CN106326812B - Frame body for fingerprint identification plate, manufacturing method thereof and light guide structure - Google Patents
Frame body for fingerprint identification plate, manufacturing method thereof and light guide structure Download PDFInfo
- Publication number
- CN106326812B CN106326812B CN201510374083.5A CN201510374083A CN106326812B CN 106326812 B CN106326812 B CN 106326812B CN 201510374083 A CN201510374083 A CN 201510374083A CN 106326812 B CN106326812 B CN 106326812B
- Authority
- CN
- China
- Prior art keywords
- frame body
- pattern
- light guide
- frame
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
A frame body for a fingerprint identification plate, a manufacturing method thereof and a light guide structure using the frame body comprise a frame body with a hollow part, a plurality of light emitting diodes and a light guide plate. The frame body is formed by injection molding of a mixed material mixed with a plastic material and a metal material, engraving lines on the frame body by a Laser Direct Structuring (Laser Direct Structuring) process, and forming a plurality of conductive parts on the lines of the frame body in an electroplating or chemical plating mode to form the frame body with conductive circuits; and adhering and fixing the plurality of light-emitting diodes on the conductive part of the frame body by an SMT (surface mount technology) process, so that the light projected by the light-emitting diodes can be projected into the light guide plate. Therefore, the frame body is formed by combining the laser engraving process with the electroplating mode, so that the frame body can be minimized, and when the frame body is applied to an electronic device, the requirement of lightness and thinness of the electronic device can be met.
Description
Technical Field
The present invention relates to a frame for a fingerprint identification plate, a method for manufacturing the same, and a light guide structure, and more particularly, to a frame for an electronic device, which can be placed by a finger and provides brightness required for fingerprint collection, a method for manufacturing the same, and a light guide structure.
Background
Electronic devices, such as smart phones, notebook computers, and personal disks, and even smart door locks, are often required to store important data such as personal letters and photos, or to unlock and prevent theft.
Early electronic devices mostly adopt a password setting method to prevent people from maliciously or intentionally stealing important data or preventing thieves from invading. However, when a general user uses a password, in order to avoid forgetting the password, the user often sets the password with important numbers such as the birthday of the user or family members; therefore, people with worry can easily use various methods to further obtain the password, which causes the leakage of important data.
Therefore, in order to improve the anti-theft functionality, the fingerprint recognition function is gradually adopted in the electronic devices nowadays. The fingerprint identification has the advantages that other people cannot imitate the fingerprint, and the secrecy effect can be greatly improved. As shown in fig. 1, a smart phone a is a necessity of life, and most users send and receive mails or store personal private data through the smart phone a.
Therefore, most of the existing smart phones a introduce a fingerprint recognition function, and further emphasize the anti-theft effect. For example, a fingerprint identification area B is provided on the smart phone a for the user to unlock the smart phone a by reading the fingerprint.
The existing fingerprint identifier is mainly characterized in that an image capturing device is arranged on a circuit board, a light guide plate is arranged above the image capturing device, a light emitting diode is arranged on the side edge of the light guide plate, light emitted by the light emitting diode is guided into the light guide plate, and when a user places a finger on a fingerprint identification area, the light guide plate can be used for increasing the brightness of the finger, so that the image capturing device reads the fingerprint on the finger, and then the comparison of the fingerprint is carried out.
However, most of the existing fingerprint identifiers have the light emitting diodes and the image capturing device disposed on the circuit board at the same time, which results in a complicated process and increased manufacturing cost.
Another existing fingerprint sensor is to integrate the image capturing device, the light guide plate and the light emitting diode together, and then fix the integrated device on a circuit board. However, the fingerprint sensor of this type has a huge overall structure design and volume, so when being mounted on a smart phone, the smart phone will be too bulky to satisfy the effects of being light, thin and convenient to carry.
Disclosure of Invention
The present invention provides a frame for a fingerprint identification plate, a method for manufacturing the same, and a light guide structure for a fingerprint identification plate, which can be placed by a finger, provide brightness required for fingerprint collection, and satisfy a thin and light fingerprint identification plate and a method for manufacturing the same.
In view of the above problems, the present invention is a light guide structure of a fingerprint sensor board and a method for manufacturing the same, and more particularly, to a light guide structure of a fingerprint sensor board for placing a finger and providing brightness required for collecting a fingerprint applied to an electronic device and a method for manufacturing the same.
