KR20100118681A

KR20100118681A - Menufacthuring method of touch panel sensor and touch panel sensor

Info

Publication number: KR20100118681A
Application number: KR1020090037492A
Authority: KR
Inventors: 남동식
Original assignee: 남동식
Priority date: 2009-04-29
Filing date: 2009-04-29
Publication date: 2010-11-08

Abstract

PURPOSE: A manufacturing method of a touch panel sensor and the touch panel sensor thereof are provided to prevent the location of a connecting FPCB from changing or deviating, thereby effectively preventing electrical shortcuts and malfunctions due to a location change. CONSTITUTION: A sensor insulation substrate(110) includes a sensor pattern and a first electrode pattern for connecting the sensor pattern with the outside. A connecting FPCB(Flexible Printed Circuit Board)(120) includes a second electrode pattern corresponding to the first electrode pattern and a wire pattern connected to the second electrode pattern. A bonding member is interposed between the sensor insulation substrate and the connecting FPCB. The bonding member includes an insulation bonding pattern(132). The insulation bonding pattern surrounds the ends of the first and second electrode patterns which are connected each other.

Description

Manufacturing Method of Touch Panel Sensor and Touch Panel Sensor {MENUFACTHURING METHOD OF TOUCH PANEL SENSOR AND TOUCH PANEL SENSOR}

The present invention relates to a method for manufacturing a touch panel sensor and a touch panel sensor, and more particularly, a flexible board for connection that is electrically connected to an insulating substrate for a sensor of the touch panel sensor and transmits a sensing signal generated from the touch panel sensor to the outside. The present invention relates to a method for manufacturing a touch panel sensor and a touch panel sensor capable of solidifying a combination thereof.

Typical touch screens electrically detect the contact of a finger. A finger is a kind of conductor through which electricity can collect, and when a finger comes close to an electrode, an electric charge can be collected between the electrode and the finger. As the charge is collected, it becomes possible to measure the capacitance or capacitance between the finger and the electrode, which can be used to indirectly detect the touch of the finger.

In addition, since the touch screen should not cover the rear display module, the electrode of the touch screen may be formed of a transparent transparent electrode material, for example, indium tin oxide (ITO) or the like while electricity flows.

1 is an exploded perspective view illustrating a conventional touch screen.

Referring to FIG. 1, the touch screen is a voltage type of a conventional touch screen, and includes an upper transparent film 20 and a lower transparent film 30, and an upper transparent film 20 and a lower transparent film 30. The first transparent conductive pattern 22 and the second transparent conductive pattern 32 are formed on both surfaces facing each other.

The second transparent conductive pattern 32 includes a horizontal voltage detector 34 for detecting position information in the horizontal direction and a pattern connector 36 positioned outside the horizontal voltage detector 34, and the horizontal voltage detector The 34 and the pattern connection part 36 may extend to the lower connection part 38 to be connected to the electrode 52 of the FPCB 50.

The first transparent conductive pattern 22 is formed on the bottom of the upper transparent film 20 to face the second transparent conductive pattern 32. The first transparent conductive pattern 22 includes a vertical voltage detector for detecting position information in the vertical direction, and the vertical voltage detector is formed on the entire bottom surface of the upper transparent film 20. The conductive pattern of the vertical voltage sensing unit extends to the left and right center portions of the film for electrical connection with the pattern connection unit 36, and a conductive bump 24 formed of a material such as silver epoxy is formed at the end of the extended conductive pattern.

The upper transparent film 20 and the lower transparent film 30 are positioned so that the transparent conductive patterns face each other, and the electrode 52 of the FPCB 50 is correspondingly fixed to the lower connection portion 38. In addition, the ACF film 42 is positioned at one side of the pattern connection part 36 corresponding to the conductive bump 24, and the other ACF film 44 is also placed at the lower connection part 38 connected to the FPCB 50. Position it.

Here, the anisotropic conductive film (ACF), that is, the ACF films 42 and 44 is a uniform dispersion of conductive fine particles in a film-like adhesive. Is an insulating material for an electrical anisotropy, and is connected to tape automated bonding (TAB) or chip on film (COF) and ITO electrode or printed wiring board (PWB) on LCD panel, LCD driver IC It is widely used for connecting ITO electrodes (Chip On Glass, COG) on LCD panels.

