TWI547886B - Fingerprint identification board light guide structure - Google Patents
Fingerprint identification board light guide structure Download PDFInfo
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- TWI547886B TWI547886B TW104128554A TW104128554A TWI547886B TW I547886 B TWI547886 B TW I547886B TW 104128554 A TW104128554 A TW 104128554A TW 104128554 A TW104128554 A TW 104128554A TW I547886 B TWI547886 B TW I547886B
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Description
本發明係有關一種指紋辨識板導光結構,特別是指一種應用於電子設備上,可供手指置放,並提供採集指紋時所需亮度之指紋辨識板導光結構者。 The invention relates to a light guiding structure of a fingerprint identification board, in particular to a fingerprint identification board light guiding structure which is applied to an electronic device and can be placed by a finger and provides brightness required for acquiring a fingerprint.
電子設備,諸如智慧型手機、筆記型電腦、隨身碟,更甚如智慧型門鎖等等,往往需要儲存私人信件或是照片等重要資料,亦或是用來解鎖、防盜等等功效。 Electronic devices, such as smart phones, laptops, flash drives, and more like smart door locks, often need to store important information such as personal letters or photos, or to unlock, burglar, and so on.
早期的電子設備大多採用密碼設定之方式,來防止有人惡意或故意竊取重要資料,或是防止盜賊入侵。然而,一般使用者在使用密碼設定時,為避免密碼的遺忘,常以自己或家人的生日等重要數字來進行密碼之設定;如此一來,容易讓有心人士利用各種方式進而獲取密碼,造成重要資料的外洩。 Most of the early electronic devices used password settings to prevent malicious or deliberate stealing of important data or to prevent thieves from invading. However, in order to avoid password forgetting, the general user often uses the important number such as the birthday of himself or his family to set the password when using the password setting. In this way, it is easy for the person concerned to use various methods to obtain the password, which is important. The leakage of information.
因此,為了提升防盜之功能性,現今電子設備,已逐漸採用指紋辨識之功效。指紋辨識的好處在於,他人無法仿造,可大幅提升保密的效果。如第1圖所示,現今的智慧型手機A,幾乎已成為生活的必需品,大多的使用者會透過智慧型手機A來進行郵件的收發,或是存放個人私密資料。 Therefore, in order to improve the functionality of theft prevention, today's electronic devices have gradually adopted the effect of fingerprint recognition. The advantage of fingerprint recognition is that others can't copy it, which can greatly improve the effect of confidentiality. As shown in Figure 1, today's smart phone A has become a necessity for life. Most users will use the smart phone A to send and receive mail or store personal data.
因此,現有的智慧型手機A,大多數皆導入指紋辨識之功 能,進而強調防盜的效果。如,智慧型手機A上設置有一指紋辨識區B,以供使用者在必須透過讀取指紋,方能達到解鎖的效果,進而登入智慧型手機A。 Therefore, most of the existing smart phone As are imported with fingerprint recognition. Can, and then emphasize the effect of theft. For example, the smart phone A is provided with a fingerprint identification area B, so that the user can read the fingerprint to achieve the unlocking effect, and then log in to the smart phone A.
現有的指紋辨識器,主要係於電路板上設置有影像擷取裝置,並於影像擷取裝置上方設置有一導光板,在於導光板的側邊設置有發光二極體,以利用發光二極體所釋放出之光線導入導光板中,進而當使用者將手指擺放於指紋辨識區上時,能夠利用導光板來增加手指的亮度,進而使影像擷取裝置來讀取手指上的指紋,進而進行指紋之比對。 The existing fingerprint identifier is mainly provided with an image capturing device on the circuit board, and a light guiding plate is disposed above the image capturing device, and a light emitting diode is disposed on a side of the light guiding plate to utilize the light emitting diode The released light is introduced into the light guide plate, so that when the user places the finger on the fingerprint recognition area, the light guide plate can be used to increase the brightness of the finger, so that the image capturing device can read the fingerprint on the finger, and then Perform a fingerprint comparison.
