CN104123564A - Fingerprint identification device and assembly with coated film protective layer - Google Patents
Fingerprint identification device and assembly with coated film protective layer Download PDFInfo
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- CN104123564A CN104123564A CN201410353941.3A CN201410353941A CN104123564A CN 104123564 A CN104123564 A CN 104123564A CN 201410353941 A CN201410353941 A CN 201410353941A CN 104123564 A CN104123564 A CN 104123564A
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Abstract
The invention relates to the technical field of integrated circuit manufacturing and mobile phones and discloses a fingerprint identification device and assembly with a coated film protective layer. According to the fingerprint identification device and assembly with the coated film protective layer, the relatively thin protective layer can be formed on the surface of a fingerprint identification chip by means of a film coating method to become part of the fingerprint identification device, subsequent forming of lenses for protection is no longer needed, process procedures are reduced, due the fact that the protective layer is relatively thin by means of film coating, attenuation of fingerprint signals passing through the protective layer can be reduced, sensitivity of the finger print identification chip can be enhanced and fingerprint identification efficiency can be improved.
Description
Technical field
The present invention relates to integrated circuit manufacture and encapsulation technology field, particularly a kind of fingerprint recognition device with plated film protective seam and fingerprint recognition assembly.
Background technology
Along with the development of mobile communication technology, smart mobile phone has been gathered the function of every field.For example, can send and receive e-mail by smart mobile phone, displaying video and audio file, record meeting summary or even open video conference etc.In addition, in mobile phone individual used, conventionally can preserve a large amount of data.If lost mobile phone or stolenly probably cause larger loss.Existing mobile phone adopts numerical ciphers or graphical passwords to protect conventionally, and this kind of password preserved trouble and be easily cracked.Therefore, popular use finger-print cipher, as the cryptoguard of mobile phone, has been guaranteed safety and the privacy of mobile phone at present.
Conventionally as shown in Figure 1, described fingerprint identification device comprises the fingerprint identification device of available technology adopting: fingerprint Identification sensor 10, the fingerprint recognition circuit 11 of being located at fingerprint Identification sensor 10 surfaces, lens 20, be located at ink 21 between lens 20 and fingerprint recognition circuit 11 and the basic ring 30 for fixing ink 21, lens 20.Wherein, fingerprint Identification sensor 10 also connects respective element in mobile phone (for accompanying drawing is simplified; not shown in Fig. 1); fingerprint Identification sensor 10 is for transmitting corresponding finger print data; fingerprint recognition circuit 11 is for identifying the finger print that is fitted in lens 20 surfaces; by mode fetching finger mark information such as couplings; and be transferred to fingerprint Identification sensor 10; lens 20 are generally glass or sapphire material; for the protection of fingerprint Identification sensor 10 and fingerprint recognition circuit 11; 21, ink, in order to shelter from fingerprint recognition circuit 11, increases attractive in appearance.
But because the technique of lens 20 is limit, the thickness of lens 20 is conventionally more than 200 μ m, the material of lens 20 is conventionally more crisp, if reduce it to thinner, frangibility, cannot be protected serviceable life.The thickness that lens 20 are thicker also can reduce the efficiency of fingerprint recognition.In addition, lens 20 and ink 21 need to carry out extra technique and can be arranged on the surface of fingerprint Identification sensor 10 and fingerprint recognition circuit 11.
Summary of the invention
The object of the present invention is to provide a kind of fingerprint recognition device with plated film protective seam and fingerprint recognition assembly, use protective seam to substitute lens and ink, when playing protective effect, can also improve fingerprint recognition efficiency, and reduce processing step.
For solving the problems of the technologies described above, embodiments of the present invention provide a kind of fingerprint recognition device with plated film protective seam, comprise fingerprint recognition chip and cover the protective seam of described fingerprint recognition chip surface, and described protective seam adopts plated film mode to form.
Embodiment of the present invention in terms of existing technologies; adopt plated film mode can form thinner protective seam; protective seam is formed at the surface of fingerprint recognition chip; become a part for fingerprint recognition device, form again lens protection without follow-up, reduced processing step; because the protective layer thickness that adopts aforesaid way to form can be thinner; thereby can reduce the decay of fingerprint signal through protective seam, strengthen the sensitivity of fingerprint recognition chip, improve fingerprint recognition efficiency.
