CN104063696A - Fingerprint identification detection assembly and terminal device containing same - Google Patents
Fingerprint identification detection assembly and terminal device containing same Download PDFInfo
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- CN104063696A CN104063696A CN201410313108.6A CN201410313108A CN104063696A CN 104063696 A CN104063696 A CN 104063696A CN 201410313108 A CN201410313108 A CN 201410313108A CN 104063696 A CN104063696 A CN 104063696A
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Abstract
The present invention provides a fingerprint identification detection assembly and a terminal device containing the same. The fingerprint identification detection assembly comprises a substrate on which a plurality of through holes are arranged, wherein conductive materials are arranged in the plurality of through holes; a plurality of independently arranged electrodes formed on the substrate and electrically connected with the conductive materials in the plurality of through holes. According to the fingerprint identification detection assembly provided by the present invention, firstly, the conductive through holes are made in a transparent cover plate of the terminal device, then the electrodes are manufactured via a semiconductor manufacture technology, are placed on the transparent cover plate of the terminal device, are connected with the through holes electrically and directly, and are connected with a fingerprint identification control chip under the transparent cover plate via leads, thereby realizing a fingerprint detection function on the terminal device. The fingerprint identification detection assembly is suitable for the terminal device of which the transparent cover plate is designed integrally.
Description
Technical field
The present invention relates to technical field of biometric identification, the terminal device that relates in particular to a kind of fingerprint recognition detection components and comprise it.
Background technology
In recent years, along with the development of memory technology, terminal device stores the capsule information such as a large amount of personal information as smart mobile phone, panel computer etc., and its security becomes even more important.How by forms such as password, figures, to realize the cryptoguard to its terminal device at present.
Yet for cipher modes such as password, figures, user need remember password and/or the figure set; In addition, in public, the danger that also exists password to reveal.And in order to improve security, often needing to increase the complexity of password and figure, the difficulty that this has further increased user's memory undoubtedly, causes conflicting between safe and easy-to-use.
Fingerprint is comprised of the rough lines of finger surface skin, is the unique feature of human body, and its complexity can be provided for enough features of identification.Fingerprint recognition is to utilize the feature of fingerprint uniqueness and stability to realize identification, and remembers without user.
Capacitance type fingerprint identification sensor forms conducting channel on base material substrate, and when finger contacts with sensor, fingerprint pattern is surveyed and formed to the different capacitances that produce by the projection of fingerprint ridge and the depression of fingerprint paddy.
When carrying out fingerprint recognition by fingerprint Identification sensor, people's finger print face and the distance between fingerprint Identification sensor can not be excessively far away, if hypertelorism is difficult to form fingerprint pattern accurately.
Summary of the invention
The invention provides a kind of fingerprint recognition detection components, to be applicable on terminal device, be particularly useful for transparent cover plate and design the terminal device without embedded entity button for integral type.
Additional aspect of the present invention and advantage will partly be set forth in the following description, and partly will from describe, become obviously, or can the acquistion by practice of the present invention.
One aspect of the present invention discloses a kind of fingerprint recognition detection components, comprising: substrate, be formed with thereon a plurality of through holes, and in described a plurality of through holes, be provided with conductive material; And, some independent electrodes that arrange, it is formed on described substrate, and is electrically connected to conductive material in described a plurality of through holes.
In an embodiment, fingerprint recognition detection components also comprises: a plurality of leads, described a plurality of leads is electrically connected to the conductive material in described a plurality of through holes, to be electrically connected to described some electrodes.
In another embodiment, described a plurality of leads is electrically connected to described a plurality of through holes by electroplating.
In another embodiment, fingerprint recognition detection components also comprises: circuit board, is formed with thereon a plurality of conductive interfaces, and is electrically connected to described or a plurality of through holes, to be electrically connected to described circuit board and described some electrodes.
In another embodiment, the conductive interface of described circuit board is electrically connected to by conducting resinl and conductive material in described a plurality of through holes.
In another embodiment, described circuit board and fingerprint recognition detect the two sides that sensing element sets up described substrate separately, and described circuit board is electrically connected to described fingerprint recognition sensing element by the conductive material in described a plurality of through holes.
In another embodiment, fingerprint recognition detection components also comprises: protective seam, it is formed on described electrode.
In another embodiment, the material of described protective seam is insulating material.
