WO2019007305A1

WO2019007305A1 - Infrared light source, iris recognition module, and electronic device

Info

Publication number: WO2019007305A1
Application number: PCT/CN2018/094011
Authority: WO
Inventors: 周意保
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-07-07
Filing date: 2018-07-02
Publication date: 2019-01-10
Also published as: CN107451532B; CN107451532A

Abstract

Disclosed in the present invention are an infrared light source (100), an iris recognition module (1000), and an electronic device. The infrared light source (100) comprises: an emission surface (10), an infrared LED chip (20), and at least two band-pass filters (30). The emission surface (10) is provided with an emission window (11). The infrared LED chip (20) is used for emitting infrared light by means of the emission window (11). The band-pass filters (30) are alternately disposed on the emission window (11) of the emission surface (10), to respectively obtain light within a first waveband comprising 780-850 nm waveband and light within a second waveband comprising 850-940 nm waveband.

Description

Infrared light source, iris recognition module and electronic device

Cross-reference to related applications

The present application claims priority to and the benefit of the patent application Serial No.

Technical field

The present invention relates to the field of electronic devices, and in particular, to an infrared light source, an iris recognition module, and an electronic device.

Background technique

Iris recognition generally requires an infrared source to assist in obtaining a clear iris image. However, the iris color of different people is different, and the wavelength of the applicable infrared light source is different. The infrared light source using a single wavelength is less suitable.

Summary of the invention

Embodiments of the present invention provide an infrared light source, an iris recognition module, and an electronic device.

The infrared light source of the embodiment of the invention is used for an iris recognition module, and the infrared light source comprises:

An emitting surface, the emitting surface is formed with an emission window;

An infrared LED chip for emitting infrared light through the emission window, wherein the infrared light source chip emits light including a wavelength band of at least 780-940 nm;

At least two band pass filters are alternately disposed on the emission window of the emission surface to respectively obtain light of a first wavelength band including a 780-850 nm band, and include a band of 850-940 nm The second band of light.

In some embodiments, the number of infrared LED chips includes a plurality.

In some embodiments, the infrared LED chip includes at least two infrared LED chips having different operating wavelengths.

In some embodiments, the operating wavelength of the infrared LED chip includes 780-850 nm and 850-940 nm.

In some embodiments, the infrared light source includes a substrate, and the infrared LED chip is disposed on the substrate;

The infrared light source further includes a package encapsulating the infrared LED chip on the substrate, the package including the emission surface, the emission surface being opposite to the substrate.

In some embodiments, the package avoids the emission window.

In some embodiments, the number of the infrared LED chips includes a plurality, the substrate is annular, the plurality of infrared LED chips are distributed along a circumferential direction of the substrate, and the package is opposite to the substrate. A corresponding ring shape is used to make the infrared light source annular.

In certain embodiments, the substrate is in the form of a circular or rectangular ring.

An iris recognition module according to an embodiment of the present invention includes an infrared light source as described above and an infrared camera for receiving reflected light of the infrared light emitted by the infrared light source in the iris to form an iris image.

In some embodiments, the number of infrared LED chips includes a plurality.

In some embodiments, the package avoids the emission window.

In some embodiments, the number of the infrared LED chips includes a plurality, the substrate is annular, the plurality of infrared LED chips are distributed along a circumferential direction of the substrate, and the package is opposite to the substrate. A corresponding ring shape is used to make the infrared light source annular, and the infrared camera is disposed inside the infrared light source.

An electronic device according to an embodiment of the present invention includes a housing formed with a through hole, and an iris recognition module as described above disposed in the housing, the emission window corresponding to the through hole, the belt A pass filter is disposed in the through hole.

In some embodiments, the outer casing includes an outer surface, the band pass filter includes an upper surface opposite the emission window, the upper surface being lower than the outer surface or the outer surface Flush.

In some embodiments, the electronic device includes a cell phone and a tablet.

The infrared light source, the iris recognition module and the electronic device according to the embodiments of the present invention are applicable to different iris color differences by covering different emission bands of infrared light by different band pass filters to illuminate infrared light of different working wavelengths. It can even be applied to different scenes and different setting requirements in different regions, which increases the applicability of infrared light source and improves the efficiency of iris recognition.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of an infrared light source according to an embodiment of the present invention.