Further, in the described fingerprint recognition device with plated film protective seam, described protective seam comprises the rigidity layer that adopts PVD plated film, CVD plated film or sputter coating mode to form.
Further, in the described fingerprint recognition device with plated film protective seam, described rigidity layer can be monocrystalline or polycrystal alumina (Al
2o
3) coating, or be silicon dioxide coating, silicon nitride coating or silit coating.
Further, in the described fingerprint recognition device with plated film protective seam, described protective seam also comprises the color layers that adopts spraying plated film mode to form, and described color layers is between described rigidity layer and described fingerprint recognition chip.
Further, in the described fingerprint recognition device with plated film protective seam, described color layers is epoxy resin or ink.
In addition, embodiment of the present invention in terms of existing technologies, fingerprint recognition chip surface forms color layers by different materials, can be for blocking fingerprint recognition chip, avoid fingerprint recognition chip to be directly exposed in sight line, can, by changing the color of color layers, make the more needs of Alternative of its adaptation simultaneously, further improve the aesthetic feeling with fingerprint recognition device.
Further; in the described fingerprint recognition device with plated film protective seam; described protective seam is the combination of combination, epoxy resin and nano titanium carbide or the combination of epoxy resin and nanometer silicon carbide of epoxy resin and nano aluminium oxide, and described protective seam adopts spraying plated film mode to form.
Further, in the described fingerprint recognition device with plated film protective seam, described nano aluminium oxide, nanometer silicon carbide or the nano titanium carbide concentration in epoxy resin is greater than 20%.
In addition; embodiment of the present invention in terms of existing technologies; can be by regulating the component content of nano aluminium oxide or nano titanium carbide or nanometer silicon carbide to carry out the hardness of corresponding raising protective seam; hardness difference; user's experience sense difference; also corresponding different to the protection intensity of fingerprint recognition chip, therefore can make the protective seam that meets different hardness demand.
Further, in the described fingerprint recognition device with plated film protective seam, the thickness of described protective seam is less than 100 μ m.
In addition, in terms of existing technologies, the thickness of protective seam can accomplish to be less than 100 μ m to embodiment of the present invention; protective seam is under the prerequisite of not sacrificing hardness and shield; there is thinner thickness, increase the sensitivity of fingerprint recognition, improve user's experience sense.
Further, in the described fingerprint recognition device with plated film protective seam, the Mohs value of described protective seam is more than or equal to 6H.
Further, the surface of fingerprint recognition chip is provided with pad, and described pad is connected with fingerprint recognition circuit.
Further, can, after plated film forms protective seam, remove the protective seam on pad by etching, adopt routing technique that pad is connected to external circuit from etching window; Or before plated film forms protective seam, first adopt routing technique that pad is connected to external circuit; To ensure the realizability of embodiment of the present invention.
The present invention also proposes a kind of fingerprint recognition assembly; be applied to the fingerprint identification function of mobile phone; described assembly comprises flexible PCB, fixed mount and the fingerprint recognition device with plated film protective seam as described above; wherein; the described fingerprint recognition device with plated film protective seam is fixed on described flexible PCB; described fixed mount is fixed on the edge of the described fingerprint recognition device with plated film protective seam, and exposes the protective seam of the described fingerprint recognition device with plated film protective seam.
Embodiment of the present invention in terms of existing technologies; fingerprint recognition assembly adopts the fingerprint recognition device with plated film protective seam as described above to make; can reach the object of saving lens production process; can also play the effect of protection fingerprint recognition chip, the sensitivity that improves fingerprint recognition simultaneously.
Further; in described fingerprint recognition assembly; also comprise quoit, described quoit is located at the periphery of the described fingerprint recognition device with plated film protective seam, and described fixed mount is fixed on the edge of the described fingerprint recognition device with plated film protective seam by described quoit.