惟,現有的指紋辨識器,其大多將發光二極體與影像擷取裝置同時設置於電路板上,如此一來,造成製程的程序繁瑣,也會增加製造成本。 However, in the existing fingerprint recognizer, most of the light-emitting diodes and the image capturing device are simultaneously disposed on the circuit board, which causes the process of the process to be cumbersome and increases the manufacturing cost.
現存的另一種指紋辨識器,則是將影像擷取裝置、導光板及發光二極體整合再一起,之後再將其固定於電路板上。惟,此類型之指紋辨識器,其整體結構設計及體積皆相當龐大,因此搭載於智慧型手機上時,會造成智慧型手機體積過大,而無法滿足輕薄、便於攜帶之效果。 Another existing fingerprint identifier integrates the image capturing device, the light guide plate and the light-emitting diode together, and then fixes it on the circuit board. However, the overall structure design and volume of this type of fingerprint reader are quite large. Therefore, when it is mounted on a smart phone, the smart phone is too large to meet the slim and portable effect.
爰此,如何提供一種應用於電子設備上,可供手指置放,並提供採集指紋時所需亮度,且同時能滿足體積輕薄之指紋辨識板導光結構及其製造方法,即為本發明所欲解決的技術手段及其主要目的。 In this way, how to provide a fingerprint identification plate light guiding structure and a manufacturing method thereof for use in an electronic device, which can be placed by a finger and provide brightness required for fingerprint collection, and which can satisfy the volume and thickness, is The technical means to be solved and its main purpose.
鑑於上述問題,本發明係指紋辨識板導光結構及其製造方法,特別是指一種應用於電子設備上,可供手指置放,並提供採集指紋時所需亮度之指紋辨識板導光結構及其製造方法。 In view of the above problems, the present invention relates to a light guide structure of a fingerprint identification board and a manufacturing method thereof, and particularly to a light guide structure of a fingerprint identification board which is applied to an electronic device and can be placed by a finger and provides brightness required for fingerprint collection and Its manufacturing method.
為達上述目的,本發明之指紋辨識板導光結構及其製造方法,係包含有一具有中空部之框體、複數發光二極體以及一導光板。其中,框體係利用混合有塑膠材料及金屬材料之混合材料射出成型後,再以雷雕製程(Laser Direct Structuring)於框體上雕刻出紋路後,再以電鍍或化學鍍方式於框體之紋路上形成有複數導電部,藉以形成有一具有導電線路之框體;再將複數發光二極體以SMT製程黏著固定於框體之導電部上,使其該些發光二極體所投射出之光線得以投射至導光板內。 In order to achieve the above object, the light guide structure of the fingerprint identification board of the present invention and the manufacturing method thereof comprise a frame body having a hollow portion, a plurality of light emitting diodes and a light guide plate. Wherein, the frame system is formed by injection molding a mixed material of a mixed material of a plastic material and a metal material, and then the texture is engraved on the frame by Laser Direct Structuring, and then the grain of the frame is electroplated or electrolessly plated. Forming a plurality of conductive portions thereon to form a frame having a conductive line; and then bonding the plurality of light-emitting diodes to the conductive portion of the frame by the SMT process to cause the light emitted by the light-emitting diodes Can be projected into the light guide plate.
藉以,框體透過雷雕製程結合電鍍方式所形成,使其框體能達到極小化,使其應用於電子裝置上時,能夠滿足電子裝置輕薄化之要求。 Therefore, the frame body is formed by the laser engraving process and the electroplating method, so that the frame body can be minimized, and when it is applied to an electronic device, the requirements for thinning and thinning of the electronic device can be met.