To achieve the above object, the light guide structure of a fingerprint identification plate and a method for manufacturing the same of the present invention comprises a frame having a hollow portion, a plurality of light emitting diodes, and a light guide plate. The frame body is formed by injection molding of a mixed material mixed with a plastic material and a metal material, engraving lines on the frame body by a Laser Direct Structuring (Laser Direct Structuring) process, and forming a plurality of conductive parts on the lines of the frame body in an electroplating or chemical plating mode to form the frame body with conductive circuits; and adhering and fixing the plurality of light-emitting diodes on the conductive part of the frame body by an SMT (surface mount technology) process, so that the light projected by the light-emitting diodes can be projected into the light guide plate.
Therefore, the frame body is formed by combining the laser engraving process with the electroplating mode, so that the frame body can be minimized, and when the frame body is applied to an electronic device, the requirement of lightness and thinness of the electronic device can be met.
Drawings
To further illustrate the technical content of the present invention, the following detailed description is provided in conjunction with the embodiments and the accompanying drawings, in which:
fig. 1 is a perspective view of a conventional smart phone.
Fig. 2 is a sectional view of a light guide structure according to the present invention in a use state.
Fig. 3 is a schematic perspective view of a light guide structure according to the present invention.
Fig. 4 is an exploded view of the light guide structure of the present invention.
Fig. 5 is a manufacturing flow chart of the light guide structure of the present invention.
Fig. 6A is a schematic perspective view of the frame body after injection molding according to the present invention.
Fig. 6B is a schematic perspective view of the frame body of the present invention after laser engraving.
Fig. 6C is a schematic perspective view of the frame body after the plating is completed.
Fig. 6D is a back perspective view of the frame body after being electroplated according to the present invention.
Fig. 7 is a back schematic view of a light guide structure of the present invention.
Fig. 8 is a schematic front view of a light guide structure according to the present invention.
Fig. 9 is a schematic cross-sectional view of fig. 8.
Fig. 10 is a partially enlarged schematic view of fig. 9.
Detailed Description
As shown in fig. 2, the present invention relates to a frame for a fingerprint identification plate, a method for manufacturing the same, and a light guide structure using the same, wherein the light guide structure is disposed on a circuit board and used for covering an image capturing device.
In the present embodiment, the fingerprint identification plate light guide structure 10 is mainly implemented in a smart phone, except that the fingerprint identification plate light guide structure 10 is disposed on the circuit board 20 and covers the image capture device 30, a protection plate 40 is further covered on the fingerprint identification plate light guide structure 10, so that the fingerprint identification plate light guide structure 10 is fixed between the circuit board 20 and the protection plate 40; in the present embodiment, the protection plate 40 can be made of glass, plastic or any transparent material.
As shown in fig. 3 and 4, the light guide structure includes a frame 50, a plurality of light emitting diodes 60 emitting light laterally, and a light guide plate 70.
As shown in fig. 5 and fig. 6A to 6D, the frame 50 is formed by an injection molding and Laser engraving process (Laser Direct Structuring), and the forming method includes the following steps: injection molding step S1: a mixed material of a plastic material and a metal material is integrally molded by injection molding to form a frame body 50 having a hollow portion 53, and the frame body 50 has an upper surface 51 and a lower surface 52. Laser engraving step S2: a plurality of first ridges 501 and a plurality of second ridges 502 spaced from each other are formed on the frame body 50 by laser engraving to melt the plastic material on the first ridges 501 and the second ridges 502 and activate the metal material on the first ridges 501 and the second ridges 502, and the first ridges 501 and the second ridges 502 respectively extend from the upper surface 51 to the lower surface 52 of the frame body 50. And a metal forming step S3: the activated metal material on the frame 50 is electroplated or chemically plated, so that a metal layer is formed in the first texture 501 and the second texture 502 on the frame 50, and further a plurality of first conductive portions 541 and second conductive portions 542 which are spaced from each other are formed on the frame 50, and each first conductive portion 541 and each second conductive portion 542 form a set of conductive portions 54.
In the injection molding step, a step portion 55 is further formed on the frame 50 by recessing downward from the upper surface 51, so that the plurality of first ridges 501 and second ridges 502 in the laser engraving step are formed on the step portion 55.