Or in described fingerprint recognition assembly, described fixed mount is quoit, described quoit is located at the edge of the described fingerprint recognition device with plated film protective seam.Can play on the one hand the effect of electrostatic prevention at the fingerprint recognition device surrounding increase quoit with plated film protective seam, can also improve on the other hand the stability maintenance with the fingerprint recognition device of plated film protective seam, can also play and increase effect attractive in appearance.
Further, in described fingerprint recognition assembly, also comprise steel disc, described flexible PCB is fixed on described steel disc.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of fingerprint identification device in prior art;
Fig. 2 is according to the fingerprint recognition device diagrammatic cross-section with plated film protective seam in first embodiment of the invention;
Fig. 3 is the vertical view according to the fingerprint recognition device with plated film protective seam is connected by routing with mainboard in first embodiment of the invention;
Fig. 4 is according to the fingerprint recognition device diagrammatic cross-section with plated film protective seam in second embodiment of the invention;
Fig. 5 is according to the fingerprint recognition device diagrammatic cross-section with plated film protective seam in third embodiment of the invention;
Fig. 6 is according to the diagrammatic cross-section of fingerprint recognizer component in four embodiment of the invention;
Fig. 7 splits schematic diagram according to the structure of fingerprint recognizer component in four embodiment of the invention.
Embodiment
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the embodiments of the present invention are explained in detail.But, persons of ordinary skill in the art may appreciate that in the each embodiment of the present invention, in order to make reader understand the application better, many ins and outs are proposed.But, even without these ins and outs and the many variations based on following embodiment and amendment, also can realize the each claim of the application technical scheme required for protection.
Please refer to Fig. 2; the first embodiment of the present invention relates to a kind of fingerprint recognition device 1 with plated film protective seam; comprise fingerprint recognition chip and cover the protective seam 200 of fingerprint recognition chip surface; wherein; fingerprint recognition chip comprises fingerprint Identification sensor 100 and is located at the fingerprint recognition circuit 110 on fingerprint Identification sensor 100 surfaces; concrete, protective seam 200 adopts plated film mode to be formed on the surface of fingerprint recognition circuit 110.
In the present embodiment, the rigidity layer of protective seam 200 for adopting PVD (physical vapour deposition (PVD)) plated film, CVD (chemical vapor deposition) plated film or sputter coating mode to form, rigidity layer can be the aluminium oxide (Al of monocrystalline or polycrystalline
2o
3) coating, can also be silicon dioxide coating, silicon nitride coating or silit coating etc.The thickness of the protective seam 200 forming is less than 100 μ m, and its Mohs value is more than or equal to 6H conventionally, ensures that it has enough hardness protection fingerprint recognition circuit 110 and fingerprint recognition chip 100.Typically, adopt PVD plated film to form alumina layer, can approach monocrystalline, Mohs value reaches 9H.In order to ensure that protective seam 200 has certain degree of hardness, it adopts the material that hardness is higher to be made conventionally, makes protective seam 200 in the situation that forming compared with minimal thickness, have enough hardness, plays good protection effect.Aluminium oxide or silit all can be produced hardness at 89 protective seams 200 even, and the protective seam 200 forming belongs to a part for fingerprint recognition device 1, and not frangibility, can be good at playing protective effect.
The mode of PVD plated film, CVD plated film or the sputter coating adopting due to protective seam 200 forms, and therefore can form thinner protective seam 200, and itself and fingerprint recognition circuit 110 and fingerprint Identification sensor 100 have good contact stabilization.In addition; protective seam 200 becomes a part for fingerprint recognition device 1; additionally form again lens protection without follow-up; reduce processing step, in addition, because protective seam 200 thickness that adopt the mode of PVD plated film, CVD plated film or sputter coating to form can be thinner; for example 10 μ m; thereby can reduce the decay of fingerprint signal through protective seam 200, strengthen the sensitivity of fingerprint recognition chip, improve fingerprint recognition efficiency.
In addition, what deserves to be explained is, while carrying out plated film, the temperature of fingerprint recognition chip position is less than or equal to 400 degree; such as; while adopting PVD plated film mode to form protective seam 200, temperature can be controlled at 100 more and spend, to ensure that fingerprint recognition chip can Yin Gaowen and lost efficacy.