A‧‧‧智慧型手機 A‧‧‧Smart Phone
B‧‧‧指紋辨識區 B‧‧‧ fingerprint identification area
C‧‧‧電路板 C‧‧‧Board
D‧‧‧影像擷取裝置 D‧‧‧Image capture device
E‧‧‧保護板 E‧‧‧protection board
10‧‧‧指紋辨識板導光結構 10‧‧‧ Fingerprinting plate light guiding structure
20‧‧‧框體 20‧‧‧ frame
21‧‧‧中空部 21‧‧‧ Hollow
22‧‧‧上表面 22‧‧‧ upper surface
23‧‧‧下表面 23‧‧‧ Lower surface
24‧‧‧容置槽 24‧‧‧ accommodating slots
25‧‧‧定位槽 25‧‧‧ positioning slot
26‧‧‧第一透孔 26‧‧‧ first through hole
27‧‧‧第二透孔 27‧‧‧Second through hole
28‧‧‧止擋塊 28‧‧‧stop block
29‧‧‧定位柱 29‧‧‧Positioning column
30‧‧‧導光板 30‧‧‧Light guide
40‧‧‧第一電極 40‧‧‧First electrode
50‧‧‧第二電極 50‧‧‧second electrode
60‧‧‧發光二極體 60‧‧‧Lighting diode
61‧‧‧側向發光區域 61‧‧‧ lateral illumination area
62‧‧‧定位凸塊 62‧‧‧Positioning bumps
63‧‧‧第一電極腳 63‧‧‧First electrode foot
64‧‧‧第二電極腳 64‧‧‧second electrode foot
70‧‧‧IR接收放器 70‧‧‧IR Receiver
71‧‧‧IR放射器 71‧‧‧IR emitter
72‧‧‧IR接收器 72‧‧‧IR receiver
73‧‧‧定位凸塊 73‧‧‧Positioning bumps
74‧‧‧第一電極腳 74‧‧‧First electrode foot
75‧‧‧第二電極腳 75‧‧‧second electrode foot
第1圖為習知智慧手機之立體示意圖。 Figure 1 is a perspective view of a conventional smart phone.
第2圖為本發明之導光結構的使用狀態剖面圖。 Fig. 2 is a cross-sectional view showing the state of use of the light guiding structure of the present invention.
第3圖為本發明之導光結構的分解示意圖。 Figure 3 is an exploded perspective view of the light guiding structure of the present invention.
第4圖為本發明之導光結構的立體示意圖。 Figure 4 is a perspective view of the light guiding structure of the present invention.
第5圖為本發明之框體的平面示意圖。 Figure 5 is a plan view of the frame of the present invention.
第6圖為本發明之導光結構的背部示意圖。 Figure 6 is a schematic view of the back of the light guiding structure of the present invention.
第7圖為本發明之導光結構的正面示意圖。 Figure 7 is a front elevational view of the light guiding structure of the present invention.
第8圖為第7圖之A-A剖面示意圖。 Figure 8 is a schematic cross-sectional view taken along line A-A of Figure 7.
第9圖為第7圖之B-B剖面示意圖。 Figure 9 is a cross-sectional view taken along line B-B of Figure 7.
如第2圖所示,本發明係有關一種用於指紋辨識板導光結 構,該指紋辨識板導光結構10係用以設置於一電路板C,並用以包覆一影像擷取裝置D。 As shown in FIG. 2, the present invention relates to a light guide junction for a fingerprint identification board. The fingerprint recognition board light guiding structure 10 is configured to be disposed on a circuit board C and used to cover an image capturing device D.
本實施例係以設置於智慧型手機中為主要實施態樣,其指紋辨識板導光結構10,除設置於電路板C上並包覆影像擷取裝置D外,於指紋辨識導光板結構10上進一步覆蓋有一保護板E,致使指紋辨識板導光結構10被固定於電路板C及保護板E間;於本實施例中,保護板E可以為玻璃、塑膠或是任何可透視之材質所製成。 In this embodiment, the fingerprint light guide structure 10 is disposed on the smart phone. The fingerprint light guide structure 10 is disposed on the circuit board C and covers the image capture device D. The fingerprint recognition light guide structure 10 is provided. The cover plate is further covered with a protective plate E, so that the light guide structure 10 of the fingerprint identification plate is fixed between the circuit board C and the protection board E. In this embodiment, the protection board E can be made of glass, plastic or any see-through material. production.
如第3圖及第4圖所示,前述導光結構,係包含有一框體20、導光板30、複數第一電極40、複數第二電極50、複數發光之發光二極體60以及一對IR接收放器70。 As shown in FIG. 3 and FIG. 4, the light guiding structure includes a frame 20, a light guide plate 30, a plurality of first electrodes 40, a plurality of second electrodes 50, a plurality of light emitting diodes 60, and a pair. The IR receivers 70.