In another embodiment, described a plurality of electrodes are array arrangement or strip type is arranged.
In another embodiment, the shape of described some electrodes comprises: square or rectangular; The length of described some electrodes or wide scope are in 20 μ m-45 μ m.
In another embodiment, described a plurality of through holes are formed on described substrate by radium-shine etching, chemical etching or deep reactive ion etch.
In another embodiment, the diameter of each through hole is within the scope of 20 μ m-45 μ m.
The present invention discloses a kind of terminal device on the other hand, comprises above-mentioned any fingerprint recognition detection components.
In an embodiment, the transparent cover plate that described substrate is described terminal device.
Fingerprint recognition detection components provided by the invention, first on the transparent cover plate of terminal device, make conductive through hole, by semiconductor fabrication process, make electrode again, be placed on the transparent cover plate of terminal device, and be directly electrically connected to through hole, under transparent cover plate, by lead-in wire, be connected with fingerprint recognition control chip again, to realize fingerprint detection function on terminal device.The terminal device that this fingerprint recognition detection components designs for integral type applicable to transparent cover plate.
Accompanying drawing explanation
By describe its example embodiment in detail with reference to accompanying drawing, above-mentioned and further feature of the present invention and advantage will become more obvious.
Fig. 1 is the sectional view of the fingerprint recognition detection components of one embodiment of the invention.
Fig. 2 is the electrode of the embodiment of the present invention schematic diagram of arranging.
Fig. 3 is the schematic diagram of the terminal device that comprises fingerprint recognition detection components of the embodiment of the present invention.
Embodiment
Referring now to accompanying drawing, example embodiment is more fully described.Yet example embodiment can be implemented in a variety of forms, and should not be understood to be limited to embodiment set forth herein; On the contrary, provide these embodiments to make the present invention by comprehensive and complete, and the design of example embodiment is conveyed to those skilled in the art all sidedly.Identical in the drawings Reference numeral represents same or similar structure.
Described feature or structure can be combined in one or more embodiments in any suitable manner.In the following description, thus provide many details to provide fully understanding embodiments of the present invention.Yet, one of ordinary skill in the art would recognize that there is no one or more in described specific detail, or adopt other method, constituent element etc., also can put into practice technical scheme of the present invention.In other cases, be not shown specifically or describe known configurations or operation to avoid fuzzy the present invention.
Fig. 1 is the sectional view of the fingerprint recognition detection components of one embodiment of the invention.As shown in Figure 1, fingerprint recognition detection components 1 comprises: substrate 11, electrode 12.
On substrate 11, be formed with a plurality of through holes 111, in a plurality of through holes 111, be respectively arranged with conductive material, as metal or its combinations such as silver, copper, gold, aluminium.
In certain embodiments, the shape circular of each through hole 111, due in its processing procedure, if the conference of crossing that the diameter of through hole is made causes substrate panel easily to rupture, if and the too small fill process of cannot realizing of diameter, therefore the diameter range of through hole 111 is at 20 μ m-45 μ m, but the present invention is not as limit.When through hole 111 is polygon, its diameter refers to its external diameter of a circle.
Form the manufacturing process of a plurality of through holes 111 on substrate 11 and comprise radium-shine etching technique, chemical etch technique or deep reactive ion etch technology.
A plurality of independent electrodes 12 that arrange are formed on substrate 11, for example, be array or strip type and arrange, and the invention is not restricted to this.
Fig. 2 is the electrode of the embodiment of the present invention schematic diagram of arranging.As Fig. 2 (a) with (b), electrode 12 is array or strip type is arranged.
Ridge and the paddy of user's finger that each electrode 12 goes out in response to the one or more pixels in its array (or strip type region), collect at least some information in fingerprint.It has following effect: when each electrode 12 is collected one or more pixel of information in fingerprint in its array (or strip type region), these electrodes are the information in fingerprint of receiving array (or strip type region) collectively.
Electrode 12 is such as thinking square, rectangle, circle etc., and the present invention is not as limit.In certain embodiments, the length and width scope of electrode 12 is in 20 μ m-45 μ m.When electrode 12 is circle, its external foursquare side size range is in 20 μ m-45 μ m.
Electrode 12 is for example made by semiconductor M5 layer manufacture craft, and its material comprises: semiconductor material.
