CN201910060U - Fingerprint sensor and fingerprint identification system - Google Patents
Fingerprint sensor and fingerprint identification system Download PDFInfo
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- CN201910060U CN201910060U CN2010205050945U CN201020505094U CN201910060U CN 201910060 U CN201910060 U CN 201910060U CN 2010205050945 U CN2010205050945 U CN 2010205050945U CN 201020505094 U CN201020505094 U CN 201020505094U CN 201910060 U CN201910060 U CN 201910060U
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Abstract
The utility model discloses a fingerprint sensor which is used for detecting fingerprint patterns and comprises a flexible substrate. The utility model also discloses a fingerprint identification system comprising the fingerprint sensor and also comprising a driving circuit unit, wherein the driving circuit unit is used for controlling the fingerprint sensor and processing signals detected by the fingerprint sensor, and the driving circuit unit is connected with the fingerprint sensor. The fingerprint sensor comprises the flexible substrate, therefore, on one hand, the failure of the fingerprint sensor can be avoided due to curving; on the other hand, the fingerprint sensor can be arranged on a product with a curved surface, so that the application range of the fingerprint sensor is expanded.
Description
Technical field
The utility model relates to the semiconductor transducer technical field, relates in particular to a kind of fingerprint sensor and fingerprint recognition system.
Background technology
Along with the development of fingerprint identification technology, fingerprint recognition system is used in daily life more and more, and for example fingerprint identification entrance guard system has the notebook computer of fingerprint recognition etc.
Fingerprint recognition system comprises fingerprint sensor and drive circuit unit, wherein: fingerprint sensor is used to survey fingerprint active user fingerprint pattern, and described active user's fingerprint pattern is converted to the finger print information of electric signal, drive circuit unit, be used to drive described fingerprint sensor, and handle the finger print information that fingerprint sensor detects.
A kind of fingerprint recognition system is disclosed in the patent No. is the Chinese patent of ZL99806059.With reference to figure 1, show the synoptic diagram of the fingerprint recognition system of described patent, described fingerprint recognition system comprises fingerprint sensor 100 and drive circuit unit 200, and wherein drive circuit unit 200 adopts flexible printed circuit board, and flexible drive circuit unit is more convenient for assembling.
But existing fingerprint recognition system has some shortcomings: for example, fingerprint sensor causes function impaired because of bending easily, causes inefficacy; Fingerprint sensor can't be positioned on the product with curved surface outward appearance or bending easily, and this is limited the range of application of fingerprint recognition system more greatly, can't satisfy the demand that various types of products use fingerprint recognition systems.
Summary of the invention
The utility model solves provides a kind of fingerprint recognition system, to enlarge the range of application of fingerprint recognition system.
For addressing the above problem, the utility model provides a kind of fingerprint sensor, is used to survey fingerprint pattern, and described fingerprint sensor comprises flexible substrates.
Described substrate is a flexible plastic substrates.
The thickness of described flexible substrates is less than 200 μ m.
Described fingerprint sensor is capacitance type fingerprint sensor or pressure type fingerprint sensor.
Described fingerprint sensor is low temperature polycrystalline silicon type fingerprint sensor or amorphous silicon film transistor type fingerprint sensor.
Described fingerprint sensor is line style or planar fingerprint sensor.
A kind of fingerprint recognition system that comprises the described fingerprint sensor of above-mentioned arbitrary claim also comprises: be used to control described fingerprint sensor and handle the drive circuit unit of the signal that fingerprint sensor detects, be connected in described fingerprint sensor.
Described driving circuit is positioned on the flexible printed circuit board.
Compared with prior art, the utlity model has following advantage: fingerprint sensor has flexible substrates, can avoid crooked and the impaired problem of function that causes, also can be suitable on the various products, has enlarged the usable range of fingerprint recognition system.
Description of drawings
Fig. 1 is the synoptic diagram of prior art fingerprint recognition system;
Fig. 2 is the synoptic diagram of the utility model fingerprint recognition system one embodiment;
Fig. 3 is the synoptic diagram of the utility model fingerprint sensor one embodiment;
Fig. 4 is the synoptic diagram of another embodiment of the utility model fingerprint sensor
Fig. 5 adopts laser to discharge to mould the process flow diagram that basic electronic technology is made the utility model fingerprint sensor.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can more be become apparent, embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
Set forth detail in the following description so that fully understand the utility model.But the utility model can be different from alternate manner described here and implements with multiple, and those skilled in the art can do similar popularization under the situation of the utility model intension.Therefore the utility model is not subjected to the restriction of following public embodiment.