After laminating the upper transparent film 20 and the lower transparent film 30 up and down, the parts connected by the lower connection portion 38 and the conductive bumps 24 connected to the FPCB 50 are compressed by heat and pressure. can do. Through partial compression, the ACF films 42 and 44 electrically connect the conductive bumps 24 and the ends of the pattern connecting portions 36, and the electrodes 52 and the second transparent conductive patterns 32 of the FPCB 50 are electrically connected. The lower connection part 38 of can be electrically connected.

Here, the FPCB 50 is disposed between both films to electrically connect the electrode 52 of the FPCB 50 and the second transparent conductive pattern 32 to the ACF film 44 around the FPCB 50. By the lower transparent film 30.

On the other hand, although the ACF films 42 and 44 have adhesive properties, the FPCB 50 interposed between the upper transparent film 20 and the lower transparent film 30 is in contact with the lower transparent film 30 during use. The binding force may be lowered, and when the lowering of the binding force occurs, a failure due to a poor contact may be caused. In particular, the FPCB 50 may be pulled out by the peripheral tension.

Even if the FPCB 50 is not pulled out, since the FPCB 50 is adhered to the lower transparent film 30 depending only on the adhesiveness of the ACF film 44 between the two substrates, the touch panel sensor may be easily used. Deviation from the original position may occur, and electrical short-circuits due to this position change and resulting electrical malfunction may occur.

In addition, ACF films 42 and 44 generally have a thickness of 15 to 35 um and a 1.0 to 5.0 mm film (tape) in which conductive particles such as metal particles having a diameter of 3 to 15 um, molten metal powder, and metal plating resin particles are dispersed in an adhesive. It is manufactured in the form of), and thermosetting resins such as epoxy and urethane are mainly used as adhesives. This is more reliable than conventional adhesives using thermoplastic resins, such as a small change in resistance even under high temperature and high humidity conditions, but corrosion occurs when exposed to moisture for a long time, resulting in electrical short circuit and touch panel sensor. Problems with electrical malfunctions can occur.

The present invention provides a method for manufacturing a touch panel sensor and a touch panel sensor capable of preventing the positional change or departure of the flexible substrate for connection to transfer the detection signal of the touch panel sensor to the outside.

The present invention provides a touch panel sensor for electrically connecting a flexible substrate for transmitting a detection signal of the touch panel sensor to the outside and an electrical insulating portion of the sensor insulating board to prevent corrosion by being exposed to moisture for a long time. It provides a manufacturing method and a touch panel sensor.

According to an exemplary embodiment of the present invention for achieving the above object of the present invention, the manufacturing method of the touch panel sensor provided adjacent to the display module of the personal mobile terminal is for connecting the sensor pattern and the sensor pattern and the outside. Providing an insulating substrate for a sensor having a first electrode pattern formed thereon, and a flexible substrate for connecting a second electrode pattern corresponding to the first electrode pattern and a wire pattern electrically connected to the second electrode pattern; Forming an insulating adhesive pattern formed on one surface of the flexible substrate for connection, and surrounding the periphery of the ends of the first electrode pattern or the second electrode pattern electrically connected to each other; and the first electrode pattern and the second electrode. Bonding the insulating substrate for the sensor and the flexible substrate for connection so that the ends of the electrode pattern are electrically connected to each other.

The touch panel sensor manufactured by the manufacturing method according to the present invention includes conductive particles such as metal particles, molten metal powder, metal plated resin particles, and the like in the process of bonding the insulator substrate for the sensor and the flexible substrate for connection. Unlike the case of bonding using a dispersion dispersed in the adhesive, by bonding only using an insulating adhesive such as a thermosetting resin such as epoxy, urethane, etc., the bonding between the sensor substrate and the flexible substrate for connection can be improved. Therefore, it is possible to effectively prevent an electrical short circuit caused by the position change of the flexible board for connection during use of the touch panel sensor and a malfunction that may occur due to this.

In addition, since the first and second electrode patterns are surrounded by the insulating adhesive pattern, and thus the electrical connection parts are not exposed to the outside, the connection parts are not exposed to moisture for a long time, thereby preventing corrosion from moisture. Even if a device using a touch panel sensor manufactured according to the method is used for a long time, an electrically stable connection can be maintained continuously.

In some cases, the insulating substrate for the sensor and the flexible substrate for forming the above-described insulating adhesive pattern may be formed on one surface of the substrate, and the first electrode pattern or the second electrode pattern may be positioned inside the insulating adhesive pattern. A conductive adhesive pattern may be further formed at the end.