In the present embodiment, the surface of fingerprint recognition chip is provided with pad, and pad is connected with fingerprint recognition circuit, for follow-up formation line, fingerprint recognition circuit and external circuit is coupled together.Form before protective seam 200 at plated film, can adopt routing (wire-bonding) technique that pad (PAD) is connected to external circuit, in the time forming protective seam 200, can the whole chip of general protection; Also can be after plated film forms protective seam 200; remove the protective seam 200 on pad (PAD) by etching; the etching window obtaining for expose can routing PAD position; adopt routing (wire-bonding) technique that PAD is connected to external circuit (as mainboard etc.) from etching window; as shown in Figure 3; etching window 301 exposes pad 302 on fingerprint recognition chip, by routing technique, pad 302 and the mainboard pad 303 on mainboard is linked together.It should be noted that, the material of protective seam 200 has determined that present embodiment can carry out etching and obtain the etching window of exposed pad 302, and the organic material of available technology adopting is not easy etching.
In the present embodiment; fingerprint recognition chip 1 comprises fingerprint Identification sensor 100 and is located at the fingerprint recognition circuit 110 on fingerprint Identification sensor 100 surfaces; fingerprint recognition circuit 110 is mainly used in identification and is fitted in the finger print information on protective seam 200 surfaces, and is fed back in fingerprint Identification sensor 100.Fingerprint recognition circuit 110 and fingerprint Identification sensor 100 can be by active electric capacity coupling, electromagnetic mode coupling, optics sensing, infrared sensing or other mode fetching finger mark information.
The second embodiment of the present invention relates to a kind of fingerprint recognition device 1 with plated film protective seam; the second embodiment and the first embodiment are roughly the same; key distinction part is: in the first embodiment, be only one deck rigidity layer with the protective seam 200 in the fingerprint recognition device 1 of plated film protective seam.And in second embodiment of the invention, except comprising one deck rigidity layer 210, also comprise one deck color layers 220 with the protective seam 200 in the fingerprint recognition device 1 of plated film protective seam.
Concrete, please refer to Fig. 4, protective seam 200 also comprises the color layers 220 that adopts spraying plated film mode to form, color layers 220 is between rigidity layer 210 and fingerprint recognition circuit 110.Color layers 220 is epoxy resin or ink, can adulterate and form different colors, such as white or black etc.Color layers 220 can be for blocking fingerprint recognition circuit 110; avoid fingerprint recognition circuit 110 to be directly exposed in sight line; can, by changing the color of color layers, make the more needs of Alternative of its adaptation simultaneously, further improve the aesthetic feeling with the fingerprint recognition device 1 of plated film protective seam.
In addition; adopt PVD plated film, CVD plated film or sputter coating mode to form rigidity layer 210 on the surface of color layers 220; rigidity layer 210 can be protected fingerprint recognition circuit 110 on the one hand, can also protect on the other hand color layers 220, makes it not be prone to the phenomenon that wears away look.
In the present embodiment, miscellaneous part and technological parameter etc. are all identical with the first embodiment, and concrete first embodiment that please refer to, does not repeat them here.
The 3rd embodiment of the present invention relates to a kind of fingerprint recognition device 1 with plated film protective seam; the 3rd embodiment and the second embodiment are roughly the same; key distinction part is: in the second embodiment, the protective seam 200 in fingerprint recognition device 1 comprises one deck rigidity layer 210 and one deck color layers 220.And in third embodiment of the invention; protective seam 200 in fingerprint recognition device 1 is only one deck, adopts the combination of combination, epoxy resin and nano titanium carbide of epoxy resin and nano aluminium oxide or the combination spraying method of epoxy resin and nanometer silicon carbide to form.
