CN201881604U - Fingerprint sensor and film for same - Google Patents
Fingerprint sensor and film for same Download PDFInfo
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- CN201881604U CN201881604U CN2010206000337U CN201020600033U CN201881604U CN 201881604 U CN201881604 U CN 201881604U CN 2010206000337 U CN2010206000337 U CN 2010206000337U CN 201020600033 U CN201020600033 U CN 201020600033U CN 201881604 U CN201881604 U CN 201881604U
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- fingerprint sensor
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- fingerprint
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Abstract
Disclosed are a fingerprint sensor and a film for the same. The thin film comprises a PET (polyester) film and a metal film positioned under the PED film. The fingerprint sensor comprising the film includes an element layer, the element layer consists of a plurality of sensor elements for detecting fingerprint information, and the metal film is covered on the sensor elements. The film for the fingerprint sensor is lower in cost, and the fingerprint sensor comprising the film is lower in cost and higher in resolution ratio, and also reduces ageing.
Description
Technical field
The present invention relates to the semiconductor transducer technical field, relate in particular to a kind of fingerprint sensor, be used for the film of fingerprint sensor.
Background technology
Along with the development of fingerprint identification technology, fingerprint recognition system is used in daily life more and more, and for example fingerprint identification entrance guard system has the notebook computer of fingerprint recognition system etc.
Fingerprint recognition system comprises fingerprint sensor and drive circuit unit, wherein: fingerprint sensor is used to survey fingerprint active user fingerprint pattern, and described active user's fingerprint pattern is converted to the finger print information of the signal of telecommunication, drive circuit unit, be used to drive described fingerprint sensor, and handle the finger print information that fingerprint sensor detects.
According to the difference of test philosophy, fingerprint sensor comprises pressure type fingerprint sensor, capacitance type fingerprint sensor, photo-electric fingerprint sensor etc.With reference to figure 1, show the schematic diagram of pressure type fingerprint sensor one embodiment.Described pressure type fingerprint sensor comprises element layer and is positioned at film 102 on the element layer; wherein element layer comprises substrate; and be positioned at a plurality of sensor elements 101 on the substrate; described a plurality of sensor element 101 is matrix form and arranges on substrate; described film 102 is used to protect described sensor element 101 on the one hand, also is used to connect sensor element 101 and ground end on the other hand.
When carrying out fingerprint recognition, finger presses is to film 102, the projection of finger print and the characteristic of depression by film transfer to sensor element 101, film 102 can be used for connecting sensor element 101 and ground end simultaneously, the projection of described fingerprint be recessed in sensor element 101 on produce different pressure, described sensor element 101 is converted into the signal of telecommunication corresponding with pressure with different pressures, and described drive circuit unit is follow-up to obtain finger print information by the described signal of telecommunication.
This shows that film 102 plays many-sided effect in the fingerprint recognition process, particularly, described film 102 is used to protect sensor element 101, and therefore described film 102 need have wear-resistant, anti-scratch characteristic; Described film 102 needs the projection and the depression of finger print are transferred on the sensor element 101, and therefore the thickness of described film is less; Meanwhile, described film 102 also needs to connect described sensor element 101 and ground end, and therefore described film 102 can conduct electricity.
The gold thin film of available technology adopting individual layer is as film 102, and cost is higher.
Summary of the invention
The problem that the present invention solves provides a kind of film that is used for fingerprint sensor, reduces cost.
For addressing the above problem, a kind of film that is used for fingerprint sensor of the present invention, described film comprise the PET film and are positioned at metallic film under the described PET film.
Preferably, the thickness of described film is less than or equal to 12 microns.
Preferably, the thickness of described metallic film is 10～90 nanometers.
Preferably, the case hardness of described PET film is 1H～4H.
Preferably, the resistance value of described metallic film is less than or equal to 1 ohm.
Correspondingly, the present invention also provides a kind of above-mentioned arbitrary fingerprint sensor that is used for the film of fingerprint sensor that comprises, described sensor comprises element layer, and described element layer comprises a plurality of sensor elements that are used to survey finger print information, and described metallic film is covered on described a plurality of sensor element.
Preferably, described fingerprint sensor comprises the fingerprint sensor of line style or face type.
Compared with prior art, the present invention has the following advantages:
1. the resistance value of described metallic film is less than or equal to 1 ohm, can effectively connect the sensor element and the ground end that are positioned at the metallic film below; Described film thickness is little simultaneously, the pattern of fingerprint can be transferred to the sensor element that is positioned at the film below, and therefore the resolution ratio of described fingerprint sensor is higher;
2. described insulation film can reach the case hardness of 1H～4H, can protect sensor element to be without prejudice, and prevents the problem that sensor element lost efficacy under repeatedly touching, thereby has improved the problem of aging of fingerprint sensor;
3. as metallic film, material cost is lower as insulation film, employing copper or titanium for described film employing PET, in addition, forms the comparatively simple and realization easily of processing step of described film, and the manufacturing cost of described fingerprint sensor is lower.