請配合第5圖及第6圖所示,前述框體20係由複數邊條圍繞而成,使其框20體中央形成有一中空部21,且框體20具有一上表面22以及一與上表面22相對應之下表面23;每一邊條上形成有複數容置槽24,每一容置槽24由上表面22朝向下表面23方向延伸,並形成有一定位槽25以及分別貫穿上表面22及下表面23之第一透孔26以及第二透孔27,第一透孔26與第二透孔27間形成有一止擋塊28,且框體20之下表面23向下延伸有至少一定位柱29。 As shown in FIG. 5 and FIG. 6, the frame 20 is surrounded by a plurality of side strips, and a hollow portion 21 is formed in the center of the frame 20, and the frame 20 has an upper surface 22 and an upper portion. The surface 22 corresponds to the lower surface 23; each of the side strips is formed with a plurality of accommodating grooves 24 extending from the upper surface 22 toward the lower surface 23, and a positioning groove 25 is formed and penetrates the upper surface 22 respectively. And a first through hole 26 and a second through hole 27 of the lower surface 23, a stop block 28 is formed between the first through hole 26 and the second through hole 27, and the lower surface 23 of the frame body 20 extends downwardly at least one Positioning post 29.
如第3圖,導光板30則是設置於框體20之上表面22上,並覆蓋於框體20之中空部21之位置處。 As shown in FIG. 3, the light guide plate 30 is disposed on the upper surface 22 of the frame 20 and covers the hollow portion 21 of the frame 20.
如第3圖、第5圖以及第6圖所示,該些第一電極40係形成於第一透孔26內,在本實施例中,該些第一電極40係延伸至框體20之上表面22,相互電性連接,且至少一第一電極40延伸至框體20的下表面23。 As shown in FIG. 3 , FIG. 5 , and FIG. 6 , the first electrodes 40 are formed in the first through holes 26 . In the embodiment, the first electrodes 40 extend to the frame 20 . The upper surface 22 is electrically connected to each other, and the at least one first electrode 40 extends to the lower surface 23 of the frame 20.
該些第二電極50係形成於第二透孔27內,在本實施例中,該些第二電極50係延伸至框體20之上表面22,相互電性連接,且至少一第二電極50延伸至框體20的下表面23。其中第一電極40與第二電極50在框體20上係彼此相互間隔不導通。 The second electrodes 50 are formed in the second through holes 27, and in the embodiment, the second electrodes 50 extend to the upper surface 22 of the frame 20, electrically connected to each other, and at least a second electrode 50 extends to the lower surface 23 of the frame 20. The first electrode 40 and the second electrode 50 are not electrically connected to each other on the frame 20 .
值得一提的是,本實施例中之框體20、第一電極40以及第二電極50,係採用射出成型結合雷雕製程(Laser Direct Structuring)所形成。所謂射出成型結合雷雕製程(Laser Direct Structuring)係採用塑料與金屬材料之混合材料透過射出成型後,再經由雷射雕刻、電鍍等製程技術,使其第一電極40與第二電極50直接被形成於框體20上,藉以可降低框體20之厚度,使其框體20達到最薄化的效果。當然,框體20、第一電極40以及第二電極50亦可採用金屬射出成型的製程所形成,本實施例僅以最佳化之效果進行說明。 It should be noted that the frame 20, the first electrode 40 and the second electrode 50 in this embodiment are formed by injection molding combined with Laser Direct Structuring. The so-called injection molding combined with the Laser Direct Structuring process uses a mixture of plastic and metal materials through injection molding, and then through the laser engraving, electroplating and other process technology, the first electrode 40 and the second electrode 50 are directly It is formed on the frame body 20, whereby the thickness of the frame body 20 can be reduced, and the frame body 20 can be made thinner. Of course, the frame body 20, the first electrode 40, and the second electrode 50 can also be formed by a metal injection molding process. This embodiment will be described only with an optimized effect.