2 is a schematic structural view of an electronic device according to some embodiments of the present invention.

Detailed ways

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1 and FIG. 2 , the infrared light source 100 of the embodiment of the present invention is used for the iris recognition module 1000 , and the iris recognition module 1000 includes an infrared light source 100 and an infrared camera 200 . The infrared camera 200 is configured to receive reflected light of the infrared light emitted by the infrared light source 100 as an effective light source in the iris to form an iris image. The infrared light source 100 includes an emitting surface 10, an infrared LED chip 20, and a band pass filter 30.

The iris recognition module 1000 can be used in the electronic device 10000. The electronic device 10000 further includes a housing 2000. The housing 2000 is provided with a through hole. The iris recognition module 1000 is disposed in the electronic device 10000. The emission window 11 corresponds to the through hole, and the band pass filter 30 is disposed in the through hole.

The emission surface 10 is formed with an emission window 11. In some examples, the number of infrared LED chips 20 can be one and can emit infrared light including at least the 780-940 nm band. It can be understood that when the number of the infrared LED chips 20 is one, the cost can be saved. The band pass filter 30 includes at least two, and the band pass covers at least the operating wavelength of the infrared LED chip, and the band pass filter 30 is selectively disposed in the emission window 11 and covers the emission window 11. The band pass filter 30 is used to separate a certain band of monochromatic light from the composite light. That is, the band pass filter 30 can be used to separate infrared light of a particular operating wavelength from multi-band infrared light. The band pass filter 30 can be switched by mechanical switch or manual paddle to selectively set and cover the emission window 11.

With the increasing importance of information security, more and more consumer electronic devices encrypt information to protect the user's personal information security, and obtain the right to obtain corresponding information and operations through the corresponding verification methods. The authentication method usually includes a character pattern password such as a character password or a pattern password. However, such a password is usually easy to crack, thereby invalidating the encryption. In addition, some electronic devices, such as mobile phones and tablet computers, also provide fingerprints as an encryption method. Users use fingerprint recognition for verification. Although fingerprints have strong differences, they are easily stolen by others and made into fake fingerprints such as fingerprints. It is also not conducive to the security of information. In this case, iris recognition technology has begun to be adopted by some electronic devices as a more secure verification method.

Iris recognition is to determine the identity of the user by comparing the similarities between the features of the iris image. The iris information is unique and difficult to copy and has high security.

Iris recognition generally requires a process of iris image acquisition, iris image processing, and iris image recognition.

In the process of iris image acquisition, it needs to be collected by a special iris recognition module. Generally, the iris recognition module includes a camera and a light source. In order to protect the human eye and obtain a rich iris image, the light source selects infrared light. Accordingly, the camera selects an infrared camera.

The color of the iris that is not used by people is usually different. For example, the iris color of European and American white people is usually blue-green, while the iris color of Asian yellow people is usually black. The irises of different colors have different response efficiencies and effects at the same working wavelength. For example, for the cyan iris, the iris image can be obtained by using visible light of 700 nm wavelength, but for the black iris, it cannot be imaged.

It can be understood that when only the infrared light source of a single working wavelength is set in the iris recognition module, it is usually a compromise selection, which is not the best choice for an iris of a specific color.

The infrared light source 100 of the embodiment of the present invention includes an infrared LED chip 20 capable of emitting infrared light of a wider wavelength band. Thus, according to the actual situation of the user's iris, the band pass filter is gated to select the color of the iris. Matches the best working wavelength of infrared light to get a better iris image.

In some embodiments, the infrared source 100 further includes a substrate 40 for providing support for the infrared source 100. The infrared LED chip 20 is disposed on the substrate 40. The infrared LED chip 20 is capable of generating a wide range of infrared light to meet the needs of different user iris features. For example, in some examples, the operating wavelength of the infrared LED chip 20 covers from 780 nm to 940 nm. Among them, the infrared light with a working wavelength of 780 nm is better for the blue-green iris in the iris recognition process. The 850 nm infrared light is better for the iris recognition process in the iris recognition process. The 940nm infrared light is effective in providing effective light source for iris imaging without being visible to the human eye, and the user experience is better.