Fingerprint recognition system of the prior art, its fingerprint sensor part adopts hard substrate usually, and the fingerprint sensor with hard substrate can't be applied to have on the product of nonplanar outward appearance, and this is restricted the range of application of fingerprint sensor.
In the fingerprint recognition system of described patent, though its drive circuit unit part can be flexible, its fingerprint sensor part still adopts the dielectric base of hard, for example silicon base of hard, printed circuit board (PCB) or glass.Fingerprint recognition system with rigid insulation substrate, its outward appearance plasticity is relatively poor.
Along with the diversified development of product, some product is crooked easily, also has increasing product to have nonplanar outward appearance, for example curved surface or disc etc.Yet, when the fingerprint sensor of hard substrate is positioned on the flexible product, cause the function of fingerprint sensor impaired because of bending easily, thereby cause inefficacy, in addition, the fingerprint sensor of hard substrate also can't be positioned on the product with curved surface, and this is limited the range of application of fingerprint sensor more greatly.
At the problems referred to above, the utility model provides a fingerprint sensor, and described fingerprint sensor comprises flexible substrates, and the fingerprint sensor with flexible substrates can be crooked, avoid the Problem of Failure that causes because of crooked, can also be positioned on the product with curved surface outward appearance.
The utility model also provides the fingerprint recognition system that comprises fingerprint sensor.With reference to figure 2, show the synoptic diagram of the utility model fingerprint recognition system one embodiment, described fingerprint recognition system comprises: fingerprint sensor 300, be connected in the drive circuit unit 400 of fingerprint sensor 300, wherein:
Fingerprint sensor 300 is used to survey the fingerprint pattern of finger, and described fingerprint pattern is converted to the finger print information of electric signal.Described fingerprint sensor 300 provides man-machine interface in the fingerprint recognition process, so described fingerprint sensor is arranged in the product usually.Described fingerprint sensor 300 comprises substrate 500, and described substrate 500 is used to support and insulate and is positioned at various electron devices or circuit unit in the substrate 500, and described substrate 500 is flexible.
Particularly, the material of described flexible substrates can be a flexiplast, and the thickness of common described flexiplast is less than 200 μ m.Can mould basic electronic technology (EPLaR, Electronics Plastic by Laser Release) by laser lift-off and form fingerprint sensor 300 with flexible substrates 500.
Drive circuit unit 400 is used to drive described fingerprint sensor 300, and handles the finger print information that fingerprint sensor 300 detects.Usually drive circuit unit 400 is sealed in the inside of product, and drive circuit unit 400 generally is not subjected to the restriction of product design, and therefore, described drive circuit unit can be positioned on the hard printed circuit board.Yet for the product with thin type curved surface outward appearance, drive circuit unit 400 also can be subject to product design, so, described drive circuit unit can be arranged on the flexible printed circuit board, to satisfy product demand.
Described have flexible fingerprint sensor and can be positioned in the product of easy bending, also can be positioned on the product with curved surface, satisfying the demand of different product to fingerprint recognition system, thereby enlarged the range of application of fingerprint recognition system.
Below in conjunction with specific embodiment the utility model is described further.
With reference to figure 3, show the synoptic diagram of fingerprint sensor one embodiment.Present embodiment is an example with the capacitance type fingerprint sensor.As shown in Figure 3, wherein, capacitance type fingerprint sensor 301, be used to survey finger print information, fingerprint pattern is converted into electric signal, described capacitance type fingerprint sensor 301 comprises substrate 501, described substrate 501 is the flexible insulation substrate, and the material of described flexible insulation substrate can be flexiplast.Mould basic electronic technology by laser lift-off and form the capacitance type fingerprint sensor 301 described capacitance type fingerprint sensors 301 with flexible insulation substrate and comprise the probe unit that a plurality of arrays are arranged, each probe unit includes: plate electrode 3011 and be positioned at insulation course 3012 on the plate electrode 3011.Fingerprint constitutes another electrode of electric capacity, because the projection 20 of fingerprint is different with the distance of plate electrode 3011 with depression 10, so the projection 20 of fingerprint and cave in 10 with plate electrode 3011 between the capacitance that forms different, thereby can fingerprint pattern be converted into electric signal by different capacitances.
The fingerprint sensor of the technical program is surveyed fingerprint pattern by the projection of fingerprint with the different electric capacity that depression is produced.Wherein, the capacitance type fingerprint sensor has flexible substrates, can be positioned on the product of easy bending, also can be arranged on the product with curved surface outward appearance, thereby enlarge the range of application of fingerprint sensor.
