WO2019007304A1 - Infrared light source, iris recognition module, and mobile terminal - Google Patents

Infrared light source, iris recognition module, and mobile terminal Download PDF

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Publication number
WO2019007304A1
WO2019007304A1 PCT/CN2018/094010 CN2018094010W WO2019007304A1 WO 2019007304 A1 WO2019007304 A1 WO 2019007304A1 CN 2018094010 W CN2018094010 W CN 2018094010W WO 2019007304 A1 WO2019007304 A1 WO 2019007304A1
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Prior art keywords
light source
infrared light
infrared
substrate
iris recognition
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PCT/CN2018/094010
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French (fr)
Chinese (zh)
Inventor
周意保
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Oppo广东移动通信有限公司
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Publication of WO2019007304A1 publication Critical patent/WO2019007304A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31User authentication
    • G06F21/32User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof
    • G06V10/14Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/143Sensing or illuminating at different wavelengths
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/18Eye characteristics, e.g. of the iris
    • G06V40/19Sensors therefor

Definitions

  • the present invention relates to the field of electronic devices, and in particular, to an infrared light source, an iris recognition module, and a mobile terminal.
  • Iris recognition generally requires an infrared source to assist in obtaining a clear iris image.
  • the iris color of different people is different, and the wavelength of the applicable infrared light source is different.
  • the infrared light source using a single wavelength is less suitable.
  • Embodiments of the present invention provide an infrared light source, an iris recognition module, and a mobile terminal.
  • the infrared light source of the embodiment of the invention is used for iris recognition, and the infrared light source comprises:
  • infrared light source wafer chips disposed on the substrate, at least two of the infrared light source wafer chips having different operating wavelengths;
  • the infrared light source wafer chip is packaged on a package on the substrate.
  • the substrate is annular
  • the plurality of infrared light source wafer chips are distributed along a circumferential direction of the substrate
  • the package is in a ring shape corresponding to the substrate to enable the infrared
  • the light source is annular.
  • the substrate is in the form of a circular or rectangular ring.
  • the infrared source wafer chip comprises an infrared LED wafer chip.
  • each of the infrared light source wafer chips has an operating wavelength of 780 nm, 850 nm, or 940 nm.
  • the number of the infrared source wafer chips per each of the operating wavelengths comprises a plurality.
  • the infrared source further includes a drive element for selectively driving at least one of the infrared source wafer chip illumination.
  • the drive element includes a switch that connects each of the infrared source wafer chips to a corresponding drive source and a control circuit that controls the switch to communicate and shut down.
  • An iris recognition module includes an infrared light source as described above and an infrared camera for receiving reflected light of the infrared light emitted by the infrared light source in the iris to form an iris image.
  • the substrate is annular
  • the plurality of infrared light source wafer chips are distributed along a circumferential direction of the substrate
  • the package is in a ring shape corresponding to the substrate to enable the infrared
  • the light source is annular
  • the infrared camera is disposed inside the infrared light source.
  • the substrate is in the form of a circular or rectangular ring.
  • the infrared source wafer chip comprises an infrared LED wafer chip.
  • each of the infrared light source wafer chips has an operating wavelength of 780 nm, 850 nm, or 940 nm.
  • the number of the infrared source wafer chips per each of the operating wavelengths comprises a plurality.
  • the infrared source further includes a drive element for selectively driving at least one of the infrared source wafer chip illumination.
  • the drive element includes a switch that connects each of the infrared source wafer chips to a corresponding drive source and a control circuit that controls the switch to communicate and shut down.
  • the mobile terminal according to the embodiment of the present invention includes the above-described iris recognition module.
  • the mobile terminal comprises a cell phone or a tablet.
  • the infrared light source, the iris recognition module and the mobile terminal of the embodiment of the invention can be applied to different users of different iris color differences by setting a plurality of wafers with different working wavelengths in the infrared light source, and can even be applied to different scenes in different regions and Different setting requirements increase the applicability of the infrared light source and improve the efficiency of iris recognition.
  • FIG. 1 is a schematic structural view of an infrared light source according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of an infrared light source according to some embodiments of the present invention.
  • FIG. 3 is a schematic structural view of an infrared light source according to some embodiments of the present invention.
  • FIG. 4 is a schematic structural diagram of a mobile terminal according to some embodiments of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • the infrared light source 100 of the embodiment of the present invention is used for the iris recognition module 1000 , and the iris recognition module 1000 includes an infrared light source 100 and an infrared camera 200 .
  • the infrared camera 200 is configured to receive reflected light of the infrared light emitted by the infrared light source 100 as an effective light source in the iris to form an iris image.
  • the infrared light source 100 includes a substrate 10, an infrared light source wafer chip 20, and a package body 30.
  • the infrared light source wafer chip 20 includes a plurality of, and at least two infrared light source wafer chips have different working wavelengths, and the package body 30 is used for packaging the infrared light source wafer chip 20 on the basic 10 .
  • the authentication method usually includes a character pattern password such as a character password or a pattern password.
  • a character pattern password such as a character password or a pattern password.
  • a password is usually easy to crack, thereby invalidating the encryption.
  • some mobile terminals such as mobile phones and tablet computers, also provide fingerprints as an encryption method. Users use fingerprint recognition for verification. Although fingerprints have strong differences, they are easily stolen by others and made into fake fingerprints such as fingerprints. It is also not conducive to the security of information. In this case, iris recognition technology has begun to be adopted by some mobile terminals as a more secure verification method.
  • Iris recognition is to determine the identity of the user by comparing the similarities between the features of the iris image.
  • the iris information is unique and difficult to copy and has high security.
  • Iris recognition generally requires a process of iris image acquisition, iris image processing, and iris image recognition.