Accordingly, the band pass of the band pass filter 30 includes at least 780-850 nm and 850-940 nm. Among them, the bandpass 780-850nm filter is used to strobe 780nm or 850nm infrared light, and the 850-940nm filter is used to strobe 850nm or 940nm infrared light. In some examples, three band pass filters having center wavelengths of 780 nm, 850 nm, and 940 nm and narrow bandwidths may also be provided. It can be understood that the smaller the bandwidth of the band pass filter, the better the pass effect. In this way, for the infrared LED chip 20 with a wider working wavelength, a suitable band pass filter can be selected to transmit the infrared light of the corresponding wavelength band, thereby obtaining a clear iris image.

The infrared light source 100 further includes a package 50 for encapsulating the infrared LED chip 20 on the substrate 40. The package 50 includes an emitting surface 10 that is opposite the substrate 40 such that infrared light can be emitted via the emission window 11 of the emitting surface 10.

The package body 50 may be a material such as a colloid or a resin. The package body 50 avoids the emission window 11 of the infrared LED chip. The emission window 11 may be a transparent cover plate covering the emission surface of the infrared LED chip 20. Generally, plastic, glass, etc. may be used for good transmission. For performance materials, lenses that scatter infrared light can also be used to increase the working range of infrared light.

After the infrared LED chip 20 is packaged by the package 50, the infrared light source 100 is formed. The infrared light source 100 can be connected to the main board of the electronic device 10000 through the board-to-board connector, and powered by the main power of the electronic device 10000. In some examples, the number of infrared LED chips may be multiple, and the plurality of infrared LED chips 20 may be collectively packaged in the same package 50, that is, the infrared light source 100 is a single module light source. The optical axis of the plurality of infrared LED chips 20 may be parallel to the optical axis of the infrared camera 200 or may be at an angle to the optical axis of the infrared camera 200. It can be understood that the plurality of infrared LED chips 20 can obtain a large brightness, so that the effective working distance and working range of the infrared light source 100 are better.

Specifically, the plurality of infrared LED chips 20 may be a plurality of infrared LED chips with a working wavelength of 780-940 nm, or may be a plurality of infrared LED chips 20 of different working wavelengths, and a plurality of infrared LED chips 20 of different working wavelengths. At least 780-940 nm band can be covered. For example, the operating wavelength of the partial infrared LED chip 20 can be 780-850 nm, and the operating wavelength of the partial infrared LED chip 20 can be 850-940 nm.

The iris recognition module 1000 is generally used to identify the identity of the user currently using the electronic device 10000. Therefore, the iris recognition module 1000 is generally pre-positioned, that is, disposed on the front panel of the electronic device 10000, for example, at the top of the front panel.

In some examples, the outer casing includes an outer surface, and the band pass filter 30 includes an upper surface 31 that is opposite the emission window 11. Wherein, the upper surface 31 is lower than the outer surface or flush with the outer surface. When flushed, the outer surface is more integrated.

In summary, the infrared light source 100 and the iris recognition module 1000 and the electronic device 10000 of the embodiment of the present invention cover different infrared wavelengths of the infrared light by covering different emission wavelengths of the infrared light. The light is suitable for users with different iris color differences, and can even be applied to different scenes and different setting requirements in different regions, thereby increasing the applicability of the infrared light source and improving the efficiency of iris recognition.

In some embodiments, the electronic device 10000 includes a mobile phone, a tablet, a smart wearable device, a smart home device, and the like.

In some embodiments, the substrate 40 is annular, the infrared LED chip 20 includes a plurality of, and is distributed along the circumferential direction of the substrate 10, and the package 50 has an annular shape corresponding to the substrate 10 to make the infrared light source 100 ring-shaped. .

In such an embodiment, the infrared camera 200 is disposed inside the infrared source 100.