With reference to figure 4, show the synoptic diagram of another embodiment of fingerprint sensor.Present embodiment is an example with the pressure type fingerprint sensor.
As shown in Figure 4, pressure type fingerprint sensor 302 is used to survey finger print information, and fingerprint pattern is converted into electric signal.Described pressure type fingerprint sensor 302 comprises flexible insulation substrate 502, and described flexible insulation substrate 502 is a flexiplast.Can form pressure type fingerprint sensor 302 by the EPLaR method with flexible insulation substrate 502, described pressure type fingerprint sensor 302 comprises a plurality of probe units 3021, and each probe unit 3021 includes: switch, link to each other with described switch contact flat board.Wherein switch is used to make the contact flat board to be in detection or non-acquisition mode, and described contact flat board then is used to survey the depression of fingerprint pattern and the different pressure that projection is produced.
Described pressure type fingerprint sensor also comprises fexible film 401, is used to provide the surface of contact that carries out fingerprint recognition, and described fexible film 401 can be transferred to fingerprint pattern on the fingerprint sensor.In addition, fexible film 401 also plays a protective role to pressure type fingerprint sensor 302.
The fingerprint recognition system of the technical program, survey fingerprint pattern by the projection of fingerprint and the different pressures that is produced that caves in, the pressure type fingerprint sensor transforms into described different pressure the electric signal of contact resistance or voltage etc., by driving circuit described electric signal is carried out data processing afterwards, to obtain finger print information.Wherein, the pressure type fingerprint sensor has flexible substrates, can be arranged on the product of easy bending, also can be arranged on the product with curved surface outward appearance, therefore can satisfy the demand of product to fingerprint sensor.
With reference to figure 5, show and adopt laser release to mould the process flow diagram that basic electronic technology is made fingerprint sensor shown in Figure 2.The manufacturing process of described fingerprint sensor may further comprise the steps:
Step s1 provides substrate of glass;
Step s2, coating flexible material on described substrate of glass;
Step s3, the thin film transistor (TFT) array of formation fingerprint sensor on described plastic sheeting;
Step s4 covers electrophoresis material on described thin film transistor (TFT) array;
Step s5 peels off substrate of glass and flexible material by laser technology.
Below each step is elaborated.
For step s2, described flexible material is a flexiplast, the general flexiplast of selecting less than 200 μ m.Usually adopt spin coating proceeding, on substrate of glass, form flexible material.Flexible material is compared with the substrate of glass of millimeter level thickness, and thickness can be ignored, and the substrate of glass that has applied flexible material can be used as traditional substrate of glass, carries out subsequent technique.
For step s3, can adopt existing thin film transistor (TFT) technology on the substrate of glass that has applied flexible material, to form the thin film transistor (TFT) array of fingerprint sensor.
For step s4, adopt usually the vacuum film pressing machine technology with the electrophoresis material pressure dressing on thin film transistor (TFT) array.
The utility model does not limit the manufacturing process of fingerprint sensor, and described fingerprint sensor can also form by other manufacturing process, for example the manufacturing process of low temperature polycrystalline silicon type fingerprint sensor or amorphous silicon film transistor.
Need to prove that also the technical program does not limit the size and the shape of fingerprint sensor yet, described fingerprint sensor can be line style or planar fingerprint sensor.
In sum, the utility model fingerprint sensor comprises flexible substrates, and flexible fingerprint sensor has stronger plasticity, can be arranged in the flexible product on the one hand, can be arranged on the other hand on curved surface or the sphere product, thereby enlarge the usable range of fingerprint sensor.
In addition, fingerprint sensor has flexible substrates, so fingerprint sensor can be not cracked, and then the risk of no one's body incised wound.
Further, fingerprint sensor is made by flexiplast, and flexiplast easily obtains, price is low, can reduce the cost of fingerprint sensor.
Should be appreciated that example herein and embodiment only are exemplary, those skilled in the art can make various modifications and corrigendum under the situation of the spirit and scope of the present utility model that do not deviate from the application and claims and limited.
Claims (8)
1. a fingerprint sensor is used to survey fingerprint pattern, it is characterized in that, described fingerprint sensor comprises flexible substrates.
2. fingerprint sensor as claimed in claim 1 is characterized in that, described substrate is a flexible plastic substrates.