Description of drawings
Fig. 1 is the schematic diagram of prior art pressure type fingerprint sensor one embodiment;
Fig. 2 is the schematic diagram that the present invention is used for film one embodiment of fingerprint sensor;
Fig. 3 is the schematic diagram of fingerprint sensor one embodiment of the present invention;
Fig. 4 is the schematic diagram of fingerprint sensor one embodiment of the present invention;
Fig. 5 is the schematic diagram of another embodiment of fingerprint sensor of the present invention.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Set forth detail in the following description so that fully understand the present invention.But the present invention can be different from alternate manner described here and implements with multiple, and those skilled in the art can do similar popularization under the situation of intension of the present invention.Therefore the present invention is not subjected to the restriction of the following public specific embodiment.
Shortcoming at described in the background technology the invention provides a kind of film that is used for fingerprint sensor, with reference to figure 2, shows the schematic diagram that the present invention is used for film one embodiment of fingerprint sensor.Described film comprises insulation film 202 and is positioned at the conductive film 201 of insulation film 202 belows.
Described insulation film 202 is PETG (Polyethylene Terephthalate, PET) film; When carrying out the scratch test, the pencil of hardness 1H～4H all can't make the surface of PET film produce visual scoring trace.
Described conductive film 201 is a metallic film, and particularly, described metallic film is copper or titanium, and described metallic film can be formed on the PET film by the mode of sputter, plating or coating; The thickness of described metallic film is 10nm～90nm; The resistance value of described metallic film is less than or equal to 1 ohm, and described metallic film has electric conductivity preferably, can connect sensor element and ground end.
The described film thickness that comprises insulation film 202 and conductive film 201 is for being less than or equal to 12 microns, and therefore described film thickness is little, and during the finger touches film, film can reflect projection and the pattern that caves on the finger print.
The film that is used for fingerprint sensor provided by the invention, adopt double-decker, described double-deck film comprises PET film and copper (or titanium) film, and material cost is lower, and manufacturing process is comparatively simple, realization easily, thereby has reduced the described cost that is used for the film of fingerprint sensor.
Correspondingly, the present invention also provides a kind of fingerprint sensor that comprises described film, with reference to figure 3, shows the schematic diagram of fingerprint sensor one embodiment of the present invention.Described fingerprint sensor comprises: element layer, be positioned at the film on the element layer, wherein,
Element layer comprises substrate 301 and is positioned at a plurality of sensor elements 304 on the substrate 301, describedly states a plurality of sensor elements 304 and is matrix form arranges on substrate 301;
Described film comprises conductive film 302 and insulation film 303, and wherein conductive film 302 is covered on a plurality of sensor elements 304, and described insulation film 303 is positioned on the conductive film 302, wherein
Described conductive film 302 is a metallic film, and particularly, described metallic film is copper or titanium, and described metallic film can be formed at by the mode of sputter, plating or coating on the insulation film 303; The thickness of described metallic film is 10nm～90nm; The resistance value of described metallic film is less than or equal to 1 ohm, can effectively connect the sensor element 304 and the ground end that are positioned at the metallic film below in the process of carrying out fingerprint recognition.
Described insulation film 303 is the PET film; When carrying out the scratch test; hardness is that the pencil of 1H～4H all can't make the surface of PET film produce visual scoring trace; therefore described insulation film 303 can prevent the destruction of extraneous hard objects to the sensor element 304 that is positioned at its below, plays the effect of protection sensor element 304.
In addition, the gross thickness of conductive film 302 and insulation film 303 is less than or equal to 12 microns, and described film thickness is little, during the finger touches film, film can go out projection and the pattern that caves on the finger print by accurate response, and the pattern of fingerprint is transferred to the sensor element 304 that is positioned at the film below.
In the fingerprint sensor that comprises described film provided by the invention, described film is a double-decker, particularly, described film comprises metallic film and insulation film, the resistance value of wherein said metallic film is less than or equal to 1 ohm, can effectively connect the sensor element and the ground end that are positioned at the metallic film below; Described film thickness is little simultaneously, the pattern of fingerprint can be transferred to the sensor element that is positioned at the film below, and therefore the resolution ratio of described fingerprint sensor is higher;
In addition, described insulation film can reach the case hardness of 1H～4H, can protect sensor element to be without prejudice, and prevents the problem that sensor element lost efficacy under repeatedly touching, thereby has improved the problem of aging of fingerprint sensor;
In the fingerprint sensor of the present invention, as metallic film, material cost is lower, in addition as insulation film, employing copper or titanium for described film employing PET, form the comparatively simple and realization easily of processing step of described film, the manufacturing cost of described fingerprint sensor is lower.
Need to prove; the present invention is with copper or the titanium embodiment as metallic film; but the present invention is not restricted to this; metallic film of the present invention can also adopt gold or platinum; these materials also can make film play the protection sensor element, effectively connect the effect of sensor element and ground end; but the cost of these materials is slightly high, and those skilled in the art can carry out the replacement of respective material according to the foregoing description.