Concrete, please refer to Fig. 5, protective seam 200 is to form by spraying plated film mode mix nano aluminium oxide, nanometer silicon carbide or nano titanium carbide dilution in epoxy resin after.Epoxy resin can change the color that forms protective seam 200 on the one hand; meet the demand of different process to color; mix on the other hand nano aluminium oxide or nanometer silicon carbide and can improve the hardness that forms protective seam 200; increase its protection intensity; in addition; use epoxy resin to mix nano aluminium oxide or mix nanometer silicon carbide to make the protective seam 200 forming there is more excellent button comfort level, improve user's experience sense.Wherein, nano aluminium oxide, nanometer silicon carbide or the nano titanium carbide concentration ratio scope in epoxy resin is greater than 20%; can be by regulating the component content of nano aluminium oxide or titanium carbide to carry out the hardness of corresponding raising protective seam 200; hardness difference; user's experience sense difference; also corresponding different to the protection intensity of fingerprint recognition circuit 110, therefore can make the protective seam that meets different hardness demand, concrete can decide according to technological requirement.
In the present embodiment, protective seam 200 is to adopt spraying plated film mode to form, and the epoxy resin that mixes nano aluminium oxide or nanometer silicon carbide is added to the surface of the solution spraying of thinning agent after as acetone diluted to fingerprint recognition circuit 110, thereby form protective seam 200.
In the present embodiment, miscellaneous part and technological parameter etc. are all identical with the first embodiment, and concrete first embodiment that please refer to, does not repeat them here.
Please refer to Fig. 6 and Fig. 7; the 4th embodiment of the present invention relates to a kind of fingerprint recognition assembly; be applied to the fingerprint identification function of mobile phone; fingerprint recognition assembly comprises flexible PCB 2, fixed mount 3 and fingerprint recognition device 1; wherein; fingerprint recognition device 1 is fixed on flexible PCB 2; fixed mount 3 is fixed on the edge of fingerprint recognition device 1 surrounding; for fixing fingerprint recognition device 1; and expose the protective seam 200 of fingerprint recognition device 1; be convenient to fingerprint and conform on protective seam 200, carry out fingerprint recognition.
Concrete, as shown in Figure 6, fingerprint recognition assembly also comprises quoit 4, and quoit 4 is located at the periphery with the fingerprint recognition device of plated film protective seam, and fixed mount 3 is fixed on the edge with the fingerprint recognition device of plated film protective seam by quoit 4.Or fixed mount 3 and quoit 4 are same parts, adopt integral formation method to make and obtain; Specifically, the fixed mount 3 in fingerprint recognition assembly is quoit, and quoit is located at the edge with the fingerprint recognition device 1 of plated film protective seam.Can play on the one hand the effect of electrostatic prevention at the fingerprint recognition device 1 surrounding increase quoit with plated film protective seam, can also improve on the other hand the stability maintenance with the fingerprint recognition device 1 of plated film protective seam, can also play and increase effect attractive in appearance.In addition, fingerprint recognition assembly also comprises steel disc 5, and flexible PCB 2 is fixed on steel disc 5.In the time carrying out fingerprint recognition, after finger plaster is bonded on protective seam 200, can carry out fingerprint recognition by fingerprint recognition circuit 110 and fingerprint Identification sensor 100.Fingerprint recognition circuit 110 and fingerprint Identification sensor 100 can be by active electric capacity coupling, electromagnetic mode coupling, optics sensing, infrared sensing or other mode fetching finger mark information.
In fourth embodiment of the invention, adopt and make as any one fingerprint recognition device 1 with plated film protective seam in embodiment mono-, two or three; can reach the object of saving lens production process; can also play the effect of protection fingerprint recognition chip, the sensitivity that improves fingerprint recognition simultaneously.
Because first and second and three embodiments are mutually corresponding with present embodiment, therefore present embodiment can with the enforcement of working in coordination of first and second and three embodiments.The correlation technique details of mentioning in first and second and three embodiments is still effective in the present embodiment, the technique effect that can reach in first and second and three embodiments can be realized in the present embodiment too, in order to reduce repetition, repeat no more here.
Above are only the preferred embodiments of the present invention, the present invention is not played to any restriction.Any person of ordinary skill in the field; not departing from the scope of technical scheme of the present invention; the technical scheme that the present invention is disclosed and technology contents make any type of variations such as replacement or amendment that are equal to; all belong to the content that does not depart from technical scheme of the present invention, within still belonging to protection scope of the present invention.
Claims (17)
1. with a fingerprint recognition device for plated film protective seam, it is characterized in that, comprise fingerprint recognition chip and cover the protective seam of described fingerprint recognition chip surface, described protective seam adopts plated film mode to form.