  • the iris recognition module includes a camera and a light source.
  • the light source selects infrared light.
  • the camera selects an infrared camera.
  • the color of the iris that is not used by people is usually different.
  • the iris color of European and American white people is usually blue-green, while the iris color of Asian yellow people is usually black.
  • the irises of different colors have different response efficiencies and effects at the same working wavelength.
  • the iris image can be obtained by using visible light of 700 nm wavelength, but for the black iris, it cannot be imaged.
  • the infrared light source 100 of the embodiment of the present invention includes a plurality of infrared light source wafer chips 20, and at least two infrared light source wafer chips 20 have different working wavelengths.
  • the color of the iris can be selected according to the actual situation of the user's iris.
  • the matched optimal operating wavelength of the infrared source wafer chip 20 emits infrared light to obtain a better iris image.
  • the substrate 10 is used to provide support for the infrared light source 100.
  • the infrared light source wafer chip 20 is disposed on the substrate 10 in a predetermined manner. It can be understood that the wafer determines the operating wavelength of the infrared source.
  • the infrared light source wafer chip 20 disposed on the substrate 10 provides at least two different operating wavelengths.
  • the infrared light source wafer chip 20 of two or more working wavelengths can be provided according to actual needs, which is not limited herein. In this way, the needs of different users' iris characteristics can be met.
  • the operating wavelengths of the infrared source wafer chip 20 include 780 nm, 850 nm, and 940 nm.
  • the infrared light with a working wavelength of 780 nm is better for the blue-green iris in the iris recognition process.
  • the 850 nm infrared light is better for the iris recognition process in the iris recognition process.
  • the 940nm infrared light is effective in providing effective light source for iris imaging without being visible to the human eye, and the user experience is better.
  • the working state of the wafers of various working wavelengths is also turned on or off. According to the specific conditions of the user or the use environment during the actual use, the user can select or set the selective opening by the mobile terminal control.
  • the package body 30 may be a material such as a colloid or a resin, and the upper surface thereof is flush with the upper surface of the wafer.
  • the package body 30 further includes a transparent cover plate covering the upper surface of the wafer to serve as an emission window for infrared light, and the cover plate may be generally used.
  • Plastic, glass and other materials with good transmission properties can also use a lens that can scatter infrared light, thereby increasing the working range of infrared light.
  • the infrared light source wafer chip 20 is encapsulated by the package body 30 to form an infrared light source 100.
  • the infrared light source 100 can be connected to the main board of the mobile terminal through a board-to-board connector, and is powered by the main power source of the mobile terminal.
  • the plurality of infrared light source wafer chips 20 are collectively packaged in the same package 30, that is, the infrared light source 100 is a single module light source.
  • the optical axes of the plurality of infrared light source wafer chips 20 may be parallel to the optical axis of the infrared camera 200 or may be at an angle to the optical axis of the infrared camera 200.
  • the iris recognition module 1000 is generally used to identify the identity of the user currently using the mobile terminal. Therefore, the iris recognition module 1000 is generally pre-positioned, that is, disposed on the front panel of the mobile terminal, for example, at the top of the front panel.
  • the infrared light source 100 and the iris recognition module 1000 of the embodiment of the present invention can be applied to different users of different iris color differences by providing a plurality of wafers having different working wavelengths in the infrared light source 100, and can even be applied to Different scenes and different setting requirements in different regions have increased the applicability of the infrared light source 100, and secondly, improved the efficiency of iris recognition.
  • the mobile terminal includes a mobile phone, a tablet, a smart wearable device, and the like.
  • the iris recognition module 1000 can also be used for devices such as smart home devices and consumer-grade drones, and is not limited herein.
  • the substrate 10 is annular, and the plurality of infrared light source wafer chips 20 are distributed along the circumferential direction of the substrate 10, and the package 30 has an annular shape corresponding to the substrate 10 to make the infrared light source 100 annular.
  • the infrared camera 200 is disposed inside the infrared source 100.
  • the substrate 10 may have a ring shape or a rectangular ring shape.
  • the power of the infrared light source 100 is limited to a certain extent, so the effective working distance of the wafer is usually 10-30 cm, and the infrared camera 200 can obtain the iris image more clearly within the effective working range.
  • the infrared camera 200 is located inside the infrared light source 100, the distance from each of the plurality of infrared light source wafer chips 20 distributed in a ring shape to the sensors of the infrared camera 200 is substantially the same, and the working distances of the respective wafers are also substantially the same.
  • the rectangular ring is easy to manufacture but only allows a limited number of wafers to be substantially the same distance from the sensors of the infrared camera 200.
  • the working distances of different wafers may be different. Therefore, in operation, the infrared light source wafer chip 20 at different working wavelengths is activated. The user may adjust the working distance as appropriate.
  • the package body 30 corresponds to the shape of the substrate 10, that is, in an annular or ring-shaped structure, so that the structure is compact and the position of the infrared camera 200 can be reserved.
  • the infrared source wafer chip 20 includes an infrared LED wafer.
  • LED wafers have better thermal, electrical, optical and mechanical properties, are easy to manufacture, and are inexpensive.
  • a plurality of infrared LED wafers are packaged by the package 30 to form an LED infrared light source component, or an LED infrared light package includes a plurality of infrared LED wafers instead of multiple LED infrared light source components or multiple LED infrared light packages. .
  • the number of infrared light source wafer chips 20 per operating wavelength includes a plurality.
  • the number of the infrared light source wafer chips 20 corresponding to one working wavelength includes a plurality of, so that one or more wafers of the same working wavelength can be turned on according to relevant conditions such as the use environment to provide different infrared light intensities.
  • relevant conditions such as the use environment to provide different infrared light intensities.