In certain embodiments, the arrangement mode of through hole 111 mates with the arrangement mode of electrode 12.
Through hole 111 is directly electrically connected to electrode 12, and through hole 111 can be positioned at electrode 12 around, also can be as being positioned at the below of electrode 12 in Fig. 1.
It should be noted that, the row, column number of above-mentioned electrode 12 and the quantity of through hole 111 and array etc. is only the use of signal, and unrestricted the present invention.
In certain embodiments, substrate 11 is for example for having the transparent cover plate of the terminal device of fingerprint identification function, by fingerprint recognition sensing element being formed on the transparent cover plate of terminal device, dwindled the distance of fingerprint recognition sensing element and finger print face, fingerprint recognition result more accurately can be provided.
Refer again to Fig. 1, fingerprint recognition detection components 1 also comprises a plurality of leads 13, and for example by semi-conductor electricity coating technology, making to go between 13 is electrically connected to through hole 111, so that electrode 12 is connected to fingerprint recognition control chip (not shown)s.
Except the form by lead-in wire 13 connecting through holes 111, according to another embodiment of the invention, through hole 111 can also connect a circuit board, for example a flexible PCB.Circuit board is positioned at substrate below, is formed with one or more conductive interfaces on it, and conductive interface is electrically connected to through hole 111 by conducting resinl, and conducting resinl comprises ACF (anisotropic conductive or anisotropic conducting rubber); On circuit board, be formed with a plurality of leads, be electrically connected to conductive interface, so that electrode 12 is connected to fingerprint recognition control chip.
In addition,, for guard electrode 12, on electrode 12, can also form layer protective layer 15.
Protective seam 15 has insulation effect, and its material is insulating material.Further, the material that protective seam 15 adopts also has color adjustability; Dielectric coefficient is high, and for example dielectric coefficient is more than 6; Hardness is high, and for example Mohs value is more than 6H; And sense of touch is good, the sense of touch of similar glass surface for example, etc. characteristic.Such as being: UV acryl glues such as silicon dioxide.
Protective seam 15 for example forms by spraying technology or printing technology.
Fig. 3 is the schematic diagram of the terminal device that comprises fingerprint recognition detection components of the embodiment of the present invention.As shown in Figure 3, terminal device 2 is for example smart mobile phone, and its screen can be divided into 21He Fei visible area, visible area 22.Take and electrode 12 is arranged on to non-visible area 22 describes as example.Substrate 11 is for example the transparent cover plate of terminal device 2, transparent cover plate is for example glass material, a plurality of electrodes 12 are formed on the transparent cover plate of terminal device 2, and are electrically connected to lead-in wire 13 (not shown)s under this transparent cover plate by being for example positioned at through hole 111 (not shown)s of its below.
Fingerprint recognition detection components provided by the invention, comprises the sensor being formed on terminal device transparent cover plate, the sensor being for example comprised of capacitor plate.Its processing procedure is: first utilize radium-shine etching technique, chemical etch technique or deep reactive ion etch technology technology by the transparent cover plate of terminal device for example glass cover-plate bore a hole, and will conductive material be set in through hole; Recycling semiconductor fabrication completes the manufacture of sensor electrode on transparent cover plate, and electrode is directly electrically connected to through hole; Next utilize semi-conductor electricity coating technology to complete being electrically connected to of lead-in wire of through hole and transparent cover plate below; Finally, in electrode top, recycle for example spraying technology or printing technology making one deck insulating protective layer, so that electrode is protected.
Fingerprint recognition detection components provided by the invention, first on the transparent cover plate of terminal device, make conductive through hole, by semiconductor fabrication process, make electrode again, be placed on the transparent cover plate of terminal device, and be directly electrically connected to through hole, under transparent cover plate, by lead-in wire, be connected with fingerprint recognition control chip again, to realize fingerprint detection function on terminal device.The terminal device that this fingerprint recognition detection components designs for integral type applicable to transparent cover plate.
Below illustrate particularly and described illustrative embodiments of the present invention.Should be appreciated that, the invention is not restricted to disclosed embodiment, on the contrary, the invention is intended to contain the various modifications and the equivalent replacement that comprise within the scope of the appended claims.
Claims (14)
1. a fingerprint recognition detection components, is characterized in that, comprising:
Substrate, is formed with a plurality of through holes thereon, in described a plurality of through holes, is provided with conductive material; And,
Some independent electrodes that arrange, it is formed on described substrate, and is electrically connected to conductive material in described a plurality of through holes.