Specifically, the substrate 40 may have a ring shape or a rectangular ring shape. Generally, for the safety of the user, the power of the infrared light source 100 is limited to a certain extent, so the effective working distance of the infrared LED chip is usually 10-30 cm, and the infrared camera 200 can obtain the iris more clearly in the effective working range. image. When the infrared camera 200 is located inside the infrared light source 100, the distance from each of the plurality of infrared LED chips 20 distributed in a ring shape to the sensors of the infrared camera 200 is substantially the same, and the working distances of the respective infrared LED chips 20 are also substantially the same.

The rectangular ring is easy to manufacture but only allows a limited number of infrared LED chips 20 to be substantially the same distance from the sensors of the infrared camera 200. The working distances of the different infrared LED chips 20 may be different, so in operation, the infrared LEDs at different working wavelengths are activated. When the chip 20 is used, the user may adjust the working distance appropriately.

The package 50 corresponds to the shape of the substrate 40, that is, in an annular or ring-shaped structure, so that the structure is compact and the position of the infrared camera 200 can be reserved.

Correspondingly, the band pass filter 30 is ring-shaped to match the emission window 11, and avoids the infrared camera 200 disposed inside the infrared light source 100, thereby effectively strobing the infrared light without blocking the imaging of the infrared camera 200. .

Infrared LED chips have better thermal, electrical, optical and mechanical properties, are easy to manufacture, and are inexpensive.

When the number of the infrared LED chips 20 is plural, the plurality of infrared LED chips 20 are encapsulated by the package body 30 to form an LED infrared light source component, or an LED infrared light package includes a plurality of infrared LED chips instead of multiple LED infrared light source assembly or multiple LED infrared light packages.

In some embodiments, when the number of infrared LED chips 20 is plural, and the plurality of infrared LED chips 20 include at least two operating wavelengths, the number of infrared LED chips 20 per operating wavelength includes a plurality.

Specifically, the number of the infrared LED chips 20 corresponding to one working wavelength includes a plurality of, so that one or more infrared LED chips of the same working wavelength can be turned on according to the use environment and the like to provide different infrared light intensities. For example, when the ambient light environment is relatively strong, the plurality of infrared LED chips 20 can be turned on to increase the emission intensity, so that the infrared camera 200 can obtain a clear iris image, but the power consumption of the plurality of infrared LED chips 20 is high, and the component is emitted. The heat is also large, and therefore, only one of the plurality of infrared LED chips 20 of the same working wavelength can be turned on when the conditions such as the light environment are good.

In such an embodiment, the number of infrared LED chips per operating wavelength is the same or different.

Specifically, when the working wavelength is short, for example, 780 nm, the blue-green iris effect is better, and for the blue-green iris, the visible light supplement light can also be an effective light source, even using longer wavelength infrared light. It can be an effective light source, and a black iris corresponding to a longer wavelength, for example, 850 nm, can only image the iris at the current wavelength or longer, and is susceptible to the environment. Therefore, the longer the number of infrared LED chips 20 that are set at a longer wavelength, the more the infrared LED chips 20 can be turned on for different working conditions, and the multi-level power consumption can be satisfied.

In some embodiments, the infrared source 100 further includes a drive element for selectively driving the at least one infrared LED chip 20 to emit light.

In such an embodiment, the drive element includes a switch and a control circuit, wherein the switch is used to connect each of the infrared LED light sources 20 with a corresponding drive source for controlling the switch to communicate and close.

It can be understood that when a certain band pass filter is selected, the infrared LED light source 20 of other working wavelengths can be turned off, and the operating wavelengths of the plurality of infrared LED chips 20 are different, and the corresponding infrared LED chip 20 is controlled by controlling the on and off of the switch. The control of the infrared LED chip 20 can be realized by switching on and off with the driving source. In this way, selecting the better infrared LED chip 20 to turn on and turning off the other infrared LED chips 20 can effectively save power consumption.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. The specific features, structures, materials or characteristics described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims

An infrared light source for an iris recognition module, wherein the infrared light source comprises:

An emitting surface, the emitting surface is formed with an emission window;

An infrared LED chip for emitting infrared light through the emission window, wherein the infrared light source chip emits light including a wavelength band of at least 780-940 nm;