Thus, even if a gap is generated between the first and second electrode patterns by the insulating adhesive pattern, the gap may be easily filled by the conductive adhesive pattern, and the positive electrode patterns may be electrically connected stably.

For reference, the insulating adhesive pattern and the conductive adhesive pattern may be formed by printing or silk screening on different surfaces of the sensor insulating substrate and the connecting flexible substrate, respectively.

In addition, as described above, the insulating adhesive pattern and the conductive adhesive pattern may be formed on different substrates of the sensor insulating substrate and the connecting flexible substrate, respectively, but the method of printing or silk screen printing the insulating adhesive pattern on any one substrate The conductive adhesive pattern may be formed in the insulating adhesive pattern by an injection or dropping method and formed on the same substrate.

In the manufacturing method of the touch panel sensor and the touch panel sensor of the present invention, in the process of bonding the insulated substrate for the sensor and the flexible substrate for connection, the conductive particles such as metal particles, molten metal powder, metal plated resin particles, and the like may be used. Unlike the case of bonding using a dispersion dispersed in the adhesive, by bonding only using an insulating adhesive such as a thermosetting resin such as epoxy, urethane, etc., the bonding property of the sensor insulating substrate and the connecting flexible substrate can be further improved. Therefore, it is possible to effectively prevent an electrical short circuit caused by the position change of the flexible board for connection during use of the touch panel sensor and a malfunction that may occur due to this.

In the method of manufacturing the touch panel sensor and the touch panel sensor of the present invention, since the first and second electrode pattern portions electrically connected to each other are surrounded by an insulating adhesive pattern and the electrical connection portions are not exposed to the outside, the connection portions are exposed to moisture for a long time. Corrosion can be prevented by not being exposed to moisture, and thus an electric stable connection can be continuously maintained even when using a device to which a touch panel sensor manufactured according to the above-described manufacturing method is used for a long time.

The method of manufacturing the touch panel sensor and the touch panel sensor of the present invention can effectively prevent the adjacent electrodes from being electrically connected by forming a conductive adhesive pattern inside the insulating adhesive pattern.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by quoting contents described in other drawings under such a rule, and the contents repeated or deemed apparent to those skilled in the art may be omitted.

Example 1

2 is an exploded perspective view of a touch panel sensor according to a first exemplary embodiment of the present invention, and FIG. 3 is a cross-sectional view of the touch panel sensor of FIG. 2 taken along the A-A direction.

2 and 3, the touch panel sensor 100 includes an insulator substrate 110 for a sensor, a flexible substrate 120 for connection, an adhesive member 130, a connection member 140, and a cover substrate 150. It includes.

The lower sensor pattern 112 and the first electrode pattern 113 are formed on the sensor insulating substrate 110.

The first electrode pattern 113 externally receives an electrical signal of an internal electrode pattern 114 for connecting the lower sensor pattern 112 to the outside and an upper signal pattern 152 formed on the bottom surface of the cover substrate 150 to be described later. The external electrode pattern 115 is transferred to the external electrode pattern 115, and the external electrode pattern 115 is formed outside the internal electrode pattern 114.

For reference, the lower sensor pattern 112 is disposed to detect horizontal position information of the user who is touched by the touch panel sensor 100, and the upper sensor pattern 152 is configured by the user who is touched by the touch panel sensor 100. It may be arranged to detect the position information in the vertical direction.

On the other hand, the connecting flexible substrate 120 is formed with a second electrode pattern 124 corresponding to the first electrode pattern 113 and a wire pattern 122 electrically connected to the second electrode pattern 124.

The adhesive member 130 is interposed between the sensor insulating substrate 110 and the flexible substrate 120 for connection, and the periphery of the ends of the first electrode pattern 113 and the second electrode pattern 124 electrically connected to each other. It includes an insulating adhesive pattern 132 formed to surround the. As the insulating adhesive pattern 132, an insulating adhesive such as thermosetting resin such as epoxy or urethane may be used as the material.

The connection member 140 is interposed between the sensor insulating substrate 110 and the connection flexible substrate 120, and is formed in the adhesive member 130 to be positioned inside the insulating adhesive pattern 132. 142). The conductive adhesive pattern 142 may use silver epoxy as its material, and in some cases, a material similar to an ACF film in which conductive particles such as metal particles, molten metal powder, and metal plating resin particles are dispersed in an adhesive such as epoxy or urethane. You can also use

The cover substrate 150 is disposed to cover the sensor insulating substrate 110, and an upper sensor pattern 152 is formed on a bottom thereof, and the electrical signal generated from the upper sensor pattern 152 is an insulating substrate 110 for the sensor. The first electrode pattern 113 formed on the upper surface of the first electrode pattern 113 is transmitted to the outside (in this embodiment, refers to the wire pattern of the flexible printed circuit board).

For reference, the upper sensor pattern 152 is electrically connected to the upper electrode pattern 153 extending to the left and right central portions of the cover substrate 150 on the bottom surface of the cover substrate 150 for electrical connection with the external electrode pattern 115. The upper electrode pattern 153 may transmit the electric signal transmitted from the upper sensor pattern 152 to the external electrode pattern 115 by a conductive bump 154 formed of a conductive material.

When the touch panel sensor 100 is disposed on the display module, the sensor insulating substrate 110 and the cover substrate 150 are made of a transparent material so as not to block light emitted from the display module located on the rear surface. It can be formed using materials such as plastic and glass such as polyethylene, polypropylene, acrylloyl, polyethylene terephthalate (PET), and using insulating substrates without using transparent materials. It may be used in a pointing device using a touch pad or a stylus fan used in a notebook. In the case of the flexible substrate 120 for connection, it is not necessary to transmit light, but it may be manufactured using a synthetic resin having flexibility.

In addition, in the case of the lower and upper sensor patterns 112 and 152, indium tin oxide (ITO) or indium zinc oxide (IZO) having both translucency and conductivity as its material so as not to block light emitted from the display module located on the rear surface thereof. Or the like, and when light transmittance is not required, various metals or alloys such as gold, silver, and aluminum, which have conductivity, may be used as the material.

For reference, since the first electrode pattern 113, the upper electrode pattern 153, and the second electrode pattern 124 are located at the edge of the touch panel sensor 100, no light transmissivity is required. The wire pattern 122 of the substrate 120 also does not require light transmission. Various metals, alloys, etc., such as gold, silver, and aluminum which have electroconductivity can be used for this.

Hereinafter, a manufacturing method for manufacturing the touch panel sensor illustrated in FIG. 2 will be described in detail with reference to FIGS. 4 and 5.

4 is a perspective view of an insulating substrate for a sensor among the components of the touch panel sensor according to the present invention. As shown in FIG. 4, an insulating substrate 110 for a sensor on which the lower sensor pattern 112 and the first electrode pattern 113 are formed is provided. Thereafter, as shown in FIG. 4, a method of printing or silkscreening the upper surface of the sensor insulating substrate 110 to surround the end of the first electrode pattern 113 formed on the sensor insulating substrate 110 is performed. Through insulating adhesive pattern 132 is formed. In this case, the insulating adhesive pattern 132 is formed to be integrally connected to surround the periphery of each end of the inner and outer electrode patterns 114 and 115 constituting the first electrode pattern 213.

5 is a rear perspective view of a flexible substrate for connection among components of a touch panel sensor according to the present invention. As shown in FIG. 5, a second electrode pattern 124 and a wire pattern 122 are provided on a bottom surface thereof. The flexible substrate 120 is prepared. Subsequently, as shown in FIG. 5, the conductive adhesive pattern 142 is formed on the second electrode pattern 124 on the bottom of the flexible flexible substrate 120 to correspond to the inside of the insulating adhesive pattern 132. do. In this case, the conductive adhesive pattern 142 may be formed through the same printing or silkscreen method as the insulating adhesive pattern 132.

As described above, after forming the conductive adhesive pattern 142 and the insulating adhesive pattern 132, respectively, as shown in FIG. 2, end portions of the first electrode pattern 113 and the second electrode pattern 124 are formed. Bonding the insulating substrate for sensor 110 and the flexible substrate 120 for connection so as to be electrically connected. In this case, the end of the second electrode pattern 124 is positioned inside the insulating adhesive pattern 132, so that the conductive adhesive pattern 142 formed at the end of the second electrode pattern 124 is the first electrode pattern 113. It is to be electrically connected to the end of the.

Thereafter, the cover substrate 150 covering the sensor insulating substrate 110 may be covered to manufacture the touch panel sensor 100.

Example 2

Components of the touch panel sensor according to the present exemplary embodiment are substantially the same as the touch panel sensor described with reference to FIGS. 2 to 5, and thus, in the present exemplary embodiment, the insulating adhesive pattern and the conductive adhesive pattern are formed in different ways from those of the previous exemplary embodiment. The description will be made in the center, and the description of the other components of the touch panel sensor may be referred to the description and drawings of the touch panel sensor of the above embodiment, and repeated descriptions thereof will be omitted.

6 is an exploded perspective view of a touch panel sensor according to a second exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view of the touch panel sensor of FIG. 6 taken along the A-A direction.

6 and 7, the touch panel sensor 200 includes an insulating substrate 210 for a sensor, a flexible substrate 220 for connection, an adhesive member 230, a connection member 240, and a cover substrate 250. It includes.

In particular, unlike the first embodiment described above, the insulating adhesive pattern 232 and the conductive adhesive pattern 242 are formed on the same sensor insulating substrate 210. In this embodiment, the adhesive pattern 232 and the conductive adhesive pattern 242 are formed together on the sensor insulating substrate 210, but in some cases, the insulating adhesive pattern and the conductive adhesive pattern are formed on the flexible substrate 220 for connection. It is also possible to form together.

Hereinafter, a manufacturing method for manufacturing the touch panel sensor illustrated in FIGS. 6 and 7 will be described in detail with reference to FIGS. 8 to 10.

FIG. 8 is a perspective view of an insulating substrate for a sensor among the components of the touch panel sensor according to the second embodiment of the present invention. As shown in FIG. 8, the lower sensor pattern 212 and the first electrode pattern 213 may be formed. The formed insulating substrate 210 for the sensor is prepared. In addition, although not shown, a flexible substrate 220 for connection to be bonded to the insulating substrate 210 for sensors is provided.

Thereafter, as illustrated in FIG. 9, a method of printing or silkscreening the upper surface of the sensor insulation substrate 210 is wrapped around the end of the first electrode pattern 213 formed on the sensor insulation substrate 210. Through insulating adhesive pattern 232 is formed.

In this case, the insulating adhesive pattern 232 is formed in a shape that is integrally connected to the periphery of the end of each of the inner and outer electrode patterns 214 and 115 constituting the first electrode pattern 213.

Thereafter, as shown in FIG. 10, the conductive adhesive pattern 242 is formed inside the insulating adhesive pattern 232.

In this case, as described above, when the conductive adhesive pattern 242 and the insulating adhesive pattern 232 are formed on the same sensor insulating substrate 210, as shown in FIG. 10, the first electrode pattern 213. To form a conductive adhesive pattern 242 at the end of the), a material similar to an ACF film in which conductive particles such as silver epoxy or metal particles, molten metal powder, and metal plating resin particles are dispersed in an adhesive such as epoxy or urethane may be dropped. Using the device 20 can be formed by a dropping method. In some cases, after the insulating adhesive pattern 232 is formed, the flexible substrate 220 for connection is directly bonded, and the raw adhesive material of the conductive adhesive pattern 232 is inserted into the insulating adhesive pattern 232 using a sharp injection tool. After injection, the conductive adhesive pattern 232 may be formed by compression.

As described above, after the conductive adhesive pattern 242 and the insulating adhesive pattern 232 are formed, as shown in FIGS. 6 and 7, the first electrode pattern 213 and the second electrode pattern 224 are formed. Bonding the insulating substrate 210 for the sensor and the flexible substrate 220 for connection so that the end is electrically connected, and covers the cover substrate 250 to cover the insulating substrate 210 for the sensor, the touch panel sensor 200 It can manufacture.

11 is a view for explaining another form of the insulating adhesive pattern among the other touch panel sensors of the present invention, and the components of the touch panel sensor according to the present embodiment are the first embodiment shown in FIGS. 2 and 3. The touch panel sensor 100 according to the present invention and the touch panel sensor 200 according to the second embodiment shown in FIGS. 6 and 7 are substantially the same, and thus, in this embodiment, the insulating adhesive has a different structure from the previous embodiment. The description will be made based on the pattern, and the description of the other components of the touch panel sensor may be referred to the description and drawings of the touch panel sensor of the above embodiment, and repeated descriptions are omitted.

Referring to FIG. 11, the insulating adhesive pattern 332 is formed to be separated from each other so as to surround the periphery of each end of each of the inner and outer electrode patterns 314 and 315 constituting the first electrode pattern 313. .

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

1 is an exploded perspective view illustrating a conventional touch screen.

2 is an exploded perspective view of a touch panel sensor according to a first embodiment of the present invention.

3 is a cross-sectional view of the touch panel sensor of FIG. 2 taken along the A-A direction.

4 is a perspective view of an insulating adhesive pattern formed on the insulating substrate for sensors shown in FIG. 2.

FIG. 5 is a rear perspective view of a conductive adhesive pattern formed on the connecting insulating substrate shown in FIG. 2.

6 is an exploded perspective view of a touch panel sensor according to a second embodiment of the present invention.

7 is a cross-sectional view of the touch panel sensor of FIG. 6 taken along the A-A direction.

8 is a perspective view of an insulating substrate for a sensor among the components of the touch panel sensor according to the second embodiment of the present invention.

FIG. 9 is a perspective view of an insulating adhesive pattern formed on the insulating substrate for sensors shown in FIG. 8.

FIG. 10 is a perspective view of a conductive adhesive pattern formed inside an insulating adhesive pattern on the sensor insulating substrate illustrated in FIG. 9.

11 is a view for explaining another form of the insulating adhesive pattern of another touch panel sensor of the present invention.

100: Touch panel sensor 110: Insulation board for sensors

112: lower sensor pattern 113: first electrode pattern

114: internal electrode pattern 115: external electrode pattern

120: flexible substrate for connection 122: wire pattern

130: adhesive member 132: insulating adhesive pattern

140: connection member 142: conductive adhesive pattern

150: cover board 152: upper sensor pattern

153: Upper electrode pattern 154: Conduction bump

Claims

A sensor insulating substrate having a sensor pattern and a first electrode pattern for connecting the sensor pattern to the outside, and a second electrode pattern corresponding to the first electrode pattern and a wire pattern electrically connected to the second electrode pattern. Providing a flexible substrate for connection;

Forming an insulating adhesive pattern on one surface of the sensor insulating substrate and the connecting flexible substrate, and surrounding the periphery of the end of the first electrode pattern or the second electrode pattern electrically connected to each other; ; And

Bonding the insulation substrate for the sensor and the flexible substrate for connection so that the ends of the first electrode pattern and the second electrode pattern are electrically connected to each other;

Method of manufacturing a touch panel sensor having a.

The method of claim 1,

Forming a conductive adhesive pattern at an end of the first electrode pattern or the second electrode pattern so as to be formed on the other surface of the sensor insulating substrate and the connecting flexible substrate, and positioned inside the insulating adhesive pattern; Method of manufacturing a touch panel sensor further comprising.

The method of claim 2,

The insulating adhesive pattern and the conductive adhesive pattern is a method of manufacturing a touch panel sensor, characterized in that formed by the method of printing or silk screen.

The method of claim 1,

The method may further include forming a conductive adhesive pattern on an end of the first electrode pattern or the second electrode pattern so as to be formed on the same surface as the insulating adhesive pattern, but positioned inside the insulating adhesive pattern. Method of manufacturing a touch panel sensor.

The method of claim 4, wherein

The insulating adhesive pattern is formed by the method of printing or silk screen,

The conductive adhesive pattern is a manufacturing method of the touch panel sensor, characterized in that formed by the injection or dropping method.

The method of claim 1,

The insulating adhesive pattern is a method of manufacturing a touch panel sensor, characterized in that formed to be separated from each other or connected to each other.

The method of claim 1,

And covering a cover substrate covering the sensor insulation substrate.

A sensor insulating substrate on which a sensor pattern and a first electrode pattern for connecting the sensor pattern and the outside are formed;

A connecting flexible substrate having a second electrode pattern corresponding to the first electrode pattern and a wire pattern electrically connected to the second electrode pattern; And

An adhesive member interposed between the sensor insulating substrate and the connection flexible substrate, the adhesive member including an insulating adhesive pattern formed to surround the periphery of the ends of the first electrode pattern and the second electrode pattern electrically connected to each other;

And the insulating adhesive pattern is formed on one surface of the insulating substrate for the sensor and the flexible substrate for the connection.

The method of claim 8,

Interposed between the sensor insulating substrate and the connecting flexible substrate;

And a connection member including a conductive adhesive pattern formed inside the adhesive member so as to be positioned inside the insulating adhesive pattern.

The method of claim 8,

The insulating adhesive pattern is formed to be separated from each other or connected to each other touch panel sensor.

The method of claim 8,

And a cover substrate covering the sensor insulating substrate.