Also need to prove, the technical program does not limit the size and the shape of fingerprint sensor yet, described fingerprint sensor can be the fingerprint sensor of face type, as shown in Figure 4, the fingerprint sensor that is used on the e-book 401 is a face type fingerprint sensor 402, and the area of described type fingerprint sensor 402 is greater than the area of fingerprint; Described fingerprint sensor can also be the line style fingerprint sensor, and as shown in Figure 5, the fingerprint sensor that is used on the e-book 501 is a line style fingerprint sensor 502, and the width of described line style fingerprint sensor 502 is less, can ignore for length.The user carries out finger scan to finish fingerprint recognition on described fingerprint with linear sensor 502, the area that described line style fingerprint sensor 502 accounts for e-book is smaller.
Need to prove that also film of the present invention can also be used for being similar to other devices of fingerprint sensor, those skilled in the art can be out of shape according to the foregoing description, substitutions and modifications.
To sum up, the invention provides a kind of film that is used for fingerprint sensor, the cost of the film of described fingerprint sensor is lower;
The present invention also provides a kind of fingerprint sensor that comprises described film, and described fingerprint sensor cost is lower, resolution ratio is higher, and has improved problem of aging.
Should be appreciated that example herein and embodiment only are exemplary, those skilled in the art can make various modifications and corrigendum under the situation of the spirit and scope of the present invention that do not deviate from the application and claims and limited.
Claims (7)
1. a film that is used for fingerprint sensor is characterized in that, described film comprises the PET film and is positioned at metallic film under the described PET film.
2. the film that is used for fingerprint sensor as claimed in claim 1 is characterized in that, the thickness of described film is less than or equal to 12 microns.
3. the film that is used for fingerprint sensor as claimed in claim 1 is characterized in that, the thickness of described metallic film is 10～90 nanometers.
4. the film that is used for fingerprint sensor as claimed in claim 1 is characterized in that, the case hardness of described PET film is 1H～4H.
5. the film that is used for fingerprint sensor as claimed in claim 1 is characterized in that, the resistance value of described metallic film is less than or equal to 1 ohm.
6. fingerprint sensor that comprises the described film of 1 to 5 arbitrary claim, described sensor comprises element layer, and described element layer comprises a plurality of sensor elements that are used to survey finger print information, and described metallic film is covered on described a plurality of sensor element.
7. fingerprint sensor as claimed in claim 6, described fingerprint sensor comprises the fingerprint sensor of line style or face type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206000337U CN201881604U (en) | 2010-11-09 | 2010-11-09 | Fingerprint sensor and film for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206000337U CN201881604U (en) | 2010-11-09 | 2010-11-09 | Fingerprint sensor and film for same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201881604U true CN201881604U (en) | 2011-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206000337U Expired - Fee Related CN201881604U (en) | 2010-11-09 | 2010-11-09 | Fingerprint sensor and film for same |
Country Status (1)
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| CN (1) | CN201881604U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102467991A (en) * | 2010-11-09 | 2012-05-23 | 金鹏科技有限公司 | Fingerprint sensor, film used for fingerprint sensor and manufacture method thereof |
| CN104123564A (en) * | 2014-07-23 | 2014-10-29 | 上海思立微电子科技有限公司 | Fingerprint identification device and assembly with coated film protective layer |
| CN104182746A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN104867883A (en) * | 2014-02-24 | 2015-08-26 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module and manufacturing method thereof |
| CN103927525B (en) * | 2014-04-30 | 2017-03-01 | 东莞晶汇半导体有限公司 | Corium RF-type Fingerprint Identification Unit metal shell sputter method for packing |
| WO2019119661A1 (en) * | 2017-12-22 | 2019-06-27 | 深圳光启超材料技术有限公司 | Measurement film, manufacturing method of measurement film, and method for measuring strain field of plane |
-
2010
- 2010-11-09 CN CN2010206000337U patent/CN201881604U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102467991A (en) * | 2010-11-09 | 2012-05-23 | 金鹏科技有限公司 | Fingerprint sensor, film used for fingerprint sensor and manufacture method thereof |
| CN104867883A (en) * | 2014-02-24 | 2015-08-26 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module and manufacturing method thereof |
| CN103927525B (en) * | 2014-04-30 | 2017-03-01 | 东莞晶汇半导体有限公司 | Corium RF-type Fingerprint Identification Unit metal shell sputter method for packing |
| CN104123564A (en) * | 2014-07-23 | 2014-10-29 | 上海思立微电子科技有限公司 | Fingerprint identification device and assembly with coated film protective layer |
| CN104182746A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN104182746B (en) * | 2014-08-26 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition mould group and its manufacturing method |
| WO2019119661A1 (en) * | 2017-12-22 | 2019-06-27 | 深圳光启超材料技术有限公司 | Measurement film, manufacturing method of measurement film, and method for measuring strain field of plane |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20171109 |