In the laser engraving step, a third texture 503 and a fourth texture 504 are further formed on the upper surface 51 of the frame 50, respectively, wherein the third texture 503 is used to connect the plurality of first textures 501, and the fourth texture 504 is used to connect the plurality of second textures 502.
In the metal forming step, the third texture 503 and the fourth texture 504 further respectively form a metal layer identical to the first texture 501 and the second texture 502, so that the third texture 503 forms a first conductive portion 543, and the fourth texture 504 forms a second conductive portion 544, so that the plurality of first conductive portions 541 are mutually conducted, and the plurality of second conductive portions 542 are mutually connected in series.
The frame 50 formed by the above steps has an upper surface 51 and a lower surface 52 corresponding to the upper surface 51, a hollow portion 53 is formed in the center, at least a pair of conductive portions 54 is formed on the frame 50, each pair of conductive portions 54 includes a first conductive portion 541 and a second conductive portion 542 which are spaced from each other; in the present embodiment, a plurality of pairs of conductive portions 54 are formed on the housing 50, and the first conductive portions 541 in each pair of conductive portions 54 are connected in series with each other, and the second conductive portions 542 thereof are also connected in series with each other.
In the present embodiment, the frame 50 is formed with a step portion 55 recessed downward from the upper surface 51, the step portion 55 is disposed around the outside of the hollow portion 53, and further, a boss 56 is protruded from the step portion 55 toward the hollow portion 53, the boss 56 is disposed around the hollow portion 53, and the first conductive portion 541 and the second conductive portion 542 of the conductive portion 54 are disposed on the step portion 55.
In addition, as shown in fig. 6C, 6D and 7, a plurality of through holes 57 are further formed on the frame 50 from the step portion 55 toward the lower surface 52, so that a portion of the first conductive portion 541 and the second conductive portion 542 extends to the lower surface 52 through the surface of the through hole 57 to form at least a first contact 545 and a second contact 546, so that the frame 50 is electrically connected to the circuit board 20 through the first contact 545 and the second contact 546 and is fixed on the circuit board 20.
In practical applications, the first conductive part 541 and the second conductive part 542 can be independent from each other, and extend to the lower surface 52 of the frame 50 to form a plurality of first contacts 545 and second contacts 546; alternatively, the first conductive portion 542 and the second conductive portion 542 may be connected in series. The number of the first contacts 545 and the second contacts 546 may be adjusted according to the design of the circuit board 20.
As shown in fig. 2, 3 and 5, the present invention further provides a manufacturing process of a light guide structure of a fingerprint identification plate, which includes the processing steps of the frame 50, and further includes the following steps: light emitting diode mounting step S4: after the frame 50 is formed, a plurality of light emitting diodes 60 emitting light in a lateral direction are provided, and each light emitting diode 60 emitting light in the lateral direction is fixed on the frame 50 in a Surface Mount Technology (SMT) manner, so that each light emitting diode 60 emitting light in the lateral direction is electrically connected with each first conductive part 541 and each second conductive part 542; and a light guide plate mounting step S5: a light guide plate 70 is provided, the light guide plate 70 is mounted on the frame 50, and the light emitting diodes 60 are arranged around the side edge of the light guide plate 70 above the hollow portion 53.
In the present embodiment, the light emitting diodes 60 emitting light laterally are disposed in the step portion 55 of the frame 50, such that each light emitting diode 60 emitting light laterally corresponds to a pair of the conductive portions 54, and are electrically connected to the first conductive portion 541 and the second conductive portion 542 of each pair of the conductive portions 54, respectively, such that the light emitting diodes 60 emitting light laterally are conducted through the circuit of the circuit board 20 to project light into the hollow portion 53 of the frame 50.
The light guide plate 70 is disposed on the boss 56 of the frame 50 and above the hollow portion 53, so that the plurality of side-emitting leds 60 are disposed around the periphery of the light guide plate 70, and the light projected by the side-emitting leds 60 can enter the light guide plate 70 and be refracted in the light guide plate 70, thereby achieving the effect of illuminating the light guide plate 70, and further forming a light guide structure for a fingerprint identification plate.
In addition, each of the four corners of the light guide plate 70 is further provided with a protrusion 71 protruding outward, and the protrusion 71 covers the step 55 of the frame 50. The protrusions 71 at each diagonal corner are shaped corresponding to each other, and are fixed to the frame 50 by the protrusions 71.