每一發光二極體60係設置於每一容置槽24內,並環設於導光板30的周圍。每一發光二極體60具有一側向發光區域61,每一側向發光區域61係位於導光板30之側邊,且每一發光二極體60之下方延伸形成有一定位凸塊62、第一電極腳63以及一第二電極腳64,定位凸塊62位於第一電極腳63與第二電極腳64間,且第一電極腳63以及第二電極腳64之長度大於定位凸塊62之長度。 Each of the light-emitting diodes 60 is disposed in each of the accommodating grooves 24 and is disposed around the light guide plate 30 . Each of the light-emitting diodes 60 has a lateral light-emitting area 61, and each of the lateral light-emitting areas 61 is located at a side of the light-guiding plate 30, and a positioning bump 62 is formed below each of the light-emitting diodes 60. An electrode leg 63 and a second electrode leg 64 are located between the first electrode leg 63 and the second electrode leg 64, and the length of the first electrode leg 63 and the second electrode leg 64 is greater than the positioning bump 62. length.
請配合第5圖、第7圖、第8圖以及第9圖所示,前述每一發光二極體60之定位凸塊62係嵌設於容置槽24之定位槽25中,並設於止擋塊28之上方;第一電極腳40穿過第一透孔26而暴露於框體20之下表面23,並與第一電極40相互電性連接;第二電極50腳穿過第二透孔27亦暴露於框體20 之下表面23,並與第二電極50相互電性連接。 As shown in FIG. 5 , FIG. 7 , FIG. 8 , and FIG. 9 , the positioning protrusion 62 of each of the light-emitting diodes 60 is embedded in the positioning groove 25 of the receiving groove 24 and is disposed on the positioning groove 25 . Above the stop block 28; the first electrode leg 40 is exposed to the lower surface 23 of the frame 20 through the first through hole 26, and is electrically connected to the first electrode 40; the second electrode 50 passes through the second The through hole 27 is also exposed to the frame 20 The lower surface 23 is electrically connected to the second electrode 50.
一對IR接收放器70,包含有一IR放射器71以及一IR接收器72,IR接收放器70係設置在框體20之兩相對應之邊條上。在本實施例中,框體20係由二短邊邊條以及二長邊邊條所圍繞而成,二短邊邊條與二長邊邊條係相互對應設置,而該對IR接收放器70則是設置在二長邊邊條上,亦即IR放射器71設置在其中一長邊邊條之容置槽24內,IR接收器72則是設置在另一長邊邊條之容置槽24內,使IR放射器71與IR接收器72係相互對應設置,且IR放射器71與IR接收器72皆具有與每一發光二極體相同之定位凸塊73、第一電極腳74以及第二電極腳75,可於第一透孔26及第二透孔27內與第一電極40及第二電極50相互電性連接,並使第一電極腳74與第二電極腳75暴露於框體2之下表面23。 A pair of IR receivers 70 includes an IR emitter 71 and an IR receiver 72. The IR receivers 70 are disposed on two corresponding side strips of the housing 20. In this embodiment, the frame 20 is formed by two short side strips and two long side strips, and the two short side strips and the two long side strips are correspondingly arranged, and the pair of IR receivers are arranged. 70 is disposed on the two long side strips, that is, the IR emitter 71 is disposed in the receiving slot 24 of one of the long side strips, and the IR receiver 72 is disposed on the other long side strip. In the slot 24, the IR emitter 71 and the IR receiver 72 are disposed corresponding to each other, and the IR emitter 71 and the IR receiver 72 have the same positioning bump 73 and the first electrode leg 74 as each of the LEDs. The second electrode leg 75 is electrically connected to the first electrode 40 and the second electrode 50 in the first through hole 26 and the second through hole 27, and exposes the first electrode leg 74 and the second electrode leg 75. On the lower surface 23 of the frame 2.
藉以,請同時配合第2圖、第3圖及第6圖所示,當本實施例中之指紋辨識板導光結構10安裝於電路板C上時,主要透過延伸於框體20之下表面23的第一電極40及第二電極5與電路板C進行電性連接,且亦可透過該些發光二極體60與該對IR接收放器40之第一電極腳63、74與第二電極腳64、75與電路板C進行電性連接,進而透過電路板C導通電路後,以驅動該些發光二極體60與該對IR接收放器70。 Therefore, when the fingerprint light guide structure 10 of the present embodiment is mounted on the circuit board C, the light transmission structure 10 of the present embodiment is mainly extended to the lower surface of the frame 20, as shown in FIG. 2, FIG. 3, and FIG. The first electrode 40 and the second electrode 5 of the 23 are electrically connected to the circuit board C, and can also pass through the light emitting diodes 60 and the first electrode legs 63, 74 and the second of the pair of IR receivers 40. The electrode legs 64 and 75 are electrically connected to the circuit board C, and then the circuit board C is turned on to drive the LEDs 60 and the pair of IR receivers 70.