3. fingerprint sensor as claimed in claim 1 or 2 is characterized in that, the thickness of described flexible substrates is less than 200 μ m.
4. fingerprint sensor as claimed in claim 1 is characterized in that, described fingerprint sensor is capacitance type fingerprint sensor or pressure type fingerprint sensor.
5. fingerprint sensor as claimed in claim 1 is characterized in that, described fingerprint sensor is low temperature polycrystalline silicon type fingerprint sensor or amorphous silicon film transistor type fingerprint sensor.
6. fingerprint sensor as claimed in claim 1 is characterized in that, described fingerprint sensor is line style or planar fingerprint sensor.
7. fingerprint recognition system that comprises the described fingerprint sensor of above-mentioned arbitrary claim also comprises: be used to control described fingerprint sensor and handle the drive circuit unit of the signal that fingerprint sensor detects, be connected in described fingerprint sensor.
8. fingerprint recognition system as claimed in claim 7 is characterized in that described driving circuit is positioned on the flexible printed circuit board.
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CN2010205050945U CN201910060U (en) | 2010-08-23 | 2010-08-23 | Fingerprint sensor and fingerprint identification system |
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CN2010205050945U CN201910060U (en) | 2010-08-23 | 2010-08-23 | Fingerprint sensor and fingerprint identification system |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103927468A (en) * | 2013-12-31 | 2014-07-16 | 上海天马微电子有限公司 | Fingerprint identifying module and display device |
CN104657651A (en) * | 2015-01-30 | 2015-05-27 | 业成光电(深圳)有限公司 | Electronic device |
CN105124893A (en) * | 2015-08-13 | 2015-12-09 | 上海箩箕技术有限公司 | Biological recognition suitcase |
CN105740754A (en) * | 2014-12-12 | 2016-07-06 | 联想(北京)有限公司 | Fingerprint acquisition module set, manufacturing method and electronic device |
CN105989335A (en) * | 2015-02-13 | 2016-10-05 | 北京智谷睿拓技术服务有限公司 | Information obtaining method, information obtaining device, and user equipment |
CN106529507A (en) * | 2016-12-07 | 2017-03-22 | 广州奥熠电子科技有限公司 | Fingerprint recognition device and portable mobile terminal |
CN108108650A (en) * | 2016-11-25 | 2018-06-01 | 敦泰电子有限公司 | Fingerprint identification module, device and its manufacturing method and electrical equipment |
US10062789B2 (en) | 2015-11-11 | 2018-08-28 | Au Optronics Corporation | Thin film transistor and operating method thereof |
-
2010
- 2010-08-23 CN CN2010205050945U patent/CN201910060U/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103927468A (en) * | 2013-12-31 | 2014-07-16 | 上海天马微电子有限公司 | Fingerprint identifying module and display device |
CN103927468B (en) * | 2013-12-31 | 2017-08-11 | 上海天马微电子有限公司 | A kind of fingerprint identification module and display device |
CN105740754A (en) * | 2014-12-12 | 2016-07-06 | 联想(北京)有限公司 | Fingerprint acquisition module set, manufacturing method and electronic device |
CN105740754B (en) * | 2014-12-12 | 2019-03-29 | 联想(北京)有限公司 | A kind of fingerprint collecting mould group, production method and electronic equipment |
CN104657651A (en) * | 2015-01-30 | 2015-05-27 | 业成光电(深圳)有限公司 | Electronic device |
CN104657651B (en) * | 2015-01-30 | 2018-02-06 | 业成光电(深圳)有限公司 | Electronic installation |
CN105989335A (en) * | 2015-02-13 | 2016-10-05 | 北京智谷睿拓技术服务有限公司 | Information obtaining method, information obtaining device, and user equipment |
CN105124893A (en) * | 2015-08-13 | 2015-12-09 | 上海箩箕技术有限公司 | Biological recognition suitcase |
US10062789B2 (en) | 2015-11-11 | 2018-08-28 | Au Optronics Corporation | Thin film transistor and operating method thereof |
CN108108650A (en) * | 2016-11-25 | 2018-06-01 | 敦泰电子有限公司 | Fingerprint identification module, device and its manufacturing method and electrical equipment |
CN108108650B (en) * | 2016-11-25 | 2022-08-05 | 敦泰电子有限公司 | Fingerprint recognition module, device and manufacturing method thereof, and electrical equipment |
CN106529507A (en) * | 2016-12-07 | 2017-03-22 | 广州奥熠电子科技有限公司 | Fingerprint recognition device and portable mobile terminal |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20170823 |