2. fingerprint recognition detection components according to claim 1, is characterized in that, also comprises: a plurality of leads, described a plurality of leads is electrically connected to the conductive material in described a plurality of through holes, to be electrically connected to described some electrodes.
3. fingerprint recognition detection components according to claim 2, is characterized in that, described a plurality of leads is electrically connected to described a plurality of through holes by electroplating.
4. fingerprint recognition detection components according to claim 1, is characterized in that, also comprises: circuit board, is formed with thereon a plurality of conductive interfaces, and is electrically connected to described or a plurality of through holes, to be electrically connected to described circuit board and described some electrodes.
5. fingerprint recognition detection components according to claim 4, is characterized in that, the conductive interface of described circuit board is electrically connected to by conducting resinl and conductive material in described a plurality of through holes.
6. fingerprint recognition detection components according to claim 4, it is characterized in that, described circuit board and fingerprint recognition detect the two sides that sensing element sets up described substrate separately, and described circuit board is electrically connected to described fingerprint recognition sensing element by the conductive material in described a plurality of through holes.
7. fingerprint recognition detection components according to claim 1 and 2, is characterized in that, also comprises: protective seam, it is formed on described electrode.
8. fingerprint recognition detection components according to claim 5, is characterized in that, the material of described protective seam is insulating material.
9. fingerprint recognition detection components according to claim 1 and 2, is characterized in that, described some electrodes are array arrangement or strip type is arranged.
10. fingerprint recognition detection components according to claim 1, is characterized in that, the shape of described some electrodes comprises: square or rectangular; The length of described some electrodes or wide scope are in 20 μ m-45 μ m.
11. fingerprint recognition detection components according to claim 1 and 2, is characterized in that, described a plurality of through holes are formed on described substrate by radium-shine etching, chemical etching or deep reactive ion etch.
12. fingerprint time detecting assemblies according to claim 1 and 2, is characterized in that, the diameter of each through hole is within the scope of 20 μ m-45 μ m.
13. 1 kinds of terminal devices, is characterized in that, comprise according to the fingerprint recognition detection components described in claim 1-12 any one.
14. terminal devices according to claim 13, is characterized in that, the transparent cover plate that described substrate is described terminal device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410313108.6A CN104063696A (en) | 2014-07-02 | 2014-07-02 | Fingerprint identification detection assembly and terminal device containing same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410313108.6A CN104063696A (en) | 2014-07-02 | 2014-07-02 | Fingerprint identification detection assembly and terminal device containing same |
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| CN104063696A true CN104063696A (en) | 2014-09-24 |
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| CN201410313108.6A Pending CN104063696A (en) | 2014-07-02 | 2014-07-02 | Fingerprint identification detection assembly and terminal device containing same |
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| CN104484663A (en) * | 2015-01-19 | 2015-04-01 | 京东方科技集团股份有限公司 | Fingerprint identification device and touch control device |
| CN104779222A (en) * | 2015-04-10 | 2015-07-15 | 华进半导体封装先导技术研发中心有限公司 | Biometric identification module structure and manufacture method |
| TWI554166B (en) * | 2015-09-21 | 2016-10-11 | Interface Optoelectronics Shenzhen Co Ltd | Conductive substrate and its manufacturing method |
| CN106326812A (en) * | 2015-06-30 | 2017-01-11 | 康而富控股股份有限公司 | Frame body used for fingerprint identification plate, manufacturing method for frame body, and light-guiding structure |
| US9626547B2 (en) | 2015-01-19 | 2017-04-18 | Boe Technology Group Co., Ltd. | Fingerprint recognition device and touch apparatus |
| WO2017101078A1 (en) * | 2015-12-17 | 2017-06-22 | 华为技术有限公司 | Cover plate, method for manufacturing same, and terminal device |
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| CN106326812A (en) * | 2015-06-30 | 2017-01-11 | 康而富控股股份有限公司 | Frame body used for fingerprint identification plate, manufacturing method for frame body, and light-guiding structure |
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| TWI554166B (en) * | 2015-09-21 | 2016-10-11 | Interface Optoelectronics Shenzhen Co Ltd | Conductive substrate and its manufacturing method |
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Application publication date: 20140924 |