As shown in fig. 2, 8, 9 and 10, since the frame 50 has a hollow portion 53 in the center, when the frame 50 is fixed on the circuit board 20 through the first contact 545 and the second contact 546 at the bottom, the frame 50 can be effectively covered outside the image capturing device 30.
The light emitting diodes 60 emitting light laterally are disposed in the step portion 55 of the frame 50 and around the periphery of the light guide plate 70. Therefore, the light projected by the side-emitting leds 60 can effectively enter the light guide plate 70, and the light guide plate 70 is uniformly illuminated.
When a finger is placed on the light guide plate 70 or placed above the light guide plate 70 through the protective plate 40, the light emitting diode 60 emitting light in the lateral direction uniformly illuminates the light guide plate 70, so that the image capturing device 30 can more clearly capture fingerprint lines on the finger, thereby improving the identification effect.
In addition, since the light emitting diode 60 emitting light laterally is integrated in the frame 50, the light guiding structure 10 of the fingerprint identification plate of the present invention can be directly fixed on the circuit board 20, thereby reducing the assembling procedures of the electronic device and greatly reducing the cost. Furthermore, the image capturing device 30 is independently disposed on the circuit board 20 and is covered by the light guiding structure 10 of the fingerprint identification plate of the present invention, so as to simplify the volume of the electronic device and achieve the purpose of making the electronic device light and thin.
In practical assembly, the frame 50 may be mounted on the circuit board 20, the light guide plate 70 may be mounted below the protection plate 40, and the circuit board 20 and the protection plate 40 may be assembled at a position corresponding to the frame 50, so that the image capturing device 30 may be mounted at the center of the hollow portion 53 more effectively, the image capturing device 30 may collect fingerprints more efficiently, and the light guide structure 10 of the fingerprint identification plate may be assembled more correctly.
Claims (10)
1. A manufacturing method of a frame body for a fingerprint identification plate comprises the following steps:
an injection molding step: the method comprises the following steps of forming a frame body with a hollow part by injection molding of a mixed material mixed with a plastic material and a metal material, wherein the frame body is integrally molded and has an upper surface and a lower surface;
laser engraving step: forming a plurality of first grains and a plurality of second grains which are mutually spaced on the frame body by utilizing a laser engraving mode, activating the metal materials in the plurality of first grains and the plurality of second grains, and respectively extending the plurality of first grains and the plurality of second grains from the upper surface to the lower surface of the frame body;
metal forming: and electroplating or chemically plating the activated metal material on the frame body to form metal layers in the first grains and the second grains on the frame body, so that a plurality of first conductive parts and second conductive parts which are mutually spaced are formed on the frame body.
2. The method as claimed in claim 1, wherein in the injection molding step, the frame further includes a step portion recessed from the upper surface, so that the first and second patterns are formed on the step portion.
3. The method as claimed in claim 2, wherein the laser engraving step further forms a third pattern and a fourth pattern on the upper surface of the frame, wherein the third pattern is used to connect a plurality of the first patterns, and the fourth pattern is used to connect a plurality of the second patterns.
4. The method as claimed in claim 3, wherein the third pattern and the fourth pattern are further formed with a metal layer having the same shape as the first pattern and the second pattern in the metal forming step, so that the third pattern forms a first metal connecting portion and the fourth pattern forms a second metal connecting portion.
5. A method for manufacturing a light guide structure, comprising the steps of, in addition to the manufacturing method according to claim 1:
the LED mounting step: providing a plurality of light emitting diodes, and arranging the light emitting diodes on the frame body to enable each light emitting diode to be electrically connected with each first conductive part and each second conductive part; and
a light guide plate mounting step: and providing a light guide plate, mounting the light guide plate on the frame, and enabling the light emitting diodes to surround the side edge of the light guide plate relative to the upper part of the hollow part.
6. The method of claim 5, wherein in the injection molding step, the frame further comprises a step portion recessed downward from the upper surface, so that the first and second patterns are formed on the step portion in the laser engraving step.
7. The method of claim 6, wherein in the step of laser engraving, a third pattern and a fourth pattern are further formed on the upper surface of the frame, wherein the third pattern is used to connect the first patterns, and the fourth pattern is used to connect the second patterns.