當使用者之手指擺放於導光板30上時,透過該對IR接收放器70接收到手指擺放之訊號,而驅動該些發光二極體60,使該些發光二極體60釋放出光線,而透過每一發光二極體60之側向發光區域61將光線投射而出,並使光線由導光板30之側邊進入導光板30內,以照亮導光板30,進而使電路板C上之影像擷取裝置D能夠清晰的讀取手指上之指紋。 When the user's finger is placed on the light guide plate 30, the pair of IR receivers 70 receive the signal of the finger placement, and the light-emitting diodes 60 are driven to release the light-emitting diodes 60. The light is projected through the lateral light-emitting area 61 of each of the light-emitting diodes 60, and the light enters the light guide plate 30 from the side of the light guide plate 30 to illuminate the light guide plate 30, thereby making the circuit board The image capturing device D on C can clearly read the fingerprint on the finger.
由於本實施例中主要係在框體20上形成有容置槽24,並使該些發光二極體60及該對IR接收放器70容設於容置槽24內,再透過發光二極體60以及IR接收放器70上之定位凸塊6273、與框體20之定位槽24相互嵌設,故能有效的使發光二極體以及IR接收放器70固定於框體20上。 In this embodiment, the accommodating groove 24 is formed in the frame body 20, and the light-emitting diodes 60 and the pair of IR receivers 70 are received in the accommodating groove 24, and then transmitted through the illuminating diode. The body 60 and the positioning projections 6273 on the IR receiver 70 are embedded in the positioning grooves 24 of the housing 20, so that the LEDs and the IR receiver 70 can be effectively fixed to the housing 20.
此外,亦能有效的降低框體20的高度,並透過LDS製程來製作框體,進而到指紋辨識板導光結構之薄型化之要求,當應用於電子裝置上時,亦能有效改善電子裝置的厚度,而達到電子裝置之薄型化要求,亦能減少電子裝置組裝上之時間,有效縮短製造工時,提升組裝效率,達到降低成本的效果。 In addition, the height of the frame 20 can be effectively reduced, and the frame can be made through the LDS process, and the thinning of the light guiding structure of the fingerprint identification plate can be effectively improved when applied to an electronic device. The thickness can reach the thinning requirements of the electronic device, and the time for assembling the electronic device can be reduced, the manufacturing man-hour can be shortened, the assembly efficiency can be improved, and the cost can be reduced.
20‧‧‧框體 20‧‧‧ frame
30‧‧‧導光板 30‧‧‧Light guide
40‧‧‧第一電極 40‧‧‧First electrode
50‧‧‧第二電極 50‧‧‧second electrode
60‧‧‧發光二極體 60‧‧‧Lighting diode
70‧‧‧IR接收放器 70‧‧‧IR Receiver
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200601176A (en) * | 2004-06-30 | 2006-01-01 | Au Optronics Corp | Transparent touch panel for recognizing fingerprint |
US20090003664A1 (en) * | 2005-10-18 | 2009-01-01 | Authentec, Inc. | Finger sensing with enhanced mounting and associated methods |
TW201011378A (en) * | 2008-09-04 | 2010-03-16 | Au Optronics Corp | Display module |
CN103699872A (en) * | 2012-09-27 | 2014-04-02 | 光环科技股份有限公司 | Biometric identification device and method |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200601176A (en) * | 2004-06-30 | 2006-01-01 | Au Optronics Corp | Transparent touch panel for recognizing fingerprint |
US20090003664A1 (en) * | 2005-10-18 | 2009-01-01 | Authentec, Inc. | Finger sensing with enhanced mounting and associated methods |
TW201011378A (en) * | 2008-09-04 | 2010-03-16 | Au Optronics Corp | Display module |
CN103699872A (en) * | 2012-09-27 | 2014-04-02 | 光环科技股份有限公司 | Biometric identification device and method |
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