2. the fingerprint recognition device with plated film protective seam according to claim 1, is characterized in that, described protective seam comprises the rigidity layer that adopts PVD plated film, CVD plated film or sputter coating mode to form.
3. the fingerprint recognition device with plated film protective seam according to claim 2, is characterized in that, described rigidity layer is the aluminium oxide coating of monocrystalline or polycrystalline.
4. the fingerprint recognition device with plated film protective seam according to claim 2, is characterized in that, described rigidity layer is silicon dioxide coating, silicon nitride coating or silit coating.
5. the fingerprint recognition device with plated film protective seam according to claim 2, is characterized in that, described protective seam also comprises the color layers that adopts spraying plated film mode to form, and described color layers is between described rigidity layer and described fingerprint recognition chip.
6. the fingerprint recognition device with plated film protective seam according to claim 5, is characterized in that, described color layers is epoxy resin or ink.
7. the fingerprint recognition device with plated film protective seam according to claim 1; it is characterized in that; described protective seam is the combination of combination, epoxy resin and nano titanium carbide or the combination of epoxy resin and nanometer silicon carbide of epoxy resin and nano aluminium oxide, and described protective seam adopts spraying method to form.
8. the fingerprint recognition device with plated film protective seam according to claim 7, is characterized in that, described nano aluminium oxide, nanometer silicon carbide or the nano titanium carbide concentration in epoxy resin is greater than 20%.
9. the fingerprint recognition device with plated film protective seam according to claim 1, is characterized in that, the thickness of described protective seam is less than 100 μ m.
10. the fingerprint recognition device with plated film protective seam according to claim 1, is characterized in that, the Mohs value of described protective seam is more than or equal to 6H.
The 11. fingerprint recognition devices with plated film protective seam according to claim 1, is characterized in that, the surface of described fingerprint recognition chip is provided with pad, and described pad is connected with fingerprint recognition circuit.
The 12. fingerprint recognition devices with plated film protective seam according to claim 11, is characterized in that, after plated film forms protective seam, remove the protective seam on described pad by etching, adopt routing technique that described pad is connected to external circuit.
The 13. fingerprint recognition devices with plated film protective seam according to claim 11, is characterized in that, before plated film forms protective seam, adopt routing technique that described pad is connected to external circuit.
14. 1 kinds of fingerprint recognition assemblies; be applied to the fingerprint identification function of mobile phone; it is characterized in that; described assembly comprises flexible PCB, fixed mount and the fingerprint recognition device with plated film protective seam as described in any one in claim 1 to 13; wherein; the described fingerprint recognition device with plated film protective seam is fixed on described flexible PCB; described fixed mount is fixed on the edge of the described fingerprint recognition device with plated film protective seam, and exposes the protective seam of the described fingerprint recognition device with plated film protective seam.
15. fingerprint recognition assemblies according to claim 14; it is characterized in that; also comprise quoit; described quoit is located at the periphery of the described fingerprint recognition device with plated film protective seam, and described fixed mount is fixed on the edge of the described fingerprint recognition device with plated film protective seam by described quoit.
16. fingerprint recognition assemblies according to claim 14, is characterized in that, described fixed mount is quoit, and described quoit is located at the edge of the described fingerprint recognition device with plated film protective seam.
17. fingerprint recognition assemblies according to claim 14, is characterized in that, also comprise steel disc, described flexible PCB is fixed on described steel disc.
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| CN201410353941.3A CN104123564A (en) | 2014-07-23 | 2014-07-23 | Fingerprint identification device and assembly with coated film protective layer |
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| CN201410353941.3A CN104123564A (en) | 2014-07-23 | 2014-07-23 | Fingerprint identification device and assembly with coated film protective layer |
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| CN106445266A (en) * | 2016-10-27 | 2017-02-22 | 广东星弛光电科技有限公司 | Fingerprint identification assembly of protective screen of glass window of mobile phone and method for manufacturing fingerprint identification assembly |
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| CN111132466A (en) * | 2019-12-27 | 2020-05-08 | 苏州晶台光电有限公司 | Method for preventing metal ion migration on surface of PCB |
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