At least two band pass filters are alternately disposed on the emission window of the emission surface to respectively obtain light of a first wavelength band including a 780-850 nm band, and include a 850-940 nm band The second band of light.
The infrared light source of claim 1 wherein the number of infrared LED chips comprises a plurality.
The infrared light source of claim 1 wherein said infrared LED chip comprises at least two infrared LED chips having different operating wavelengths.
The infrared light source according to claim 1, wherein the operating wavelength of the infrared LED chip comprises 780-850 nm and 850-940 nm.
The infrared light source according to claim 1, wherein the infrared light source comprises a substrate, and the infrared LED chip is disposed on the substrate;

The infrared light source further includes a package encapsulating the infrared LED chip on the substrate, the package including the emission surface, the emission surface being opposite to the substrate.
The infrared light source of claim 5 wherein said package circumvents said emission window.
The infrared light source according to claim 5, wherein the number of the infrared LED chips comprises a plurality, the substrate is annular, the plurality of infrared LED chips are distributed along a circumferential direction of the substrate, and the The package has an annular shape corresponding to the substrate to make the infrared light source annular.
The infrared light source according to claim 7, wherein said substrate has a circular or rectangular ring shape.
An iris recognition module, wherein the iris recognition module comprises:

An infrared light source, the infrared light source comprising: an emitting surface, an infrared LED chip and at least one band pass filter;

The emitting surface is formed with an emission window;

The infrared LED chip is configured to emit infrared light through the emission window, wherein the infrared light source chip emits light including a wavelength band of at least 780-940 nm;

The band pass filters are alternately disposed on an emission window of the emission surface to respectively obtain light of a first wavelength band including a 780-850 nm band, and light of a second wavelength band including a band of 850-940 nm; and

The infrared camera is configured to receive the reflected light of the infrared light emitted by the infrared light source in the iris to form an infrared iris image.
The iris recognition module according to claim 9, wherein the number of the infrared LED chips comprises a plurality.
The iris recognition module of claim 9, wherein the infrared LED chip comprises at least two infrared LED chips having different operating wavelengths.
The iris recognition module according to claim 9, wherein the operating wavelength of the infrared LED chip comprises 780-850 nm and 850-940 nm.
The iris recognition module according to claim 9, wherein the infrared light source comprises a substrate, and the infrared LED chip is disposed on the substrate;

The infrared light source further includes a package encapsulating the infrared LED chip on the substrate, the package including the emission surface, the emission surface being opposite to the substrate.
The iris recognition module of claim 13 wherein said package evades said emission window.
The iris recognition module according to claim 13, wherein the number of the infrared LED chips comprises a plurality, the substrate is annular, and the plurality of infrared LED chips are distributed along a circumferential direction of the substrate and The package body has an annular shape corresponding to the substrate to make the infrared light source annular; the infrared camera is disposed inside the infrared light source.
The iris recognition module according to claim 15, wherein the substrate has a circular or rectangular ring shape.
An electronic device, comprising:

a housing having a through hole formed therein; and

The iris recognition module module, the iris recognition module includes:

An infrared light source, the infrared light source comprising: an emitting surface, an infrared LED chip and at least one band pass filter;

The emitting surface is formed with an emission window;

The infrared LED chip is configured to emit infrared light through the emission window, wherein the infrared light source chip emits light including a wavelength band of at least 780-940 nm;

The band pass filters are alternately disposed on an emission window of the emission surface to respectively obtain light of a first wavelength band including a 780-850 nm band, and light of a second wavelength band including a band of 850-940 nm; and

An infrared camera for receiving reflected light of the infrared light emitted by the infrared light source in the iris to form an infrared iris image;

The iris recognition module is disposed in the outer casing, the emission window is corresponding to the through hole, and the band pass filter is disposed in the through hole.
The electronic device according to claim 17, wherein said outer casing comprises an outer surface, said band pass filter comprising an upper surface facing away from said emission window, said upper surface being lower than said outer surface The surface is either flush with the outer surface.
The electronic device of claim 17 wherein said electronic device comprises a cell phone and a tablet.