8. The method of claim 7, wherein the third pattern and the fourth pattern further form a metal layer identical to the first pattern and the second pattern in the metal forming step, so that the third pattern forms a first metal connection portion and the fourth pattern forms a second metal connection portion.
9. A light guide structure, comprising a frame formed by the method of claim 1, and further comprising:
a plurality of light emitting diodes arranged on the frame body, so that each light emitting diode is electrically connected with each first conductive part and each second conductive part;
and the light guide plate is arranged on the frame body, and the light emitting diodes surround the side edge of the light guide plate relative to the upper part of the hollow part.
10. The light guide structure of claim 9, wherein the frame further comprises a step portion recessed downward from the top surface, and the first conductive portions and the second conductive portions are disposed on the step portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510374083.5A CN106326812B (en) | 2015-06-30 | 2015-06-30 | Frame body for fingerprint identification plate, manufacturing method thereof and light guide structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510374083.5A CN106326812B (en) | 2015-06-30 | 2015-06-30 | Frame body for fingerprint identification plate, manufacturing method thereof and light guide structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106326812A CN106326812A (en) | 2017-01-11 |
| CN106326812B true CN106326812B (en) | 2020-02-21 |
Family
ID=57722747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510374083.5A Active CN106326812B (en) | 2015-06-30 | 2015-06-30 | Frame body for fingerprint identification plate, manufacturing method thereof and light guide structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106326812B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1694260A (en) * | 2005-04-15 | 2005-11-09 | 宜霖科技股份有限公司 | Contact image display structure |
| CN104063696A (en) * | 2014-07-02 | 2014-09-24 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification detection assembly and terminal device containing same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5909920B2 (en) * | 2011-08-17 | 2016-04-27 | セイコーエプソン株式会社 | LIGHTING DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND ELECTRONIC DEVICE |
-
2015
- 2015-06-30 CN CN201510374083.5A patent/CN106326812B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1694260A (en) * | 2005-04-15 | 2005-11-09 | 宜霖科技股份有限公司 | Contact image display structure |
| CN104063696A (en) * | 2014-07-02 | 2014-09-24 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification detection assembly and terminal device containing same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106326812A (en) | 2017-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10318786B2 (en) | Integration of touch screen and fingerprint sensor assembly | |
| US8582837B2 (en) | Pseudo-translucent integrated circuit package | |
| CN104049803A (en) | Mobile terminal | |
| CN103379199B (en) | Mobile terminal | |
| TWI705384B (en) | Double sided sensor module suitable for integration into electronic devices | |
| US9773152B2 (en) | Light guiding structure for fingerprint recognizing sheet | |
| CN105989362B (en) | Capacitive sensing assembly comprising thin film plastic | |
| US20070052679A1 (en) | Transparent key of an electronic device | |
| CN208141412U (en) | A kind of display module with fingerprint identification module | |
| US9915776B2 (en) | Light guide mechanism of fingerprint recognition plate | |
| CN114340280A (en) | Electronic device with sealed biometric input system | |
| CN204088139U (en) | The light shield layer structure of keyboard back light module | |
| TWI552092B (en) | A frame for a fingerprint identification plate, a method of manufacturing the same, and a light guide structure using the same | |
| US9846274B2 (en) | Frame utilized in fingerprint recognition plate, manufacturing method thereof, and light guide mechanism with the frame | |
| CN106326812B (en) | Frame body for fingerprint identification plate, manufacturing method thereof and light guide structure | |
| CN217718721U (en) | Fingerprint identification module and light guide | |
| TW201732668A (en) | Optical fingerprint sensor package structure | |
| TWI547886B (en) | Fingerprint identification board light guide structure | |
| JP6026606B1 (en) | Light guiding structure of fingerprint authentication panel | |
| JP6055038B1 (en) | Manufacturing method of frame used for fingerprint authentication panel, and manufacturing method of light guide structure using the frame | |
| CN106446755B (en) | Identification of fingerprint plate light guide structure | |
| TWM516192U (en) | Guide light structure of fingerprint recognition plate | |
| CN204334750U (en) | Camera module | |
| CN210120707U (en) | Be applied to single PCB board electronic identification subassembly of intelligence lock | |
| TW201409512A (en) | Key device and light guiding film thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |