of the sensing layer and are used for electrically connecting the control chip to the sensing layer.
According to another embodiment of the present invention, the substrate is a glass substrate.
According to another embodiment of the present invention, the sensing layer is a glass type sensing layer or a film type sensing layer.
According to the above object of the present invention, a fingerprint sensing device is also provided. The fingerprint sensing device comprises a substrate, a sensing layer, a control chip and a protective layer. The substrate has a first side and a second side opposite to each other. The sensing layer is arranged on the first side surface of the substrate. The control chip is arranged on the second side surface of the substrate. The protective layer is arranged on the second side surface of the substrate and is positioned between the substrate and the control chip.
According to an embodiment of the present invention, the fingerprint sensing device further includes a plurality of metal traces. The metal wires cross the substrate in the thickness direction of the substrate, and the metal wires are used for electrically connecting the control chip to the sensing layer.
According to another embodiment of the present invention, the substrate is a glass substrate.
According to another embodiment of the present invention, the first side surface of the substrate has a contact surface and a non-contact surface. Wherein, the contact surface is used for the direct contact of the finger, and the control chip is arranged on the non-contact surface.
According to another embodiment of the present invention, the fingerprint sensing device further comprises a shielding layer. The shielding layer is arranged on the control chip and covers the control chip.
According to another embodiment of the present invention, the sensing layer is a glass-type sensing layer or a thin film-type sensing layer.
Drawings
FIG. 1A is a top view of a fingerprint sensing device according to an embodiment of the present invention;
FIG. 1B is a side view of the fingerprint sensing device of FIG. 1A;
fig. 2 is a side view of a fingerprint sensing device according to another embodiment of the present invention.
Description of the symbols
100. 200: fingerprint sensing device
110. 210: substrate
120. 220, and (2) a step of: sensing layer
120A, 210A: first side surface
120B, 210B: second side surface
130. 230: control chip
140. 240: metal routing
150. 250: protective layer
212: contact surface
214: non-contact surface
Detailed Description
Embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative and do not limit the scope of the invention.
Referring to fig. 1A, a top view of a fingerprint sensing device 100 according to an embodiment of the invention is shown. The fingerprint sensing device 100 is used to obtain a fingerprint signal of a user, and can be applied to electronic devices or systems such as a notebook computer, a tablet computer, a smart phone, a digital camera, an access control system, or an anti-theft system for a vehicle, but not limited thereto.
In fig. 1A, the fingerprint sensing device 100 includes a substrate 110, a sensing layer 120, a control chip 130 and a metal trace 140. The substrate 110 is used for a user to directly contact with. In the present invention, the substrate 110 may be a glass substrate, a resin substrate, or the like. The sensing layer 120 is disposed on the substrate 110 and has a first side 120A and a second side 120B opposite to each other, wherein the first side 120A is connected to the substrate 110. The sensing layer 120 is used for sensing fingerprint lines of a user, and the sensing layer 120 performs a corresponding sensing method according to the structure type. For example, if the sensing layer 120 is a capacitive sensing layer, the sensing layer 120 may have a plurality of electrode structures arranged in a matrix, the electrode structures respectively act on ridges (ridges) and grooves (valleys) of a finger to gather different charge amounts, the different charge amounts generate sensing signals, and then the sensing signals are processed by a back-end processing circuit to obtain fingerprint image signals. The sensing layer 120 serving as a capacitive sensing layer can be a glass type sensing layer or a film type sensing layer, and related embodiments thereof are well known to those skilled in the art and therefore will not be described in detail herein. In the present invention, the sensing layer 120 may be a pressure-type sensing layer or a thermal-type sensing layer, for example.
The control chip 130 is disposed on the second side 120B of the sensing layer 120 and electrically connected to the sensing layer 120 through a metal trace 140 also disposed on the second side 120B of the sensing layer 120. The control chip 130 may have a plurality of pins (pins) for connecting the metal traces 140 to receive the sensing signals of the sensing layer 120, and a control circuit inside the control chip 130 may process the sensing signals to obtain the fingerprint image signals.
In addition, referring to fig. 1B, a protection layer 150 is further disposed on the second side 120B of the sensing layer 120. As shown in fig. 2, the protection layer 150 is disposed between the sensing layer 120 and the control chip 130, and is used to prevent the control chip 130 from being damaged due to the direct contact of the control chip 130 with the sensing layer 120. The passivation layer 150 may include, for example, a non-conductive polymer (NCP) or other insulating material with adhesive property. In some embodiments, the protection layer 150 may include an Anisotropic Conductive Film (ACF) for electrically connecting the pins of the control chip 130 to the metal traces 140 and electrically insulating the body of the control chip 130 from the sensing layer 120.
It should be noted that in fig. 1A, the control chip 130 is disposed at the center of the fingerprint sensing device 100. In practical applications, the control chip 130 may not be limited to being located at the center of the fingerprint sensing device 100. For example, the control chip 130 may be disposed at a side or a corner of the fingerprint sensing device 100 according to the layout of the metal traces 140 and the electrodes in the sensing layer 120.
The fingerprint sensing device has the advantages of high fingerprint identification resolution, low manufacturing cost, large fingerprint sensing area and the like. In other words, compared to the conventional Chip On Film (COF) or Chip On Board (COB) fingerprint sensing device, the fingerprint sensing device of the present invention has the sensing layer and the control chip overlapped in the thickness direction of the substrate, so that the planar space on the substrate can be utilized more effectively, and the sensing layer is disposed on the glass substrate by a proper manufacturing process, thereby improving the resolution of fingerprint sensing. On the other hand, compared with the existing fingerprint sensing chip, the fingerprint sensing device of the invention can reduce the manufacturing cost and increase the fingerprint sensing area.
Referring to fig. 2, a side view of a fingerprint sensing device 200 according to another embodiment of the present invention is shown. In fig. 2, the fingerprint sensing device 200 includes a substrate 210, a sensing layer 220, a control chip 230, a metal trace 240 and a protection layer 250. The substrate 210 may be a glass substrate, a resin substrate, or other similar substrates. The substrate 210 has a first side 210A and a second side 210B opposite to each other, wherein the first side 210A of the substrate 210 is provided with a sensing layer 220, the sensing layer 220 is used for sensing fingerprint lines of a user, and a corresponding sensing method is performed according to the structure type of the sensing layer 220. The sensing layer 220 may have the same structure type as the sensing layer 120, so the description of the sensing layer 220 refers to the description of the sensing layer 120 in the previous paragraphs, and is not repeated herein.
The control chip 230 is disposed on the second side 210B of the substrate 210, and is electrically connected to the sensing layer 220 through a metal trace 240 crossing the substrate 210 in a thickness direction of the substrate 210. In the present embodiment, the second side 210B of the substrate 210 can be divided into a contact surface 212 and a non-contact surface 214, wherein the contact surface 212 is directly contacted by a finger of a user, and the non-contact surface 214 is provided for the control chip 230 to be disposed thereon. The non-contact surface 214 is preferably located on a side of the fingerprint sensing device 200, such that the second side 210B of the substrate 210 has a larger contact surface 212 for a user's finger to directly contact. The control chip 230 may have a plurality of pins for connecting the metal traces 240 to receive the sensing signal of the sensing layer 220, and the control circuit inside the control chip 230 may process the sensing signal to obtain the fingerprint image signal.
The protection layer 250 is disposed between the substrate 210 and the control chip 230, and is used to prevent the control chip 230 from being damaged due to the direct contact between the control chip 230 and the substrate 210. The passivation layer 250 may comprise, for example, a non-conductive adhesive or other adhesive insulating material. In some embodiments, the protection layer 250 may include an anisotropic conductive adhesive for electrically connecting the pins of the control chip 230 to the metal traces 240 and electrically insulating the body of the control chip 230 from the substrate 210.
In addition, in some embodiments, a shielding layer (not shown) may be disposed on the control chip 230 of the fingerprint sensing device 200 and/or at a side of the control chip 230 for covering the control chip 230, so as to prevent the user's finger from directly contacting the control chip 230.
In summary, in the fingerprint sensing device of the present invention, the sensing layer and the control chip are disposed in an overlapping manner in the thickness direction of the substrate, and the sensing layer is disposed on the glass substrate or the sensing layer through a suitable manufacturing process. The fingerprint sensing device completed according to the embodiment of the invention has the advantages of high fingerprint identification resolution, low manufacturing cost, large fingerprint sensing area and the like.
While the invention has been described in conjunction with the above embodiments, it is not intended to limit the invention, and various modifications and alterations may be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (7)
1. A fingerprint sensing device, comprising:
a substrate;
the sensing layer is arranged on the whole substrate and provided with a first side surface and a second side surface which are opposite to each other, wherein the first side surface of the sensing layer is connected with the substrate;
the control chip is arranged on the second side surface of the sensing layer;
the protective layer is arranged on the second side surface of the sensing layer and is positioned between the sensing layer and the control chip; and the plurality of metal wires are arranged on the second side surface of the sensing layer and are used for electrically connecting the control chip to the sensing layer.
2. The fingerprint sensing device according to claim 1, wherein said substrate is a glass substrate.
3. The fingerprint sensing device according to claim 1, wherein the sensing layer is a glass type sensing layer or a film type sensing layer.
4. A fingerprint sensing device, comprising:
a substrate having a first side and a second side opposite to each other;
the sensing layer is arranged on the first side surface of the whole substrate;
the control chip is arranged on the second side surface of the substrate;
the protective layer is arranged on the second side surface of the substrate and is positioned between the substrate and the control chip; and
a plurality of metal wires crossing the substrate in the thickness direction of the substrate, and the plurality of metal wires are used for electrically connecting the control chip to the sensing layer,
the second side of the substrate has a contact surface and a non-contact surface, the contact surface is used for direct contact of a finger, the control chip is arranged on the non-contact surface, and the non-contact surface is located on the side edge of the fingerprint sensing device.
5. The fingerprint sensing device according to claim 4, wherein said substrate is a glass substrate.
6. The fingerprint sensing device according to claim 4, further comprising a shielding layer disposed on said control chip, said shielding layer covering said control chip.
7. The fingerprint sensing device according to claim 4, wherein the sensing layer is a glass type sensing layer or a film type sensing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410264167.9A CN105205483B (en) | 2014-06-13 | 2014-06-13 | Fingerprint sensing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410264167.9A CN105205483B (en) | 2014-06-13 | 2014-06-13 | Fingerprint sensing device |
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| Publication Number | Publication Date |
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| CN105205483A CN105205483A (en) | 2015-12-30 |
| CN105205483B true CN105205483B (en) | 2020-09-01 |
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| CN201410264167.9A Active CN105205483B (en) | 2014-06-13 | 2014-06-13 | Fingerprint sensing device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107766779A (en) * | 2016-08-19 | 2018-03-06 | 上海箩箕技术有限公司 | Electronic equipment |
| CN107025427A (en) * | 2016-11-10 | 2017-08-08 | 关键禾芯科技股份有限公司 | Identification of fingerprint module |
| CN108090398A (en) * | 2016-11-22 | 2018-05-29 | 致伸科技股份有限公司 | Identification of fingerprint module |
| WO2021114526A1 (en) | 2019-12-13 | 2021-06-17 | 海信视像科技股份有限公司 | Display device |
Citations (2)
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| CN1629876A (en) * | 2003-12-19 | 2005-06-22 | 升达科技股份有限公司 | Separated touch control board module and electronic product having the same |
| CN203102316U (en) * | 2012-10-12 | 2013-07-31 | 周正三 | Biosensor module, biosensor assembly, and electronic device using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8149001B2 (en) * | 2008-08-15 | 2012-04-03 | Standard Microsystems Corporation | Low cost fingerprint sensor system |
| US8605960B2 (en) * | 2009-03-02 | 2013-12-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fingerprint sensing device |
| TW201342442A (en) * | 2012-04-10 | 2013-10-16 | Himax Tech Ltd | Touch panel |
| TW201416991A (en) * | 2012-10-16 | 2014-05-01 | Wei-Ting Lin | Capacitive fingerprint sensor and method of manufacturing the same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1629876A (en) * | 2003-12-19 | 2005-06-22 | 升达科技股份有限公司 | Separated touch control board module and electronic product having the same |
| CN203102316U (en) * | 2012-10-12 | 2013-07-31 | 周正三 | Biosensor module, biosensor assembly, and electronic device using the same |
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