  • the ambient light environment is relatively strong, multiple wafers can be turned on to increase the emission intensity, so that the infrared camera 200 can obtain a clear iris image, but the power consumption of turning on multiple wafers is high, and the heat generation of the components is also large. Therefore, it is only necessary to turn on one wafer operation when the conditions such as the light environment are good.
  • the number of infrared source wafer chips per operating wavelength is the same or different.
  • the visible light supplement light can also be an effective light source, even using longer wavelength infrared light. It can be an effective light source, and a black iris corresponding to a longer wavelength, for example, 850 nm, can only image the iris at the current wavelength or longer, and is susceptible to the environment. Therefore, the longer the wavelength of the infrared wafer is set, the more the infrared light source wafer chip 20 can be opened to meet the different working conditions, and the multi-level power consumption can be satisfied.
  • the infrared source 100 further includes a drive element for selectively driving at least one infrared source wafer chip illumination.
  • the drive element includes a switch and a control circuit, wherein the switch is used to connect each of the infrared source wafer chips 20 with a corresponding drive source for controlling the switch to communicate and close.
  • the operating wavelengths of the plurality of infrared light source wafer chips 20 are different, and part of the wafers are selected to emit infrared light according to user selection or use, and the corresponding wafer and the driving source are controlled to be turned on and off by controlling the switching of the switches. Control of the wafer is possible.

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Abstract

Disclosed in the present invention are an infrared light source (100), an iris recognition module (1000), and a mobile terminal. The infrared light source (100) comprises: a substrate (10), multiple infrared light source wafer chips (20), and a package (30). The multiple infrared light source wafer chips (20) are disposed on the substrate (10), and at least two of the infrared light source wafer chips (20) have different operating wavelengths. The package (30) is configured to package the infrared light source wafer chips (20) on the substrate (30).

Description

红外光源、虹膜识别模组和移动终端Infrared light source, iris recognition module and mobile terminal
相关申请的交叉引用Cross-reference to related applications
本申请请求2017年07月07日向中国国家知识产权局提交的、专利申请号为201710551819.0的专利申请的优先权和权益,并且通过参照将其全文并入此处。The present application claims priority to and the benefit of the patent application No. PCT Application No.
技术领域Technical field
本发明涉及电子装置领域,尤其涉及一种红外光源、虹膜识别模组和移动终端。The present invention relates to the field of electronic devices, and in particular, to an infrared light source, an iris recognition module, and a mobile terminal.
背景技术Background technique
虹膜识别一般需要红外光源辅助获取清晰的虹膜图像,然而不同人种虹膜颜色不同,适用的红外光源的波长不同,采用单一波长的红外光源适用性较差。Iris recognition generally requires an infrared source to assist in obtaining a clear iris image. However, the iris color of different people is different, and the wavelength of the applicable infrared light source is different. The infrared light source using a single wavelength is less suitable.
发明内容Summary of the invention
本发明的实施方式提供一种红外光源、虹膜识别模组和移动终端。Embodiments of the present invention provide an infrared light source, an iris recognition module, and a mobile terminal.
本发明实施方式的红外光源,用于虹膜识别,所述红外光源包括:The infrared light source of the embodiment of the invention is used for iris recognition, and the infrared light source comprises:
基板;Substrate
设置在所述基板上的多个红外光源晶圆芯片,至少两个所述红外光源晶圆芯片的工作波长不同;和a plurality of infrared light source wafer chips disposed on the substrate, at least two of the infrared light source wafer chips having different operating wavelengths; and
将所述红外光源晶圆芯片封装在所述基板上的封装体。The infrared light source wafer chip is packaged on a package on the substrate.
在某些实施方式中,所述基板呈环状、所述多个红外光源晶圆芯片沿所述基板的圆周方向分布且所述封装体呈与所述基板对应的环状以使所述红外光源呈环状。In some embodiments, the substrate is annular, the plurality of infrared light source wafer chips are distributed along a circumferential direction of the substrate, and the package is in a ring shape corresponding to the substrate to enable the infrared The light source is annular.
在某些实施方式中,所述基板呈圆环或矩形环状。In certain embodiments, the substrate is in the form of a circular or rectangular ring.
在某些实施方式中,所述红外光源晶圆芯片包括红外LED晶圆芯片。In some embodiments, the infrared source wafer chip comprises an infrared LED wafer chip.
在某些实施方式中,所述红外光源晶圆芯片中的每一个的工作波长为780nm、850nm或940nm。In some embodiments, each of the infrared light source wafer chips has an operating wavelength of 780 nm, 850 nm, or 940 nm.
在某些实施方式中,每一所述工作波长的所述红外光源晶圆芯片的数目包括多个。In some embodiments, the number of the infrared source wafer chips per each of the operating wavelengths comprises a plurality.
在某些实施方式中,所述红外光源还包括驱动元件,所述驱动元件用于选择性驱动至少一个所述红外光源晶圆芯片发光。In some embodiments, the infrared source further includes a drive element for selectively driving at least one of the infrared source wafer chip illumination.
在某些实施方式中,所述驱动元件包括连接每个所述红外光源晶圆芯片与对应驱动源的开关和用于控制所述开关连通和关闭的控制电路。In some embodiments, the drive element includes a switch that connects each of the infrared source wafer chips to a corresponding drive source and a control circuit that controls the switch to communicate and shut down.
本发明实施方式的虹膜识别模组,包括如上所述的红外光源和用于接收所述红外 光源发射的红外光在虹膜的反射光线以形成虹膜图像的红外摄像头。An iris recognition module according to an embodiment of the present invention includes an infrared light source as described above and an infrared camera for receiving reflected light of the infrared light emitted by the infrared light source in the iris to form an iris image.
在某些实施方式中,所述基板呈环状、所述多个红外光源晶圆芯片沿所述基板的圆周方向分布且所述封装体呈与所述基板对应的环状以使所述红外光源呈环状,所述红外摄像头设置在所述红外光源内侧。In some embodiments, the substrate is annular, the plurality of infrared light source wafer chips are distributed along a circumferential direction of the substrate, and the package is in a ring shape corresponding to the substrate to enable the infrared The light source is annular, and the infrared camera is disposed inside the infrared light source.
在某些实施方式中,所述基板呈圆环或矩形环状。In certain embodiments, the substrate is in the form of a circular or rectangular ring.
在某些实施方式中,所述红外光源晶圆芯片包括红外LED晶圆芯片。In some embodiments, the infrared source wafer chip comprises an infrared LED wafer chip.
在某些实施方式中,所述红外光源晶圆芯片中的每一个的工作波长为780nm、850nm或940nm。In some embodiments, each of the infrared light source wafer chips has an operating wavelength of 780 nm, 850 nm, or 940 nm.
在某些实施方式中,每一所述工作波长的所述红外光源晶圆芯片的数目包括多个。In some embodiments, the number of the infrared source wafer chips per each of the operating wavelengths comprises a plurality.
在某些实施方式中,所述红外光源还包括驱动元件,所述驱动元件用于选择性驱动至少一个所述红外光源晶圆芯片发光。In some embodiments, the infrared source further includes a drive element for selectively driving at least one of the infrared source wafer chip illumination.
在某些实施方式中,所述驱动元件包括连接每个所述红外光源晶圆芯片与对应驱动源的开关和用于控制所述开关连通和关闭的控制电路。In some embodiments, the drive element includes a switch that connects each of the infrared source wafer chips to a corresponding drive source and a control circuit that controls the switch to communicate and shut down.
本发明实施方式的移动终端,包括上述的虹膜识别模组。The mobile terminal according to the embodiment of the present invention includes the above-described iris recognition module.
在某些实施方式中,所述移动终端包括手机或平板电脑。In some embodiments, the mobile terminal comprises a cell phone or a tablet.
本发明实施方式的红外光源、虹膜识别模组和移动终端,通过在红外光源内设置多个工作波长不同的晶圆,以适用于不同虹膜颜色差异的用户,甚至可适用于不同地区不同场景以及不同设置需求,一来增加了红外光源的适用性,二来提高虹膜识别的效率。The infrared light source, the iris recognition module and the mobile terminal of the embodiment of the invention can be applied to different users of different iris color differences by setting a plurality of wafers with different working wavelengths in the infrared light source, and can even be applied to different scenes in different regions and Different setting requirements increase the applicability of the infrared light source and improve the efficiency of iris recognition.
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。The additional aspects and advantages of the invention will be set forth in part in the description which follows.
附图说明DRAWINGS
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图1是本发明实施方式的红外光源的结构示意图。1 is a schematic structural view of an infrared light source according to an embodiment of the present invention.
图2是本发明某些实施方式的红外光源的结构示意图。2 is a schematic structural view of an infrared light source according to some embodiments of the present invention.
图3是本发明某些实施方式的红外光源的结构示意图。3 is a schematic structural view of an infrared light source according to some embodiments of the present invention.
图4是本发明某些实施方式的移动终端的结构示意图。4 is a schematic structural diagram of a mobile terminal according to some embodiments of the present invention.
具体实施方式Detailed ways
下面详细描述本发明的实施方式,所述实施方式的示例在附图中示出,其中自始至终 相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.
请参阅图1至图4,本发明实施方式的红外光源100,用于虹膜识别模组1000,虹膜识别模组1000包括红外光源100和红外摄像头200。红外摄像头200用于接收作为有效光源的红外光源100发射的红外光在虹膜的反射光线以形成虹膜图像。红外光源100包括基板10、红外光源晶圆芯片20和封装体30。Referring to FIG. 1 to FIG. 4 , the infrared light source 100 of the embodiment of the present invention is used for the iris recognition module 1000 , and the iris recognition module 1000 includes an infrared light source 100 and an infrared camera 200 . The infrared camera 200 is configured to receive reflected light of the infrared light emitted by the infrared light source 100 as an effective light source in the iris to form an iris image. The infrared light source 100 includes a substrate 10, an infrared light source wafer chip 20, and a package body 30.
其中,红外光源晶圆芯片20包括多个,并且至少两个红外光源晶圆芯片的工作波长不同,封装体30用于将红外光源晶圆芯片20封装在基本10上。The infrared light source wafer chip 20 includes a plurality of, and at least two infrared light source wafer chips have different working wavelengths, and the package body 30 is used for packaging the infrared light source wafer chip 20 on the basic 10 .
随着信息安全重要性的提升,越来越多的消费移动终端中对信息进行加密以保护用户的个人信息安全,并在通过相应的验证方式获得获取相应信息与操作的权限。验证方式通常包括有字符密码、图案密码等文字图案密码,然而这种密码通常容易破解,从而使得加密失效。此外,部分移动终端如手机、平板电脑等还提供指纹作为加密方式,用户通过指纹识别进行验证,指纹虽然具有较强的差异性,但易于被他人窃取并制作成如指模等假指纹进行验证,同样不利于信息的安全。在这种情况下,虹膜识别技术作为一种安全性更高的验证方式开始被一些移动终端所采用。With the increasing importance of information security, more and more consumer mobile terminals encrypt information to protect the user's personal information security, and obtain the corresponding information and operation authority through the corresponding verification method. The authentication method usually includes a character pattern password such as a character password or a pattern password. However, such a password is usually easy to crack, thereby invalidating the encryption. In addition, some mobile terminals, such as mobile phones and tablet computers, also provide fingerprints as an encryption method. Users use fingerprint recognition for verification. Although fingerprints have strong differences, they are easily stolen by others and made into fake fingerprints such as fingerprints. It is also not conducive to the security of information. In this case, iris recognition technology has begun to be adopted by some mobile terminals as a more secure verification method.
虹膜识别是通过对比虹膜图像特征之间的相似性来确定用户身份,虹膜信息具有唯一性,并且不易复制,安全性较高。Iris recognition is to determine the identity of the user by comparing the similarities between the features of the iris image. The iris information is unique and difficult to copy and has high security.
虹膜识别一般需要经过虹膜图像获取、虹膜图像处理以及虹膜图像识别的过程。Iris recognition generally requires a process of iris image acquisition, iris image processing, and iris image recognition.
在虹膜图像获取的过程中,需要由专门的虹膜识别模组进行采集,一般地,虹膜识别模组包括摄像头以及光源,其中为保护人眼安全以及获取纹理丰富的虹膜图像,光源选择红外光,相应地,摄像头选择红外摄像头。In the process of iris image acquisition, it needs to be collected by a special iris recognition module. Generally, the iris recognition module includes a camera and a light source. In order to protect the human eye and obtain a rich iris image, the light source selects infrared light. Accordingly, the camera selects an infrared camera.
不用人种的虹膜颜色通常不同,例如欧美白种人的虹膜颜色通常是蓝绿色,而亚洲的黄种人的虹膜颜色通常是黑色。不同颜色的虹膜对同一工作波长的响应效率及效果均是不同的,例如对于蓝绿色的虹膜采用700nm波长的可见光也可获取虹膜图像,然而对于黑色的虹膜来说,则无法成像。The color of the iris that is not used by people is usually different. For example, the iris color of European and American white people is usually blue-green, while the iris color of Asian yellow people is usually black. The irises of different colors have different response efficiencies and effects at the same working wavelength. For example, for the cyan iris, the iris image can be obtained by using visible light of 700 nm wavelength, but for the black iris, it cannot be imaged.
可以理解,当虹膜识别模组中仅设置单一工作波长的红外光源时,通常是折中选择,对于某一特定颜色的虹膜来说,都不是最佳选择。It can be understood that when only the infrared light source of a single working wavelength is set in the iris recognition module, it is usually a compromise selection, which is not the best choice for an iris of a specific color.
本发明实施方式的红外光源100,包括有多个红外光源晶圆芯片20,并且至少两个红外光源晶圆芯片20的工作波长不同,如此,可根据用户虹膜的实际情况,选择与虹膜颜色相匹配的最佳工作波长的红外光源晶圆芯片20发射红外光,从而获取效果更佳的虹膜图像。The infrared light source 100 of the embodiment of the present invention includes a plurality of infrared light source wafer chips 20, and at least two infrared light source wafer chips 20 have different working wavelengths. Thus, the color of the iris can be selected according to the actual situation of the user's iris. The matched optimal operating wavelength of the infrared source wafer chip 20 emits infrared light to obtain a better iris image.
基板10用于为红外光源100提供支撑。红外光源晶圆芯片20以预定方式设置在基板10上。可以理解,晶圆决定了红外光源的工作波长。设置在基板10上的红外光源晶圆芯片20至少提供两种不同工作波长,当然也可以根据实际需求提供两种以上工作波长的红外光源晶圆芯片20,在此不做限制。如此,可满足不同用户虹膜特征的需求。例如,在某些示例中,红外光源晶圆芯片20的工作波长包括780nm、850nm和940nm。其中,工作波长为780nm的红外光对于蓝绿色虹膜在虹膜识别过程中效果更佳。而850nm的红外光对于黑色虹膜在虹膜识别过程中效果更佳。940nm的红外光在能够有效对于虹膜成像提供有效光 源的同时不被人眼可见,用户体验更佳。多种工作波长的晶圆的工作状态也即是开启或关闭可根据实际使用过程中用户的具体情况或使用环境等,由用户选择或设置通过移动终端控制进行选择性开启。The substrate 10 is used to provide support for the infrared light source 100. The infrared light source wafer chip 20 is disposed on the substrate 10 in a predetermined manner. It can be understood that the wafer determines the operating wavelength of the infrared source. The infrared light source wafer chip 20 disposed on the substrate 10 provides at least two different operating wavelengths. Of course, the infrared light source wafer chip 20 of two or more working wavelengths can be provided according to actual needs, which is not limited herein. In this way, the needs of different users' iris characteristics can be met. For example, in some examples, the operating wavelengths of the infrared source wafer chip 20 include 780 nm, 850 nm, and 940 nm. Among them, the infrared light with a working wavelength of 780 nm is better for the blue-green iris in the iris recognition process. The 850 nm infrared light is better for the iris recognition process in the iris recognition process. The 940nm infrared light is effective in providing effective light source for iris imaging without being visible to the human eye, and the user experience is better. The working state of the wafers of various working wavelengths is also turned on or off. According to the specific conditions of the user or the use environment during the actual use, the user can select or set the selective opening by the mobile terminal control.
封装体30可以是胶体、树脂等材料,其上表面与晶圆上表面平齐,封装体30还包括覆盖晶圆上表面的透明盖板,以作为红外光的发射窗口,盖板可以采用一般的塑料、玻璃等具有良好透射性能的材料,也可采用能够对红外光进行散射的透镜,从而加大红外光的工作范围。The package body 30 may be a material such as a colloid or a resin, and the upper surface thereof is flush with the upper surface of the wafer. The package body 30 further includes a transparent cover plate covering the upper surface of the wafer to serve as an emission window for infrared light, and the cover plate may be generally used. Plastic, glass and other materials with good transmission properties, can also use a lens that can scatter infrared light, thereby increasing the working range of infrared light.
红外光源晶圆芯片20经封装体30封装后,形成红外光源100,红外光源100可通过板对板连接器与移动终端的主板进行连接,并由移动终端的主电源为其进行供电。多个红外光源晶圆芯片20共同封装于同一封装体30内,也即是说,红外光源100为单一模组的光源。多个红外光源晶圆芯片20的光轴可与红外摄像头200的光轴平行,也可与红外摄像头200的光轴呈一定的夹角。The infrared light source wafer chip 20 is encapsulated by the package body 30 to form an infrared light source 100. The infrared light source 100 can be connected to the main board of the mobile terminal through a board-to-board connector, and is powered by the main power source of the mobile terminal. The plurality of infrared light source wafer chips 20 are collectively packaged in the same package 30, that is, the infrared light source 100 is a single module light source. The optical axes of the plurality of infrared light source wafer chips 20 may be parallel to the optical axis of the infrared camera 200 or may be at an angle to the optical axis of the infrared camera 200.
虹膜识别模组1000通常用于对当前使用移动终端的用户的身份进行识别,因此虹膜识别模组1000通常前置,也即是设置在移动终端的前面板,例如设置于前面板顶端。The iris recognition module 1000 is generally used to identify the identity of the user currently using the mobile terminal. Therefore, the iris recognition module 1000 is generally pre-positioned, that is, disposed on the front panel of the mobile terminal, for example, at the top of the front panel.
综上所述,本发明实施方式的红外光源100和虹膜识别模组1000,通过在红外光源100内设置多个工作波长不同的晶圆,以适用于不同虹膜颜色差异的用户,甚至可适用于不同地区不同场景以及不同设置需求,一来增加了红外光源100的适用性,二来提高虹膜识别的效率。In summary, the infrared light source 100 and the iris recognition module 1000 of the embodiment of the present invention can be applied to different users of different iris color differences by providing a plurality of wafers having different working wavelengths in the infrared light source 100, and can even be applied to Different scenes and different setting requirements in different regions have increased the applicability of the infrared light source 100, and secondly, improved the efficiency of iris recognition.
在某些实施方式中,移动终端包括手机、平板电脑及智能穿戴设备等。此外,虹膜识别模组1000还可用于智能家居设备及消费级无人机等设备,在此不做限制。In some embodiments, the mobile terminal includes a mobile phone, a tablet, a smart wearable device, and the like. In addition, the iris recognition module 1000 can also be used for devices such as smart home devices and consumer-grade drones, and is not limited herein.
在某些实施方式中,基板10呈环状、多个红外光源晶圆芯片20沿基板10的圆周方向分布,且封装体30呈与基板10对应的环状以使红外光源100呈环状。In some embodiments, the substrate 10 is annular, and the plurality of infrared light source wafer chips 20 are distributed along the circumferential direction of the substrate 10, and the package 30 has an annular shape corresponding to the substrate 10 to make the infrared light source 100 annular.
在这样的实施方式中,红外摄像头200设置在红外光源100内侧。In such an embodiment, the infrared camera 200 is disposed inside the infrared source 100.
具体地,基板10可以是圆环状也可以是矩形环形等结构。一般地,为了用户的安全,红外光源100的功率会在一定程度上进行限制,因此晶圆的有效工作距离通常为10-30厘米,在有效工作范围内红外摄像头200能较为清晰的获取虹膜图像。当红外摄像头200位于红外光源100内侧时,呈圆环状分布的多个红外光源晶圆芯片20中的每个到红外摄像头200的传感器的距离基本相同,各个晶圆的工作距离也基本相同。Specifically, the substrate 10 may have a ring shape or a rectangular ring shape. Generally, for the safety of the user, the power of the infrared light source 100 is limited to a certain extent, so the effective working distance of the wafer is usually 10-30 cm, and the infrared camera 200 can obtain the iris image more clearly within the effective working range. . When the infrared camera 200 is located inside the infrared light source 100, the distance from each of the plurality of infrared light source wafer chips 20 distributed in a ring shape to the sensors of the infrared camera 200 is substantially the same, and the working distances of the respective wafers are also substantially the same.
矩形环状易于制造但仅能允许有限数量的晶圆到红外摄像头200的传感器的距离基本相同,不同晶圆的工作距离可能不同,因此操作中,在启动不同工作波长的红外光源晶圆芯片20时,用户可能会适当调节工作距离。The rectangular ring is easy to manufacture but only allows a limited number of wafers to be substantially the same distance from the sensors of the infrared camera 200. The working distances of different wafers may be different. Therefore, in operation, the infrared light source wafer chip 20 at different working wavelengths is activated. The user may adjust the working distance as appropriate.
封装体30与基板10的形状对应,也即是呈圆环状或环装结构,如此,结构紧凑,并 能够为红外摄像头200预留位置。The package body 30 corresponds to the shape of the substrate 10, that is, in an annular or ring-shaped structure, so that the structure is compact and the position of the infrared camera 200 can be reserved.
在某些实施方式中,红外光源晶圆芯片20包括红外LED晶圆。In some embodiments, the infrared source wafer chip 20 includes an infrared LED wafer.
LED晶圆拥有较佳的热学性能、电性能、光学性能和机械性能,并且易于制造,价格低廉。LED wafers have better thermal, electrical, optical and mechanical properties, are easy to manufacture, and are inexpensive.
多个红外LED晶圆由封装体30封装后形成一个LED红外光源组件,或者说一个LED红外灯封装中包括多个红外LED晶圆,而非多个LED红外光源组件或多个LED红外灯封装。A plurality of infrared LED wafers are packaged by the package 30 to form an LED infrared light source component, or an LED infrared light package includes a plurality of infrared LED wafers instead of multiple LED infrared light source components or multiple LED infrared light packages. .
在某些实施方式中,每一工作波长的红外光源晶圆芯片20的数目包括多个。In some embodiments, the number of infrared light source wafer chips 20 per operating wavelength includes a plurality.
具体地,对应一种工作波长的红外光源晶圆芯片20的数目包括多个,如此,可根据使用环境等相关条件开启同一工作波长的一个或多个晶圆从而提供不同的红外光强度。例如在周围光环境干扰较强时,可开启多个晶圆提高发射强度,以使得红外摄像头200能够获得清晰的虹膜图像,但开启多个晶圆的功耗较高,元件发热量也较大,因此,在光环境等条件较佳时仅开启一个晶圆工作即可。Specifically, the number of the infrared light source wafer chips 20 corresponding to one working wavelength includes a plurality of, so that one or more wafers of the same working wavelength can be turned on according to relevant conditions such as the use environment to provide different infrared light intensities. For example, when the ambient light environment is relatively strong, multiple wafers can be turned on to increase the emission intensity, so that the infrared camera 200 can obtain a clear iris image, but the power consumption of turning on multiple wafers is high, and the heat generation of the components is also large. Therefore, it is only necessary to turn on one wafer operation when the conditions such as the light environment are good.
在某些实施方式中,每一工作波长的红外光源晶圆芯片的数目相同或不同。In some embodiments, the number of infrared source wafer chips per operating wavelength is the same or different.
具体地,当工作波长较短时,例如780nm时,对蓝绿色的虹膜效果更佳,而对于蓝绿色的虹膜使用可见光的补光灯也能够成为有效光源,甚至使用波长更长的红外光也能够成为有效光源,而波长较长例如850nm的红外光对应的黑色虹膜仅能在当前波长或更长波长的照射下对虹膜成像,并且易受环境的影响。因此,波长越长的红外晶圆设置的个数越多,既能满足不同工作状况开启多个红外光源晶圆芯片20也可满足多级功耗的需求。Specifically, when the working wavelength is short, for example, 780 nm, the blue-green iris effect is better, and for the blue-green iris, the visible light supplement light can also be an effective light source, even using longer wavelength infrared light. It can be an effective light source, and a black iris corresponding to a longer wavelength, for example, 850 nm, can only image the iris at the current wavelength or longer, and is susceptible to the environment. Therefore, the longer the wavelength of the infrared wafer is set, the more the infrared light source wafer chip 20 can be opened to meet the different working conditions, and the multi-level power consumption can be satisfied.
在某些实施方式中,红外光源100还包括驱动元件,驱动元件用于选择性驱动至少一个红外光源晶圆芯片发光。In some embodiments, the infrared source 100 further includes a drive element for selectively driving at least one infrared source wafer chip illumination.
在这样的实施方式中,驱动元件包括开关和控制电路,其中开关用于连接每个红外光源晶圆芯片20与对应驱动源,控制电路用于控制开关连通和关闭。In such an embodiment, the drive element includes a switch and a control circuit, wherein the switch is used to connect each of the infrared source wafer chips 20 with a corresponding drive source for controlling the switch to communicate and close.
可以理解,多个红外光源晶圆芯片20的工作波长不同,根据用户选择或使用情况选择开启部分晶圆以发射红外光,通过控制开关的通断来控制相应的晶圆与驱动源通断,可实现对晶圆的控制。It can be understood that the operating wavelengths of the plurality of infrared light source wafer chips 20 are different, and part of the wafers are selected to emit infrared light according to user selection or use, and the corresponding wafer and the driving source are controlled to be turned on and off by controlling the switching of the switches. Control of the wafer is possible.
在本说明书的描述中,参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. The specific features, structures, materials or characteristics described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本发明的实施方式,本领域的普通技术人员可以理解:在不脱 离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims (18)

  1. 一种红外光源,用于虹膜识别,其特征在于,所述红外光源包括:An infrared light source for iris recognition, characterized in that the infrared light source comprises:
    基板;Substrate
    设置在所述基板上的多个红外光源晶圆芯片,至少两个所述红外光源晶圆芯片的工作波长不同;和a plurality of infrared light source wafer chips disposed on the substrate, at least two of the infrared light source wafer chips having different operating wavelengths; and
    将所述红外光源晶圆芯片封装在所述基板上的封装体。The infrared light source wafer chip is packaged on a package on the substrate.
  2. 如权利要1所述的红外光源,其特征在于,所述基板呈环状、所述多个红外光源晶圆芯片沿所述基板的圆周方向分布且所述封装体呈与所述基板对应的环状以使所述红外光源呈环状。The infrared light source according to claim 1, wherein the substrate is annular, the plurality of infrared light source wafer chips are distributed along a circumferential direction of the substrate, and the package body corresponds to the substrate The ring shape is such that the infrared light source is annular.
  3. 如权利要求2所述红外光源,其特征在于,所述基板呈圆环或矩形环状。The infrared light source according to claim 2, wherein said substrate has a circular or rectangular ring shape.
  4. 如权利要求1所述的红外光源,其特征在于,所述红外光源晶圆芯片包括红外LED晶圆芯片。The infrared light source of claim 1 wherein said infrared source wafer chip comprises an infrared LED wafer chip.
  5. 如权利要求1所述的红外光源,其特征在于,所述红外光源晶圆芯片中的每一个的工作波长为780nm、850nm或940nm。The infrared light source of claim 1 wherein each of said infrared source wafer chips has an operating wavelength of 780 nm, 850 nm or 940 nm.
  6. 如权利要求1所述的红外光源,其特征在于,每一所述工作波长的所述红外光源晶圆芯片的数目包括多个。The infrared light source of claim 1 wherein the number of said infrared source wafer chips per operating wavelength comprises a plurality.
  7. 如权利要求1所述的红外光源,其特征在于,所述红外光源还包括驱动元件,所述驱动元件用于选择性驱动至少一个所述红外光源晶圆芯片发光。The infrared light source of claim 1 wherein said infrared source further comprises a drive element for selectively driving at least one of said infrared source wafer chip illumination.
  8. 如权利要求7所述的红外光源,其特征在于,所述驱动元件包括连接每个所述红外光源晶圆芯片与对应驱动源的开关和用于控制所述开关连通和关闭的控制电路。The infrared light source of claim 7 wherein said drive element comprises a switch connecting each of said infrared source wafer chips to a corresponding drive source and a control circuit for controlling said switch to communicate and deactivate.
  9. 一种虹膜识别模组,其特征在于,所述虹膜识别模组包括:An iris recognition module, wherein the iris recognition module comprises:
    红外光源,所述红外光源包括:基板、多个红外光源晶圆芯片和封装体;An infrared light source, the infrared light source comprising: a substrate, a plurality of infrared light source wafer chips and a package;
    所述多个红外光源晶圆芯片设置在所述基板上,至少两个所述红外光源晶圆芯片的工作波长不同;和The plurality of infrared light source wafer chips are disposed on the substrate, and at least two of the infrared light source wafer chips have different operating wavelengths; and
    封装体用于将所述红外光源晶圆芯片封装在所述基板上;和a package for encapsulating the infrared light source wafer chip on the substrate; and
    红外摄像头,用于接收所述红外光源发射的红外光在虹膜的反射光线以形成虹膜图像。The infrared camera is configured to receive the reflected light of the infrared light emitted by the infrared light source in the iris to form an iris image.
  10. 如权利要求9所述的虹膜识别模组,其特征在于,所述基板呈环状、所述多个红外光源晶圆芯片沿所述基板的圆周方向分布且所述封装体呈与所述基板对应的环状以使所述红外光源呈环状,所述红外摄像头设置在所述红外光源内侧。The iris recognition module according to claim 9, wherein the substrate is annular, the plurality of infrared light source wafer chips are distributed along a circumferential direction of the substrate, and the package is formed with the substrate A corresponding ring shape is used to make the infrared light source annular, and the infrared camera is disposed inside the infrared light source.
  11. 如权利要求10所述的虹膜识别模组,其特征在于,所述基板呈圆环或矩形环状。The iris recognition module according to claim 10, wherein the substrate has a circular or rectangular ring shape.
  12. 如权利要求9所述的虹膜识别模组,其特征在于,所述红外光源晶圆芯片包括红外LED晶圆芯片。The iris recognition module of claim 9, wherein the infrared light source wafer chip comprises an infrared LED wafer chip.
  13. 如权利要求9所述的虹膜识别模组,其特征在于,所述红外光源晶圆芯片中的每一个的工作波长为780nm、850nm或940nm。The iris recognition module according to claim 9, wherein each of said infrared light source wafer chips has an operating wavelength of 780 nm, 850 nm or 940 nm.
  14. 如权利要求9所述的虹膜识别模组,其特征在于,每一所述工作波长的所述红外光源晶圆芯片的数目包括多个。The iris recognition module of claim 9, wherein the number of the infrared light source wafer chips of each of the working wavelengths comprises a plurality.
  15. 如权利要求9所述的虹膜识别模组,其特征在于,所述红外光源还包括驱动元件,所述驱动元件用于选择性驱动至少一个所述红外光源晶圆芯片发光。The iris recognition module of claim 9 wherein said infrared source further comprises a drive element for selectively driving at least one of said infrared source wafer chip illumination.
  16. 如权利要求15所述的虹膜识别模组,其特征在于,所述驱动元件包括连接每个所述红外光源晶圆芯片与对应驱动源的开关和用于控制所述开关连通和关闭的控制电路.The iris recognition module according to claim 15, wherein said driving element comprises a switch connecting each of said infrared light source wafer chips and a corresponding driving source, and a control circuit for controlling said switch to communicate and close .
  17. 一种移动终端,其特征在于,包括:A mobile terminal, comprising:
    虹膜识别模组,所述虹膜识别模组包括:红外光源,所述红外光源包括:基板、多个红外光源晶圆芯片和封装体;An iris recognition module, the iris recognition module includes: an infrared light source, the infrared light source includes: a substrate, a plurality of infrared light source wafer chips, and a package;
    所述多个红外光源晶圆芯片设置在所述基板上,至少两个所述红外光源晶圆芯片的工作波长不同;和The plurality of infrared light source wafer chips are disposed on the substrate, and at least two of the infrared light source wafer chips have different operating wavelengths; and
    封装体用于将所述红外光源晶圆芯片封装在所述基板上;和a package for encapsulating the infrared light source wafer chip on the substrate; and
    红外摄像头,用于接收所述红外光源发射的红外光在虹膜的反射光线以形成虹膜图像。The infrared camera is configured to receive the reflected light of the infrared light emitted by the infrared light source in the iris to form an iris image.
  18. 如权利要求17所述的移动终端,其特征在于,所述移动终端包括手机或平板电脑。The mobile terminal of claim 17, wherein the mobile terminal comprises a mobile phone or a tablet.
PCT/CN2018/094010 2017-07-07 2018-07-02 Infrared light source, iris recognition module, and mobile terminal WO2019007304A1 (en)

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